CN102706458B - Infrared thermal imaging coordinate positioning method - Google Patents

Infrared thermal imaging coordinate positioning method Download PDF

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CN102706458B
CN102706458B CN201210171905.6A CN201210171905A CN102706458B CN 102706458 B CN102706458 B CN 102706458B CN 201210171905 A CN201210171905 A CN 201210171905A CN 102706458 B CN102706458 B CN 102706458B
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infrared thermal
infrared
thermal image
plate
location
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CN102706458A (en
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林杨欢
王学孟
沈辉
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Guangdong Shunde Zhousi Mdt Infotech Ltd
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SHUNDE SYSU INSTITUTE FOR SOLAR ENERGY
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Abstract

本发明公开了一种红外热像坐标定位方法,含以下步骤:(1)选取红外热像定位板,红外热像定位板包括底板和垂直设于底板上的多个散热柱;(2)均匀加热红外热像定位板;(3)拍摄红外热像定位板的红外热像图;(4)找出红外热像定位板的红外热像图中的低温点;(5)根据红外热像图中红外热像定位板上散热柱的位置参数,计算出红外热像图中每个像素点的实际坐标位置;(6)取下拍摄完的红外热像定位板,拍摄待分析样品的红外热像图,根据换算散热柱与待分析样品的位置关系,确定待分析样品各部位的实际坐标位置。该方法简单、精度高,能够快速确定温度异常点的位置情况,可以适用于各种场合,具有很强的实用性。

The invention discloses an infrared thermal image coordinate positioning method, which comprises the following steps: (1) selecting an infrared thermal image positioning plate, the infrared thermal image positioning plate includes a base plate and a plurality of cooling columns vertically arranged on the base plate; (2) uniformly Heating the infrared thermal image positioning plate; (3) shooting the infrared thermal image of the infrared thermal image positioning plate; (4) finding out the low temperature point in the infrared thermal image of the infrared thermal image positioning plate; (5) according to the infrared thermal image The position parameters of the heat dissipation column on the mid-infrared thermal image positioning board are used to calculate the actual coordinate position of each pixel in the infrared thermal image; (6) remove the infrared thermal image positioning board after shooting, and take the infrared thermal image of the sample to be analyzed According to the image diagram, the actual coordinate position of each part of the sample to be analyzed is determined according to the positional relationship between the converted cooling column and the sample to be analyzed. The method is simple, has high precision, can quickly determine the location of the abnormal temperature point, is applicable to various occasions, and has strong practicability.

Description

一种红外热像坐标定位方法A Coordinate Positioning Method of Infrared Thermal Image

技术领域 technical field

本发明属于红外热像技术领域,具体涉及一种红外热像坐标定位方法。The invention belongs to the technical field of infrared thermal imaging, and in particular relates to an infrared thermal imaging coordinate positioning method.

背景技术 Background technique

由于红外热成像技术能够进行非接触式的、高分辨率的温度成像,能够生成高质量的图像,可提供测量目标的众多信息,弥补了人类肉眼的不足,因此已经在电力系统、土木工程、汽车、冶金、石化、医疗等诸多行业得到广泛应用,未来的发展前景更不可限量。随着红外热像技术应用的发展,其对红外图像分析的速度、精度都有了更高的要求。目前,大多数的红外图像分析都是通过红外图像的轮廓与样品轮廓比较来确定温度异常点的位置。这样的方法精度低、速度慢,如果物体的发射率和温度与背景的相差不大的话还会出现难以确定温度异常点位置的情况。Because infrared thermal imaging technology can perform non-contact, high-resolution temperature imaging, generate high-quality images, provide a lot of information on measurement targets, and make up for the lack of human eyes, it has been used in power systems, civil engineering, Automobile, metallurgy, petrochemical, medical and many other industries have been widely used, and the future development prospect is even more limitless. With the development of the application of infrared thermal imaging technology, it has higher requirements for the speed and accuracy of infrared image analysis. At present, most of the infrared image analysis is to determine the position of the temperature anomaly point by comparing the profile of the infrared image with the profile of the sample. Such a method has low precision and slow speed. If the emissivity and temperature of the object are not much different from the background, it will be difficult to determine the position of the temperature anomaly.

发明内容 Contents of the invention

本发明的目的在于提供一种能快速、准确的从热像图像中找到像素对应的实际位置坐标的红外热像坐标定位方法,该方法简单、精度高,能够快速确定温度异常点的位置情况,可以适用于各种场合,具有很强的实用性。The purpose of the present invention is to provide an infrared thermal image coordinate positioning method that can quickly and accurately find the actual position coordinates corresponding to the pixels from the thermal image. It can be applied to various occasions and has strong practicability.

