CN102686035B - For improving the method and system of coating - Google Patents
For improving the method and system of coating Download PDFInfo
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- CN102686035B CN102686035B CN201110442660.1A CN201110442660A CN102686035B CN 102686035 B CN102686035 B CN 102686035B CN 201110442660 A CN201110442660 A CN 201110442660A CN 102686035 B CN102686035 B CN 102686035B
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- 239000011248 coating agent Substances 0.000 title claims abstract description 135
- 238000000576 coating method Methods 0.000 title claims abstract description 135
- 238000007639 printing Methods 0.000 claims abstract description 156
- 239000000463 material Substances 0.000 claims abstract description 123
- 229910000679 solder Inorganic materials 0.000 claims description 47
- 230000002085 persistent Effects 0.000 claims description 25
- 238000003466 welding Methods 0.000 claims description 6
- 238000004088 simulation Methods 0.000 claims description 5
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 38
- 239000004020 conductor Substances 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000000126 substance Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002365 multiple layer Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 230000000717 retained Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
Abstract
It relates to a kind of system and method for improving coating, the method comprises determining that or receives successive ignition print solution, this successive ignition print solution represents the repeatedly printing iteration of the coating material on circuit to be applied to, and this circuit includes at least one three dimensional structure to be coated by this coating material；Wherein this successive ignition print solution is shape and size based on this at least one three dimensional structure；And the repeatedly printing iteration of coating material is performed according to described successive ignition print solution；Wherein, after printing iteration at least one times, at least partially curing coating material of printing during this prints iteration at least one times.
Description
Related application
This application claims the priority of the U.S. Provisional Patent Application the 61/427219th of December in 2010 submission on the 27th.
Technical field
The present invention relates to the method for improving coating.
Background technology
Some process needs in nonplanar textural applying coating.A kind of such process in electronic manufacturing industry is applying protective coating on the metallic conductor being positioned on insulating planar substrate.These conductors are likely to be of variously-shaped, and their depth-width ratio may be the least or very big, and they exceed the absolute altitude of this plane may be very different at diverse location.However, it may generally be desirable to cover some part and some part in the metal part exceeding plane of substrate with the uniform coating with predetermined thickness.
Ink jet printing has inherent defect for covering the vertical portion protruded from plane.In vertical or precipitous part, ink may flow and cause the thickness of coating less than aequum or to cause complete uncoated region.
Such as, in electronic printing circuit board (PCB) manufacture process, the planar substrates (laminate) with the conductive trace (it has different-thickness on PCB) being generally made up of copper must be coated with solder mask layer in some part of PCB.The purpose of solder resist is formation protective layer on conductor, and the region (pad etc.) welded by making needs carry out is not coated with and makes it possible to weld in that region.Solder resist is printed on laminate and is higher than on the copper conductor of laminate, and expects that solder resist covers copper conductor with uniform thickness, in order to withstand in manufacture process below owing to using the corrosion caused by strong chemicals.
Have increasing need for the efficient process providing the 3D profile no matter being printed surface how can print uniform coating.
Summary of the invention
A kind of method can be provided, the method comprises the steps that and determines or receive successive ignition print solution, and this successive ignition print solution represents the repeatedly printing iteration being applied to include the coating material on the circuit of at least one three dimensional structure to be coated by coating material；This successive ignition print solution can shape and size based on this at least one three dimensional structure；The repeatedly printing iteration of coating material is performed according to described successive ignition print solution；After printing iteration at least one times, the coating material that at least partially curing (cure) prints during this prints iteration at least one times.
Described method comprises the steps that the partially cured coating material of printing during the iteration of printing every time in addition to last printing iteration；And be fully cured the last time printing iteration during printing coating material.
The described partially cured persistent period can be shorter than the described completely crued persistent period.
The described partially cured persistent period can be shorter than the half of described completely crued persistent period.
Described method comprises the steps that and applies same amount of coating material during printing iteration every time.
