CN102709460A - Shape-preserved secondary compression-expansion radiator for LED (light-emitting diode) backlight source and manufacturing method - Google Patents
Shape-preserved secondary compression-expansion radiator for LED (light-emitting diode) backlight source and manufacturing method Download PDFInfo
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- CN102709460A CN102709460A CN2012102175158A CN201210217515A CN102709460A CN 102709460 A CN102709460 A CN 102709460A CN 2012102175158 A CN2012102175158 A CN 2012102175158A CN 201210217515 A CN201210217515 A CN 201210217515A CN 102709460 A CN102709460 A CN 102709460A
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Abstract
The invention discloses a shape-preserved secondary compression-expansion radiator for an LED (light-emitting diode) backlight source and a manufacturing method. The manufacturing method comprises the following steps of: firstly performing surface cleaning treatment on a circular hot pipe by utilizing an ultrasonic cleaner; performing primary press swelling on the circular hot pipe by using a primary shape-preserved compression-expansion mould to compress the circular hot pipe into an elliptical hot pipe; annealing the press-swelled elliptical hot pipe; and preparing a substrate which is provided with a cavity, wherein the section of the cavity is provided with an open elliptical groove; embedding the elliptical hot pipe in the elliptical groove, installing a compression-expansion device on an opening of the elliptical groove, and pressing the upper surface of the elliptical hot pipe exposed outside the opening into a plane so that the plane is flush with the opening of the elliptical groove. After the hot pipe is swelled by pressing, an installation plane with the diameter greater than that of the original hot pipe can be supplied, the contact area of the backlight source and the hot pipe is enlarged, the radiation speed and efficiency of the LED backlight source is quickened so that the service life of the LED backlight source is prolonged, and therefore, the shape-preserved secondary compression-expansion radiator has a great economic value.
Description
Technical field
The present invention relates to radiator and manufacturing process, relate in particular to a kind of conformal secondary that is used for the LED-backlit source and press expand radiator and manufacturing approach.
Background technology
LED (light-emitting diode) has been widely used in fields such as mobile phone backlight, traffic lights, automobile brake lamp.Temperature is the principal element that influences the white light LEDs rotary light performance, and along with the rising of white light LEDs junction temperature, its luminous flux descends, and red shift will take place emission wavelength.100.Under the temperature of C, red shift of wavelength 4～9nm causes YAG fluorescent material absorptivity to descend, and total luminous intensity reduces, white light colourity variation.Simultaneously, along with the rising of junction temperature, the light decay of LED is fairly obvious, has directly influenced the useful life of LED.At present, the large power white light LED electrical efficiency is about about 15%, and 85% electric energy is converted into heat, and the chip size of LED is merely 1mm * 1mm～2.5mm * 2.5mm, and its heat radiation density requirements is reached more than the 100W/cm2.The hot property of LED becomes the bottleneck problem of its large-scale application of restriction.Because the luminous flux of single LEDs is limited, adopts the LED array to satisfy the luminous flux requirement usually in high-power field, this makes heat dissipation problem more outstanding, the LED-backlit source of especially the great power LED array being formed.
The LED-backlit source has a large amount of electric energy when working and is converted into heat energy.The heat that produces will make LED-backlit source knot surface temperature too high if can't derive, and then influences life cycle, luminous efficiency and the stability in LED-backlit source; Simultaneously, too high temperature can make the electro-optical properties of liquid crystal display screen change, and then involves a series of problems such as light, electricity, look, influences the use of entire product.So how improving heat-sinking capability is the key technology that the LED-backlit source needs to be resolved hurrily.
The radiator of monophasic fluid air blast cooling is adopted in traditional LED-backlit source, its complex structure, and radiating rate is slower, and rate of heat dispation is lower, can not satisfy the requirement that LED-backlit source heat-dissipating amount increases day by day.
Summary of the invention
The objective of the invention is to overcome the shortcoming and defect of above-mentioned prior art, provide a kind of conformal secondary that is used for the LED-backlit source to press expand radiator and manufacturing approach, its technology is simple, radiating efficiency is high.
