CN102706458A - Infrared thermal imaging coordinate positioning method - Google Patents
Infrared thermal imaging coordinate positioning method Download PDFInfo
- Publication number
- CN102706458A CN102706458A CN2012101719056A CN201210171905A CN102706458A CN 102706458 A CN102706458 A CN 102706458A CN 2012101719056 A CN2012101719056 A CN 2012101719056A CN 201210171905 A CN201210171905 A CN 201210171905A CN 102706458 A CN102706458 A CN 102706458A
- Authority
- CN
- China
- Prior art keywords
- infrared
- infrared thermal
- plate
- location
- thermal imagery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Radiation Pyrometers (AREA)
Abstract
The invention discloses an infrared thermal imaging coordinate positioning method which comprises the follow steps: (1), selecting an infrared thermal imaging positioning plate, wherein the infrared thermal imaging positioning plate comprises a bottom plate and a plurality of heat radiation pillars vertically arranged on the bottom plate; (2), uniformly heating the infrared thermal imaging positioning plate; (3), shooting the infrared thermal imaging maps of the infrared thermal imaging positioning plate; (4), finding a low temperature point in the infrared thermal images of the infrared thermal imaging positioning plate; (5), calculating the practical coordinate position of each pixel in the infrared thermal image according to location parameters of the heat radiation pillar on the infrared thermal imaging positioning plate in a infrared thermal image; (6), taking down the shot infrared thermal imaging positioning plate, shooting infrared thermal images of samples to be analyzed, and determining the practical coordinate positions of all parts of the samples to be analyzed according to the recalculating to the position relation of the heat radiation pillar and the samples to be analyzed. The method is simple, is high in accuracy, can quickly determine the position condition of abnormal temperature points, is applicable to various occasions, and has a very strong practicability.
Description
Technical field
The invention belongs to the Infrared Thermography Technology field, be specifically related to a kind of infrared thermal imagery coordinate location method.
Background technology
Because infrared thermal imaging technique can carry out contactless, high-resolution temperature imaging; Can generate high-quality image; Numerous information of measurement target can be provided; Remedied the deficiency of human eye, therefore be used widely in many industries such as electric system, civil engineering work, automobile, metallurgy, petrochemical industry, medical treatment, future prospects for development is more limitless.Along with the Infrared Thermography Technology application and development, its speed to infrared image analysis, precision have all had higher requirement.At present, most infrared image analysis all is the position that profile and sample profile through infrared image relatively come to confirm temperature anomaly point.Such method precision is low, speed is slow, if the situation of temperature anomaly point position also can appear being difficult to confirm in being more or less the same of the emissivity of object and temperature and background.
Summary of the invention
The object of the present invention is to provide a kind of infrared thermal imagery coordinate location method that can from the thermography picture, find the corresponding actual position coordinate of pixel fast and accurately; This method is simple, precision is high; Can confirm the situation of temperature anomaly point fast; Go for various occasions, have very strong practicality.
Above-mentioned purpose of the present invention realizes through following method: a kind of infrared thermal imagery coordinate location method contains following steps:
(1) choose the infrared thermal imagery location-plate, said infrared thermal imagery location-plate comprises base plate and is vertical at a plurality of thermal columns on the base plate;
(2) even HEATING INFRARED thermal imagery location-plate;
(3) adopt thermal infrared imager to take the Infrared Thermogram of infrared thermal imagery location-plate;
(4) find out low warm spot in the Infrared Thermogram of infrared thermal imagery location-plate;
(5), calculate the real coordinate position of each pixel in the Infrared Thermogram according to the location parameter of thermal column on the infrared thermal imagery location-plate in the Infrared Thermogram;
(6) taken the Infrared Thermogram of infrared thermal imagery location-plate after, take off the infrared thermal imagery location-plate, take the Infrared Thermogram of sample to be analyzed, according to the position of conversion thermal column and sample to be analyzed relation, confirm the real coordinate position at each position of sample to be analyzed.
In above-mentioned steps:
Base plate is processed by the material of poor radiation described in the step of the present invention (1), and the material of described poor radiation is preferred but be not limited to plastics, timber or pottery.
