CN102709657A - 共享连续电路的集成环行器 - Google Patents
共享连续电路的集成环行器 Download PDFInfo
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- CN102709657A CN102709657A CN2012100880144A CN201210088014A CN102709657A CN 102709657 A CN102709657 A CN 102709657A CN 2012100880144 A CN2012100880144 A CN 2012100880144A CN 201210088014 A CN201210088014 A CN 201210088014A CN 102709657 A CN102709657 A CN 102709657A
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- circulator
- substrate
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- trace
- assembly
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- 239000000758 substrate Substances 0.000 claims abstract description 208
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 95
- 239000004020 conductor Substances 0.000 claims abstract description 73
- 238000000034 method Methods 0.000 claims description 38
- 230000005291 magnetic effect Effects 0.000 abstract description 14
- 238000005253 cladding Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 41
- 238000010586 diagram Methods 0.000 description 21
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 238000013461 design Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 10
- 239000004810 polytetrafluoroethylene Substances 0.000 description 10
- 238000000354 decomposition reaction Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000003475 lamination Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- LUTSRLYCMSCGCS-BWOMAWGNSA-N [(3s,8r,9s,10r,13s)-10,13-dimethyl-17-oxo-1,2,3,4,7,8,9,11,12,16-decahydrocyclopenta[a]phenanthren-3-yl] acetate Chemical compound C([C@@H]12)C[C@]3(C)C(=O)CC=C3[C@@H]1CC=C1[C@]2(C)CC[C@H](OC(=O)C)C1 LUTSRLYCMSCGCS-BWOMAWGNSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000011031 large-scale manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229920003656 Daiamid® Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- AQCDIIAORKRFCD-UHFFFAOYSA-N cadmium selenide Chemical compound [Cd]=[Se] AQCDIIAORKRFCD-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000001915 proofreading effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/32—Non-reciprocal transmission devices
- H01P1/38—Circulators
- H01P1/383—Junction circulators, e.g. Y-circulators
- H01P1/387—Strip line circulators
Landscapes
- Non-Reversible Transmitting Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/024986 | 2011-02-10 | ||
| US13/024,986 US8514031B2 (en) | 2004-12-17 | 2011-02-10 | Integrated circulators sharing a continuous circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102709657A true CN102709657A (zh) | 2012-10-03 |
Family
ID=45571411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100880144A Pending CN102709657A (zh) | 2011-02-10 | 2012-02-10 | 共享连续电路的集成环行器 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP2487750A1 (enExample) |
| CN (1) | CN102709657A (enExample) |
| IN (1) | IN2012DE00383A (enExample) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104868212A (zh) * | 2014-02-25 | 2015-08-26 | 南京理工大学 | 基于GaN MMIC功率放大器的混合集成有源环行器 |
| CN106953150A (zh) * | 2017-04-28 | 2017-07-14 | 成都致力微波科技有限公司 | 双通道微带环行隔离组件 |
| CN107394325A (zh) * | 2017-08-09 | 2017-11-24 | 成都八九九科技有限公司 | 一种微带器件与传输线的匹配方法 |
| CN112310586A (zh) * | 2020-11-27 | 2021-02-02 | 四川中光防雷科技股份有限公司 | 一种集成型环行器 |
| CN114171869A (zh) * | 2021-11-22 | 2022-03-11 | 北京无线电测量研究所 | 一种闭合磁路微带环行器 |
| CN114464974A (zh) * | 2022-03-16 | 2022-05-10 | 电子科技大学 | 一种具有滤波特性的环形器 |
| CN115295995A (zh) * | 2022-07-21 | 2022-11-04 | 西南应用磁学研究所(中国电子科技集团公司第九研究所) | 一种高互调环行器的宽带电路 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4761621A (en) * | 1986-06-30 | 1988-08-02 | Motorola, Inc. | Circulator/isolator resonator |
| WO2006066254A1 (en) * | 2004-12-17 | 2006-06-22 | Ems Technologies, Inc. | Integrated circulators sharing a continuous circuit |
| US20060139118A1 (en) * | 2004-12-17 | 2006-06-29 | Ems Technologies, Inc. | Integrated circulators sharing a continuous circuit |
| CN101051703A (zh) * | 2006-02-07 | 2007-10-10 | 日立金属株式会社 | 不可逆电路元件 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3334317A (en) | 1964-01-31 | 1967-08-01 | Sylvania Electric Prod | Ferrite stripline circulator having closed magnetic loop path and centrally located, conductive foil overlying radially extending center conductors |
| US3854106A (en) | 1974-02-19 | 1974-12-10 | Bendix Corp | Depressed-puck microstrip circulator |
-
2012
- 2012-02-07 EP EP12154357A patent/EP2487750A1/en not_active Withdrawn
- 2012-02-10 IN IN383DE2012 patent/IN2012DE00383A/en unknown
- 2012-02-10 CN CN2012100880144A patent/CN102709657A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4761621A (en) * | 1986-06-30 | 1988-08-02 | Motorola, Inc. | Circulator/isolator resonator |
| WO2006066254A1 (en) * | 2004-12-17 | 2006-06-22 | Ems Technologies, Inc. | Integrated circulators sharing a continuous circuit |
| US20060139118A1 (en) * | 2004-12-17 | 2006-06-29 | Ems Technologies, Inc. | Integrated circulators sharing a continuous circuit |
| CN101051703A (zh) * | 2006-02-07 | 2007-10-10 | 日立金属株式会社 | 不可逆电路元件 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104868212A (zh) * | 2014-02-25 | 2015-08-26 | 南京理工大学 | 基于GaN MMIC功率放大器的混合集成有源环行器 |
| CN104868212B (zh) * | 2014-02-25 | 2017-11-14 | 南京理工大学 | 基于GaN MMIC功率放大器的混合集成有源环行器 |
| CN106953150A (zh) * | 2017-04-28 | 2017-07-14 | 成都致力微波科技有限公司 | 双通道微带环行隔离组件 |
| CN107394325A (zh) * | 2017-08-09 | 2017-11-24 | 成都八九九科技有限公司 | 一种微带器件与传输线的匹配方法 |
| CN112310586A (zh) * | 2020-11-27 | 2021-02-02 | 四川中光防雷科技股份有限公司 | 一种集成型环行器 |
| CN114171869A (zh) * | 2021-11-22 | 2022-03-11 | 北京无线电测量研究所 | 一种闭合磁路微带环行器 |
| CN114464974A (zh) * | 2022-03-16 | 2022-05-10 | 电子科技大学 | 一种具有滤波特性的环形器 |
| CN114464974B (zh) * | 2022-03-16 | 2022-07-05 | 电子科技大学 | 一种具有滤波特性的环形器 |
| CN115295995A (zh) * | 2022-07-21 | 2022-11-04 | 西南应用磁学研究所(中国电子科技集团公司第九研究所) | 一种高互调环行器的宽带电路 |
| CN115295995B (zh) * | 2022-07-21 | 2023-11-03 | 西南应用磁学研究所(中国电子科技集团公司第九研究所) | 一种高互调环行器的宽带电路 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2487750A1 (en) | 2012-08-15 |
| IN2012DE00383A (enExample) | 2015-05-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121003 |