本发明的上述目的是通过如下方法来实现的:一种红外热像坐标定位方法,含以下步骤:The above object of the present invention is achieved by the following method: a method for positioning infrared thermal image coordinates, comprising the following steps:

(1)选取红外热像定位板,所述红外热像定位板包括底板和垂直设于底板上的多个散热柱;(1) selecting an infrared thermal image positioning plate, the infrared thermal image positioning plate includes a base plate and a plurality of heat dissipation columns vertically arranged on the base plate;

(2)均匀加热红外热像定位板;(2) Heating the infrared thermal image positioning board evenly;

(3)采用红外热像仪拍摄红外热像定位板的红外热像图;(3) Use an infrared thermal imager to shoot an infrared thermal image of the infrared thermal image positioning board;

(4)找出红外热像定位板的红外热像图中的低温点;(4) Find out the low temperature point in the infrared thermal image of the infrared thermal image positioning plate;

(5)根据红外热像图中红外热像定位板上散热柱的位置参数,计算出红外热像图中每个像素点的实际坐标位置;(5) Calculate the actual coordinate position of each pixel in the infrared thermal image according to the position parameters of the cooling column on the infrared thermal image positioning plate in the infrared thermal image;

(6)拍摄完红外热像定位板的红外热像图后,取下红外热像定位板,拍摄待分析样品的红外热像图,根据换算散热柱与待分析样品的位置关系,确定待分析样品各部位的实际坐标位置。(6) After taking the infrared thermal image of the infrared thermal image positioning plate, remove the infrared thermal image positioning plate, take the infrared thermal image of the sample to be analyzed, and determine the positional relationship between the heat dissipation column and the sample to be analyzed according to the positional relationship between the converted cooling column and the sample to be analyzed The actual coordinate position of each part of the sample.

在上述步骤中:In the above steps:

本发明步骤(1)中所述底板由散热性差的材料制成,所述的散热性差的材料优选但不局限于塑料、木材或陶瓷。The bottom plate in the step (1) of the present invention is made of a material with poor heat dissipation, and the material with poor heat dissipation is preferably but not limited to plastic, wood or ceramics.

本发明步骤(1)中所述底板的大小优选但不局限于1cm2~1m2The size of the bottom plate in step (1) of the present invention is preferably but not limited to 1 cm 2 ~1 m 2 .

本发明步骤(1)中所述散热柱由散热性好的金属材质制成,所述的金属材质优选但不局限于铁、铜、铝、钨、锡或镍。The cooling post in the step (1) of the present invention is made of a metal material with good heat dissipation, and the metal material is preferably but not limited to iron, copper, aluminum, tungsten, tin or nickel.

本发明步骤(1)中所述散热柱的数量优选但不局限于1~100个。The number of cooling columns described in step (1) of the present invention is preferably but not limited to 1-100.

本发明步骤(1)中所述散热柱的一端垂直镶嵌于红外热像定位板的底板中,另一端高出底板表面优选但不局限于0.1~20cm。One end of the cooling column described in step (1) of the present invention is vertically embedded in the bottom plate of the infrared thermal image positioning plate, and the other end is preferably but not limited to 0.1-20 cm higher than the surface of the bottom plate.

本发明中采用的红外热像定位板,包括底板和垂直设于底板上的散热柱,这是一种表面上钉有散热柱的板材,底板的制作材料为散热能力较差的材料,如:塑料、表面有保温涂层的板材等;散热柱为具有良好散热能力的材料制成,如:各类金属材料,散热柱被垂直固定在底板表面。The infrared thermal image positioning plate adopted in the present invention includes a bottom plate and a heat dissipation column vertically arranged on the bottom plate, which is a plate with a heat dissipation column nailed on the surface, and the base plate is made of a material with poor heat dissipation capacity, such as: Plastic, boards with thermal insulation coating on the surface, etc.; the heat dissipation column is made of materials with good heat dissipation capabilities, such as: various metal materials, and the heat dissipation column is vertically fixed on the surface of the bottom plate.

红外热像定位板的主要原理是:在定位板被均匀加热后,由于散热柱无论比表面积还是材料散热特性都比底板的大,所以散热柱散热速度要快得多,在一定时间内拍摄得到的红外热像图中就会出现显著的低温点。由测量多个散热柱之间的距离及位置关系与红外热像图中低温点的关系的比较,通过程序计算就可算出红外热像图中每个像素点所代表的实际坐标位置。The main principle of the infrared thermal image positioning board is: after the positioning board is evenly heated, since the heat dissipation column is larger than the bottom plate in terms of specific surface area and material heat dissipation characteristics, the heat dissipation speed of the heat dissipation column is much faster, and it can be photographed within a certain period of time. There will be a significant low temperature point in the infrared thermal image. By comparing the distance and position relationship between the measured multiple heat dissipation columns with the relationship of the low temperature point in the infrared thermal image, the actual coordinate position represented by each pixel in the infrared thermal image can be calculated through program calculation.