Described method comprises the steps that and applies different amounts of coating material during printing iteration at least twice.
Described method comprises the steps that at least one parameter changing coating material during printing iteration.
Described method comprises the steps that the viscosity changing coating material during printing iteration.
Described coating material can be welding resistance ink.
Described method comprises the steps that and determines successive ignition print solution based on the design information about at least one three dimensional structure described.
Described method comprise the steps that based on about will described in coating material coats at least one three dimensional structure design information and based on will during single printing iteration the expection thickness of coating material layers of printing, determine successive ignition print solution.
Described method comprises the steps that the ratio number of times of printing iteration being defined as the height not less than the highest three dimensional structure that should be coated by solder resist with the expection thickness of the coating material layers will printed during single printing iteration.
Described method comprises the steps that and is defined as the number of times of printing iteration not less than the ratio using the minimum thickness of the coating material printed as the result repeatedly printing iteration with the expection thickness of the coating material layers will printed during single printing iteration.
Described method comprises the steps that the repeatedly printing iteration of simulation coating material.
Can condense, after printing iteration at least one times, the coating material that (freeze) prints during this printing iteration.
A kind of system can be provided, this system comprises the steps that print controller, it is arranged to determine or receive successive ignition print solution, this successive ignition print solution represents the repeatedly printing iteration being applied to include the coating material on the circuit of at least one three dimensional structure to be coated by coating material, and this successive ignition print solution can shape and size based on this at least one three dimensional structure；Printing element, is arranged to perform the repeatedly printing iteration of coating material according to described successive ignition print solution；Solidified cell, is arranged at least partially curing coating material of printing during printing iteration at least one times.
Described solidified cell may be configured so that the partially cured coating material of printing during the iteration of printing every time in addition to last printing iteration；And be fully cured the last time printing iteration during printing coating material.
The described partially cured persistent period can be shorter than the described completely crued persistent period.
The described partially cured persistent period can be shorter than the half of described completely crued persistent period.
Described printing element can be arranged to during printing iteration every time apply same amount of coating material.
Described printing element can be arranged to during printing iteration at least twice apply different amounts of coating material.
Described printing element can be arranged to change at least one parameter of coating material during printing iteration.
Described printing element can be arranged to change the viscosity of coating material during printing iteration.
Described coating material can be welding resistance ink.
Described print controller can be arranged to determine successive ignition print solution based on the design information about at least one three dimensional structure described.
Described print controller can be arranged to based on about will described in coating material coats at least one three dimensional structure design information and based on will during single printing iteration the expection thickness of coating material layers of printing, determine successive ignition print solution.
Described print controller can be arranged to the ratio number of times of printing iteration being defined as the height not less than the highest three dimensional structure that should be coated by solder resist with the expection thickness of the coating material layers will printed during single printing iteration.
Described print controller can be arranged to be defined as not less than the ratio using the minimum thickness of the coating material printed as the result repeatedly printing iteration with the expection thickness of the coating material layers will printed during single printing iteration the number of times of printing iteration.
Described print controller can be arranged to simulate the described of coating material and repeatedly print iteration.
Described system can include condensing unit, and this condensation unit is arranged to condense in the coating material of printing during printing iteration at least one times.
Accompanying drawing explanation
Should be appreciated that to make explanation letter will be clear that what the element shown in accompanying drawing was not necessarily to scale.Such as, in order to clear, the size of some element may be exaggerated relative to other element.And, when thinking fit, drawing reference numeral may have repetition in each figure, to show correspondence or similar element.
Fig. 1 illustrates method according to an embodiment of the invention；
Fig. 2 illustrates the cross section of copper conductor according to an embodiment of the invention and solder resist；
Fig. 3 A-3C illustrates copper conductor of the prior art；
Fig. 3 D illustrates the cross section of copper conductor according to an embodiment of the invention and solder resist；
Fig. 4 illustrates method according to an embodiment of the invention；And
Fig. 5 illustrates system according to an embodiment of the invention.