The size of base plate described in the step of the present invention (1) is preferred but be not limited to 1cm
2~ 1m
2
Thermal column is processed by the good metal material of thermal diffusivity described in the step of the present invention (1), and described metal material is preferred but be not limited to iron, copper, aluminium, tungsten, tin or nickel.
The quantity of thermal column described in the step of the present invention (1) is preferred but be not limited to 1 ~ 100.
An end of thermal column vertically is embedded in the base plate of infrared thermal imagery location-plate described in the step of the present invention (1), and it is preferred but be not limited to 0.1 ~ 20cm that the other end exceeds backplate surface.
The infrared thermal imagery location-plate that adopts among the present invention; Comprise base plate and be vertical at the thermal column on the base plate; This is the sheet material that nail has thermal column on a kind of surface, and the manufacturing materials of base plate is the relatively poor material of heat-sinking capability, as: there is the sheet material of heat insulation coating etc. on plastics, surface; Thermal column is that the material with good heat radiating ability is processed, as: each metalloid material, thermal column is vertically fixed on backplate surface.
The cardinal principle of infrared thermal imagery location-plate is: after location-plate is evenly heated; Because the thermal column specific surface area still is all big than base plate of material heat dissipation characteristics; So it is much fast that the thermal column radiating rate is wanted, low significantly warm spot will appear in the Infrared Thermogram that shooting obtains within a certain period of time.By the comparison of the relation of low warm spot in the distance between a plurality of thermal columns of measurement and position relation and the Infrared Thermogram, calculate the real coordinate position that just can calculate each pixel representative in the Infrared Thermogram through program.
Can find out the low warm spot in the Infrared Thermogram of infrared thermal imagery location-plate through human eye identification or computer recognizer in the step of the present invention (4);
In the step of the present invention (6) for small sample; The infrared thermal imagery location-plate is placed on the device with position limiting structure, adjustment thermal infrared imager and device with position limiting structure on same straight line, taken the Infrared Thermogram of infrared thermal imagery location-plate after; Take off the infrared thermal imagery location-plate; Place small sample to be analyzed in same position,, confirm the real coordinate position at each position of this small sample through taking the Infrared Thermogram of small sample.
In the step of the present invention (6) for large-scale sample; The infrared thermal imagery location-plate is fixed on the large-scale sample; Adjust large-scale sample and thermal infrared imager on same straight line, taken the Infrared Thermogram of infrared thermal imagery location-plate after, take off the infrared thermal imagery location-plate; Take the Infrared Thermogram of large-scale sample to be analyzed, confirm the real coordinate position at this each position of large-scale sample.
As one embodiment of the present invention, for small-sized sample, generally be placed on device photographs Infrared Thermogram with position limiting structure, to carry out just can taking the thermography of a plurality of samples after the one-time positioning and analyzing, its detailed process is following:
(1) thermal infrared imager and the device with position limiting structure are fixed on the same straight line;
(2) the infrared thermal imagery location-plate is placed on the limiting structure with position limiting structure device;
(3) even HEATING INFRARED thermal imagery location-plate;
(4) Infrared Thermogram of shooting infrared thermal imagery location-plate;
(5) find low warm spot, according to the real coordinate position of each pixel in the Infrared Thermogram of thermal column position relation calculating infrared thermal imagery location-plate;
(6) take off the infrared thermal imagery location-plate, place small sample to be analyzed,, confirm the real coordinate position at each position of this small sample through taking the Infrared Thermogram of small sample in same position.
Can change sample then, take analysis, through one-time positioning, can take the thermography of a plurality of samples and analyze.
As one embodiment of the present invention, for large-scale sample, general direct shooting sample is placed on thermal infrared imager and sample on same straight line, and each sample all need be located and once taken analysis again, and its detailed process is following:
(1) thermal infrared imager and sample are placed on the same straight line;
(2) the infrared thermal imagery location-plate is fixed on some position of sample, like right angle frame place or center;
(3) even HEATING INFRARED thermal imagery location-plate;
(4) Infrared Thermogram of shooting infrared thermal imagery location-plate;
(5) find low warm spot, calculate the real coordinate position of each pixel in the Infrared Thermogram according to thermal column position relation;
(6) take off the infrared thermal imagery location-plate, take the Infrared Thermogram of large-scale sample and analyze;
Change sample at last, repeat above-mentioned (1) ~ (6) step, can obtain the real coordinate position at other each positions of large-scale sample.
