CN102706458B - Infrared thermal imaging coordinate positioning method - Google Patents
Infrared thermal imaging coordinate positioning method Download PDFInfo
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- CN102706458B CN102706458B CN201210171905.6A CN201210171905A CN102706458B CN 102706458 B CN102706458 B CN 102706458B CN 201210171905 A CN201210171905 A CN 201210171905A CN 102706458 B CN102706458 B CN 102706458B
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Abstract
The invention discloses an infrared thermal imaging coordinate positioning method which comprises the follow steps: (1), selecting an infrared thermal imaging positioning plate, wherein the infrared thermal imaging positioning plate comprises a bottom plate and a plurality of heat radiation pillars vertically arranged on the bottom plate; (2), uniformly heating the infrared thermal imaging positioning plate; (3), shooting the infrared thermal imaging maps of the infrared thermal imaging positioning plate; (4), finding a low temperature point in the infrared thermal images of the infrared thermal imaging positioning plate; (5), calculating the practical coordinate position of each pixel in the infrared thermal image according to location parameters of the heat radiation pillar on the infrared thermal imaging positioning plate in a infrared thermal image; (6), taking down the shot infrared thermal imaging positioning plate, shooting infrared thermal images of samples to be analyzed, and determining the practical coordinate positions of all parts of the samples to be analyzed according to the recalculating to the position relation of the heat radiation pillar and the samples to be analyzed. The method is simple, is high in accuracy, can quickly determine the position condition of abnormal temperature points, is applicable to various occasions, and has a very strong practicability.
Description
Technical field
The invention belongs to Infrared Thermography Technology field, be specifically related to a kind of infrared thermal imagery coordinate location method.
Background technology
Because infrared thermal imaging technique can carry out contactless, high-resolution temperature imaging, can generate high-quality image, numerous information of measurement target can be provided, make up the deficiency of human eye, therefore be used widely in all conglomeraties such as electric system, civil engineering work, automobile, metallurgy, petrochemical industry, medical treatment, following development prospect is more limitless.Along with the development of Infrared Thermography Technology application, its speed, precision to infrared image analysis has had higher requirement.At present, most infrared image analysis is all the position that profile by infrared image and sample profile relatively carry out to determine temperature anomaly point.Such method precision is low, speed is slow, if being more or less the same of the emissivity of object and temperature and background also there will be the situation that is difficult to determine temperature anomaly point position.
Summary of the invention
The object of the present invention is to provide a kind of infrared thermal imagery coordinate location method that can find fast and accurately actual position coordinate corresponding to pixel from thermography picture, the method is simple, precision is high, can determine fast the situation of temperature anomaly point, go for various occasions, there is very strong practicality.
Above-mentioned purpose of the present invention realizes by the following method: a kind of infrared thermal imagery coordinate location method, contains following steps:
(1) choose infrared thermal imagery location-plate, described infrared thermal imagery location-plate comprises base plate and is vertical at the multiple thermal columns on base plate;
(2) homogeneous heating infrared thermal imagery location-plate;
(3) adopt thermal infrared imager to take the Infrared Thermogram of infrared thermal imagery location-plate;
(4) find out the low warm spot in the Infrared Thermogram of infrared thermal imagery location-plate;
(5), according to the location parameter of thermal column on infrared thermal imagery location-plate in Infrared Thermogram, calculate the real coordinate position of each pixel in Infrared Thermogram;
(6) taken after the Infrared Thermogram of infrared thermal imagery location-plate, take off infrared thermal imagery location-plate, take the Infrared Thermogram of sample to be analyzed, according to the position relationship of conversion thermal column and sample to be analyzed, determine the real coordinate position at the each position of sample to be analyzed.
In above-mentioned steps:
Described in step of the present invention (1), base plate is made up of the material of poor radiation, and the material of described poor radiation is preferably but not limited to plastics, timber or pottery.
Described in step of the present invention (1), the size of base plate is preferably but not limited to 1cm
2~ 1m
2.
Described in step of the present invention (1), thermal column is made up of the good metal material of thermal diffusivity, and described metal material is preferably but not limited to iron, copper, aluminium, tungsten, tin or nickel.
Described in step of the present invention (1), the quantity of thermal column is preferably but not limited to 1 ~ 100.
Described in step of the present invention (1), one end of thermal column is vertically embedded in the base plate of infrared thermal imagery location-plate, and the other end exceeds backplate surface preferably but not limited to 0.1 ~ 20cm.