Detailed description of the invention
In following specific descriptions, give a large amount of detail to provide thorough understanding of the present invention.It will be understood by those skilled in the art, however, that the present invention can implement without these details.In other example, it is known that method, process and parts be not described in detail to avoid obscuring the invention.
Sufficiently thick solder mask layer can be applied on copper conductor so that solder mask layer can withstand strong surface and process (finishing process), such as chemical nickel and gold (ENIG).Even if by chemical erosion during this strong ENIG, the solder resist that be enough to fully cover copper conductor still can be retained.
Proposed method provides its thickness solder mask layer more than the minimum thickness needed for coated copper conductor.
Method cited below can be used for obtaining the PCB surface for any high request and processes chemically-resistant or the solder mask layer of mechanical treatment of (such as, but not limited to leaching silver, wicking etc.).
The method can include receiving the design information about the object coated with solder resist, the profile of the three-dimensional conductor that especially should be coated by this solder resist, and determines how coating.This determines can minimum desired thickness based on solder mask layer and the shape of three-dimensional conductor.Rule of thumb, when being coated with thicker solder mask layer, compared with the conductor of intensive layout, it may be necessary to pay special attention to spaced-apart height and narrow conductor especially true for the vertical wall of these conductors.Can be injected into by simulation and at least by the behavior of partially cured solder resist before another layer of solder resist of printing, determine coating profile.
The method can include receiving about copper conductor (including solder pad) and alternatively about computer-aided design (CAD) information of other PCB region, and from the surface appearance of plate/surface preparation, solder resist and the angle of operational characteristic, print demand according to the specific solder resist of these PCB region and define how to coat these PCB region.The method can include sequentially printing multiple solder mask layer, and (except last solder mask layer) partially cured each solder mask layer.Note, arbitrary solder mask layer can before proceeding to apply next solder mask layer by all/partially cured or be not cured.
If using the successive ignition of solder resist printing, produce sufficiently thick solder resist coating the most feasible, because the possible viscosity of solder resist material that can be used for this process is less and is more likely to be appropriate for ink-jet.
Fig. 1 illustrates method 100 according to an embodiment of the invention.
Method 100 is from the beginning of the stage 110, in the stage 110, determines how printing and where prints solder resist so that covered laminate and copper conductor.
Can be the stage 120 after stage 110, it prints solder resist on laminate.Can be one section of delay after the stage 120, solder resist starts to be dried during this period.
It is a series of stage 130-150 after stage 120.
Stage 130 is included on copper conductor (and the most in its vicinity) printing solder mask layer.
Being the stage 150 after stage 130, it checks whether that all of solder mask layer has been printed.If it is then be the stage 180 after the stage 150.Otherwise, it is the stage 140 after the stage 150, its partially cured current solder mask layer.
Note, can be the stage 130 after the stage 150, and not perform the stage 140 of at least partially curing current solder mask layer.
Stage 140 includes partially cured first solder mask layer.This solidification can include applying portion radiation or heat (radiation of such as 20-70% or heat), applies heat or radiation in the part being fully cured the persistent period, etc..
It is the stage 130 after stage 140, thus allows to print multiple layer near the conductor protruded.
When the stage 150 determines that all layers are printed, the stage 180 includes being fully cured in the stage 130 last printed solder mask layer.
It is to remove PCB (be automatically brought into operation 190 and process 195) after stage 180.
Fig. 2 illustrates the cross section of the conductor 200 that may be located on laminate layer 210.Conductor 200 can be covered by multiple solder mask layer 202-208.Dotted line (202-206 represents) illustrates different solder mask layers.Last solder mask layer 208 is marked as 208.The thickness of such multiple field solder resist coating (layer 202-208) be enough to withstand ENIG process.