Compared with prior art, the present invention has following advantage:
(1) the present invention can customize the size of thermal column according to the image resolution ratio of thermal infrared imager; Make low warm spot only account for 1 or several pixel; This subjective deviation that occurs when just can avoid removing to choose low warm spot through human eye is excessive, also can reduce that computer is chosen the difficulty of low warm spot program, wrong possibility appears in the minimizing program simultaneously;
(2) infrared thermal imagery location-plate of the present invention is made simply, need not any electrical equipment, and is with low cost;
(3) the present invention's shape per sample and the resolution of thermal infrared imager through arranging different radiating post quantity and relative position relation, can further improve the coordinate setting precision, reduce the difficulty and the systematic error of calculation procedure;
(4) through method of the present invention; No matter be that the test analysis or the large sample of large-scale working-yard that produces small sample in enormous quantities on the line detects; Can confirm the pixel real coordinate position of Infrared Thermogram fast, accurately, thus fast, accurately to the defective in the sample, abnormity point analyze, work such as reparation.
Description of drawings
Fig. 1 is the diagram of the infrared thermal imagery location-plate of the employing in the embodiment of the invention 1;
Fig. 2 is the synoptic diagram that in the embodiment of the invention 1 the infrared thermal imagery coordinate location method is applied to crystal-silicon solar cell defect analysis field;
Fig. 2 a is the vertical view of location-plate putting position among Fig. 2;
Fig. 3 is the infrared thermal imagery location-plate synoptic diagram that adopts in the embodiment of the invention 2;
Fig. 4 places the synoptic diagram on the kiln furnace wall with location-plate in the embodiment of the invention 2;
Fig. 4 a is the synoptic diagram that adopts infrared thermal imagery location-plate maintenance kiln large-scale furnace wall among the embodiment 2;
Fig. 5 is the synoptic diagram of the infrared location-plate of employing in the embodiment of the invention 3;
Fig. 6 a places the synoptic diagram that carries out infrared coordinate setting on the support with infrared location-plate in the embodiment of the invention 3;
Fig. 6 b is that infrared location-plate places the structural representation on the support among Fig. 6 a;
Fig. 6 c places the synoptic diagram that carries out infrared coordinate setting on the support with doughnut in the embodiment of the invention 3;
Fig. 6 d places the synoptic diagram on the support with doughnut in the embodiment of the invention 3;
Wherein: 11, base plate; 12, thermal column; 1, test board; 2, positive stop strip; 3, location-plate (thermal column does not show) or specimen; 4, thermal infrared imager; 21, location-plate; 22, kiln wall; 23, thermal infrared imager.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.
The infrared thermal imagery coordinate location method is applied to the field of crystal-silicon solar cell defect analysis, and the infrared thermal imagery location-plate is as shown in Figure 1, comprises base plate 11 and is vertical at the thermal column 12 on the base plate 11; Base plate 11 uses plastic plate, and size is 156mm * 156mm * 3mm at present embodiment, and thermal column 12 uses stainless steel; Diameter is 1mm, is 20mm highly, but is not to be that the size that base plate and heat radiation are lived is limited in fact; Can be according to the difference of analytic target, to adjust accordingly and get final product, thermal column quantity is three; Be distributed on three summits of right-angle triangle; The length of side of this right-angle triangle is 120mm, 100mm, the summit, right angle be positioned at the location-plate coordinate system (10mm, 10mm) locate (this coordinate system with base plate always angular vertex be initial point O; The limit that is parallel to the right-angle triangle both sides is the xy axle, and is as shown in fig. 1).Thermal column uses such distribution mode mainly to utilize set up a rectangular coordinate system at these 3; Can calculate the real coordinate position of pixel in the thermography very easily through the transformation for mula of rectangular coordinate system; These 3 position relations are simple simultaneously; No matter be human eye go to distinguish or through image recognition program discern quite simple, the probability of makeing mistakes is low.
