CN102694249A - CMMB (China Mobile Multimedia Broadcasting) antenna and mobile multimedia broadcasting device - Google Patents
CMMB (China Mobile Multimedia Broadcasting) antenna and mobile multimedia broadcasting device Download PDFInfo
- Publication number
- CN102694249A CN102694249A CN2012101431551A CN201210143155A CN102694249A CN 102694249 A CN102694249 A CN 102694249A CN 2012101431551 A CN2012101431551 A CN 2012101431551A CN 201210143155 A CN201210143155 A CN 201210143155A CN 102694249 A CN102694249 A CN 102694249A
- Authority
- CN
- China
- Prior art keywords
- microflute
- cmmb
- antenna
- cmmb antenna
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
The invention provides a CMMB antenna. The CMMB antenna comprises a resonator unit, wherein the resonator unit comprises a dielectric substrate, a first copper coating and a second copper coating respectively coated on the dielectric substrate, a copper belt arranged inside the dielectric substrate, and a plurality of plated through holes which are arranged on the edge of the dielectric substrate and distributed at the two sides of the copper belt, wherein a plurality of micro flutes are arranged on the first copper coating; a feeder interface getting through the dielectric substrate is arranged at one end of the copper belt; and the first copper coating and the second copper coating are electrically connected by the plated through holes. The invention further provides a multimedia mobile broadcasting device using the CMMB antenna. With the adoption of the CMMB antenna provided by the invention, the performance requirements of the CMMB antenna are satisfied by simple structural design; moreover, the effect when the CMMB antenna is arranged inside the mobile multimedia broadcasting device is almost the same as that of a current external CMMB antenna by combining the used low-loss antenna dielectric substrate.
Description
Technical field
The invention belongs to communication equipment field, be specifically related to a kind of CMMB antenna and use the CMMB device of this antenna.
Background technology
Development along with wireless communication technique; Wireless telecommunications system has had increasingly high requirement; In order to satisfy the requirement of communication, existing various wireless routers adopt external antenna basically, greatly the surplus energy of the industrial design of limits product and mechanism design performance; And external antenna also need design impedance matching connector and mechanism's module of adaptation, and these connectors and mechanism's module have almost accounted for the cost of entire antenna more than 90 percent.
Antenna is as the radiating element and the receiving device of final radiofrequency signal, and its operating characteristic will directly influence the service behaviour of whole electronic system.The installation of antenna not only need be considered the shape of antenna itself; The electromagnetic radiation that produces when also needing the more device busy of considering the antenna place; Particularly the high-frequency work of central processing unit has produced electromagnetic radiation, and this can receive and send signal to antenna cause bad influence, even can therefore cause the antenna can't operate as normal; Therefore, the placement of antenna is to need the expensive time to consider and checking in electronic system.
Outside the CMMB antenna equipment of being positioned over more,, be provided with like this and can take bigger space can receive enough signals; Also can have influence on the aesthetics of CMMB equipment; Therefore, need a kind of antenna of design, put the requirement that in CMMB equipment, also can satisfy its communication.
Summary of the invention
In order to solve the problem that exists in the existing CMMB antenna; The invention provides a kind of CMMB antenna, this antenna has promptly satisfied the performance requirement of CMMB antenna through simple structural design, realizes that simultaneously the CMMB antenna is built-in; To achieve these goals, the present invention adopts following technical scheme:
A kind of CMMB antenna; Comprise resonant element; Said resonant element comprises: a medium substrate, overlay on first of the upper and lower surface of said medium substrate respectively and cover copper layer and second and cover the copper layer, be positioned at the copper strips of said medium substrate, and be positioned at said medium substrate edge and be distributed in the number of metal hole of said copper strips both sides; Said first cover the copper layer be provided with about said copper strips symmetry, two opening frame shapes, first microflute, second microflute that opening is relative and the 3rd microflute that connects said first microflute and said second microflute; The width of said the 3rd microflute increases to said first microflute, the second microflute direction along said the 3rd microflute center respectively; Said copper strips one end setting runs through the feeding interface of said medium substrate, and said first covers copper layer and said second covers the copper layer through said plated-through hole electrical connection.
Further, the resonance band of said resonant element is 474-794MHz.
Further, the direction to the bottom land of said first microflute increases said first microflute width that is positioned at said the 3rd microflute right portions along the end of said the 3rd microflute right portions.
Further, to be positioned at the track that the width of said the 3rd microflute right portions increases be hyperbola, arc or parabola shaped to said first microflute.