Fig. 3 A illustrates three dimensional structure 310, and it includes that end is the linear conductor of tubulose pad.Three dimensional structure 310 is positioned on laminate surface 330.Dotted line 320 illustrates imaginary sectional plane.The sectional view of Fig. 3 B-3D intercepts along this imaginary plane.
Fig. 3 B is the sectional view along the imaginary plane shown in dotted line 320.
Fig. 3 C is the sectional view of the single layer 350 of three dimensional structure 310, laminate 330 and coating material.Although this single layer is around three dimensional structure 310, but it is the thinnest (see for example a little 302), and it is contemplated that in chemical treating process after this coating, it can be corroded and remove at such point.
Fig. 3 D is the sectional view of multiple layers 360,362,364 and 366 of three dimensional structure 310, laminate 330 and coating material.
Noting, the height of this three dimensional structure is H (370), and the thickness of each layer of coating material is T 372.The iterations of printing may be configured as equal to 1+ (H/T) or more than 1+ (H/T).
Fig. 4 illustrates method 400 according to an embodiment of the invention.
Method 400 can be from the stage 410 or from the beginning of the stage 420.
Stage 410 can include determining that successive ignition print solution, and this successive ignition print solution represents the repeatedly printing iteration of the coating material on circuit to be applied to, and this circuit includes at least one three dimensional structure to be coated by this coating material.This successive ignition print solution can shape and size based on this at least one three dimensional structure.
Stage 410 can include the stage 411, and it determines successive ignition print solution based on the design information about at least one three dimensional structure.
Stage 410 can include the stage 412, and it, based on the design information about at least one three dimensional structure to be coated by coating material and based on by the expection thickness of the coating material layers of printing during single printing iteration, determines successive ignition print solution.
Stage 410 can include the stage 413, and the number of times of printing iteration is defined as the ratio of the height not less than the highest three dimensional structure that should be coated and the expection thickness of the coating material layers will printed during single printing iteration by solder resist by it.
Stage 410 can include the stage 414, and the number of times of printing iteration is defined as not less than the ratio using the minimum thickness of the coating material printed as the result repeatedly printing iteration with the expection thickness of the coating material layers will printed during single printing iteration by it.
Stage 410 can include the stage 416, the repeatedly printing iteration of its simulation coating material.
Stage 420 can include receiving successive ignition print solution, and this successive ignition print solution represents the repeatedly printing iteration of the coating material on circuit to be applied to, and this circuit includes at least one three dimensional structure to be coated by this coating material.This successive ignition print solution can shape and size based on this at least one three dimensional structure.
Being the stage 430 after stage 410 and 420, it performs the repeatedly printing iteration of coating material according to successive ignition print solution.
Stage 430 can include the stage 432, and it performs the printing iteration of coating material.
Can be the stage 434 after stage 432, it be at least one during the coating material of printing performs following operation during printing iteration: make coating material condense, and at least partially curing coating material is fully cured coating material, or does nothing.Condense the diffusion that such as can temporarily prevent coating material.
Can be the stage 436 after stage 434, it determines whether that all printing iteration are complete.If it is, the stage 430 terminates, otherwise, can be the stage 438 after the stage 436, in the stage 438, change at least one parameter (if according to repeatedly printing iterative scheme if necessary) of printing operation and jump to the stage 432.
Therefore, after printing iteration at least one times, can at least partially curing coating material of printing during this prints iteration at least one times.
Stage 430 can include the partially cured coating material of printing during the iteration of printing every time in addition to last printing iteration；And it is fully cured and prints the coating material printed during iteration the last time.
The partially cured persistent period can be shorter than the completely crued persistent period.
The partially cured persistent period can be shorter than the half of completely crued persistent period.
Stage 430 applies same amount of coating material during may be included in every time printing iteration.
Stage 430 applies same amount of coating material during may be included in every time printing iteration.
Stage 430 may be included in the viscosity changing coating material during printing iteration.
Coating material can be welding resistance ink.
Fig. 5 illustrates system 500 according to an embodiment of the invention.
System 500 can include any method mentioned in this specification.