The practical implementation step of this instance is following:
(1) above-mentioned infrared thermal imagery location-plate is placed on the test desk; This test desk has stationkeeping that mutually perpendicular fixed blocks places location-plate as the stop means centre position, visual field at thermal infrared imager; Adjustment thermal infrared imager and test desk are on same straight line, shown in Fig. 2 and 2a;
(2) use hair dryer to infrared thermal imagery location-plate blowing hot-air, make the base plate thermally equivalent of infrared thermal imagery location-plate;
(3) the real-time shoot function of use thermal infrared imager waits to occur in the Infrared Thermogram significantly at right angles taking Infrared Thermogram behind three low warm spots of distribution;
(4) use finder to access Infrared Thermogram; Use mouse in Infrared Thermogram, to select the position of three low warm spots; Calculate the coordinate transform formula that three low temperature point transformation are the position in the base plate coordinate system of thermal column place through program then, through this coordinate transform formula calculate each pixel in the Infrared Thermogram the relative real coordinate position on the base plate of infrared thermal imagery location-plate;
(5) take off location-plate, put the 156mm * 156mm solar cell piece that needs analysis, take Infrared Thermogram, just can analyze the relevant position of defective in the battery sheet through corresponding processing back in same position.
The infrared thermal imagery coordinate location method is applied to the field that overhaul the kiln large-scale furnace wall, and the infrared thermal imagery location-plate of use is as shown in Figure 3, comprises base plate 1 and is vertical at the thermal column 2 on the base plate 1; Because the kiln wall temperature is higher,, be of a size of 1000mm * 1000mm * 20mm so base plate 1 uses resistant to elevated temperatures ceramic wafer; Thermal column 2 uses thermal stability tungsten preferably, and diameter is 10mm, highly is 10mm; But be not to be that the size that base plate and heat radiation are lived is limited in fact, can be according to the difference of analytic target, adjust accordingly and get final product; Thermal column quantity is four, and it is as shown in Figure 3 to distribute, and the length of side of this right-angle triangle is 8000mm, 8000mm; The summit, right angle is positioned at the (100mm with the location-plate coordinate system; 100mm) locate (this coordinate system with base plate always angular vertex be initial point O, the limit that is parallel to the right-angle triangle both sides is the xy axle, and is as shown in fig. 1).Thermal column uses such distribution mode mainly to utilize set up a rectangular coordinate system at these 4, and wherein vertical edges has two effects at the many thermal columns of middle: 1, distinguish the xy axle; 2, improve the resolving accuracy that vertical direction also is the y axle (because the refractory brick on the kiln wall all keeps flat, vertical direction ratio horizontal direction needs higher precision to go to confirm that fragment of brick is out of joint)
The practical implementation step of this instance is following:
(1) as shown in Figure 3 above-mentioned infrared thermal imagery location-plate 21 is placed on the lower left corner of kiln wall 22, the lower left corner justified margin of the left hand edge of infrared thermal imagery location-plate 21 and lower limb and kiln wall 22;
(2) the infrared thermal imagery location-plate is close to the furnace wall, because furnace wall temperature is higher, through heat conduction infrared thermal imagery location-plate thermally equivalent;
(3) use the real-time shoot function of thermal infrared imager 23, wait the infrared thermal image figure that takes the infrared thermal imagery location-plate behind four low warm spots that occur among the infrared thermal image figure significantly at right angles distributing;
(4) use finder to access the Infrared Thermogram of infrared thermal imagery location-plate; Use mouse in Infrared Thermogram, to select the position of four low warm spots; Calculate the coordinate transform formula that four low temperature point transformation are the position in the base plate coordinate system of thermal column place through program then, through this coordinate transform formula calculate each pixel among the infrared thermal image figure relative actual bottom plate coordinate position;
(5) remove the infrared thermal imagery location-plate, take the Infrared Thermogram of furnace wall again, calculate, just can calculate the position that needs to change refractory brick, and carry out the maintenance of kiln wall in view of the above through location of pixels to temperature anomaly point among the figure.
