CN102709657A - Integrated circulators sharing a continuous circuit - Google Patents

Integrated circulators sharing a continuous circuit Download PDF

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Publication number
CN102709657A
CN102709657A CN2012100880144A CN201210088014A CN102709657A CN 102709657 A CN102709657 A CN 102709657A CN 2012100880144 A CN2012100880144 A CN 2012100880144A CN 201210088014 A CN201210088014 A CN 201210088014A CN 102709657 A CN102709657 A CN 102709657A
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China
Prior art keywords
circulator
substrate
circuit
trace
assembly
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Pending
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CN2012100880144A
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Chinese (zh)
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D·J·波佩尔卡
T·沃恩
J·D·沃斯
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EMS Technologies Canada Ltd
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EMS Technologies Inc
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Priority claimed from US13/024,986 external-priority patent/US8514031B2/en
Application filed by EMS Technologies Inc filed Critical EMS Technologies Inc
Publication of CN102709657A publication Critical patent/CN102709657A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices
    • H01P1/38—Circulators
    • H01P1/383—Junction circulators, e.g. Y-circulators
    • H01P1/387—Strip line circulators

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Abstract

The present invention is directed to a circuit assembly that includes an integrated circulator assembly. The circuit assembly has a first substrate, which contains a continuous circuit trace that includes a circulator component from the circulator assembly and at least one electrical component from the circuit assembly. A second substrate is disposed beneath the first substrate and includes a cladding on one surface. The second substrate contains an aperture that accepts a ferrite element, which is axially aligned with the circulator component of the circuit trace. A conductive material is placed across the ferrite element so that it forms a continuous ground plane with the cladding, which is common to the entire circuit trace. The circulator assembly also contains a magnet bonded to the ferrite element. The circulator assembly may also include a yoke disposed below the magnet to shield the circulator from external magnetic fields.

Description

Share the integrated circulator of continuous circuits
With reference to related application
The application submitted on December 19th, 2005, the part continuation application with Patent Application No. 11/314,160 of same names, and it requires the priority of the U.S. Provisional Patent Application sequence number 60/634,945 of submission on December 17th, 2004.These two applications are all included this paper in as a reference herein, as fully proposing below.
Technical field
Embodiments of the invention relate to a kind of device, system and method that the continuous circuits trace is provided; And more specifically relate to a kind of device, system and method that the continuous circuits trace that comprises other electronic units in circulator and the continuous circuits trace is provided, avoided the needs of artificial interconnection and impedance matching.
Background technology
Use circulator isolate with the transmission electronic signal be known.Circulator is the multiport device, and it is at a port received RF (RF) signal, and it is routed to adjacent port, simultaneously to all the other port isolation or uncoupling RF signal.At present, circulator is used to operate in very high-frequency application.For example, circulator is used in the microwave circuit and the microwave that are used for radar and communication system usually and transmits and receives (T/R) module.Traditional circulator design can comprise y type RF conductor, has three port connectors, and three port connectors are positioned between a pair of ferrite substrate.Magnet is placed on the above and below of ferrite substrate in ferrite component, to produce the DC bias magnetic field, so that the irreversible operation of three transmission paths between the port connector to be provided.Foil or covering are placed on the outer surface of each ferrite substrate below each magnet, think that circulator provides ground plane and the shielding to pseudo-RF radiation is provided.Parts are placed in steel sheel or the shell to keep providing the loop in the magnetic field that magnet produces then, shield the external magnetic field for parts simultaneously.
Though circulator is extremely efficient device, traditional circulator has some shortcomings.At first, traditional circulator is installed in is in the big slightly perforate of the encapsulation of cut ratio circulator in the circuit board on the circuit board in the position that circulator will be mounted.Circulator is placed in this perforate then, and manually interconnection of port connector use, and for example welding, flat cable etc. are attached to the external circuit trace on the circuit board.
Shown in Figure 1A, be derived from the United States Patent(USP) No. 4,761,621 of Kane (" Kane "), the printed circuit circulator is being known in the art.But, even usually those circulators that are made as the printed circuit parts still use conventional method to be connected to external electronic (for example, resistor, filter, other circulator).In other words, external component is installed by mounted on surface or through the hole and is welded to then on the printed circuit board (PCB) (PCB).The result; Because the port pins 313,401,403 of circulator is processed by different materials usually; And has the different impedance value with external component 407,409,413; And because these parts 407,409,413 are soldered to plate, therefore have impedance mismatching in interconnection place, it causes the deterioration of circulator electrical property.
Impedance mismatching must utilize banded connector or other known methods to proofread and correct with the impedance matching of port connector with circuit trace.Shown in Figure 1B, be derived from the United States Patent(USP) No. 3,334,317 of Andre (" Andre "), attempt proofreading and correct this impedance mismatching and comprise that the multistage impedance matching section 10b of use, 10c are to carry out conventional impedance transformation.This has increased the complexity of manufacturing process, and need regulate based on the operating frequency range of circulator.In other words, two resonators that are operated in two different frequencies need impedance matching section 10b, 10c, and its frequency based on them is of different sizes (being width).
In addition, the discontinuous connectivity port that is present between circulator and the circuit trace.Manually interconnection also cause the port connector place the insertion loss, increase and the high variability of performance of circulator from the interference of the RF signal of not expecting.And manually interconnection tends to have the undesirable heat performance, and it possibly cause the minimizing of the amount of signal power that maybe be through circuit.
Another deficiency of conventional circulator is that circulator and external circuit parts are not in same plane.This feasible common ground that is difficult to provide effectively circulator and circuit.Typically, must molded metallic plate consistent with the profile that produces with circulator, and make it be bonded to the two the back side of circulator and external circuit.This on-plane surface ground plane possibly cause the decline of circulator electrical property.
Another deficiency of conventional circulator is it and makes costliness, and can not utilize automatic manufacturing process to make.For example, it is fragile that the ferrite substrate that is used for conventional circulator tends to, and possibly damage in the manufacturing process automatically.In addition, parts, especially resonator, ferrite component and magnet must accurately be aimed to guarantee the circulator proper operation.Thereby all or at least the conventional circulator of part must assembled by hand, and parts must utilize anchor clamps or alignment box to aim at.In case parts are correctly aimed at, they are sealed in the outer steel shell with hand usually.Spring or other compressing mechanisms place in the shell to guarantee that Ferrite Material keeps the lasting contact with resonator usually.Unfortunately, no matter this assembling process in the time, still all is expensive pecuniarily.
Taked some trials to solve these with the related problem of conventional circulator.For example, a kind of method is passed through the circulator cascade in common encapsulation, to attempt reducing the impedance mismatching between two or more circulators.This circulator comprises two or more cascades RF conductor together, and they are set between two rectangle ferrite substrates.Single impedance matching element is coupling in being of coupled connections between the port to improve the performance of circulator of circulator resonator of cascade.Unfortunately, this method still must be used manually to interconnect the cascade circulator is connected to external circuit.And the circulator element is not put between two ferrite substrates that damage easily.