System 500 can include print controller 510, printing element 520 and solidified cell 530.These parts can be separated from each other or integrate.
Print controller 510 can be arranged to determine or receive successive ignition print solution, and this successive ignition print solution represents the repeatedly printing iteration of the coating material on circuit to be applied to, and this circuit includes at least one three dimensional structure to be coated by this coating material；Wherein this successive ignition print solution can shape and size based on this at least one three dimensional structure.
Printing element 520 can be arranged to perform the repeatedly printing iteration of coating material according to successive ignition print solution.
Solidified cell 530 can be arranged at least partially curing coating material of printing during printing operation at least one times.
Solidified cell 530 can be arranged to the partially cured coating material of printing during the iteration of printing every time in addition to last printing iteration；And it is fully cured and prints the coating material printed during iteration the last time.
The partially cured persistent period can be shorter than the completely crued persistent period.
The partially cured persistent period can be shorter than the half of completely crued persistent period.
Printing element 520 can be arranged to during printing iteration every time apply same amount of coating material.
Printing element 520 can be arranged to during printing iteration at least twice apply different amounts of coating material.
Printing element 520 can be arranged to change at least one parameter of coating material during printing iteration.
Printing element 520 can be arranged to change the viscosity of coating material during printing iteration.
Coating material can be welding resistance ink.
Print controller 510 can be arranged to determine successive ignition print solution based on the design information about at least one three dimensional structure.
Print controller 510 can be arranged to, based on the design information about at least one three dimensional structure to be coated by coating material and based on by the expection thickness of the coating material layers of printing during single printing iteration, determine successive ignition print solution.
Print controller 510 can be arranged to the ratio being defined as the number of times of printing iteration being not less than the height at the highest three dimensional structure that should be coated by solder resist with the expection thickness of the coating material layers will printed during single printing iteration.
Print controller 510 can be arranged to be defined as not less than the ratio using the minimum thickness of the coating material printed as the result repeatedly printing iteration with the expection thickness of the coating material layers will printed during single printing iteration the number of times of printing iteration.
Print controller 510 can be arranged to simulate the repeatedly printing iteration of coating material.
System 500 can include condensing unit 540, and it can be arranged to during printing iteration at least one times condense printed coating material.
Although shown and described herein is some feature of the present invention, but those skilled in the art can be readily apparent that many is revised, replaces, changes and is equal to now.It will thus be appreciated that claim be intended to cover all these fall modifications and changes in true spirit.
Claims (30)
1. for the method improving coating, including:
Determining or receive successive ignition print solution, this successive ignition print solution represents and to apply
The repeatedly printing iteration of the coating material on circuit, this circuit includes being coated with by this coating material
At least one three dimensional structure covered；Wherein this successive ignition print solution is at least one based on this
The shape and size of three dimensional structure；
The repeatedly printing iteration of coating material is performed according to described successive ignition print solution；Wherein,
The repeatedly printing iteration performing coating material includes: partially cured except printing iteration for the last time
The coating material of printing during the iteration of printing every time in addition；And be fully cured the last time
The coating material of printing during printing iteration.
The most partially cured include: apply 20%
Heat between 70% or radiation.
3. the method for claim 1, the wherein said partially cured persistent period is shorter than
The described completely crued persistent period.
4. the method for claim 1, the wherein said partially cured persistent period is shorter than
The half of described completely crued persistent period.
5. the method for claim 1, including: during printing iteration every time, apply phase
Commensurability coating material.
6. the method for claim 1, including: execute during printing iteration at least twice
Add different amounts of coating material.
7. the method for claim 1, including: during printing iteration, change coating material
At least one parameter of material.
8. the method for claim 1, including: during printing iteration, change coating material
The viscosity of material.
9. the method for claim 1, wherein said coating material is welding resistance ink.
10. the method for claim 1, including: based on about described at least one three
The design information of dimension structure determines successive ignition print solution.