Further, the both ends of said first microflute to said copper strips said first cover the projection of copper layer distance do not wait.
Further, the said copper strips other end is provided with the loading interfaces that can connect resistance.
Further, said medium substrate component comprises glass cloth, epoxy resin and comprises the compound with said epoxy resin generation cross-linking reaction.
The present invention also provides a kind of CMMB device, comprises main frame, also comprises said CMMB antenna.
Further, said CMMB device is vehicle-mounted CMMB terminal.
Further, said vehicle-mounted CMMB terminal is fixed on the upper end, seat, and said CMMB antenna is arranged at the inboard near vehicle window of the headrest cover that coats said vehicle-mounted CMMB terminal.
CMMB antenna by using of the present invention little band transmission principle; Promptly satisfied the performance requirement of CMMB antenna through simple structural design; Can be applied to existing CMMB device flexibly; The low-loss antenna medium base material that is used in combination makes that effect and the existing external CMMB antenna effect when the CMMB antenna is built in the CMMB device is basic identical.
Description of drawings
Fig. 1 is the radiating element plan structure sketch map of CMMB antenna of the present invention;
Fig. 2 is that the radiating element of CMMB antenna of the present invention is looked up structural representation;
Fig. 3 is the sketch map of radiating element copper strips on medium substrate of CMMB antenna of the present invention;
Fig. 4 is the sketch map of radiating element plated-through hole on medium substrate of CMMB antenna of the present invention;
Fig. 5 is the structural representation of CMMB device of the present invention.
Embodiment
Now in detail with reference to the embodiment that describes in the accompanying drawing.For complete understanding the present invention, numerous details in following detailed description, have been mentioned.But it should be appreciated by those skilled in the art that the present invention can need not these details and realize.In other embodiments, be not described in detail known method.Process, assembly and circuit are in order to avoid unnecessarily make embodiment fuzzy.
First cover copper layer 1, second and cover the structure of copper layer 2, medium substrate 3 and copper strips 4 and the distribution of plated-through hole 8 referring to what be respectively CMMB antenna 10 resonant elements shown in Fig. 1-4; The resonant element of this CMMB antenna 10 comprises that first covers copper layer 1, second and cover copper layer 2, medium substrate 3, copper strips 4 and plated-through hole 8; First covers copper layer 1, second covers the upper and lower surface that copper layer 2 overlays on medium substrate 3 respectively; Cover first and to be provided with first microflute 11, second microflute 12 and the 3rd microflute 13 on the copper layer 1; First microflute 11 and second microflute 12 are opening opening opposing frame shape; First microflute 11 and second microflute 12 be about copper strips 4 symmetries, and the end that first microflute 11 is positioned at the 3rd microflute 13 left sides is positioned at the distance of the end on the 3rd microflute 13 right sides to copper strips 4 to the distance of copper strips 4 greater than first microflute 11, and the width that first microflute 11 is positioned at the 3rd microflute 13 right portions changes; This width is positioned at the part on the 3rd microflute 13 right sides along first microflute 13 end increases to the direction of the bottom land of first microflute 11; The track of this increase is a hyperbola, also can be arc or parabola shaped etc., the width intermediate narrower of the 3rd microflute 13; Two ends are wide, increased to first microflute 11, second microflute, 12 directions by the 3rd microflute 13 centers; Copper strips 4 is positioned at medium substrate 3, copper strips 4 first cover copper layer 1 projection vertically divide the 3rd microflute 13 equally, be provided with feeding interface 6 and loading interfaces 7 at the two ends of copper strips 4, feeding interface 6 runs through medium substrate 3 and second with loading interfaces 7 and covers copper layer 2; Plated-through hole 8 is provided with a plurality of; Be positioned at medium substrate 3 edges, and the symmetry the both sides that are distributed in copper strips 4, plated-through hole 8 be evenly distributed in medium substrate 3 around; Can regard one group as in the distribution of everywhere; Can regard every group in the present embodiment as has two plated-through holes 8, and one or other numbers also can be set, and plated-through hole 8 electrical connections first are covered copper layer 1 and second and covered copper layer 2.
In Fig. 1; First cover copper layer 1 annulus hole 14 cover copper layer 1 with first and form with copper strips 4 and open circuit, the feeding interface 6 of resonant element connects coaxial lines, is used for the input and the output of the signal of telecommunication; Loading interfaces 7 can increase by a resistance, changes the electromagnetic waveform mode that resonant element gives off.