The infrared thermal imagery coordinate location method is applied to the doughnut performance test, and the infrared thermal imagery location-plate of use is as shown in Figure 5, comprises base plate and is vertical at the thermal column on the base plate; Because tire need be fixed on make an experiment on the support and study mainly to as if the rubber part of circle outer shroud; So the location-plate that uses is an annular, is that 190.5mm, internal diameter are that 25.0mm is an example with the annulus external diameter, being of uniform thickness of the thickness of location-plate and the tire of required test is convenient to be fixed on the support; The base plate of location-plate is that timber is processed; This is that weight is also lighter, relatively is suitable as the location-plate of Tire testing because timber is processed easily; Thermal column uses stainless steel; Be 5mm with the diameter in the present embodiment, height is that example describes for 10mm, and thermal column quantity is 15; It is as shown in Figure 5 to distribute; Thermal column uses such distribution mode can establish a polar coordinate system easily, even every thermal column at a distance from 60 degree distribution varying numbers also can be confirmed the position of polar coordinates initial point comparatively accurately through the algorithm of least square method under the artificial situation that occurs error when confirming low warm spot, also can avoid the pixel of thermal infrared imager image through the method that different thermal columns compare at interval simultaneously is the definite error of actual coordinate that rectangular coordinate distributes and causes.
The practical implementation step of this instance is following:
(1) shown in Fig. 6 a-6b, above-mentioned infrared thermal imagery location-plate is fixed on the test bracket;
(2) the use blowing hot wind heats or uses hot-water soak to make the location-plate thermally equivalent;
(3) the real-time shoot function of use thermal infrared imager waits to occur in the Infrared Thermogram taking infrared thermal image figure behind 15 low warm spots;
(4) use finder to access Infrared Thermogram; Use mouse in Infrared Thermogram, to select the position of 15 low warm spots; Calculate the coordinate transform formula that 15 low temperature point transformation are the position in the base plate coordinate system of thermal column place through program then, through this coordinate transform formula calculate each pixel in the Infrared Thermogram relative actual bottom plate coordinate position;
(5) remove location-plate; Be shown in like Fig. 6 c-6d and fix the tire that to test on the support, after experiments such as spin friction or stress test, use thermal infrared imager to take thermography; Through temperature anomaly point location of pixels in the thermography is calculated; Just can calculate needs its physical location, thus each item performance of research tire, and take this as a foundation and pinpoint the problems and improve design.
The present invention will be described more than to enumerate specific embodiment.It is pointed out that above embodiment only is used for the present invention is described further, do not represent protection scope of the present invention, nonessential modification and adjustment that other people prompting according to the present invention is made still belong to protection scope of the present invention.
Claims (8)
1. infrared thermal imagery coordinate location method is characterized in that containing following steps:
(1) choose the infrared thermal imagery location-plate, said infrared thermal imagery location-plate comprises base plate and is vertical at a plurality of thermal columns on the base plate;
(2) even HEATING INFRARED thermal imagery location-plate;
(3) adopt thermal infrared imager to take the Infrared Thermogram of infrared thermal imagery location-plate;
(4) find out low warm spot in the Infrared Thermogram of infrared thermal imagery location-plate;
(5), calculate the real coordinate position of each pixel in the Infrared Thermogram according to the location parameter of thermal column on the infrared thermal imagery location-plate in the Infrared Thermogram;
(6) take off the infrared thermal imagery location-plate of having taken, take the Infrared Thermogram of sample to be analyzed,, confirm the real coordinate position at each position of sample to be analyzed according to the position relation of conversion thermal column and sample to be analyzed.
2. infrared thermal imagery coordinate location method according to claim 1 is characterized in that: base plate is processed by the material of poor radiation described in the step (1), and the material of described poor radiation is plastics, timber or pottery.
3. infrared thermal imagery coordinate location method according to claim 1 is characterized in that: the size of base plate is 1cm described in the step (1)
2~ 1m
2
4. infrared thermal imagery coordinate location method according to claim 1 is characterized in that: thermal column is processed by the good metal material of thermal diffusivity described in the step (1), and described metal material is iron, copper, aluminium, tin, tungsten or nickel.
5. infrared thermal imagery coordinate location method according to claim 1 is characterized in that: the quantity of thermal column is 1 ~ 100 described in the step (1).