Another solution is the cost effective method that designs and produces a large amount of circulators.This method comprises the circulator trace deposition on the dielectric base plate of center.Preboring has a series of dielectric pads of opening to be arranged on around the ferrite component, and this ferrite component leans against on the top of the every side of central substrate.Be placed on every side of substrate layer after the steel plate.Be placed on the top of steel disk after the outer spacer.Outer spacer comprise etching must toward down to several through holes of steel plate to provide and the electrically contacting of ground.Externally bore several through holes on the pad then, and be filled with electric conducting material to be provided for of the contact of mounted on surface circulator to circuit board.Though this method uses cheap materials, this circulator has some shortcomings.At first, steel disk only covers the part of circulator trace, and this can not be for the circulator trace provides enough ground connection, thereby can not shield pseudo-RF signal for the circulator trace fully.And, because circulator is designed to mounted on surface, circulator not with external circuit in line, so the ground plane of circuit is an on-plane surface and discrete.Ground plane between external circuit and the circulator must be by flat cable or other connector bridge joints, and it causes electric poor efficiency.And because circulator is a mounted on surface, it uses and manually connects circulator to external circuit, and it causes the impedance mismatching between circulator and the external circuit.
Therefore, this area needs low-cost circulator, and its use can be used the standard dielectric material of conventional PCB technology assembling.This area further needs to be integrated in the circulator in the circuit, and wherein the trace of the circuit trace of circulator and electronic circuit is the identical continuous circuits trace of part, need not to use manual interconnection.Also further need have the continuous ground face, and can be inserted in the circuit board so that circulator trace and trace circulator in line from the parts of external circuit.
Summary of the invention
Embodiments of the invention relate to device, the system and method that a kind of generation comprises the continuous circuits trace of one or more circulators and one or more external electronic.Ability making these parts in the continuous circuits trace has been eliminated the impedance mismatching that produces between the parts.This has eliminated then and has utilized the impedance matching section of the variable-width between the parts and adjacent lines and trace for example to carry out the needs of physical impedance coupling.This technology is made the low-cost printed circuit board (PCB) (PCB) of circulator becomes possibility, and overcome usually with the PCB environment in the related performance loss of printing circulator.
The embodiment of the invention can comprise the device that comprises first substrate and be printed on the continuous circuits trace on first substrate, and the continuous circuits trace comprises the first circulator pattern and first external component.The circulator pattern can comprise center conductor element and three or more a plurality of connectivity port.In certain embodiments, the circulator pattern can comprise further that the discontinuous ring that is arranged on the center conductor component ambient loads to improve circulator.In other embodiments, the center conductor element can comprise that one or more slits load to improve circulator.
First external component can comprise various RF electronic units.The RF electronic unit can comprise, for example but be not restrictedly, and the second circulator pattern, filter, antenna, power splitter or power combiner.In certain embodiments, this circuit can and then be included in second external component in the continuous circuit trace with the first circulator pattern and first external component.For improving the circulator performance, this first substrate can be thinner relatively.In certain embodiments, the thickness of first substrate is between about 0.001 and 0.010 inch.
In certain embodiments, this device can and then comprise second substrate that is arranged on below first substrate.Second substrate can comprise, for example, the covering on first side, perforate, and insert in the perforate and the ferrite component of approximate and center conductor element alignment.In certain embodiments, electric conducting material can be arranged on the ferrite component top, electrically contacts to form the continuous ground face with covering.First magnet also can be arranged on the ferrite below.
The embodiment of the invention also can comprise first substrate, be printed on the first continuous circuits trace of first substrate, first side; The first continuous circuits trace comprises the first circulator pattern and first external component; Be printed on the second continuous circuits trace of first substrate, second side, the second continuous circuits trace comprises at least the second circulator pattern.As above, first and second circulators can comprise center conductor element and three or more a plurality of connectivity port separately.In certain embodiments, first circulator can be connected with the conductive through hole in first substrate with second circulator.
Embodiments of the invention can and then comprise second substrate that is arranged on below first substrate.Second substrate can comprise, the covering on first side, and first perforate, and insert in first perforate and first ferrite component of approximate and center conductor element alignment.Electric conducting material can be arranged on first ferrite component top, electrically contacts with covering on second substrate, first side and can form the continuous ground face.In certain embodiments, first magnet can be arranged on the ferrite component below.
The thickness of first substrate can be between about 0.001 and 0.010 inch.The thickness of second substrate can be between about 0.01 and 0.07 inch.In a preferred embodiment, electric conducting material comprises the conductive film adhesive.In certain embodiments, the second continuous circuits trace that is printed on first substrate, second side can comprise the second circulator pattern and second external component.
In certain embodiments, the 3rd substrate can be arranged on first substrate top.The 3rd substrate can comprise the covering on first side, second perforate, and second ferrite component.Second ferrite component can insert in second perforate and can be similar to and the center conductor element alignment.In a preferred embodiment, electric conducting material can be arranged on second ferrite component top, so that it electrically contacts with formation continuous ground face with covering on the 3rd substrate first side.This device can and then comprise second magnet, and it can be arranged on second ferrite component top.
Other embodiment of the present invention can comprise the method that produces integrated circuit, and comprising provides first substrate and on first side of first substrate, print the continuous circuits that comprise the first circulator pattern and first external component.
This method can and then comprise second substrate that the metal level that is included at least one side is provided, and in second substrate, produces first perforate that size and dimension is designed to accept first ferrite disk.First ferrite disk can be inserted in this perforate, and electric conducting material can be placed on first ferrite disk so that the metal level on the electric conducting material and first ferrite disk and second substrate electrically contacts to form the continuous ground face.First magnet can be placed under first ferrite disk, and second substrate can be engaged to first base plate bottom.
The embodiment of the invention can and then comprise provides the 3rd substrate, and it comprises the metal level at least one side.Second perforate can form in the 3rd substrate, and size and dimension is designed to accept second ferrite disk.Second ferrite disk can be inserted in this perforate, and electric conducting material can be placed on this ferrite disk so that the metal level on the electric conducting material and first ferrite disk and the 3rd substrate electrically contacts to form the continuous ground face.In certain embodiments, second magnet can be placed on second ferrite disk top.The 3rd substrate can be engaged to the first substrate top.In certain embodiments, the second continuous circuits trace can be printed on second side of first substrate, comprises at least the second circulator.
Through looking back the following detailed description of disclosed embodiment, with reference to accompanying drawing and claim, various aspects of the present invention can be expressly understood and understand more.
Description of drawings
Figure 1A has the diagram that conventional through hole is installed the printing circulator on the printed circuit board (PCB) (PCB) of resistor.
Figure 1B is the diagram that comprises the conventional circulator of impedance matching element.
Fig. 1 C is the diagram that comprises the conventional circulator of adjustment sheet.
Fig. 1 D is the diagram that has the conventional circulator of mismatch port connection owing to the discontinuous capacitance trace.
Fig. 2 A is the diagram of the decomposition view of the circulator assembly that is used with microstrip circuit according to some embodiments of the invention.
Fig. 2 B is the diagram of the circuit trace decomposition view of circulator assembly according to some embodiments of the invention.
Fig. 2 C is a diagram according to some embodiments of the invention and the decomposition view integrated circulator assembly of microstrip circuit assembly.
Fig. 3 be according to some embodiments of the invention with Fig. 2 A in the diagram of vertical view of the integrated circulator assembly of microstrip circuit assembly.
Fig. 4 is the diagram of the cross-sectional view of the circulator assembly that obtains along 4-4 line among Fig. 3 according to some embodiments of the invention.
Fig. 5 is the diagram of decomposition view of the exemplary embodiment of the circulator assembly that is used with strip-line circuit according to some embodiments of the invention.
Fig. 6 is the diagram of the decomposition view of the circulator assembly that is integrated in the strip-line circuit assembly according to some embodiments of the invention.
Fig. 7 is the diagram of the vertical view of the circulator assembly that is integrated in the strip-line circuit assembly according to some embodiments of the invention.