本发明步骤(4)中可以通过人眼识别或电脑识别程序找出红外热像定位板的红外热像图中的低温点;In step (4) of the present invention, the low temperature point in the infrared thermal image of the infrared thermal image positioning plate can be found out through human eye recognition or computer recognition program;

本发明步骤(6)中对于小型样品,将红外热像定位板置于具有限位结构的装置上,调整红外热像仪和具有限位结构的装置在同一直线上,拍摄完红外热像定位板的红外热像图后,取下红外热像定位板,在同样位置放置待分析的小型样品,通过拍摄小型样品的红外热像图,确定该小型样品的各部位的实际坐标位置。In the step (6) of the present invention, for small samples, the infrared thermal image positioning plate is placed on the device with the limiting structure, the infrared thermal imager and the device with the limiting structure are adjusted on the same straight line, and the infrared thermal image is positioned after shooting After taking the infrared thermal image of the plate, remove the infrared thermal image positioning plate, place the small sample to be analyzed at the same position, and determine the actual coordinate position of each part of the small sample by taking the infrared thermal image of the small sample.

本发明步骤(6)中对于大型样品,将红外热像定位板固定于大型样品上,调整大型样品和红外热像仪在同一直线上,拍摄完红外热像定位板的红外热像图后,取下红外热像定位板,拍摄待分析的大型样品的红外热像图,确定该大型样品各部位的实际坐标位置。In step (6) of the present invention, for a large sample, the infrared thermal image positioning plate is fixed on the large sample, and the large sample and the infrared thermal imager are adjusted on the same straight line, and after the infrared thermal image of the infrared thermal image positioning plate is taken, Remove the infrared thermal image positioning plate, take an infrared thermal image of the large sample to be analyzed, and determine the actual coordinate position of each part of the large sample.

作为本发明的一种实施方式,对于小型的样品,一般放在具有限位结构的装置上拍摄红外热像图,进行一次定位后就可拍摄多个样品的热像图并进行分析,其具体过程如下:As an embodiment of the present invention, for small samples, it is generally placed on a device with a limit structure to take infrared thermal images, and after one positioning, multiple thermal images of samples can be taken and analyzed. The process is as follows:

(1)将红外热像仪和具有限位结构的装置固定在同一直线上;(1) Fix the infrared thermal imager and the device with a limit structure on the same straight line;

(2)将红外热像定位板放置在具有限位结构装置的限定结构上;(2) Place the infrared thermal image positioning plate on the limited structure with the limit structure device;

(3)均匀加热红外热像定位板;(3) Heating the infrared thermal image positioning board evenly;

(4)拍摄红外热像定位板的红外热像图;(4) Shoot the infrared thermal image of the infrared thermal image positioning board;

(5)找到低温点,根据散热柱位置关系计算红外热像定位板的红外热像图中每个像素点的实际坐标位置;(5) Find the low temperature point, and calculate the actual coordinate position of each pixel in the infrared thermal imaging image of the infrared thermal image positioning board according to the positional relationship of the cooling column;

(6)取下红外热像定位板,在同样位置放置待分析的小型样品,通过拍摄小型样品的红外热像图,确定该小型样品的各部位的实际坐标位置。(6) Remove the infrared thermal image positioning plate, place the small sample to be analyzed in the same position, and determine the actual coordinate position of each part of the small sample by taking the infrared thermal image of the small sample.

然后可以更换样品,进行拍摄分析,经过一次定位,可以拍摄多个样品的热像图并进行分析。Then the sample can be replaced, photographed and analyzed, and after one positioning, thermal images of multiple samples can be taken and analyzed.