6. infrared thermal imagery coordinate location method according to claim 1 is characterized in that: an end of thermal column vertically is embedded in the base plate of infrared thermal imagery location-plate described in the step (1), and the other end exceeds backplate surface 0.1 ~ 20cm.
7. infrared thermal imagery coordinate location method according to claim 1; It is characterized in that: in the step (6) for small sample; The infrared thermal imagery location-plate is placed on the device with position limiting structure, adjustment thermal infrared imager and device with position limiting structure on same straight line, taken the Infrared Thermogram of infrared thermal imagery location-plate after; Take off the infrared thermal imagery location-plate; Place small sample to be analyzed in same position,, confirm the real coordinate position at each position of this small sample through taking the Infrared Thermogram of small sample.
8. infrared thermal imagery coordinate location method according to claim 1; It is characterized in that: for large-scale sample, the infrared thermal imagery location-plate is fixed on the large-scale sample in the step (6), adjusts large-scale sample and thermal infrared imager on same straight line; After having taken the Infrared Thermogram of infrared thermal imagery location-plate; Take off the infrared thermal imagery location-plate, take the Infrared Thermogram of large-scale sample to be analyzed, confirm the real coordinate position at this each position of large-scale sample.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210171905.6A CN102706458B (en) | 2012-05-29 | 2012-05-29 | Infrared thermal imaging coordinate positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210171905.6A CN102706458B (en) | 2012-05-29 | 2012-05-29 | Infrared thermal imaging coordinate positioning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102706458A true CN102706458A (en) | 2012-10-03 |
| CN102706458B CN102706458B (en) | 2014-06-25 |
Family
ID=46899408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210171905.6A Active CN102706458B (en) | 2012-05-29 | 2012-05-29 | Infrared thermal imaging coordinate positioning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102706458B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104284103A (en) * | 2014-09-26 | 2015-01-14 | 国家电网公司 | Calibration method of internal parameters of thermal infrared camera |
| CN105548258A (en) * | 2015-11-26 | 2016-05-04 | 天津津航技术物理研究所 | Rapid composite material image damage detection method based on infrared imaging |
| CN109751955A (en) * | 2017-11-01 | 2019-05-14 | 北京振兴计量测试研究所 | Non-contact object displacement measuring device and the measurement method for using it |
| CN111006744A (en) * | 2019-12-17 | 2020-04-14 | 北京德火科技有限责任公司 | Infrared thermal imaging type aviation oil liquid level detection method |
| CN111998768A (en) * | 2020-06-10 | 2020-11-27 | 中国科学院武汉岩土力学研究所 | System and method for realizing drilling positioning based on thermal imaging technology |
| CN114054709A (en) * | 2021-11-17 | 2022-02-18 | 成都星云智联科技有限公司 | Method, equipment and storage medium for identifying and tracking casting blank |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006170648A (en) * | 2004-12-13 | 2006-06-29 | Kurabo Ind Ltd | Chart for calibration and method of measuring internal parameter |
| JP2008202971A (en) * | 2007-02-16 | 2008-09-04 | Ihi Corp | Device and method for adjusting infrared camera |
| JP2011064636A (en) * | 2009-09-18 | 2011-03-31 | Suzuki Motor Corp | Calibration device for thermal image camera |
| CN102156986A (en) * | 2011-04-12 | 2011-08-17 | 华南理工大学 | Calibration method of near-infrared camera |
| CN102221409A (en) * | 2011-04-12 | 2011-10-19 | 华南理工大学 | Near infrared calibration board design method |
-
2012
- 2012-05-29 CN CN201210171905.6A patent/CN102706458B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006170648A (en) * | 2004-12-13 | 2006-06-29 | Kurabo Ind Ltd | Chart for calibration and method of measuring internal parameter |
| JP2008202971A (en) * | 2007-02-16 | 2008-09-04 | Ihi Corp | Device and method for adjusting infrared camera |
| JP2011064636A (en) * | 2009-09-18 | 2011-03-31 | Suzuki Motor Corp | Calibration device for thermal image camera |
| CN102156986A (en) * | 2011-04-12 | 2011-08-17 | 华南理工大学 | Calibration method of near-infrared camera |