Fig. 8 A and 8B jointly as Fig. 8, are the diagrams of the cross-sectional view of the circulator assembly that obtains along 8-8 line among Fig. 7 according to some embodiments of the invention.
Fig. 9 is the diagram of the isometric view of the circulator assembly that obtains along 9-9 line among Fig. 7 according to some embodiments of the invention.
Figure 10 is the diagram of decomposition view of another embodiment of the circulator assembly that is integrated in the strip-line circuit assembly according to some embodiments of the invention.
Figure 11 is the diagram of the vertical view of the strip-line circuit assembly that comprises two integrated circulator assemblies according to some embodiments of the invention.
Figure 12 is the logical flow chart of method that is used to produce the circulator assembly that illustrates according to some embodiments of the invention.
Embodiment
Be principle and the characteristic of conveniently understanding various embodiments of the invention, the various exemplary embodiments of explained later.Though describe the preferred embodiments of the present invention in detail, should be appreciated that other embodiment expect.Thereby, the present invention be not intended to its scope be restricted to propose in the following explanation or figure shown in structure and the details of layout of parts.The present invention can have other embodiment, can put into practice in every way or realize.In addition, when describing preferred embodiment, for clarity sake will select specific term for use.
Have to be noted that also singulative " ", " one " and " being somebody's turn to do " comprise plural reference as being used in specification and the accessory claim, only if text clearly expression in addition.For example, to the combination that intention comprises a plurality of parts of quoting also of parts.The system that comprises " one " parts quoted also that intention comprises the miscellaneous part that removes this that name.
In addition, when describing preferred embodiment, for clarity sake select term for use.Intention is each term contemplates, and it can be by the meaning the most widely understood by one of ordinary skill in the art, and has comprised all technical equivalents, and it is worked to realize similar purpose in a similar manner.
Scope can be expressed as from " approximately " or " roughly " particular value and/or to " approximately " or " roughly " another particular value herein.When the such scope of expression, other exemplary embodiments comprise from a particular value and/or to another particular value.
Word " comprises ", " containing " or passed on " comprising " compound, element, article or the method step of at least one name to appear in composition or article or the method; Other compounds, material, article, method step do not appear but do not get rid of, though other such compounds, material, article, method step and named have an identical functions.
It is also to be understood that mentioning of one or more method steps do not got rid of other method step occurs, or between those steps of clearly appointment, inserts method step.Similarly, should also be appreciated that mentioning in composition that one or more parts are not got rid of those clearly miscellaneous parts beyond the parts of appointment occur being different from.
Various, slit and other characteristics can be used for changing, example but without limitation, the frequency response of resonator, bandwidth or loading characteristic.For example, as from shown in Figure 1A and 1D of Kane, circulator can comprise the central cam shape current-carrying part that is surrounded by discontinuous ring.Slit in the ring act as load maintainer, and can make the overall dimensions of resonator reduce.As stated, described to comprise the circulator of central circular current-carrying part 28 from Figure 1B of Andre, it has the port one 0 that comprises impedance matching section 10b and 10c.Fig. 1 C from the United States Patent(USP) No. 3,854,106 of authorizing Tresselt (" Tresselt ") has described a kind of central circular current-carrying part with the sheet 34 that is installed on the port.These sheets can make the bandwidth of circulator broaden or narrow down according to using.
For clarity sake, the term " circulator " that here uses is commonly referred to as circulator, comprises various designs, and comprises the parts (for example, sheet, slit, impedance matching section) that are used for " adjusting " circulator.Influence the parts of circulator self operation, opposite with integrated circuit, be considered to the part of circulator rather than " outside " parts.In other words, place like this usefulness, Figure 1B-1D only describes circulator, does not have any external component.In addition, the actual design of circulator is unessential to the embodiment of the invention.
As external component or the external electronic used can comprise here, for example but and without limitation, other circulator, filter, antenna, power splitter or power combiner.These parts and circulator are placed in the same circuit, but in the circulator outside, and be mainly used in the signal (with regulate circulator self opposite) of modification through circuit.Fig. 2 C for example, has described to have the circulator 110 in the continuous circuits trace of filter 210.In this structure, filter 210 will be considered to " outside " electronic unit.
Term " continuous circuits trace " like what use here, can comprise printing, vapour deposition (" sputter "), lamination, etching or deposit or be produced on the circuit on the printed circuit board (PCB) (PCB) with distinct methods.These circuit are processed through the various parts of printing on PCB and parts, and through using printed conductor or trace, rather than manually interconnection, welding or other mechanical connection means and connect.PCB makes and to have reduced cost, reduces or has eliminated the impedance mismatching in connecting.As a result, impedance matching is measured, and for example those are above-described, and it is unnecessary to become.
Therefore the embodiment of the invention relates to a kind of device, system and method that is used to provide the continuous circuits trace that comprises one or more circulators and one or more external electronic (for example circulator, resistor or filter).One or more circulators and one or more external component can be produced on the continuous circuits trace, thereby do not need manual interconnection.This point has also reduced production cost, has improved reliability and performance, and reduced product size except other.
Fig. 2 A is the decomposition view of circulator assembly 100 according to some embodiments of the invention.Circulator assembly 100 contains single ground plane in being commonly referred to " little band " structure.Circulator assembly 100 comprises first substrate 105, and it is processed by non-ferroelectric media material, and is used to support circuit trace 110.Typically, first substrate 105 is processed by the dielectric substance that is used to construct conventional PCB.For example, first substrate 105 can be processed by polymer, such as but not limited to polytetrafluoroethylene (PTFE); The combination of PTFE and glass fabric; PTFE and the combination of microfibrous glass at random, the combination of PTFE and pottery, polyamidemine and the daiamid composition that comprises polyamidemine and glass; PA membrane, epoxy resin (for example cyanate, bisamide triazine (bisamalemide tiazine) etc.But for specialized application, first substrate 105 also can be processed by semi-conducting material, and this semi-conducting material is such as but not limited to silicon (Si), GaAs (GaAs), indium antimonide (InSb), cadmium sulfide (CdS), and cadmium selenide (CdSe).
Use Standard PC B manufacturing technology, physical vapor deposition (PVD) (being also referred to as " sputter ") for example, chemical vapor deposition (CVD)s etc. apply circuit trace 110 side that is substrate 105.Circuit trace 110 is an electric conducting material, for example golden (Au), silver (Ag), copper (Cu), aluminium (Al), titaniums (Ti) etc. at first are applied on the substrate 105.The mask that comprises the circuit element pattern, pattern forms circulator pattern 115 or circulator parts 115 on electric conducting material under this situation.Circulator pattern 115 can comprise the 115A of center conductor portion and three or more a plurality of connectivity port 115B.In certain embodiments, as directed, circulator pattern 115 can comprise that one or more breach, discontinuous external rings or miscellaneous part are to change or to regulate the behavior of circulator 115.
The electric conducting material that exposes is removed from substrate.Mask is removed then, stays the circuit trace of wanting 110.The circuit trace 110 of the circulator 100 that is formed by this mode forms continuous trace, does not have discontinuous or irregular.Replacedly, circulator circuit trace 110 can be placed on a side of substrate 105, and passes substrate 105 through conductive through hole 175 and be connected to the second circulator circuit trace 170, shown in Fig. 2 B.Use the second circulator circuit trace 170 to increase performance through increase bandwidth, reduction insertion loss, raising isolation.