During the external radiated electromagnetic wave of resonant element, the signal of telecommunication 6 is advanced to loading interfaces 7 along copper strips 4 from feeding interface, and the signal of telecommunication intercouples at first microflute 11, second microflute 12 and 13 of the 3rd microflutes, externally gives off electromagnetic wave.
Fig. 1-4 also shows a kind of concrete execution mode of CMMB antenna of the present invention, and the resonant element of this CMMB antenna is 80 * 80mm
2The groove width of first microflute 11 and second microflute, 12 ends is 4mm, and the end that first microflute 11 is positioned at the 3rd microflute 13 left sides is 20mm to the distance of bottom land, and the corresponding distance in right side is 29mm; The width of copper strips 4 is 0.9mm; The resonance band of this resonant element is 474-794MHz, and this execution mode also can connect 50-150 Ω resistance in loading interfaces 7, and other embodiments can be according to demand through repeatedly modulated test acquisition.
First kind execution mode is following:
In such execution mode, be used for the infiltration solution of some low dielectric constant and low loss of production and processing the present invention's medium substrate (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier spare or similar application part etc.).Said infiltration solution comprises: first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction; And one or more solvents.Wherein first component and second component dispose mixing according to a certain percentage.Above-mentioned first component, second component and said one or more solvents are made into said infiltration solution.Said infiltration solution is through stirring the back, will a said glass cloth soaking into first component and second component are adsorbed in the glass cloth perhaps on the surface; Baking is copied said glass cloth and is made said one or more solvent evaporates then, and makes first component and the mutual chemical combination of second component be cross-linked to form semi-solid preparation thing or solidfied material.The semi-solid preparation thing is meant to be copied the glass cloth of absorption first component and second component in the relatively low environment of temperature in baking, and first component comprises the soft mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.Solidfied material be meant with the glass cloth of absorption first component and second component baking copy temperature relatively than high ambient in, first component comprises the relative harder mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.Wherein said semi-solid preparation or solidfied material are worked under the 1GHz frequency, have≤4.0 nominal dielectric constant and≤0.01 electrical loss tangent amount.
In this execution mode; The glass cloth of said infiltration forms semi-solid preparation thing (in the form of sheets) through low-temperature bake; Said then semi-solid preparation thing is cut into cuts out sheet, and it is superimposed and be hot pressed into this and implement described multilayer dielectricity substrate (being multilayer layer pressing plate or sheet) according to the thickness needs said multi-disc to be cut out sheet.Wherein the hot pressing process purpose makes the component of winning comprise epoxy resin and the chemical combination cross-linking reaction all takes place the second component inclusion compound exactly.
Can certainly understand, the glass cloth of said infiltration directly forms solidfied material, single-layer medium substrate promptly of the present invention (being individual layer laminated sheet or sheet) through high-temperature baking.
In concrete embodiment, the compound of said second component can be selected the copolymer that comprises by polarity macromolecule and non-polar high polymer chemical combination for use, like styrene maleic anhydride copolymer.It is understandable that, can all can be used for the prescription composition of this execution mode with the copolymer of epoxy resin generation chemical combination cross-linking reaction.The styrene maleic anhydride copolymer of this execution mode wherein, its molecular formula is following:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6,8 styrene or any number in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of said second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In concrete embodiment, said epoxy resin and styrene maleic anhydride copolymer are prepared according to the ratio of sense value, add the certain amount of solvent wiring solution-forming then.Said epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process; Like common agitator and agitated reactor epoxy resin is evenly mixed with styrene maleic anhydride copolymer, thus make in the said solution epoxy resin with promptly be infiltration solution according to the invention after styrene maleic anhydride copolymer evenly mixes.
In concrete embodiment; Impel above-mentioned infiltration solution 200-400 gel in second (selecting 171 ℃ of gel ambient temperatures for use) through adding certain promoter, promote wherein about the above-mentioned 260 seconds infiltration solution gelatinizing time that (like 258-260 second or 250-270 second etc.) effect is better.Said promoter can be selected for use and included but not limited to tertiary amines, any one type or mixture between them in imidazoles and the boron trifluoride mono aminoethane.
Said one or more solvents can be selected for use and include but not limited to acetone, butanone, N, mix the mixed solvent that forms in dinethylformamide, EGME, the toluene between any one or the above-mentioned two or more solvent.