The present invention realizes through following technical proposals:
A kind of conformal secondary that is used for the LED-backlit source is pressed the radiator that expands; It is characterized in that comprising substrate, elliptical heat pipe, be provided with the shape chamber of a strip opening at a side lower part of substrate, the cross section in this shape chamber is the oval groove of opening; Said elliptical heat pipe places in this ellipse groove; The surface of said elliptical heat pipe has a plane, and this plane flushes with the opening part of oval groove, and the contact-making surface of said elliptical heat pipe and oval groove fits tightly.Said elliptical heat pipe inside has capillary structure, and this capillary structure is the channel form capillary structure.
The conformal secondary that is used for the LED-backlit source is pressed the manufacturing approach of the radiator that expands, and comprises the steps:
(1) at first utilize circular heat pipe supersonic wave cleaning machine to carry out cleaning surfaces, oven dry processing;
(2) it is bloated to press the mould that expands that circular heat pipe is once pressed with a conformal, and circular heat pipe is compressed into elliptical heat pipe;
(3) to pressing the elliptical heat pipe after expanding to carry out annealing in process;
(4) prepare a substrate, a side of this substrate has the shape chamber of a strip opening, and the cross section in this shape chamber has the oval groove of an opening;
(5) elliptical heat pipe is embedded in the oval groove; And above the opening of oval groove, install and press the device that expands; Expand along carry out secondary conformal pressure perpendicular to the direction of finger notch flute length axle, the upper surface that will expose the outside elliptical heat pipe of opening is pressed into a plane, and this plane is flushed with the opening part of oval groove; For the LED-backlit source provides mounting platform, secondary conformal pressure expands the outer wall of elliptical heat pipe and the inwall of oval groove is closely pressed the applying of expanding simultaneously.
The present invention has following advantage and effect with respect to prior art:
The present invention is embedded into elliptical heat pipe in the oval groove; And on the opening of oval groove, put the device that install to press expands; Expand along carry out secondary conformal pressure perpendicular to the direction of finger notch flute length axle, the upper surface that will expose the outside elliptical heat pipe of opening is pressed into a plane, and this plane is flushed with the opening part of oval groove; For the LED-backlit source provides mounting platform, secondary conformal pressure expands the outer wall of elliptical heat pipe and the inwall of oval groove is closely pressed the applying of expanding simultaneously.Adopt the secondary conformal to press and expand, the phase transformation expand tube is combined with the conformal compression, can reduce contact heat resistance greatly.
Conformal secondary of the present invention is pressed and is expanded; The upper surface of elliptical heat pipe was pressed into a bigger plane after pressure expanded, and bloated applying of the tight pressure of the inwall of elliptical heat pipe and oval groove, and this plane has increased the contact area of backlight striation and heat pipe; Can significantly accelerate the radiating rate in LED-backlit source; Improve the radiating efficiency of radiator, also improved the useful life in LED-backlit source, have very big economic worth.
Description of drawings
Fig. 1 presses the radiator integral sketch map that expands for the conformal secondary in LED-backlit of the present invention source;
Fig. 2 is Fig. 1 radiator schematic cross-section;
Fig. 3 is a circular heat tube section sketch map;
Fig. 4 is conformal compression back elliptical heat pipe schematic cross-section;
Fig. 5 is the schematic cross-section in the oval groove for elliptical heat pipe embeds;
Fig. 6 presses the back schematic cross-section that expands for secondary;
Embodiment
Below in conjunction with specific embodiment the present invention is done further concrete detailed description the in detail.
Embodiment
Like Fig. 1, shown in Figure 2; The present invention is used for the conformal secondary in LED-backlit source and presses the radiator that expands; Comprise substrate 11, elliptical heat pipe 2, be provided with the shape chamber 12 of a strip opening at a side lower part of substrate 11, the cross section in this shape chamber 12 is the oval groove 13 of opening; Said elliptical heat pipe 2 places in this ellipse groove 13; The surface of said elliptical heat pipe 2 has a plane, and this plane flushes with the opening part of oval groove 13, and said elliptical heat pipe 2 fits tightly with the contact-making surface of oval groove 13.Said elliptical heat pipe 2 inside have capillary structure, and this capillary structure is the channel form capillary structure.