Circulator circuit trace 110 can have the form of any conventional circulator.In Fig. 2 A, circulator circuit trace 110 contains RF resonator and three conductive conveyor belts, and its point from the triangle resonator extends, and ends at electrode or the contact pad designed (not shown) place that is used to be connected to external circuit.Although circuit trace 110 is depicted as the RF resonator with triangle; Those skilled in the art will recognize that without departing from the scope of the invention circuit trace 110 can be to adopt and contains the center resonator and the Any shape of three equally spaced conductive conveyor belts that the RF resonator extends from the center.As stated, circulator 110 can comprise that also various regulating elements are to revise the behavior of circulator 110.
Circulator assembly 100 also has second substrate 120 that is arranged under first substrate 105.Second substrate 120 is also processed by dielectric substance, and is preferably processed by the dielectric substance that is used to construct PCB, as stated.Based on design standard, second substrate 120 can perhaps can be processed by the different electric dielectric material by processing with first substrate, 105 identical dielectric substances.Second substrate 120 comprises approximate perforate 125 of aiming at circulator circuit trace 110.Perforate 125 be typically in shape round; But perforate also can be any polygon, for example square, triangle, pentagon, hexagon etc.The bottom side of second substrate 120 comprises the covering 130 that forms the continuous ground face.Covering 130 is the thin layer of electric conducting material, and electric conducting material is copper, gold, silver, aluminium, titanium etc. for example.
Circulator assembly 100 also contains the ferrite component 135 in the perforate 125 that is arranged at second substrate 120.Ferrite component 135 is circular in shape, and has diameter with the diameter coupling of perforate 125 so that its strictness is attached in the perforate 125.Although ferrite component 135 typically is described as circle; Ferrite component 135 will have the shape identical with perforate 125; Guaranteeing that ferrite component 135 aims at himself with circulator circuit trace 110, and make discontinuous minimizing between second substrate 120 and the ferrite component 135.
Electric conducting material 140 is arranged on ferrite component 135 belows.Electric conducting material 140 is bigger slightly than perforate 125, electrically contacts to guarantee itself and covering 130, and the continuous ground face across circulator circuit trace 110 is provided thus.Electric conducting material 140 is typically extremely thin, roughly 0.001 inch to 0.003 inch scope.As a result, electric conducting material 140 roughly with covering 130 coplanes, it is compared with conventional circulator provides improved shielding and improved electrical property.In one exemplary embodiment, electric conducting material 140 is the conductive film adhesive, and it can be cut into any shape of wanting.Conductive film adhesive 140 bonds to the covering 130 of second substrate 120 simply, covers perforate 125 fully to guarantee it, guarantees the continuous ground face thus.Except accomplishing ground plane, conductive strips also are provided to the additional support of ferrite component 135, further guarantee it thus in perforate 125, and have eliminated the required external support housing of conventional circulator.In another exemplary embodiment, electric conducting material 140 can be electroconductive binder, for example conducts electricity the bi-component epoxy thing.Conduction bi-component epoxy thing is horizontal strides perforate and puts in the thin layer when molten condition, typically have the thickness between about 0.001 inch to 0.003 inch, and allow to repair.In another exemplary embodiment, electric conducting material 140 may simply be metallic film.Metallic film can use the thin pearl of adhesive to be fixed to covering.
Circulator assembly 100 also contain be placed on electric conducting material 140 belows and with the magnet 145 of Ferrite Material 135 and circulator circuit trace 110 the two approximate alignment.In one exemplary embodiment, magnet 145 is permanent magnet, and is polarized to direct current (DC) bias magnetic field that produces through Ferrite Material 135 and circulator circuit trace 110.Magnet 145 remains on correct position by electric conducting material 140.
Circulator assembly 100 also can contain the yoke 155 that is arranged on magnet 145 belows.Yoke 155 is typically big slightly than magnet 145, and the handle 165 that has plate 160 and extend around plate 160 peripheries.The height of handle 165 is enough to cover magnet 145, the DC field circuit to be provided and to enough shieldings of external magnetic field.
Each three of end that circulator assembly 100 also comprises three conductive strips being arranged in circulator circuit trace 110 connect the liner (not shown)s, and it is electrically connected to external circuit with circuit bank piece installing 100.Connect liner and can be rat hole (mouse hole), it is known in this area.Replacedly, connect the downside that liner can be formed on second substrate 120, act as surface mounting assembly.
Fig. 2 C shows the decomposition view of the microstrip circuit 200 that contains circulator assembly 100.As shown in the figure, circulator assembly 100 comprises circular load maintainer, and is completely integrated in the microstrip circuit 200, rather than connects through the required manual interconnection of conventional circulator.Microstrip circuit 200 comprises deposition or is etched in the continuous circuits trace 205 on first substrate 105.Continuous circuits trace 205 comprises at least one circulator circuit trace 110, and it is electrically connected at least one other external RF conductor 210, and (parts related with circulator are relative, as stated).RF parts 210 can be the RF parts of filter part, coupler part or any other type.RF parts 210 even can be another circulator.Because circulator circuit trace 110 is integrated in the continuous circuits trace 205 that comprises RF parts 210, between circulator circuit trace 110 and RF parts 210, just there is not discontinuous or manual interconnection.Integrated and the conventional circulator design of circulator assembly 100 is compared several advantages is provided.At first, because always there is impedance mismatching in interconnected between conventional circulator design demand circulator and the external circuit elements in interconnection place, it causes the signal degradation do not expected in the system.But,, between circulator circuit trace 110 and electronic unit 210, do not have impedance mismatching because circulator circuit trace 110 is integrated in circuit trace 205.Therefore, seldom even there is not signal degradation at circulator assembly 100 and other interface existence that connects between the RF parts 210.Secondly, because discontinuous in the interconnect bridge circuit trace, conventional circulator tends to have the high loss of inserting in interconnection place.Because it is any interconnected that the present invention has eliminated, the insertion loss that is associated with those interconnection is eliminated.In addition, through eliminating interconnection, when circulator assembly 100 is connected into microstrip circuit 200, do not exist to allow RF to disturb the discontinuity that gets into microstrip circuit 200.As a result, the interference that the RF signal of in circulator assembly 100, not expecting produces greatly reduces.
Below second substrate 120 that outer surface comprises covering 130 is arranged on first substrate 105.Second substrate 120 comprises the perforate 125 of aiming at the circulator circuit trace 110 of continuous circuits trace 205.Typically, thin many of first substrate, 105 to the second substrates.The thickness of first substrate 105 is in about 0.001 inch to 0.010 inch scope, and the thickness of second substrate 120 is in about 0.010 inch to 0.070 inch scope.In one exemplary embodiment; The thickness of first substrate 105 is in about 0.003 inch to 0.007 inch scope; More preferably be 0.005 inch, and the thickness of second substrate 120 more preferably is 0.03 inch in about 0.01 inch to 0.07 inch scope.The thickness that those skilled in the art will recognize that first substrate 105 and second substrate 120 must not limited by numerical value provided herein, and is adjustable as the desired any thickness of particular design.
Ferrite component 135 is placed in the perforate 125.Below the ferrite component 135 is electric conducting material 140.In the exemplary embodiment, electric conducting material 140 is processed by the conductive film adhesive, and it is arranged across ferrite component 135.Electric conducting material 140 is bigger slightly than perforate 125.This allows electric conducting material 140 and covering 130 to electrically contact and on whole continuous conduction trace 205, forms the continuous ground face.Remain on continuous ground plane on the whole continuous conduction trace 205, for microstrip circuit 200 provides the improved shielding to the external RF signals of not expecting.And; Because electric conducting material 140 is processed by film; Typically be about 0.001 inch; Electric conducting material 140 is coplanar with covering 130 basically, and this has improved the electrical property of microstrip circuit 200, this be since along the path of ground plane based on last and identical along the path of continuous circuits trace 205.