In another embodiment, said infiltration solution comprises: first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction; And one or more solvents.The mixture that the compound of said second component selects for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.Wherein said cyanate performed polymer concentration 75%.Promoter is selected methylimidazole for use; Said solvent is selected butanone for use.This execution mode soaks into solution specifically fills a prescription like following table:
In above-mentioned prescription, added styrene maleic anhydride copolymer and cyanate performed polymer simultaneously, the chemical combination cross-linking reaction all can take place with epoxy resin in both.
Second type of execution mode is following:
In second type of execution mode of the present invention; The composition (also can be referred to as compound or composite material) of some low dielectric constant and low loss of the medium substrate among production the present invention (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier spare or similar application part etc.); Said composition comprises glass cloth, first component and second component, and first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction.Wherein said composition is worked under the 1GHz frequency, has≤4.0 nominal dielectric constant and≤0.01 electrical loss tangent amount.Wherein in this execution mode, said composition is worked under the 1GHz frequency, has≤0.005 electrical loss tangent amount.
Said composition fabrication processes also comprises following technology:
At first, second component is comprised the compound and the said epoxy resin that crosslinked reaction take place with said epoxy resin prepare, add the certain amount of solvent wiring solution-forming then according to the ratio of sense value.In concrete embodiment, said compound comprises the copolymer of polarity macromolecule and non-polar high polymer chemical combination, and wherein the copolymer of preferred embodiment can be selected styrene maleic anhydride copolymer for use.Said epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, and like common agitator and agitated reactor epoxy resin are evenly mixed with styrene maleic anhydride copolymer.The styrene maleic anhydride copolymer of this execution mode wherein, its molecular formula is following:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6 or 8 styrene in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of said second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In concrete embodiment, make epoxy resin and styrene maleic anhydride copolymer in the said solution can carry out the chemical combination cross-linking reaction under certain condition, take place to depend on said glass cloth after the chemical combination cross-linking reaction, thereby form medium substrate of the present invention.
Said one or more solvents can be selected for use and include but not limited to acetone, butanone, N, in dinethylformamide, EGME, the toluene any one or above-mentioned between mixed solvent.
Said various component ratios of solution one specific embodiment such as following table:
Above-mentioned solution formula comprises epoxy resin, styrene maleic anhydride copolymer, cyanate performed polymer, promoter methylimidazole and a kind of solvent butanone.In above-mentioned prescription, added styrene maleic anhydride copolymer and cyanate performed polymer simultaneously, both are all crosslinked with epoxy resin ability chemical combination.
Then, from above-mentioned solution, extract said a small amount of test sample book,, regulate said solution at this fixed temperature environment gel time through adding promoter in a certain specified temp environmental testing said solution gelatinizing time.Can impel above-mentioned solution in 200-400 gel in time second through adding one or more promoter; Wherein said a certain specified temp environment is a single temperature value or a selected specific range of temperatures; At this execution mode; Carry out gel time through being set in 171 degrees centigrade of environment, make above-mentioned solution preferable in gel time about 260 seconds (like 258-260 second or 250-270 second etc.) effect.Said promoter can be selected for use and included but not limited to select for use tertiary amines, any one type or mixture between them in imidazoles and the boron trifluoride mono aminoethane.
The 3rd step is when above-mentioned test sample book during gel, is soaked into the back with glass cloth and taken out oven dry in 200-400 time range second, the formation composition in said solution.In these concrete steps; Glass cloth immersed fully to soak in the solution guarantee that said epoxy resin and styrene maleic anhydride copolymer are adsorbed in the glass cloth perhaps on the surface; The glass cloth that immerses solution then is through hanging on air dry oven 180 ℃ of bakings about 5 minutes; Purpose is fully volatilized the solvent butanone exactly, and makes said epoxy resin and styrene maleic anhydride copolymer chemical combination cross-linking reaction, and the product of glass cloth and said chemical combination cross-linking reaction makes the semi-solid preparation composition.It is understandable that, prolong stoving time with or improve baking temperature, can form hardening composition.General a large amount of commercial production adopts in the vertical gluing machine and accomplishes in the impregnation subsystem and baking oven subsystem.
At last, change composition and the conductive foil with oven dry carries out pressing.In these concrete steps, with change composition (prepreg or prepreg) and conductive foil pressing in the vacuum hotpressing machine of oven dry.Said conductive foil is selected for use and is comprised the electric conducting material that copper, silver, gold, aluminium or above-mentioned material alloy material etc. make.Because the price of copper product is relatively low, the conductive foil of therefore selecting for use copper to become is suitable for industrialization.