作为本发明的一种实施方式,对于大型的样品,一般直接拍摄样品,将红外热像仪和样品放在在同一直线上,每个样品都需要定位一次再进行拍摄分析,其具体过程如下:As an embodiment of the present invention, for large samples, the samples are generally taken directly, and the infrared thermal imager and the sample are placed on the same straight line. Each sample needs to be positioned once before shooting and analysis. The specific process is as follows:

(1)将红外热像仪和样品放置在同一直线上;(1) Place the thermal imaging camera and the sample on the same straight line;

(2)将红外热像定位板固定在样品的某些位置上,如直角边框处或中心处;(2) Fix the infrared thermal image positioning plate on certain positions of the sample, such as the right-angle frame or the center;

(3)均匀加热红外热像定位板;(3) Heating the infrared thermal image positioning board evenly;

(4)拍摄红外热像定位板的红外热像图;(4) Shoot the infrared thermal image of the infrared thermal image positioning board;

(5)找到低温点,根据散热柱位置关系计算红外热像图中每个像素点的实际坐标位置;(5) Find the low temperature point, and calculate the actual coordinate position of each pixel in the infrared thermal image according to the positional relationship of the cooling column;

(6)取下红外热像定位板,拍摄大型样品的红外热像图并进行分析;(6) Remove the infrared thermal image positioning plate, take and analyze the infrared thermal image of a large sample;

最后更换样品,重复上述(1)~(6)步骤,可以获得其他大型样品各部位的实际坐标位置。Finally, replace the sample and repeat the above steps (1)~(6) to obtain the actual coordinate positions of various parts of other large samples.

与现有技术相比,本发明具有如下优点:Compared with prior art, the present invention has following advantage:

(1)本发明可以根据红外热像仪的图像分辨率来定制散热柱的大小,使得低温点只占1个或几个像素点,这就能避免通过人眼去选取低温点的时候出现的主观偏差过大,同时也能降低电脑选取低温点程序的难度、减少程序出现错误的可能;(1) The present invention can customize the size of the heat dissipation column according to the image resolution of the infrared thermal imager, so that the low temperature point only occupies one or a few pixels, which can avoid the occurrence of the problem when the low temperature point is selected by the human eye. If the subjective deviation is too large, it can also reduce the difficulty of selecting a low-temperature program for the computer and reduce the possibility of program errors;

(2)本发明红外热像定位板制作简单,无需任何的电气设备,成本低廉;(2) The infrared thermal image positioning plate of the present invention is simple to manufacture, does not need any electrical equipment, and has low cost;

(3)本发明根据样品的形状及红外热像仪的分辨率,通过安排不同的散热柱数量及相对位置关系,可以进一步提高坐标定位精度,降低计算程序的难度和系统误差;(3) According to the shape of the sample and the resolution of the infrared thermal imager, the present invention can further improve the coordinate positioning accuracy and reduce the difficulty and system error of the calculation program by arranging different numbers of cooling columns and relative positional relationships;

(4)通过本发明的方法,无论是产线上大批量小样品的测试分析还是大型施工现场的大样品检测,都可以快速、精确的确定红外热像图的像素实际坐标位置,从而快速、精确的对样品中的缺陷、异常点进行分析、修复等工作。(4) Through the method of the present invention, whether it is the test and analysis of large batches of small samples on the production line or the detection of large samples at large construction sites, the actual coordinate position of the pixel of the infrared thermal image can be determined quickly and accurately, thereby quickly and Accurately analyze and repair the defects and abnormal points in the sample.

附图说明 Description of drawings

图1是本发明实施例1中的采用的红外热像定位板的图示;Fig. 1 is the pictorial diagram of the infrared thermal image positioning plate adopted in the embodiment 1 of the present invention;

图2是本发明实施例1中将红外热像坐标定位方法应用于晶体硅太阳电池缺陷分析领域的示意图;2 is a schematic diagram of applying the infrared thermal imaging coordinate positioning method to the field of defect analysis of crystalline silicon solar cells in Embodiment 1 of the present invention;

图2a是图2中定位板摆放位置的俯视图;Fig. 2a is a top view of the placement position of the positioning plate in Fig. 2;

图3是本发明实施例2中采用的红外热像定位板示意图;Fig. 3 is a schematic diagram of an infrared thermal image positioning plate used in Embodiment 2 of the present invention;

图4是本发明实施例2中将定位板置于窑炉炉壁上的示意图;Fig. 4 is the schematic diagram of placing the positioning plate on the furnace wall of the kiln in Example 2 of the present invention;

图4a是实施例2中采用红外热像定位板检修大型窑炉壁的示意图;Fig. 4a is a schematic diagram of using an infrared thermal image positioning board to overhaul a large kiln wall in embodiment 2;

图5是本发明实施例3中采用的红外定位板的示意图;5 is a schematic diagram of an infrared positioning board used in Embodiment 3 of the present invention;

图6a是本发明实施例3中将红外定位板置于支架上进行红外坐标定位的示意图;Fig. 6a is a schematic diagram of placing the infrared positioning plate on the bracket for infrared coordinate positioning in embodiment 3 of the present invention;