Magnet 145 is arranged on electric conducting material 140 belows, with ferrite component 135 approximate alignment.Magnet 145 is used to respond to the bias magnetic field through ferrite component 135.Yoke 155 can join on the magnet 145 with jointing material 150 then, so that the loop of bias magnetic field to be provided, and the external magnetic field of also not expecting for 100 shieldings of circulator assembly.
Fig. 3 is for comprising the vertical view of the microstrip circuit 200 of integrated circulator assembly 100 among Fig. 2 according to some embodiments of the invention.The continuous circuits trace 205 that comprises circulator circuit trace 110 and another RF parts 210 is shown in the drawings.Second substrate, 120 (not shown)s are placed on the below of first substrate 105, and it comprises the Ferrite Material 135 that is placed in the perforate 125.Like finding among the figure, the center RF resonator approximate alignment of Ferrite Material 135 and circulator circuit trace 110.Electric conducting material 140 extends beyond perforate 125, to provide and being electrically connected of covering 130 (not shown)s on the back side of second substrate, 120 (not shown)s.Electric conducting material 140 is also approximate to be aimed at perforate 125.
Fig. 4 is the cross-sectional view of microstrip circuit 200 parts that obtain of the 4-4 line along Fig. 3.The continuous circuits trace 205 that comprises circulator circuit trace 110 is placed on the end face of first substrate 105.First substrate 105 is made up of the thin layer of non-ferroelectric media material, and for example PTFE or other are used for the material of manufacturing PCB.First substrate 105 is thinner relatively, has thickness T 1, in about 0.001 inch to 0.010 inch scope, and second substrate 120 has thickness T 2, in about 0.010 inch to 0.070 inch scope.In one exemplary embodiment, first substrate 105 has thickness T 1, in about 0.003 inch to 0.007 inch scope, more preferably be 0.005 inch, and second substrate 120 has thickness T 2, in about 0.01 inch to 0.07 inch scope, more preferably be 0.03 inch.Those skilled in the art will recognize that first substrate 105 and 120 fens other thickness T of second substrate 1And T 2Must do not limited, and be adjustable as the desired any thickness of particular design by numerical value provided herein.Continuous circuits trace 205 typically with the extremely thin end face that is deposited upon first substrate 105, has thickness T 3(in about 0.0008 inch to 0.0015 inch scope).
Utilize preferred circuit plate adhesive known in the art, second substrate 120 is engaged to the bottom of first substrate 105.Second substrate 120 is also processed by non-ferroelectric media material, and they are used for the structure of PCB, for example PTFE etc.In one exemplary embodiment, second substrate 120 is processed by identical dielectric substance with first substrate 105.But, those skilled in the art will recognize that first substrate 105 also processed by the different non-ferroelectric media material with differing dielectric constant with second substrate 120, like the requirement of application-specific institute.The bottom of second substrate 120 also is included as the thin covering 130 that microstrip circuit 200 provides ground plane.
Ferrite Material 135 is integrated in second substrate 120.Ferrite Material 135 is arranged in the perforate 125 of being milled in second substrate 120, replacedly, uses conventional thermal impedance, non-conductive jointing material, bi-component epoxy thing for example known in the art, and Ferrite Material 135 can adhere in the perforate 125.The thickness T of the thickness of Ferrite Material 135 and second substrate 120 2Basic identical, so the surface of basic coplane is formed on the bottom of the bottom of the top of the top of Ferrite Material 135, second substrate 120, Ferrite Material 135 and second substrate 120.This allows first substrate, 105 horizontal on second substrate 120, has no tangible height change at the interface of second substrate 120 and Ferrite Material 135, because any variation possibly produce stress to first substrate 105.Stress in first substrate 105 can cause the breaking even rupture of first substrate 105 on the interface between second substrate 120 and the Ferrite Material 135, and this can cause the complete failure of performance degradation even strip-line circuit 200.Make the needs of the basic coplane in bottom of bottom and second substrate 120 of Ferrite Material 135 that planar groundplane is provided, this discussed preceding.
Electric conducting material 140 is arranged on second substrate, 120 downsides.Electric conducting material 140 extends beyond the border of perforate 125, so as to provide with in fully the electrically contacting of the covering 130 of second substrate, 120 downsides, for microstrip circuit 200 the continuous ground face is provided thus.Except providing the continuous ground face across ferrite component 135, electric conducting material 140 also is bonded on ferrite component 135 in the perforate 125 of second substrate 120.In addition, electric conducting material 140 has enough elasticity, to adapt to owing to the minor variations of making the thickness of tolerance between second substrate 120 and ferrite component 135.Magnet 145 is bigger than perforate 125, also aims at ferrite component 135, to guarantee that ferrite component 135 is covered fully.At last, yoke 155 usefulness jointing materials 150 are engaged to magnet 145.Handle 165 (Fig. 2) slave plate 160 (Fig. 2) of yoke 155 extend with the direction that makes progress, and fully around magnet 145, the external magnetic field that can disturb circulator assembly 100 to work for magnet 145 shieldings thus.
Fig. 5 is the decomposition view of circulator assembly 500 exemplary embodiments that are arranged as the strip line structure according to some embodiments of the invention.Circulator assembly 500 comprises first substrate 503 of supporting circulator circuit trace 506.First substrate 503 is made up of the thin layer of non-ferroelectric media material, and for example PTFE or other are used for the material of manufacturing PCB.Circulator circuit trace 506 comprises triangle center resonator and three conductive conveyor belts, and it is equidistant around the periphery of triangle center resonator.Those skilled in the art will realize in other shapes without departing from the scope of the invention and can be used for the center resonator.
Circulator assembly 500 also comprises second substrate 512 and the 3rd substrate 533 that is positioned at first substrate, 503 tops that is positioned at first substrate, 503 belows, forms layer structure thus.Second substrate 512 and the 3rd substrate 533 are also processed by non-ferroelectric media material.In the exemplary embodiment, second substrate 512 is processed by the identical dielectric substance that is used for first substrate 503 with the 3rd substrate 533.In another exemplary embodiment, second substrate 512 is processed by the dielectric substance different with the dielectric substance that is used for first substrate 503 with the 3rd substrate 533.
Second substrate 512 comprises first covering 515 that is arranged on the end outer surface (not shown).Similarly, the 3rd substrate 533 comprises second covering 536 on the outer surface (not shown) of deposition top.First and second coverings 515 and 536 are through using standard deposition technique, for example PVD, CVD etc., plated metal thin layer and forming. Second substrate 512 and 533 each the self-contained perforate 518 and 539 respectively of the 3rd substrate.Perforate 518 and 539 with first substrate 503 on circulator circuit trace 506 aim at.First ferrite component 521 is inserted in first perforate 518, and second ferrite component 542 is inserted in second perforate 539. Ferrite component 521 and 542 typically places in perforate 518 and 539 respectively.But ferrite component 521 and 542 can use adhesive, and for example bi-component epoxy thing etc. is bonded in perforate 518 and 539.