The infrared thermal imagery location-plate adopting in the present invention, comprise base plate and be vertical at the thermal column on base plate, this is the sheet material that on a kind of surface, nail has thermal column, and the making material of base plate is the poor material of heat-sinking capability, as: there is the sheet material of heat insulation coating etc. on plastics, surface; Thermal column is that the material with good heat radiating ability is made, as: each metalloid material, thermal column is vertically fixed on backplate surface.
The cardinal principle of infrared thermal imagery location-plate is: after location-plate is by homogeneous heating, large than base plate all due to thermal column specific surface area or material heat dissipation characteristics, so thermal column radiating rate is faster, takes in the Infrared Thermogram obtaining and just there will be significant low warm spot within a certain period of time.By the comparison of the relation of low warm spot in the distance between the multiple thermal columns of measurement and position relationship and Infrared Thermogram, calculate the real coordinate position that just can calculate each pixel representative in Infrared Thermogram by program.
In step of the present invention (4), can find out the low warm spot in the Infrared Thermogram of infrared thermal imagery location-plate by eye recognition or computer recognizer;
In step of the present invention (6) for small sample, infrared thermal imagery location-plate is placed on the device with position limiting structure, the device of adjusting thermal infrared imager and have position limiting structure is on same straight line, take after the Infrared Thermogram of infrared thermal imagery location-plate, take off infrared thermal imagery location-plate, place small sample to be analyzed in same position, by taking the Infrared Thermogram of small sample, determine the real coordinate position at each position of this small sample.
In step of the present invention (6) for large-scale sample, infrared thermal imagery location-plate is fixed on large-scale sample, adjust large-scale sample and thermal infrared imager on same straight line, take after the Infrared Thermogram of infrared thermal imagery location-plate, take off infrared thermal imagery location-plate, take the Infrared Thermogram of large-scale sample to be analyzed, determine the real coordinate position at this each position of large-scale sample.
As one embodiment of the present invention, for small-sized sample, be generally placed on the device photographs Infrared Thermogram with position limiting structure, to carry out just can taking the thermography of multiple samples and analyzing after one-time positioning, its detailed process is as follows:
(1) thermal infrared imager and the device with position limiting structure are fixed on same straight line;
(2) infrared thermal imagery location-plate is placed on the limiting structure with limit structure device;
(3) homogeneous heating infrared thermal imagery location-plate;
(4) Infrared Thermogram of shooting infrared thermal imagery location-plate;
(5) find low warm spot, according to the real coordinate position of each pixel in the Infrared Thermogram of thermal column position relationship calculating infrared thermal imagery location-plate;
(6) take off infrared thermal imagery location-plate, place small sample to be analyzed in same position, by taking the Infrared Thermogram of small sample, determine the real coordinate position at each position of this small sample.
Then can change sample, take analysis, through one-time positioning, can take the thermography of multiple samples and analyze.
As one embodiment of the present invention, for large-scale sample, general direct shooting sample, is placed on thermal infrared imager and sample on same straight line, and each sample needs location once to take analysis again, and its detailed process is as follows:
(1) thermal infrared imager and sample are placed on same straight line;
(2) infrared thermal imagery location-plate is fixed on some position of sample, as frame place, right angle or center;
(3) homogeneous heating infrared thermal imagery location-plate;
(4) Infrared Thermogram of shooting infrared thermal imagery location-plate;
(5) find low warm spot, calculate the real coordinate position of each pixel in Infrared Thermogram according to thermal column position relationship;
(6) take off infrared thermal imagery location-plate, take the Infrared Thermogram of large-scale sample and analyze;
Finally change sample, repeat above-mentioned (1) ~ (6) step, can obtain the real coordinate position at other each positions of large-scale sample.
Compared with prior art, tool of the present invention has the following advantages:
(1) the present invention can customize according to the image resolution ratio of thermal infrared imager the size of thermal column, make low warm spot only account for 1 or several pixel, the subjective deviation occurring when this just can be avoided going to choose low warm spot by human eye is excessive, also can reduce computer simultaneously and choose the difficulty of low warm spot program, the wrong possibility of minimizing program appearance;
(2) infrared thermal imagery location-plate of the present invention is made simply, without any electrical equipment, with low cost;
(3) the present invention's shape per sample and the resolution of thermal infrared imager, by arranging different thermal column quantity and relative position relation, can further improve coordinate setting precision, reduces difficulty and the systematic error of calculation procedure;
(4) by method of the present invention, no matter be to produce the test analysis of small sample in enormous quantities or the detection of the large sample of large construction field on line, can determine fast, accurately the pixel real coordinate position of Infrared Thermogram, thus fast, accurately to the defect in sample, abnormity point analyze, the work such as reparation.