The conformal secondary that is used for the LED-backlit source is pressed the manufacturing approach of the radiator that expands, and comprises the steps:
(1) at first utilize circular heat pipe 1 supersonic wave cleaning machine to carry out cleaning surfaces, oven dry processing;
(2) it is bloated to press the mould that expands that circular heat pipe 1 is once pressed with a conformal, and circular heat pipe 1 is compressed into elliptical heat pipe 2;
(3) to pressing the elliptical heat pipe 2 after expanding to carry out annealing in process;
(4) prepare a substrate, a side of this substrate has the shape chamber 12 of a strip opening, and the cross section in this shape chamber 12 has the oval groove 13 of an opening;
(5) elliptical heat pipe 2 is embedded in the oval groove 13; And above the opening of oval groove 13, install and press the device that expands; Press bloated along carry out the secondary conformal perpendicular to the direction of oval groove 13 major axis; The upper surface that will expose the outside elliptical heat pipe 2 of opening is pressed into a plane; This plane is flushed with the opening part of oval groove 13, and for the LED-backlit source provides mounting platform, secondary conformal pressure expands the outer wall of elliptical heat pipe 2 and the inwall of oval groove 13 is closely pressed the applying of expanding simultaneously.
Below by way of example, specify above-mentioned manufacturing approach;
(1) at first utilize supersonic wave cleaning machine to carry out removing surface circular heat pipe 1, the back oven dry; (as shown in Figure 3);
(2) it is bloated to press the mould that expands that circular heat pipe 1 is once pressed with a conformal, and it is major axis 5.5mm that circular heat pipe 1 is compressed into major axis, the elliptical heat pipe 2 (as shown in Figure 4) of minor axis 4.4mm;
(3) to pressing the elliptical heat pipe 2 after expanding to carry out annealing in process;
(4) to adopt drawing process to process length be 500mm, have major axis is that 6.2mm, minor axis are that 4.4mm, upper end chord length are substrate 11 (see figure 2)s of having of 4mm of oval groove 13.
(5) elliptical heat pipe 2 is embedded in the oval groove 13 (as shown in Figure 5); And in the LED-backlit source contact-making surface device that install to press expands; Expand along carry out secondary conformal pressure perpendicular to the direction of major axis, realize combining closely of heat pipe and substrate, make elliptical heat pipe 2 upper surfaces press simultaneously and be expanded into the plane that overlaps with oval groove 13 opening parts; Press the plane of expanding and accomplishing, can provide the wide platform of 4mm to supply LED-backlit source (not shown) thermal source heat radiation (as shown in Figure 6).
With respect to a tube expansion technique; The secondary conformal press expanded joint touch thermal resistance little and with the long-pending big characteristics of heat source-contacting surface, accomplished the expanded joint of the elongate conduit of opposite heat tube, and owing to adopt pure water in the expand tube process as hydraulic fluid; Technical process does not have oily matter, pollution-free environmental protection.
As stated, just can realize the present invention preferably.
Claims (4)
1. a manufacturing approach that is used for the bloated radiator of conformal secondary pressure in LED-backlit source is characterized in that comprising the steps:
(1) at first utilize circular heat pipe supersonic wave cleaning machine to carry out cleaning surfaces, oven dry processing;
(2) it is bloated to press the mould that expands that circular heat pipe 1 is once pressed with a conformal, and circular heat pipe is compressed into elliptical heat pipe;
(3) to pressing the elliptical heat pipe after expanding to carry out annealing in process;
(4) prepare a substrate, a side of this substrate has the shape chamber of a strip opening, and the cross section in this shape chamber has the oval groove of an opening;
(5) elliptical heat pipe is embedded in the oval groove; And above the opening of oval groove, install and press the device that expands; Expand along carry out secondary conformal pressure perpendicular to the direction of finger notch flute length axle, the upper surface that will expose the outside elliptical heat pipe of opening is pressed into a plane, and this plane is flushed with the opening part of oval groove; For the LED-backlit source provides mounting platform, secondary conformal pressure expands the outer wall of elliptical heat pipe and the inwall of oval groove is closely pressed the applying of expanding simultaneously.
