CN102711363A - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN102711363A CN102711363A CN2012100477558A CN201210047755A CN102711363A CN 102711363 A CN102711363 A CN 102711363A CN 2012100477558 A CN2012100477558 A CN 2012100477558A CN 201210047755 A CN201210047755 A CN 201210047755A CN 102711363 A CN102711363 A CN 102711363A
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- CN
- China
- Prior art keywords
- circuit board
- copper
- circuit
- single electrode
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention relates to a circuit board. The circuit board can use single electrode chips and has a high antistatic function. The circuit board comprises copper, insulation rubber and copper foil, wherein the copper is located on the lower portion of the insulation rubber, the copper foil is arranged on the upper portion of the insulation rubber, the copper and the copper foil are pressed to a whole through the insulation rubber to form a copper substrate, a layer of inhibited oil is printed on an non-functional area on the copper substrate, a circuit is etched on the surface of a functional area on the copper substrate, and a gold layer is precipitated on the surface of the functional area on the copper substrate. A special circuit design is used in the circuit board, a limitation that single electrode chips cannot be used in an integrated art broken through, the product use is expanded, and simultaneously the light efficiency of products is effectively improved. By the aid of the use of single electrode chips and the special circuit of the circuit board, the circuit board has the advantages of being stable in circuit voltage and circuit current and capable of prolonging the service life of products.
Description
Technical field
The present invention relates to a kind of circuit board, particularly a kind of circuit board with high-antistatic performance that can use single electrode chip.
Background technology
Existing ic circuit plate has limited the use single electrode chip because of technology and structure Design, thereby has limited the use of circuit board, and existing circuit board often antistatic effect is poor, product circuit is damaged easily.
Summary of the invention
The present invention is directed to the deficiency of prior art, a kind of circuit board with high-antistatic performance that can use single electrode chip is provided.
The present invention realizes through following technical scheme:
A kind of circuit board; Comprise red metal, insulating cement and Copper Foil; Red metal is positioned at the below of insulating cement, and Copper Foil is positioned at the top of insulating cement, it is characterized in that: said red metal and Copper Foil are pressed into an integrally formed copper base through insulating cement; Nonfunctional area on the said copper base is printed on one deck oil resistance, and the functional areas surface etching of this copper base has circuit and deposits a gold medal layer.
Further, said insulating cement is a kind of colloid of resistant to elevated temperatures high heat conduction.
Further, said oil resistance is the high reflective white oil resistance of a kind of high heat conduction.
The beneficial effect that the present invention produces is: the functional areas employing chemical reaction mode of copper base at copper foil surface, forms the golden face pad of gold layer with deposition of gold, improves the welding effect of Jin Cengxianlu and wafer.Copper base injection molding machine high-voltage high-speed through high tonnage in die cavity is formed in high temperature resistant white colloid on the copper base, forms the luminous zone of product.The present invention adopts unique line design, breaks through the restriction that existing integrated package technology can not be used single electrode chip, has expanded the use of product, effectively raises the light efficiency of product simultaneously.The unique circuit that uses and cooperate this product of single electrode chip makes the voltage of circuit, electric current more stable, thereby has prolonged the useful life of product.During encapsulation, single electrode chip is fixed in the functional areas of circuit through high heat conduction silver slurry, single electrode chip is connected through Jin Cengxianlu; Form corresponding string and connection circuit; It is full with the filling of the luminous zone in the white colloid that fluorescent glue technology is once filled in employing then, single electrode chip covered energising back single electrode chip chip front side; Lateral emitting excites fluorescent glue to send white light.Copper Foil and red metal are laminated with through high heat conductive insulating glue and form, and have effectively increased the antistatic property of product strong, thereby the better protection product circuit is not by bad.When this product used the single electrode chip encapsulation simultaneously, light efficiency was higher, can be widely used in the indoor and outdoor lighting.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a cross-sectional view of the present invention.