Accompanying drawing explanation
Fig. 1 is the diagram of the infrared thermal imagery location-plate of the employing in the embodiment of the present invention 1;
Fig. 2 is the schematic diagram that in the embodiment of the present invention 1, infrared thermal imagery coordinate location method is applied to crystal-silicon solar cell defect analysis field;
Fig. 2 a is the vertical view of location-plate putting position in Fig. 2;
Fig. 3 is the infrared thermal imagery location-plate schematic diagram adopting in the embodiment of the present invention 2;
Fig. 4 in the embodiment of the present invention 2 is placed in location-plate the schematic diagram on kiln furnace wall;
Fig. 4 a is the schematic diagram that adopts infrared thermal imagery location-plate maintenance kiln large-scale furnace wall in embodiment 2;
Fig. 5 is the schematic diagram of the infrared location-plate of employing in the embodiment of the present invention 3;
Fig. 6 a is placed in by infrared location-plate the schematic diagram that carries out infrared coordinate location on support in the embodiment of the present invention 3;
Fig. 6 b is that in Fig. 6 a, infrared location-plate is placed in the structural representation on support;
Fig. 6 c in the embodiment of the present invention 3 is placed in doughnut the schematic diagram that carries out infrared coordinate location on support;
Fig. 6 d in the embodiment of the present invention 3 is placed in doughnut the schematic diagram on support;
Wherein: 11, base plate; 12, thermal column; 1, test board; 2, positive stop strip; 3, location-plate (thermal column does not show) or test sample; 4, thermal infrared imager; 21, location-plate; 22, kiln wall; 23, thermal infrared imager.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further illustrated.
Infrared thermal imagery coordinate location method is applied to the field of crystal-silicon solar cell defect analysis, infrared thermal imagery location-plate as shown in Figure 1, comprise base plate 11 and be vertical at the thermal column 12 on base plate 11, base plate 11 uses plastic plate, size is 156mm × 156mm × 3mm at the present embodiment, thermal column 12 uses stainless steel, diameter is 1mm, be highly 20mm, but in fact above is not that base plate and the size of dispelling the heat are limited, can be according to the difference of analytic target, carry out corresponding adjustment, thermal column quantity is three, be distributed on three summits of right-angle triangle, the length of side of this right-angle triangle is 120mm, 100mm, summit, right angle is positioned at the (10mm with location-plate coordinate system, 10mm) locate (this coordinate system take base plate always angular vertex as initial point O, the limit that is parallel to right-angle triangle both sides is xy axle, as shown in fig. 1).Thermal column uses such distribution mode mainly to utilize set up a rectangular coordinate system at these 3, can calculate very easily the real coordinate position of pixel in thermography by the transformation for mula of rectangular coordinate system, these 3 position relationships are simple simultaneously, be no matter human eye go to distinguish or identify by image recognition program quite simple, the probability of makeing mistakes is low.
The concrete implementation step of this example is as follows:
(1) above-mentioned infrared thermal imagery location-plate is placed on test desk, the position that this test desk has mutually perpendicular fixed blocks as stop means, location-plate to be placed is fixed on the centre position, visual field of thermal infrared imager, adjust thermal infrared imager and test desk on same straight line, as shown in Fig. 2 and 2a;
(2) use hair dryer to infrared thermal imagery location-plate blowing hot-air, make the base plate thermally equivalent of infrared thermal imagery location-plate;
(3) the real-time shoot function of use thermal infrared imager, waits in Infrared Thermogram and occurs significantly at right angles after three low warm spots of distribution, taking Infrared Thermogram;
(4) use finder to recall Infrared Thermogram, use mouse in Infrared Thermogram, to select the position of three low warm spots, then calculate by program the coordinate transform formula that three low temperature point transformation are the position in the base plate coordinate system of thermal column place, calculate the relative real coordinate position on the base plate of infrared thermal imagery location-plate of each pixel in Infrared Thermogram by this coordinate transform formula;
(5) take off location-plate, put in same position the 156mm × 156mm solar cell piece that needs analysis, by taking Infrared Thermogram after corresponding processing, just can analyze the relevant position of defect in cell piece.