2. a conformal secondary that is used for the LED-backlit source is pressed the radiator that expands; It is characterized in that comprising substrate, elliptical heat pipe, be provided with the shape chamber of a strip opening at a side lower part of substrate, the cross section in this shape chamber is the oval groove of opening; Said elliptical heat pipe places in this ellipse groove; The surface of said elliptical heat pipe has a plane, and this plane flushes with the opening part of oval groove, and the contact-making surface of said elliptical heat pipe and oval groove fits tightly.
3. the conformal secondary that is used for the LED-backlit source according to claim 2 is pressed the radiator that expands, and it is characterized in that said elliptical heat pipe inside has capillary structure.
4. the conformal secondary that is used for the LED-backlit source according to claim 3 is pressed the radiator that expands, and it is characterized in that said capillary structure is the channel form capillary structure.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210217515.8A CN102709460B (en) | 2012-06-28 | 2012-06-28 | Shape-preserved secondary compression-expansion radiator for LED (light-emitting diode) backlight source and manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210217515.8A CN102709460B (en) | 2012-06-28 | 2012-06-28 | Shape-preserved secondary compression-expansion radiator for LED (light-emitting diode) backlight source and manufacturing method |
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| CN102709460A true CN102709460A (en) | 2012-10-03 |
| CN102709460B CN102709460B (en) | 2014-12-03 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112917098A (en) * | 2021-01-22 | 2021-06-08 | 杭州祥博传热科技股份有限公司 | Heat pipe burying method for radiator |
| CN115488246A (en) * | 2022-08-10 | 2022-12-20 | 祥博传热科技股份有限公司 | Seamless high-heat-conductivity forming process for heat pipe of radiator |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2728684Y (en) * | 2004-10-14 | 2005-09-28 | 华南理工大学 | Manufacturing equipment of capillary tissure microslot of hot pipe inner wall |
| JP2006019557A (en) * | 2004-07-02 | 2006-01-19 | Fujikura Ltd | Light emitting device, its mounting method, lighting apparatus and display |
| US20080150126A1 (en) * | 2006-12-22 | 2008-06-26 | Zhi-Yong Zhou | Light emitting diode module with heat dissipation device |
| CN203190361U (en) * | 2012-06-28 | 2013-09-11 | 华南理工大学 | Shape-protecting secondary compressing heat radiator for LED backlight |
-
2012
- 2012-06-28 CN CN201210217515.8A patent/CN102709460B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006019557A (en) * | 2004-07-02 | 2006-01-19 | Fujikura Ltd | Light emitting device, its mounting method, lighting apparatus and display |
| CN2728684Y (en) * | 2004-10-14 | 2005-09-28 | 华南理工大学 | Manufacturing equipment of capillary tissure microslot of hot pipe inner wall |
| US20080150126A1 (en) * | 2006-12-22 | 2008-06-26 | Zhi-Yong Zhou | Light emitting diode module with heat dissipation device |
| CN203190361U (en) * | 2012-06-28 | 2013-09-11 | 华南理工大学 | Shape-protecting secondary compressing heat radiator for LED backlight |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112917098A (en) * | 2021-01-22 | 2021-06-08 | 杭州祥博传热科技股份有限公司 | Heat pipe burying method for radiator |
| CN115488246A (en) * | 2022-08-10 | 2022-12-20 | 祥博传热科技股份有限公司 | Seamless high-heat-conductivity forming process for heat pipe of radiator |
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| CN102709460B (en) | 2014-12-03 |
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