| CN102221409A (en) * | 2011-04-12 | 2011-10-19 | 华南理工大学 | Near infrared calibration board design method |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104284103A (en) * | 2014-09-26 | 2015-01-14 | 国家电网公司 | Calibration method of internal parameters of thermal infrared camera |
| CN105548258A (en) * | 2015-11-26 | 2016-05-04 | 天津津航技术物理研究所 | Rapid composite material image damage detection method based on infrared imaging |
| CN105548258B (en) * | 2015-11-26 | 2018-06-19 | 天津津航技术物理研究所 | Composite impact damage rapid detection method based on infrared imaging |
| CN109751955A (en) * | 2017-11-01 | 2019-05-14 | 北京振兴计量测试研究所 | Non-contact object displacement measuring device and the measurement method for using it |
| CN111006744A (en) * | 2019-12-17 | 2020-04-14 | 北京德火科技有限责任公司 | Infrared thermal imaging type aviation oil liquid level detection method |
| CN111006744B (en) * | 2019-12-17 | 2024-04-19 | 北京德火科技有限责任公司 | Infrared thermal imaging type aviation oil liquid level detection method |
| CN111998768A (en) * | 2020-06-10 | 2020-11-27 | 中国科学院武汉岩土力学研究所 | System and method for realizing drilling positioning based on thermal imaging technology |
| CN114054709A (en) * | 2021-11-17 | 2022-02-18 | 成都星云智联科技有限公司 | Method, equipment and storage medium for identifying and tracking casting blank |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102706458B (en) | 2014-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102706458B (en) | Infrared thermal imaging coordinate positioning method | |
| Thokchom et al. | Analysis of fluid flow and particle transport in evaporating droplets exposed to infrared heating | |
| CN109709140B (en) | Method and device for measuring local convective heat transfer coefficient under microscale | |
| Attalla et al. | Experimental investigation of heat transfer for a jet impinging obliquely on a flat surface | |
| Attalla et al. | Heat transfer from a flat surface to an inclined impinging jet | |
| CN104284103A (en) | Calibration method of internal parameters of thermal infrared camera | |
| Porras-Amores et al. | Using quantitative infrared thermography to determine indoor air temperature | |
| JP2016192965A (en) | Method and system for high-speed pcr heating | |
| CN101936775A (en) | Combined measuring device and method for air outlet temperature filed of wind tube | |
| Gfroerer et al. | Thermal diffusivity imaging | |
| CN103630085A (en) | Multi-angle blade measuring device and method | |
| CN105445116A (en) | High-temperature multi-axial cyclic test device for polymer materials | |
| EP3051278B1 (en) | 3d thermal diffusivity | |
| CN205607902U (en) | Metal heat preservation plate thermal insulation performance detection device | |
| CN106353361A (en) | Method for testing laser absorptivity of material with coating layer | |
| CN110686982B (en) | Cross double-pull comprehensive test platform and method suitable for high-temperature condition | |
| CN109470363B (en) | Curved surface thin wall heating heat flow distribution measuring method based on infrared thermal imaging temperature measurement technology | |
| WO2016142864A1 (en) | Batch and continuous methods for evaluating the physical and thermal properties of films | |
| CN205643221U (en) | Heat dissipation testing arrangement | |
| Yang et al. | Infrared identification of internal overheating components inside an electric control cabinet by inverse heat transfer problem | |
| CN106482287B (en) | A kind of method and air-conditioning wind direction control method that heat source is positioned using infrared signal | |
| CN107782604A (en) | A kind of high flux graphite heating module of rapid and uniform heating | |
| Pitz et al. | Simulation of the laser beam forming process with moving meshes for large aluminium plates | |
| CN102565130A (en) | Defect measuring apparatus and defect measuring method | |
| Alifanov et al. | Complex identification of thermophysical properties of anisotropic composite material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180222 Address after: 528303 Guangdong Foshan city Shunde District Ronggui Rong Li neighborhood committee Jianfeng Road No. 7, two floor 218 Patentee after: Guangdong Shunde Zhousi Mdt InfoTech Ltd Address before: 528300 Shunde, Foshan, Daliang new city Desheng Road, No. 1 Patentee before: Shunde Sysu Institute for Solar Energy |