Infrared thermal imagery coordinate location method is applied to the field of kiln large-scale furnace wall maintenance, the infrared thermal imagery location-plate using as shown in Figure 3, comprise base plate 1 and be vertical at the thermal column 2 on base plate 1, because kiln wall temperature is higher, so base plate 1 uses resistant to elevated temperatures ceramic wafer, be of a size of 1000mm × 1000mm × 20mm, thermal column 2 uses the good tungsten of thermal stability, diameter is 10mm, be highly 10mm, but in fact above is not that base plate and the size of dispelling the heat are limited, can be according to the difference of analytic target, carry out corresponding adjustment, thermal column quantity is four, distribute as shown in Figure 3, the length of side of this right-angle triangle is 8000mm, 8000mm, summit, right angle is positioned at the (100mm with location-plate coordinate system, 100mm) locate (this coordinate system take base plate always angular vertex as initial point O, the limit that is parallel to right-angle triangle both sides is xy axle, as shown in fig. 1).Thermal column uses such distribution mode mainly to utilize set up a rectangular coordinate system at these 4, and wherein in middle, many thermal columns have two effects to perpendicular edge: 1, distinguish xy axle; 2, improve the resolving accuracy that vertical direction is also y axle (because the refractory brick on kiln wall all keeps flat, vertical direction ratio horizontal direction needs higher precision to go to determine that fragment of brick is out of joint)
The concrete implementation step of this example is as follows:
(1) as shown in Figure 3 above-mentioned infrared thermal imagery location-plate 21 is placed on to the lower left corner of kiln wall 22, the lower left corner justified margin of the left hand edge of infrared thermal imagery location-plate 21 and lower limb and kiln wall 22;
(2) infrared thermal imagery location-plate is close to furnace wall, because furnace wall temperature is higher, through overheated conduction infrared thermal imagery location-plate thermally equivalent;
(3) the real-time shoot function of use thermal infrared imager 23, waits the Infrared image of taking infrared thermal imagery location-plate in Infrared image after obvious four the low warm spots that at right angles distribute of appearance;
(4) use finder to recall the Infrared Thermogram of infrared thermal imagery location-plate, use mouse in Infrared Thermogram, to select the position of four low warm spots, then calculate by program the coordinate transform formula that four low temperature point transformation are the position in the base plate coordinate system of thermal column place, calculate by this coordinate transform formula the actual bottom plate coordinate position that in Infrared image, each pixel is relative;
(5) remove infrared thermal imagery location-plate, again take the Infrared Thermogram of furnace wall, through the location of pixels of temperature anomaly point in figure is calculated, just can calculate the position that need to change refractory brick, and carry out accordingly the maintenance of kiln wall.
Infrared thermal imagery coordinate location method is applied to doughnut performance test, the infrared thermal imagery location-plate using as shown in Figure 5, comprise base plate and be vertical at the thermal column on base plate, because tire need to be fixed on the rubber part that the main object of testing and studying on a support is circle outer shroud, so the location-plate using is an annular, take annulus external diameter as 190.5mm, internal diameter is that 25.0mm is example, being of uniform thickness of the thickness of location-plate and the tire of required test is convenient to be fixed on support, the base plate of location-plate is that timber is made, this is because timber is easily processed, weight is also lighter, relatively be suitable as the location-plate of Tire testing, thermal column uses stainless steel, in the present embodiment take diameter as 5mm, highly for 10mm is that example describes, thermal column quantity is 15, distribute as shown in Figure 5, thermal column uses such distribution mode can establish easily a polar coordinate system, even if also can determine comparatively accurately by the algorithm of least square method the position of polar coordinates initial point in the situation that the thermal column of 60 degree distribution varying numbers occurs error in the time artificially determining low warm spot, simultaneously also can avoid the pixel of thermal infrared imager image by the method for different thermal columns interval comparison is the rectangular coordinate definite error of actual coordinate causing that distributes.
The concrete implementation step of this example is as follows:
(1), as shown in Fig. 6 a-6b, above-mentioned infrared thermal imagery location-plate is fixed on test bracket;
(2) use blowing hot wind heat or use hot-water soak to make location-plate thermally equivalent;
(3) the real-time shoot function of use thermal infrared imager, waits in Infrared Thermogram and occurs taking Infrared image after 15 low warm spots;
(4) use finder to recall Infrared Thermogram, use mouse in Infrared Thermogram, to select the position of 15 low warm spots, then calculate by program the coordinate transform formula that 15 low temperature point transformation are the position in the base plate coordinate system of thermal column place, calculate by this coordinate transform formula the actual bottom plate coordinate position that in Infrared Thermogram, each pixel is relative;
(5) remove location-plate, as being shown in, Fig. 6 c-6d on support, fixes the tire that will test, after the experiment such as spin friction or stress test, use thermal infrared imager to take thermography, through temperature anomaly point location of pixels in thermography is calculated, just can calculate and need its physical location, thus the properties of study of tire, and take this as a foundation and pinpoint the problems and improve design.