In order to be suitable for antenna system or some performance parameter requirements of electronic equipment, multi-disc prepreg or prepreg are carried out lamination formation multilayer layer pressing plate simultaneously.Use these laminated sheets and can effectively reduce the antenna recombination loss, and then guarantee the aerial radiation yield value.
Utilize above-mentioned composition, single-layer sheet prepreg or prepreg, multilayer layer pressing plate to be processed into antenna substrate, pcb board, copper-clad base plate, chip carrier spare or similar application part; Reduce the dielectric constant and the dielectric loss of above-mentioned product (antenna substrate, pcb board, copper-clad base plate, chip carrier spare or similar application part, single or multiple lift are pressed presser blade) through the form of introducing polarity and non-polar high polymer copolymer, thereby satisfy its demands of applications in electronic equipment.
Be illustrated in figure 5 as a kind of structural representation of CMMB device; This CMMB device is vehicle-mounted CMMB terminal 20; This CMMB terminal 20 comprises main frame (not shown), headrest cover 201, display screen 202, connecting rod 203, power line 204 and CMMB antenna 10; This vehicle-mounted CMMB terminal 20 is fixed on the upper end at seat through connecting rod 203; Headrest cover 201 coating vehicle-mounted CMMB terminal 20 main frame, CMMB antenna 10 and display screen 202 around, CMMB antenna 10 is placed on the inboard near vehicle window of headrest cover 201, so that receive and send the CMMB signal.
Combine accompanying drawing that preferred embodiment of the present invention is described above; But the present invention is not limited to above-mentioned embodiment; Those of ordinary skill in the art is under enlightenment of the present invention; Make under the scope situation that aim of the present invention and claim protect not breaking away from, all within protection of the present invention.
Claims (10)
1. CMMB antenna; Comprise resonant element; It is characterized in that; Said resonant element comprises: a medium substrate, overlay on first of the upper and lower surface of said medium substrate respectively and cover copper layer and second and cover the copper layer, be positioned at the copper strips of said medium substrate, and be positioned at said medium substrate edge and be distributed in the number of metal hole of said copper strips both sides; Said first cover the copper layer be provided with about said copper strips symmetry, two opening frame shapes, first microflute, second microflute that opening is relative and the 3rd microflute that connects said first microflute and said second microflute; The width of said the 3rd microflute increases to said first microflute, the second microflute direction along said the 3rd microflute center respectively; Said copper strips one end setting runs through the feeding interface of said medium substrate, and said first covers copper layer and said second covers the copper layer through said plated-through hole electrical connection.
2. CMMB antenna according to claim 1 is characterized in that, the resonance band of said resonant element is 474-794MHz.
3. CMMB antenna according to claim 1 is characterized in that, the direction to the bottom land of said first microflute increases the width that said first microflute is positioned at said the 3rd microflute right portions along the end of said the 3rd microflute right portions.
4. CMMB antenna according to claim 3 is characterized in that, the track that said first microflute is positioned at the width increase of said the 3rd microflute right portions is hyperbola, arc or parabola shaped.
5. CMMB antenna according to claim 3 is characterized in that, the both ends of said first microflute to said copper strips said first cover the projection of copper layer distance do not wait.
6. according to each described CMMB antenna of claim 1-5, it is characterized in that the said copper strips other end is provided with the loading interfaces that can connect resistance.
7. according to each described CMMB antenna of claim 1-5, it is characterized in that said medium substrate component comprises glass cloth, epoxy resin and comprises the compound with said epoxy resin generation cross-linking reaction.
8. a CMMB device comprises main frame, it is characterized in that, also comprises the described CMMB antenna of claim 1-7.