图6b是图6a中红外定位板置于支架上的结构示意图;Fig. 6b is a schematic diagram of the structure of the infrared positioning plate placed on the bracket in Fig. 6a;

图6c是本发明实施例3中将汽车轮胎置于支架上的进行红外坐标定位的示意图;Fig. 6c is a schematic diagram of placing an automobile tire on a bracket for infrared coordinate positioning in Example 3 of the present invention;

图6d是本发明实施例3中将汽车轮胎置于支架上的示意图;Fig. 6d is a schematic diagram of placing a car tire on a support in Example 3 of the present invention;

其中:11、底板;12、散热柱;1、测试台;2、限位条;3、定位板(散热柱未显示)或测试样品;4、红外热像仪;21、定位板;22、窑炉墙壁;23、红外热像仪。Among them: 11. Bottom plate; 12. Cooling column; 1. Test bench; 2. Limiting bar; 3. Positioning plate (cooling column not shown) or test sample; 4. Infrared thermal imager; 21. Positioning plate; 22. Kiln wall; 23. Infrared camera.

具体实施方式 Detailed ways

以下结合附图对本发明作进一步的说明。The present invention will be further described below in conjunction with the accompanying drawings.

实施例1Example 1

将红外热像坐标定位方法应用于晶体硅太阳电池缺陷分析的领域,红外热像定位板如图1所示,包括底板11和垂直设于底板11上的散热柱12,底板11使用塑料板,尺寸在本实施例为156mm×156mm×3mm,散热柱12使用不锈钢,直径为1mm,高度为20mm,但实际上以上并非是对底板和散热住的尺寸进行限定,可以根据分析对象的不同,进行相应的调整即可,散热柱数量为三个,分布于直角三角形的三个顶点上,该直角三角形的边长为120mm、100mm,直角顶点位于以定位板坐标系的(10mm,10mm)处(该坐标系以底板一直角顶点为原点O,平行于直角三角形两边的边为xy轴,如图1中所示)。散热柱使用这样的分布方式主要利用这三点建立一个直角坐标系,通过直角坐标系的变换公式可以很方便的计算出热像图中像素点的实际坐标位置,同时这三点位置关系简单,无论是人眼去辨别还是通过图像识别程序进行识别的相当简单,出错几率低。The infrared thermal image coordinate positioning method is applied to the field of defect analysis of crystalline silicon solar cells. The infrared thermal image positioning plate is shown in Figure 1, including a base plate 11 and a heat dissipation column 12 vertically arranged on the base plate 11. The base plate 11 is made of a plastic plate. In this embodiment, the size is 156mm×156mm×3mm, and the heat dissipation column 12 is made of stainless steel, with a diameter of 1mm and a height of 20mm, but in fact the above is not to limit the size of the bottom plate and the heat sink, and it can be determined according to the different analysis objects. Corresponding adjustments are enough. The number of heat dissipation columns is three, distributed on the three vertices of a right triangle. The side lengths of the right triangle are 120mm and 100mm, and the vertices of the right angle are located at (10mm, 10mm) in the positioning board coordinate system ( The coordinate system takes the right-angled vertex of the bottom plate as the origin O, and the sides parallel to the two sides of the right-angled triangle as the xy axis, as shown in Figure 1). The distribution method of the cooling column mainly uses these three points to establish a rectangular coordinate system. The actual coordinate position of the pixel point in the thermal image can be easily calculated through the transformation formula of the rectangular coordinate system. At the same time, the relationship between the three points is simple. Whether it is to distinguish by human eyes or through image recognition programs, it is quite simple, and the probability of error is low.

本实例的具体实施步骤如下:The specific implementation steps of this example are as follows:

(1)将上述的红外热像定位板放在测量台上,该测量台有互相垂直的固定方块作为限位装置将定位板放置的位置固定在红外热像仪的视场中间位置,调整红外热像仪和测量台在同一直线上,如图2和2a所示;(1) Put the above-mentioned infrared thermal image positioning plate on the measuring platform, the measuring platform has fixed squares perpendicular to each other as a limit device to fix the position of the positioning plate in the middle of the field of view of the infrared thermal imager, adjust the infrared The thermal imager and the measuring platform are on the same straight line, as shown in Figure 2 and 2a;

(2)使用电吹风向红外热像定位板吹热风,使红外热像定位板的底板均匀受热;(2) Use a hair dryer to blow hot air to the infrared thermal image positioning plate, so that the bottom plate of the infrared thermal image positioning plate is evenly heated;

(3)使用红外热像仪的实时拍摄功能,等红外热像图中出现明显的呈直角分布的三个低温点后拍摄红外热像图;(3) Use the real-time shooting function of the infrared thermal imager, wait for three obvious low-temperature points distributed at right angles to appear in the infrared thermal image, and then take the infrared thermal image;