11. the method for claim 1, including: based on about to be coated with by coating material
The design information of at least one three dimensional structure described covered based on will be during single printing iteration
The expection thickness of the coating material layers of printing, determines successive ignition print solution.
12. methods as claimed in claim 11, including: the number of times of printing iteration is defined as
Not less than the height of the highest three dimensional structure that should be coated by solder resist with will print iteration at single
The ratio of the expection thickness of the coating material layers of period printing.
13. methods as claimed in claim 11, including: the number of times of printing iteration is defined as
Not less than will as the minimum thickness of the printed coating material of the result repeatedly printing iteration with will
The ratio of the expection thickness of the coating material layers of printing during single printing iteration.
14. methods as claimed in claim 11, including: simulation coating material described repeatedly
Printing iteration.
15. the method for claim 1, wherein after printing iteration at least one times,
Condense in the coating material printed during this printing iteration.
16. 1 kinds of systems being used for improving coating, including:
Print controller, is arranged to determine or receive successive ignition print solution, and this repeatedly changes
The repeatedly printing iteration of coating material on circuit to be applied to, this circuit is represented for print solution
Including at least one three dimensional structure to be coated by this coating material；Wherein this successive ignition printing
Scheme is shape and size based on this at least one three dimensional structure；
Printing element, is arranged to perform coating material according to described successive ignition print solution
Repeatedly print iteration；
Solidified cell, is arranged to: partially cured every in addition to last printing iteration
The coating material of printing during secondary printing iteration；And be fully cured and print iteration the last time
The coating material of period printing.
17. systems as claimed in claim 16, wherein, partially cured include: apply 20%
Heat between 70% or radiation.
18. systems as claimed in claim 16, the wherein said partially cured persistent period is short
In the described completely crued persistent period.
19. systems as claimed in claim 16, the wherein said partially cured persistent period is short
Half in the described completely crued persistent period.
20. systems as claimed in claim 16, wherein, described printing element is arranged to
Apply same amount of coating material during printing iteration every time.
21. systems as claimed in claim 16, wherein, described printing element is arranged to
Different amounts of coating material is applied at least twice during printing iteration.
22. systems as claimed in claim 16, wherein, described printing element is arranged to
At least one parameter of coating material is changed during printing iteration.
23. systems as claimed in claim 16, wherein, described printing element is arranged to
The viscosity of coating material is changed during printing iteration.
24. systems as claimed in claim 16, wherein said coating material is welding resistance ink.
25. systems as claimed in claim 16, wherein, described print controller is arranged to
Successive ignition print solution is determined based on the design information about at least one three dimensional structure described.
26. systems as claimed in claim 16, wherein, described print controller is arranged to
Based on about will described in coating material coats the design information of at least one three dimensional structure base
In by the expection thickness of the coating material layers of printing during single printing iteration, determine and repeatedly change
For print solution.
27. systems as claimed in claim 26, wherein, described print controller is arranged to
The number of times of printing iteration is defined as not less than the highest three dimensional structure that should be coated by solder resist
Height with will during single printing iteration the ratio of expection thickness of the coating material layers of printing.
28. systems as claimed in claim 26, wherein, described print controller is arranged to
The number of times of printing iteration is defined as not less than using printed as the result repeatedly printing iteration
The minimum thickness of coating material is pre-with the coating material layers will printed during single printing iteration
The ratio of phase thickness.
29. systems as claimed in claim 26, wherein, described print controller is arranged to
Simulation the described of coating material repeatedly prints iteration.
30. systems as claimed in claim 16, including condensing unit, this condensation unit is set
It is set to condense in and prints the coating material printed during iteration at least one times.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201061427219P | 2010-12-27 | 2010-12-27 | |
| US61/427,219 | 2010-12-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102686035A CN102686035A (en) | 2012-09-19 |
| CN102686035B true CN102686035B (en) | 2016-12-14 |
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Granted publication date: 20161214 Termination date: 20211227 |