First electric conducting material 524 is provided with across the bottom of first ferrite component 521.Similarly, second electric conducting material 545 is placed across the top of second ferrite component 542.In one exemplary embodiment, electric conducting material 524 and 545 is formed by the conductive film adhesive, and it is bigger slightly than perforate 518 and 539.The conductive film adhesive makes and electrically contacts with covering 515 and 536, two continuous ground faces to be provided, the RF radiation that it is not expected for 506 shieldings of circulator circuit trace.Replacedly, do not use the conductive film adhesive, electric conducting material 524 and 545 can be formed by electroconductive binder, for example conducts electricity the bi-component epoxy thing.Typically, electric conducting material 524 and 545 is thinner relatively.As a result, electric conducting material 524 and 545 and covering 515 and 536 coplane roughly.
Circulator assembly 500 also comprises first magnet 527 that is arranged on first ferrite component, 521 belows.Similarly, second magnet 548 is placed on second ferrite component, 542 tops.First magnet 527 and second magnet 548 all with circulator circuit trace 506 approximate alignment, to produce through ferrite component 521 and 542 and the DC bias magnetic field of circulator circuit trace 506.
Circulator assembly 500 also can comprise the yoke 554 with top board 557 and base plate 560.The top board 557 of yoke 554 is placed on the top of second magnet 548.First jointing material 551 can insert so that top board 557 is adhered on second magnet 548 between the top board 557 and second magnet 548.Similarly, base plate 560 is arranged on the bottom of first magnet 527, and can join first magnet 527 to through second jointing material 530.In the exemplary embodiment, first jointing material 551 and second jointing material 530 are processed by the same conductive that is used for accomplishing across second substrate 509 and the 3rd substrate 533 ground plane.
Yoke 554 also can comprise at least one handle 563, and it extends between top board 557 and base plate 560, and the loop in the magnetic field of magnet 527 and 548 inductions is provided.In the exemplary embodiment, yoke 554 comprises two handles 563, and they pass first pair of otch of first substrate 503, the 3rd pair of otch of second pair of otch of second substrate 512, the 3rd substrate 533, and be connected to base plate 560.The top board 557 of yoke 554 has roughly the same or big slightly size with base plate 560 and magnet 527 and 548, thinks that circulator circuit trace 506 provides enough shieldings.Have two handles 563 although yoke 554 has been described, those skilled in the art will recognize that yoke 554 can have single handle 563 or be placed on three handles 563 in the middle of three conductive strips of circulator circuit trace 506.Each of each of each of first pair of otch, second pair of otch and the 3rd pair of otch thought that by the edge plating circulator assembly 500 provides extra shielding and isolation.
Each three of end that circulator assembly 500 also comprises three conductive strips being arranged in circulator circuit trace 506 connect the liner (not shown)s, and it is electrically connected to external circuit with circulator assembly 500.Connect liner and can be rat hole, it is known in this area.Replacedly, connecting the bottom side that liner can be formed on second substrate 512 is used for as surface mounted device.Connecting liner can pass second substrate 512 through etching vias and upwards be formed on the bottom side of second substrate 512 until each of three conductive strips.Through hole is then by for example fillings such as copper, gold, silver, aluminium of electric conducting material.
Strip-line circuit 600 according to some embodiments of the invention is shown in Fig. 6-9.Strip-line circuit 600 comprises that at least one is integrated in the circulator assembly 500 (Fig. 5) of strip-line circuit 600.According to some embodiments of the invention, at least one the external RF parts 609 in circulator assembly 500 and the continuous circuits trace 606 on being etched in first substrate 603 are integrated.RF parts 609 can be the electronic unit of filter part, coupler part or any other type.Because circulator circuit trace 605 is integrated with continuous circuits trace 606, between circulator circuit trace 506 and RF parts 609, do not exist discontinuous or interconnection.The same with microstrip circuit 200; This structure is compared with conventional circulator design several advantages is provided, and comprises improved impedance matching between circulator assembly 500 and other electronic units 609, low insertion loss; To the improved shielding of the RF signal do not expected and higher reliability.Although being shown, strip-line circuit 600 has the single circulator assembly 500 integrated with single RF parts 609; It will be appreciated by those skilled in the art that; Without departing from the scope of the invention, strip-line circuit 600 can expand to and comprise any amount of circulator assembly 500 integrated with any amount of RF parts 609.
Second substrate 612 and the 3rd substrate 633 are separately positioned on the below and the top of first substrate 603, and on their outer surfaces separately, deposit covering 615 and 636.Second substrate 612 and the 3rd substrate 633 comprise perforate 618 and 639 respectively, they and circulator circuit trace 605 approximate alignment.Ferrite component 621 and 642 is arranged in perforate 618 and 639.Electric conducting material 624 and 645 covers perforate 618 and 639.In the exemplary embodiment, electric conducting material 624 and 645 is processed by the conductive film adhesive, and it is arranged across ferrite component 621 and 642.Because conductive film adhesive 624 is with 645 bigger than perforate 618 and 639, film adhesive and covering 615 and 636 electrically contact and formation continuous ground face on whole continuous conduction trace 606.Remain on continuous ground plane on the whole continuous conduction trace 606, for strip-line circuit 600 provides the improved shielding to the external RF signals of not expecting.And; Because electric conducting material 624 and 645 is processed (its thickness typically is about 0.001 inch) by the conductive film adhesive; Conducting film and covering 615 and 636 are coplanar basically; This has further improved electrical property, and this is because identical based on last path with continuous circuits trace 606 along the path of ground plane.Magnet 627 and 648 is arranged on the below and the top of electric conducting material 624 and 645, and with ferrite component 621 and 642 approximate alignment.Yoke 654 can be engaged to magnet 627 and 648 with jointing material 630 and 651 then, so that the loop of DC bias magnetic field to be provided, also for circulator assembly 500 (Fig. 5) shielding to the external magnetic field of not expecting is provided.
Fig. 7 is the vertical view of strip-line circuit 600 according to some embodiments of the invention.First substrate, 603 (not shown)s of carrying continuous circuits trace 606 (shown in broken lines) are arranged between second substrate, 612 (not shown)s and the 3rd substrate 633.Continuous circuits trace 606 comprises the circulator circuit trace 605 that is electrically connected to RF parts 609.Because circulator circuit trace 605 is integrated in same continuous circuits trace 606 with RF parts 609, between circulator circuit trace 605 and RF parts 609, does not have interconnection.This allows strip-line circuit 600 to have better electrical characteristics, the for example improved impedance matching between the circuit block, the transmission of improved signal and improved heat distribution through continuous circuits trace 606.
In addition, covering 636 covers the whole outside or the end face of the 3rd substrate 633.Electric conducting material 645 extends beyond perforate 639, to provide and the electrically contacting of covering 636, to form the continuous ground face on the whole continuous circuits trace 606.This allows circulator circuit trace 605 and RF parts 609 to share common ground.Circulator circuit trace 605 and RF parts 609 have common ground and compare with conventional circulator several advantages are provided.The common ground face provides the shielding that makes continuous circuits trace 606 avoid the enhancing of external RF radiation.The common ground face has also increased the line isolation, has reduced from the radiated emission of strip-line circuit 600 to improve the electrical property of strip-line circuit 600.