(4)使用定位程序调出红外热像图,使用鼠标在红外热像图中选出三个低温点的位置,然后通过程序计算出三个低温点变换为散热柱所在底板坐标系中的位置的坐标变换公式,通过该坐标变换公式计算出红外热像图中每个像素点所相对的在红外热像定位板的底板上的实际坐标位置;(4) Use the positioning program to call out the infrared thermal image, use the mouse to select the positions of the three low-temperature points in the infrared thermal image, and then calculate the three low-temperature points through the program and transform them into the positions in the base plate coordinate system where the heat dissipation column is located The coordinate transformation formula is used to calculate the actual coordinate position of each pixel in the infrared thermal image on the bottom plate of the infrared thermal image positioning board through the coordinate transformation formula;

(5)取下定位板,在同样位置放上需要分析的156mm×156mm太阳电池片,通过相应的处理后拍摄红外热像图,便可分析出电池片中缺陷的相应位置。(5) Remove the positioning plate, put the 156mm×156mm solar cell to be analyzed at the same position, and take the infrared thermal image after corresponding processing, and then analyze the corresponding position of the defect in the cell.

实施例2Example 2

将红外热像坐标定位方法应用于大型窑炉壁检修的领域,使用的红外热像定位板如图3所示,包括底板1和垂直设于底板1上的散热柱2,由于窑炉壁温度较高,所以底板1使用耐高温的陶瓷板,尺寸为1000mm×1000mm×20mm,散热柱2使用热稳定性能较好的钨,直径为10mm,高度为10mm,但实际上以上并非是对底板和散热住的尺寸进行限定,可以根据分析对象的不同,进行相应的调整即可,散热柱数量为四个,分布如图3所示,该直角三角形的边长为8000mm、8000mm,直角顶点位于以定位板坐标系的(100mm,100mm)处(该坐标系以底板一直角顶点为原点O,平行于直角三角形两边的边为xy轴,如图1中所示)。散热柱使用这样的分布方式主要利用这四点建立一个直角坐标系,其中垂直边在中间处多一个散热柱有两个作用:1、辨别xy轴;2、提高竖直方向也是y轴的分辨精度(由于窑炉壁上的耐火砖都是平放的,竖直的方向比水平方向需要更高的精度去确定那个砖块出了问题)The infrared thermal image coordinate positioning method is applied to the field of large-scale kiln wall maintenance. The infrared thermal image positioning board used is shown in Figure 3, including the bottom plate 1 and the cooling column 2 vertically arranged on the bottom plate 1. Due to the temperature of the kiln wall Higher, so the bottom plate 1 uses a high temperature resistant ceramic plate with a size of 1000mm×1000mm×20mm, and the heat dissipation column 2 uses tungsten with better thermal stability, with a diameter of 10mm and a height of 10mm, but in fact the above is not for the bottom plate and The size of the heat sink is limited, and it can be adjusted according to the different analysis objects. The number of cooling columns is four, and the distribution is shown in Figure 3. The side lengths of the right triangle are 8000mm and 8000mm, and the vertices of the right angle are located at Position (100mm, 100mm) of the positioning plate coordinate system (the coordinate system takes the right angle vertex of the bottom plate as the origin O, and the side parallel to the two sides of the right triangle is the xy axis, as shown in Figure 1). Using such a distribution method of cooling columns mainly uses these four points to establish a rectangular coordinate system, in which one more cooling column in the middle of the vertical side has two functions: 1. Identify the xy axis; 2. Improve the resolution of the vertical direction and the y axis Accuracy (Since the refractory bricks on the furnace wall are laid flat, the vertical direction requires higher precision than the horizontal direction to determine which brick has a problem)

本实例的具体实施步骤如下:The specific implementation steps of this example are as follows:

(1)如图3所示将上述的红外热像定位板21放在窑炉壁22的左下角,红外热像定位板21的左边缘和下边缘与窑炉壁22的左下角边缘对齐;(1) As shown in Figure 3, the above-mentioned infrared thermal image positioning plate 21 is placed on the lower left corner of the kiln wall 22, and the left edge and the lower edge of the infrared thermal image positioning plate 21 are aligned with the lower left edge of the kiln wall 22;

(2)红外热像定位板紧贴炉壁,由于炉壁温度较高,经过热传导红外热像定位板均匀受热;(2) The infrared thermal image positioning plate is close to the furnace wall. Due to the high temperature of the furnace wall, the infrared thermal image positioning plate is evenly heated through heat conduction;