Wherein, Reference numeral
1---red metal
2---insulating cement
3---Copper Foil
4---copper base
5---the copper base nonfunctional area
6---the copper base functional areas
7---oil resistance
8---the gold layer
Embodiment
From Fig. 1 and Fig. 2, can find out; Present embodiment comprises red metal 1, insulating cement 2 and Copper Foil 3; Red metal 1 is positioned at the below of insulating cement 2, and Copper Foil 3 is positioned at the top of insulating cement 2, and said red metal 1 is pressed into an integrally formed copper base 4 with Copper Foil 3 through insulating cement 2; Copper base nonfunctional area 5 on this copper base 4 is printed on one deck oil resistance 7, and copper base functional areas 6 surface etchings of this copper base 4 have circuit and deposit a gold medal layer 8.Said insulating cement 2 is a kind of colloid of resistant to elevated temperatures high heat conduction; Said oil resistance 7 is the high reflective white oil resistance of a kind of high heat conduction.
Copper base functional areas 6 employing chemical reaction modes on Copper Foil 3 surfaces, form the golden face pad of gold layer 8 with deposition of gold, improve the welding effect of golden layer 8 circuit and wafer.Copper base 4 injection molding machine high-voltage high-speed through high tonnage in die cavity is formed in high temperature resistant white colloid on the copper base 4, forms the luminous zone of product.During encapsulation, single electrode chip is fixed in the copper base functional areas 6 of circuit through high heat conduction silver slurry, single electrode chip is connected through gold layer 8 circuit; Form corresponding string and connection circuit; It is full with the filling of the luminous zone in the white colloid that fluorescent glue technology is once filled in employing then, single electrode chip covered energising back single electrode chip chip front side; Lateral emitting excites fluorescent glue to send white light.Copper Foil 3 is laminated with through high heat conductive insulating glue 2 with red metal 1 and forms, and has effectively increased the antistatic property of product strong, thereby the better protection product circuit is not by bad.When this product used the single electrode chip encapsulation simultaneously, light efficiency was higher, can be widely used in the indoor and outdoor lighting.This structure adopts unique line design, breaks through the restriction that existing integrated package technology can not be used single electrode chip, has expanded the use of product, effectively raises the light efficiency of product simultaneously.The unique circuit that uses and cooperate this product of single electrode chip makes the voltage of circuit, electric current more stable, thereby has prolonged the useful life of product.
Below the present invention is done a detailed description, but obvious, those skilled in the art can carry out various changes and improvement, and the scope of the present invention that does not deviate from appended claims and limited.
Claims (3)
1. circuit board; Comprise red metal, insulating cement and Copper Foil; Red metal is positioned at the below of insulating cement, and Copper Foil is positioned at the top of insulating cement, it is characterized in that: said red metal and Copper Foil are pressed into an integrally formed copper base through insulating cement; Nonfunctional area on the said copper base is printed on one deck oil resistance, and the functional areas surface etching of this copper base has circuit and deposits a gold medal layer.
2. a kind of circuit board according to claim 1 is characterized in that: said insulating cement is a kind of colloid of resistant to elevated temperatures high heat conduction.
3. a kind of circuit board according to claim 1 is characterized in that: said oil resistance is the high reflective white oil resistance of a kind of high heat conduction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100477558A CN102711363A (en) | 2012-02-28 | 2012-02-28 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100477558A CN102711363A (en) | 2012-02-28 | 2012-02-28 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102711363A true CN102711363A (en) | 2012-10-03 |
Family
ID=46903860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100477558A Pending CN102711363A (en) | 2012-02-28 | 2012-02-28 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102711363A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687286A (en) * | 2012-08-29 | 2014-03-26 | 上海温良昌平电器科技有限公司 | High thermal conductivity flexible printed circuit board |
-
2012
- 2012-02-28 CN CN2012100477558A patent/CN102711363A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687286A (en) * | 2012-08-29 | 2014-03-26 | 上海温良昌平电器科技有限公司 | High thermal conductivity flexible printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121003 |