9. CMMB device according to claim 8 is characterized in that, said CMMB device is vehicle-mounted CMMB terminal.
10. CMMB antenna according to claim 9 is characterized in that, said vehicle-mounted CMMB terminal is fixed on the upper end, seat, and said CMMB antenna is arranged at the inboard near vehicle window of the headrest cover that coats said vehicle-mounted CMMB terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210143155.1A CN102694249B (en) | 2012-05-10 | 2012-05-10 | A kind of CMMB antenna and Mobile multi-media broadcasting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210143155.1A CN102694249B (en) | 2012-05-10 | 2012-05-10 | A kind of CMMB antenna and Mobile multi-media broadcasting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102694249A true CN102694249A (en) | 2012-09-26 |
| CN102694249B CN102694249B (en) | 2015-10-07 |
Family
ID=46859576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210143155.1A Active CN102694249B (en) | 2012-05-10 | 2012-05-10 | A kind of CMMB antenna and Mobile multi-media broadcasting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102694249B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1832252A (en) * | 2006-03-22 | 2006-09-13 | 北京航空航天大学 | Cross feed broad-band omnidirectional antenna |
| US20080136597A1 (en) * | 2006-12-08 | 2008-06-12 | Electronics And Telecommunications Research Institute | Rfid sensor tag antenna using coupling feeding method |
| CN101867074A (en) * | 2010-05-04 | 2010-10-20 | 华东交通大学 | Broadband filter based on defect ground plane integrated waveguide (DGW) structure |
| CN101982898A (en) * | 2010-08-24 | 2011-03-02 | 浙江大学 | Millimetre wave planar antenna and array thereof |
| CN102130379A (en) * | 2011-03-18 | 2011-07-20 | 中兴通讯股份有限公司 | Miniature microstrip antenna |
| CN102204112B (en) * | 2008-10-27 | 2014-03-12 | 三菱电机株式会社 | Radio communication device |
-
2012
- 2012-05-10 CN CN201210143155.1A patent/CN102694249B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1832252A (en) * | 2006-03-22 | 2006-09-13 | 北京航空航天大学 | Cross feed broad-band omnidirectional antenna |
| US20080136597A1 (en) * | 2006-12-08 | 2008-06-12 | Electronics And Telecommunications Research Institute | Rfid sensor tag antenna using coupling feeding method |
| CN102204112B (en) * | 2008-10-27 | 2014-03-12 | 三菱电机株式会社 | Radio communication device |
| CN101867074A (en) * | 2010-05-04 | 2010-10-20 | 华东交通大学 | Broadband filter based on defect ground plane integrated waveguide (DGW) structure |
| CN101982898A (en) * | 2010-08-24 | 2011-03-02 | 浙江大学 | Millimetre wave planar antenna and array thereof |
| CN102130379A (en) * | 2011-03-18 | 2011-07-20 | 中兴通讯股份有限公司 | Miniature microstrip antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102694249B (en) | 2015-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102821570A (en) | Electronic apparatus and housing thereof | |
| CN102683853B (en) | Irregular standing wave synthesis electrode couple element antenna | |
| CN102810738B (en) | A kind of dual-band antenna and electronic equipment | |
| CN103296381B (en) | Antenna device | |
| CN102821565A (en) | Electronic equipment and enclosure thereof | |
| CN103296380B (en) | Antenna assembly | |
| CN102723592B (en) | A kind of built-in type CMMB antenna and communication terminal | |
| CN102694250B (en) | CMMB antenna and mobile multimedia broadcast device | |
| CN102694235B (en) | A kind of CMMB antenna and Mobile multi-media broadcasting device | |
| CN103311655B (en) | Double frequency GPRS antenna device | |
| CN102694249B (en) | A kind of CMMB antenna and Mobile multi-media broadcasting device | |
| CN102694248B (en) | CMMB antenna and mobile multimedia broadcaster | |
| CN103296374A (en) | Antenna device | |
| CN102694251B (en) | A kind of CMMB antenna and Mobile multi-media broadcasting device | |
| CN102800949B (en) | GPRS (General Packet Radio Service) antenna and electronic device | |
| CN102683836B (en) | A kind of GPRS antenna | |
| CN102664303B (en) | There is the electronic installation of built-in antenna | |
| CN102664304B (en) | Portable electronic device with internally-arranged Bluetooth antenna | |
| CN102820521B (en) | A kind of built-in antenna and electronic equipment | |
| CN102723594B (en) | A kind of GPRS antenna and electronic installation | |
| CN202797263U (en) | GPRS (General Packet Radio Service) antenna and electronic device | |
| CN102810737B (en) | A kind of GPRS antenna and electronic installation | |
| CN103296375B (en) | Antenna assembly | |
| CN102694230B (en) | Watch antenna and manufacture method, real-time communication watch | |
| CN103682602B (en) | A kind of dual-band antenna and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201123 Address after: 226000 room 0606, Zhongnan building, No.203, middle Renmin Road, Nantong City, Jiangsu Province Patentee after: Jiangsu Xun Chen Mdt InfoTech Ltd. Address before: 518034. A, 18B, CIC international business center, 1061 Mei Xiang Road, Shenzhen, Guangdong, Futian District Patentee before: KUANG-CHI INNOVATIVE TECHNOLOGY Ltd. |