(3)使用红外热像仪23的实时拍摄功能,等红外热象图中出现明显的呈直角分布的四个低温点后拍摄红外热像定位板的红外热象图;(3) Use the real-time shooting function of the infrared thermal imager 23 to take the infrared thermal image of the infrared thermal image positioning plate after four obvious low temperature points distributed at right angles appear in the infrared thermal image;

(4)使用定位程序调出红外热像定位板的红外热像图,使用鼠标在红外热像图中选出四个低温点的位置,然后通过程序计算出四个低温点变换为散热柱所在底板坐标系中的位置的坐标变换公式,通过该坐标变换公式计算出红外热象图中每个像素点所相对的实际底板坐标位置;(4) Use the positioning program to call up the infrared thermal image of the infrared thermal image positioning board, use the mouse to select the positions of four low-temperature points in the infrared thermal image, and then calculate the four low-temperature points through the program and transform them into the location of the cooling column The coordinate transformation formula of the position in the bottom plate coordinate system, the actual bottom plate coordinate position relative to each pixel point in the infrared thermal image is calculated by the coordinate transformation formula;

(5)移开红外热像定位板,重新拍摄炉壁的红外热像图,经过对图中温度异常点的像素位置计算,便可以计算出需要更换耐火砖的位置,并据此进行窑炉壁的维护。(5) Remove the infrared thermal image positioning plate, and re-take the infrared thermal image of the furnace wall. After calculating the pixel position of the abnormal temperature point in the picture, the position where the refractory brick needs to be replaced can be calculated, and the kiln can be carried out accordingly. Wall maintenance.

实施例3Example 3

将红外热像坐标定位方法应用于汽车轮胎性能测试,使用的红外热像定位板如图5所示,包括底板和垂直设于底板上的散热柱,因为轮胎需要固定在一个支架上进行试验并且研究的主要对象是圆外环的橡胶部分,所以使用的定位板是一个圆环形,以圆环外径为190.5mm、内径为25.0mm为例,定位板的厚度与所需测试的轮胎的厚度一样便于固定在支架上,定位板的底板为木料制成,这是因为木材容易加工,重量也较轻,比较适合作为轮胎测试的定位板,散热柱使用不锈钢,本实施例中以直径为5mm,高度为10mm为例进行说明,散热柱数量为15个,分布如图5所示,散热柱使用这样的分布方式能轻易的确立一个极坐标系,每隔60度分布不同数量的散热柱即使在人为确定低温点时出现误差的情况下也可以通过最小二乘法的算法较为精确的确定极坐标原点的位置,同时也可以通过不同散热柱间隔比较的方法避免红外热像仪图像的像素为直角坐标分布而引起的实际坐标确定的误差。The infrared thermal image coordinate positioning method is applied to the performance test of automobile tires. The infrared thermal image positioning board used is shown in Figure 5, including the bottom plate and the cooling column vertically arranged on the bottom plate, because the tire needs to be fixed on a bracket for testing and The main object of the study is the rubber part of the outer ring, so the positioning plate used is a circular ring. Taking the outer diameter of the ring as 190.5mm and the inner diameter as 25.0mm as an example, the thickness of the positioning plate is consistent with the tire to be tested. The same thickness is convenient to be fixed on the bracket, and the bottom plate of the positioning plate is made of wood, which is because the wood is easy to process and light in weight, so it is more suitable as a positioning plate for tire testing. The heat dissipation column is made of stainless steel. In this embodiment, the diameter is 5mm, the height is 10mm as an example, the number of heat dissipation columns is 15, and the distribution is shown in Figure 5. Using this distribution method, a polar coordinate system can be easily established, and different numbers of heat dissipation columns are distributed every 60 degrees. Even if there is an error in the artificial determination of the low temperature point, the position of the origin of the polar coordinates can be determined more accurately through the algorithm of the least squares method, and at the same time, the pixel of the infrared thermal imager image can be avoided by comparing the intervals of different cooling columns. The error in determining the actual coordinates caused by the distribution of rectangular coordinates.