With reference to figure 8A, 8B and Fig. 9, show the cross-sectional view of the part of strip-line circuit 600.Especially, Fig. 8 A is the diagram of the cross section of the circuit bank piece installing 600 that obtains along 8-8 line among Fig. 7, and Fig. 8 B is the enlarged drawing of the cross section shown in Fig. 8 A.Fig. 9 illustrates the diagram of the isometric view of the strip-line circuit 600 that obtains along 9-9 line among Fig. 7.Cross-sectional view illustrates the relative thickness of first substrate 603 and the second and the 3rd substrate 612 and 633.First substrate 603 has thickness T 1, in about 0.001 inch to 0.010 inch scope.The second and the 3rd substrate 612 and 633 typically has same thickness T 2, bigger than first substrate, 603 thickness, in about 0.01 inch to 0.07 inch scope.In a preferred embodiment, first substrate 603 has thickness T 1, in about 0.003 inch to 0.007 inch scope, more preferably be about 0.005 inch, and second substrate 120 has thickness T 2, in about 0.01 inch to 0.07 inch scope, more preferably be about 0.03 inch.The details of continuous circuits trace 606 parts is shown in Fig. 8 B, to show relative thickness.Typically, continuous circuits trace 606 is extremely thin, has thickness T 3, usually at about 0.25 ounce/meter 2(oz/m 2) to 1.0 (oz/m 2) in the scope.Any gap 805 (Fig. 8 B) between first substrate 603 and the 3rd substrate 633 is filled by the thermally-stabilised adhesive of standard, and this is well-known in PCB makes.Because the elimination of interconnection between circulator assembly 500 and the RF parts 609, continuous circuits trace 606 is uniform along its entire path basically.Circuit trace 606 evenly cause improved heat distribution along continuous circuits trace 606, this allows strip-line circuit 600 to handle more high-power signal.
Figure 10 is the diagram with another exemplary embodiment of the strip-line circuit assembly 1000 of the integrated circulator assembly of at least one other RF parts that comprises according to some embodiments of the invention.Strip-line circuit 1000 is equal to strip-line circuit shown in Figure 6 600, except yoke 654 has been eliminated from circulator assembly 500.
Have the single circulator element that is integrated in circuit trace 606 though strip-line circuit has illustrated, those skilled in the art will recognize that strip-line circuit assembly 600 can comprise any amount of circulator assembly that is integrated in the circuit trace.Figure 11 is the diagram of another exemplary strip-line circuit 1100; It comprises two the circulator assemblies 1110 and 1115 with the circulator circuit trace 1120 that is connected in series respectively and 1125 according to the present invention, and circulator circuit trace 1120 and 1125 is integrated in the continuous circuits trace 1115 (it comprises at least one other electronic component 1030).As see in the drawings, circulator circuit trace 1120 and 1125 is connected to RF parts 1130 through omnibus circuit trace 1115, and does not use interconnection.And, circulator assembly 1105 and 1110 and RF parts 1130 share the common ground faces, wherein common ground face 1130 extends on whole continuous circuits trace 1115.
Figure 12 is the diagram flow chart of process 1200 that is used to make circulator assembly 100 according to some embodiments of the invention.Process 1200 allows through easy highly reliable, the cheap circulator assembly 100 of lower cost materials large-scale production that obtains of use, and eliminates the needs of assembled by hand microstrip circulator assembly 100.Though process 1200 is described as making microstrip circulator assembly 100, those skilled in the art will recognize that process 1200 is also applicable to making according to strip line circulator 500 of the present invention (Fig. 5).And, those skilled in the art will recognize that method 1200 is equally applicable to make microstrip line circuit 200 (Fig. 2) and the strip-line circuit 600 (Fig. 6) that comprises integrated circulator assembly.
Process 1200 wherein produces circuit trace 110 since 1205 on first substrate 105, wherein the continuous circuits trace comprises at least one circulator circuit trace 110.First substrate 105 is processed by non-ferroelectric media material, for example is used for the dielectric substance of manufacturing PCB.For example, first substrate 105 can be by combinations such as PTFE or PTFE and glass, glass fiber, resin, potteries and is processed.Typically, first substrate 105 of carrying continuous circuits trace 110 is relative thin.For example, in the exemplary embodiment, first substrate 105 has thickness T 1, in about 0.003 inch to 0.007 inch scope, more preferably be about 0.005 inch.
Can use any conventional method as known in the art that continuous circuits trace 110 is deposited on first substrate 105.For example, can continuous circuits trace 110 be deposited on first substrate 105 through physical vapour deposition (PVD) (being also referred to as " sputter "), chemical vapour deposition (CVD), electro-deposition, lamination etc.Replacedly, a side of first substrate 105 can comprise covering one side, and continuous circuits trace 110 can use the standard technique etching.The design of continuous circuits trace 110 is compared with the circulator parts that conventional circulator uses several advantages is provided.For example, because continuous circuits trace 110 places on the non-ferroelectric media substrate, the continuous trace 110 of circulator assembly 100 can use conventional PCB fabrication techniques.Secondly, non-ferroelectric media than be used for conventional circulator to contain iron substrate more durable.Routine contains iron substrate typically to be processed by ferrite, or by the metal dust compacting, it tends to frangible, easy damage, size-constrained, expensive and not compatible with other RF parts usually.Therefore, the use of the material that the PCB that is generally used for first substrate is used makes circulator assembly 100 firmer than conventional circulator, therefore is of value to automated production.
1210, cutting and opening holes 125 in second substrate 120 is when second substrate 120 is engaged to first substrate 105, with the position that allows perforate 125 with circuit trace 110 approximate alignment.Perforate 125 drills second substrate 120 and covering 130 fully.This " logical bore " process is compared with existing circulator has several advantages.Perforate 125 has avoided on substrate, milling groove to problem very little and that accurate tolerance is relevant, on substrate, mills groove to very little and accurate tolerance and is difficult to reach, easily goes wrong, makes costliness.
1215, be placed at least one side under first substrate 105 through second substrate 120 that will comprise covering 130 and produce lamination.Jointing material, the junction film that for example is suitable for the RF circuit is placed between first substrate 105 and second substrate 120.Second substrate 120 is also by the non-ferroelectric media material structure that is used for manufacturing PCB.Typically, second substrate 120 is by processing with first substrate, 105 same materials, and has identical dielectric constant.But, those skilled in the art will recognize that second substrate 120 can be by processing with first substrate, 105 material different, and have different dielectric constants.And second substrate 120 is made as has thickness T 2, its thickness than first substrate 105 is bigger.In one exemplary embodiment, the thickness T of second substrate 120 2Between about 0.01 inch to 0.07 inch, it more preferably is about 0.03 inch.The lamination that be made up of first substrate 105 and second substrate 120 this moment can engage more closely to form the circuit board lamination.Replacedly, engaging process can be carried out after all elements have been aimed at and assembled.
Second substrate 120 comprises perforate 125, circuit trace 110 approximate alignment on itself and first substrate 105.Perforate 125 shapes typically are circle, and have the diameter of the whole center resonator part that can surround circulator circuit trace 110.It is preferred that round hole 125 is compared with other shapes, because round hole 125 is compared making more easily and more cheap with other shape perforates.Though it is more desirable that round hole 125 is described as, perforate 125 can have any polygonal shape, for example triangle, square, pentagon, hexagon, heptagon, octagon etc.
1220, ferrite component 135 is placed in the perforate 125 in second substrate 120.Ferrite component 135 typically forms disk shape, has the thickness T with second substrate 120 2The basic thickness that equates.This allows the top of ferrite component 135 and the top coplane of second substrate 120, and covering 130 coplanes on the bottom of ferrite component 135 and second substrate, 120 bottoms.This prevents any discontinuous being formed in the circuit trace 110 that form owing to the deflection of not expecting.In second substrate 120, using perforate 125 (itself and circulator parts 115 approximate alignment) the permission ferrite component 135 of preboring is " autoregistration ".Therefore, need not to use special line-up jig or structure, ferrite component 135 can be placed with circulator element 115 relative correct relations.And,, insert the process of ferrite component 135 and can use the automation of Standard PC B manufacturing technology owing to no longer need line-up jig.