The present invention will be described more than to enumerate specific embodiment.It is pointed out that above embodiment, only for the invention will be further described, does not represent protection scope of the present invention, nonessential modification and adjustment that other people prompting according to the present invention is made, still belong to protection scope of the present invention.
Claims (2)
1. an infrared thermal imagery coordinate location method, is characterized in that containing following steps:
(1) choose infrared thermal imagery location-plate, described infrared thermal imagery location-plate comprises base plate and is vertical at the multiple thermal columns on base plate;
(2) homogeneous heating infrared thermal imagery location-plate;
(3) adopt thermal infrared imager to take the Infrared Thermogram of infrared thermal imagery location-plate;
(4) find out the low warm spot in the Infrared Thermogram of infrared thermal imagery location-plate;
(5), according to the location parameter of thermal column on infrared thermal imagery location-plate in Infrared Thermogram, calculate the real coordinate position of each pixel in Infrared Thermogram;
(6) take off the infrared thermal imagery location-plate of having taken, take the Infrared Thermogram of sample to be analyzed, according to the position relationship of conversion thermal column and sample to be analyzed, determine the real coordinate position at the each position of sample to be analyzed;
Described in step (1), base plate is made up of the material of poor radiation, and the material of described poor radiation is plastics, timber or pottery;
Described in step (1), thermal column is made up of the good metal material of thermal diffusivity, and described metal material is iron, copper, aluminium, tin, tungsten or nickel.
2. infrared thermal imagery coordinate location method according to claim 1, is characterized in that: described in step (1), the size of base plate is 1cm
2~ 1m
2.
3. infrared thermal imagery coordinate location method according to claim 1, is characterized in that: described in step (1), the quantity of thermal column is 1 ~ 100.
4. infrared thermal imagery coordinate location method according to claim 1, is characterized in that: described in step (1), one end of thermal column is vertically embedded in the base plate of infrared thermal imagery location-plate, and the other end exceeds backplate surface 0.1 ~ 20cm.
5. infrared thermal imagery coordinate location method according to claim 1, it is characterized in that: in step (6) for small sample, infrared thermal imagery location-plate is placed on the device with position limiting structure, the device of adjusting thermal infrared imager and have position limiting structure is on same straight line, take after the Infrared Thermogram of infrared thermal imagery location-plate, take off infrared thermal imagery location-plate, place small sample to be analyzed in same position, by taking the Infrared Thermogram of small sample, determine the real coordinate position at each position of this small sample.
6. infrared thermal imagery coordinate location method according to claim 1, it is characterized in that: in step (6) for large-scale sample, infrared thermal imagery location-plate is fixed on large-scale sample, adjust large-scale sample and thermal infrared imager on same straight line, take after the Infrared Thermogram of infrared thermal imagery location-plate, take off infrared thermal imagery location-plate, take the Infrared Thermogram of large-scale sample to be analyzed, determine the real coordinate position at this each position of large-scale sample.
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| CN104284103B (en) * | 2014-09-26 | 2018-08-24 | 国网江西省电力有限公司电力科学研究院 | A kind of thermal infrared camera intrinsic parameter scaling method |
| CN105548258B (en) * | 2015-11-26 | 2018-06-19 | 天津津航技术物理研究所 | Composite impact damage rapid detection method based on infrared imaging |
| CN109751955A (en) * | 2017-11-01 | 2019-05-14 | 北京振兴计量测试研究所 | Non-contact object displacement measuring device and the measurement method for using it |
| CN111006744B (en) * | 2019-12-17 | 2024-04-19 | 北京德火科技有限责任公司 | Infrared thermal imaging type aviation oil liquid level detection method |
| CN111998768B (en) * | 2020-06-10 | 2021-11-16 | 中国科学院武汉岩土力学研究所 | System and method for realizing drilling positioning based on thermal imaging technology |
| CN114054709B (en) * | 2021-11-17 | 2023-05-23 | 成都星云智联科技有限公司 | Method, equipment and storage medium for identifying and tracking casting blank |
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