本实例的具体实施步骤如下:The specific implementation steps of this example are as follows:

(1)如图6a-6b所示,将上述的红外热像定位板固定在测试支架上;(1) As shown in Figures 6a-6b, fix the above-mentioned infrared thermal image positioning plate on the test bracket;

(2)使用热吹风进行加热或使用热水浸泡使定位板均匀受热;(2) Use hot air to heat or soak in hot water to heat the positioning plate evenly;

(3)使用红外热像仪的实时拍摄功能,等红外热像图中出现15个低温点后拍摄红外热象图;(3) Use the real-time shooting function of the infrared thermal imager, wait for 15 low-temperature spots to appear in the infrared thermal image, and then shoot the infrared thermal image;

(4)使用定位程序调出红外热像图,使用鼠标在红外热像图中选出15个低温点的位置,然后通过程序计算出15个低温点变换为散热柱所在底板坐标系中的位置的坐标变换公式,通过该坐标变换公式计算出红外热像图中每个像素点所相对的实际底板坐标位置;(4) Use the positioning program to call out the infrared thermal image, use the mouse to select the positions of 15 low-temperature points in the infrared thermal image, and then calculate the 15 low-temperature points through the program and transform them into the positions in the base plate coordinate system where the heat dissipation column is located The coordinate transformation formula is used to calculate the actual coordinate position of the base plate relative to each pixel in the infrared thermal image;

(5)移开定位板,如图6c-6d所示在支架上固定好要测试的轮胎,经过旋转摩擦或应力试验等实验后,使用红外热像仪拍摄热像图,经过对热像图中温度异常点像素位置计算,便可以计算出需其实际位置,从而研究轮胎的各项性能,并以此为根据发现问题和进行改善设计。(5) Remove the positioning plate, fix the tire to be tested on the bracket as shown in Figure 6c-6d, and after the experiments such as rotation friction or stress test, use the infrared thermal imager to take the thermal image, after the thermal image By calculating the pixel position of the temperature abnormal point, the actual position can be calculated, so as to study the performance of the tire, and use this as a basis to find problems and improve the design.

以上列举具体实施例对本发明进行说明。需要指出的是,以上实施例只用于对本发明作进一步说明,不代表本发明的保护范围,其他人根据本发明的提示做出的非本质的修改和调整,仍属于本发明的保护范围。The present invention has been described by citing specific examples above. It should be pointed out that the above examples are only used to further illustrate the present invention, and do not represent the protection scope of the present invention. Non-essential modifications and adjustments made by others according to the hints of the present invention still belong to the protection scope of the present invention.

Claims (2)

1. an infrared thermal imagery coordinate location method, is characterized in that containing following steps:
(1) choose infrared thermal imagery location-plate, described infrared thermal imagery location-plate comprises base plate and is vertical at the multiple thermal columns on base plate;
(2) homogeneous heating infrared thermal imagery location-plate;
(3) adopt thermal infrared imager to take the Infrared Thermogram of infrared thermal imagery location-plate;
(4) find out the low warm spot in the Infrared Thermogram of infrared thermal imagery location-plate;
(5), according to the location parameter of thermal column on infrared thermal imagery location-plate in Infrared Thermogram, calculate the real coordinate position of each pixel in Infrared Thermogram;
(6) take off the infrared thermal imagery location-plate of having taken, take the Infrared Thermogram of sample to be analyzed, according to the position relationship of conversion thermal column and sample to be analyzed, determine the real coordinate position at the each position of sample to be analyzed;
Described in step (1), base plate is made up of the material of poor radiation, and the material of described poor radiation is plastics, timber or pottery;
Described in step (1), thermal column is made up of the good metal material of thermal diffusivity, and described metal material is iron, copper, aluminium, tin, tungsten or nickel.
2. infrared thermal imagery coordinate location method according to claim 1, is characterized in that: described in step (1), the size of base plate is 1cm 2~ 1m 2.
3. infrared thermal imagery coordinate location method according to claim 1, is characterized in that: described in step (1), the quantity of thermal column is 1 ~ 100.
4. infrared thermal imagery coordinate location method according to claim 1, is characterized in that: described in step (1), one end of thermal column is vertically embedded in the base plate of infrared thermal imagery location-plate, and the other end exceeds backplate surface 0.1 ~ 20cm.
5. infrared thermal imagery coordinate location method according to claim 1, it is characterized in that: in step (6) for small sample, infrared thermal imagery location-plate is placed on the device with position limiting structure, the device of adjusting thermal infrared imager and have position limiting structure is on same straight line, take after the Infrared Thermogram of infrared thermal imagery location-plate, take off infrared thermal imagery location-plate, place small sample to be analyzed in same position, by taking the Infrared Thermogram of small sample, determine the real coordinate position at each position of this small sample.
6. infrared thermal imagery coordinate location method according to claim 1, it is characterized in that: in step (6) for large-scale sample, infrared thermal imagery location-plate is fixed on large-scale sample, adjust large-scale sample and thermal infrared imager on same straight line, take after the Infrared Thermogram of infrared thermal imagery location-plate, take off infrared thermal imagery location-plate, take the Infrared Thermogram of large-scale sample to be analyzed, determine the real coordinate position at this each position of large-scale sample.
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