1225, electric conducting material 140 is placed across perforate 125 and on ferrite component 135, so that itself and covering 130 electrically contact.Electric conducting material 140 has been accomplished the ground plane of circulator 100 through electrically contacting with covering 130.Usually, the thickness of conductive layer 140 is in about 0.003 inch to 0.007 inch scope.Should the ground plane that be essentially the plane be provided thin electric conducting material, it strides across perforate 125 continuously.Conductive layer 140 is typically processed by conductive strips, and it has not only accomplished ground plane, also ferrite component 135 is bearing in the perforate 125, and in the working temperature of circulator 100, is heat-staple.Replacedly, electric conducting material 140 can be processed by electroconductive binder, for example bi-component epoxy thing etc.
Next, 1230, magnet 145 is placed on conductive layer 140 belows, with ferrite component 135 approximate alignment.Ferromagnetic 145 typically are permanent magnet, and are engaged to ferrite component with electric conducting material 140.Typically, electric conducting material for the identical conductive strips of electric conducting material 140 that are used to be arranged between magnet 145 and the ferrite disk 135.Electric conducting material 140 also can be processed by electroconductive binder etc.
1235, yoke 155 is placed on magnet 145 belows.Electric conducting material 140 also is arranged between magnet 145 and the yoke 155 to allow yoke 155 to be engaged to magnet 145.
At last, 1240,, be also referred to as common joint (co-bonding) with a one-step process laminated stack.The common engaging process of making can be applicable to make at least one circulator with at least one RF parts; These at least one RF parts share public, continuous circuits trace, wherein various assembly parts in the one step that is commonly referred to " engaging altogether " or " engaging altogether " by lamination or be bound up.
The method 1200 that is used to make circulator assembly 100 provides several advantages of comparing with existing method.At first, because circulator assembly 100 uses the standard dielectric material of the PCB that is generally used for substrate, rather than ferrite substrate, the cost of making the circulator assembly greatly reduces.Secondly, because ferrite component 135 autoregistrations, circulator assembly 100 can need not to use line-up jig and assemble.Therefore, circulator assembly 100 can use the assembling of standard automation PCB manufacturing technology.And method 1200 is supported dull and stereotyped production practices, and this allows the large-scale production of circulator assembly, and this has greatly reduced the whole cost of producing circulator assembly 100.
Under the situation of spirit that does not break away from exemplary embodiment and scope, other alternate embodiments are conspicuous to the those skilled in the art under the exemplary embodiment.Thereby scope of the present invention is limited accessory claim, rather than aforesaid description.

Claims (3)

1. device comprises:
First substrate (105), and
Be printed on the continuous circuits trace (110) on this first substrate (105), this continuous circuits trace (110) comprises the first circulator pattern (115) and first external component;
Wherein this circulator pattern (115) comprises center conductor element (115A) and three or more a plurality of connectivity port (115B).
2. this device of claim 1 further comprises:
Be arranged on second substrate (120) under this first substrate (105), comprise:
Covering on first side (130);
Perforate (125); And
Ferrite component (135), insert in this perforate (125) and with this center conductor element (115A) approximate alignment;
Electric conducting material (140) is arranged on this ferrite component (135) and upward and with this covering (130) electrically contacts to form the continuous ground face; And
First magnet (145) is arranged on this ferrite component (135) below.
3. method that produces integrated circuit comprises:
First substrate (105) is provided;
On first side of this first substrate (105), print continuous circuits, these continuous circuits comprise the first circulator pattern (115) and first external component.
CN2012100880144A 2011-02-10 2012-02-10 Integrated circulators sharing a continuous circuit Pending CN102709657A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104868212A (en) * 2014-02-25 2015-08-26 南京理工大学 Mixed integrated active circulator based on GaN MMIC power amplifier
CN106953150A (en) * 2017-04-28 2017-07-14 成都致力微波科技有限公司 Binary channels micro-strip is gone in ring barrier assembly
CN107394325A (en) * 2017-08-09 2017-11-24 成都八九九科技有限公司 A kind of matching process of micro-strip device and transmission line
CN114171869A (en) * 2021-11-22 2022-03-11 北京无线电测量研究所 Micro-strip circulator with closed magnetic circuit
CN114464974A (en) * 2022-03-16 2022-05-10 电子科技大学 Circulator with filtering characteristic
CN115295995A (en) * 2022-07-21 2022-11-04 西南应用磁学研究所(中国电子科技集团公司第九研究所) Broadband circuit of high intermodulation circulator

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4761621A (en) * 1986-06-30 1988-08-02 Motorola, Inc. Circulator/isolator resonator
WO2006066254A1 (en) * 2004-12-17 2006-06-22 Ems Technologies, Inc. Integrated circulators sharing a continuous circuit
US20060139118A1 (en) * 2004-12-17 2006-06-29 Ems Technologies, Inc. Integrated circulators sharing a continuous circuit
CN101051703A (en) * 2006-02-07 2007-10-10 日立金属株式会社 Non-reciprocal circuit device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334317A (en) 1964-01-31 1967-08-01 Sylvania Electric Prod Ferrite stripline circulator having closed magnetic loop path and centrally located, conductive foil overlying radially extending center conductors
US3854106A (en) 1974-02-19 1974-12-10 Bendix Corp Depressed-puck microstrip circulator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4761621A (en) * 1986-06-30 1988-08-02 Motorola, Inc. Circulator/isolator resonator
WO2006066254A1 (en) * 2004-12-17 2006-06-22 Ems Technologies, Inc. Integrated circulators sharing a continuous circuit
US20060139118A1 (en) * 2004-12-17 2006-06-29 Ems Technologies, Inc. Integrated circulators sharing a continuous circuit
CN101051703A (en) * 2006-02-07 2007-10-10 日立金属株式会社 Non-reciprocal circuit device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104868212A (en) * 2014-02-25 2015-08-26 南京理工大学 Mixed integrated active circulator based on GaN MMIC power amplifier
CN104868212B (en) * 2014-02-25 2017-11-14 南京理工大学 Hybrid integrated active circulator based on GaN MMIC power amplifiers
CN106953150A (en) * 2017-04-28 2017-07-14 成都致力微波科技有限公司 Binary channels micro-strip is gone in ring barrier assembly
CN107394325A (en) * 2017-08-09 2017-11-24 成都八九九科技有限公司 A kind of matching process of micro-strip device and transmission line
CN114171869A (en) * 2021-11-22 2022-03-11 北京无线电测量研究所 Micro-strip circulator with closed magnetic circuit
CN114464974A (en) * 2022-03-16 2022-05-10 电子科技大学 Circulator with filtering characteristic
CN114464974B (en) * 2022-03-16 2022-07-05 电子科技大学 Circulator with filtering characteristic
CN115295995A (en) * 2022-07-21 2022-11-04 西南应用磁学研究所(中国电子科技集团公司第九研究所) Broadband circuit of high intermodulation circulator
CN115295995B (en) * 2022-07-21 2023-11-03 西南应用磁学研究所(中国电子科技集团公司第九研究所) Broadband circuit of high intermodulation circulator

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Application publication date: 20121003