CN102683788B - A kind of Meta-material harmonic oscillator based on LTCC and preparation method - Google Patents
A kind of Meta-material harmonic oscillator based on LTCC and preparation method Download PDFInfo
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Abstract
The invention provides a kind of Meta-material harmonic oscillator based on LTCC, the adjustment portion that the ceramic powder that it is 50000GHz ~ 200000GHz that described Meta-material harmonic oscillator comprises by Qf is made and the LTCC part prepared lower than the ceramic powder of 950 DEG C by sintering temperature, LTCC part comprises ceramic substrate and is attached to the multiple metal micro structures on ceramic substrate.Also relate to the preparation method of this structure metamaterial harmonic oscillator.The dielectric constant of the Meta-material harmonic oscillator adopting LTCC technology to prepare can reach 80, but because the loss ratio of pottery that can be low temperature co-fired is larger, so make the Qf of Meta-material harmonic oscillator reduce, in order to not only meet high dielectric (dielectric constant is 50 ~ 70), but also meet the performance of high Qf (Qf can reach 20000GHz), therefore the present invention prepare that LTCC part containing metal micro structure and the adjustment portion with high Qf link together based on LTCC Meta-material harmonic oscillator, assigned to improve the Qf of whole Meta-material harmonic oscillator by the adjusting portion with high Qf; And this preparation technology is simple, easy to operate, can large-scale industry make.
Description
[technical field]
The present invention relates to filter field, particularly relate to a kind of Meta-material harmonic oscillator based on LTCC and preparation method.
[background technology]
Meta Materials is material electromagnetic wave being played to modulating action grown up nearly ten years.Meta Materials is generally be attached to by the metal micro structure of some to have on certain mechanics, electromagnetic substrate, and these micro-structurals with specific pattern and material can produce modulating action to the electromagnetic wave of the special frequency channel through its body.
Harmonic oscillator just refers to the electronic component producing resonance frequency, and conventional is divided into quartz-crystal resonator and ceramic resonance, plays a part to produce frequency, has stable, the feature that interference free performance is good, be widely used in various electronic product.Harmonic oscillator is important plays FREQUENCY CONTROL, and the transmitting and receiving that all electronic products relate to frequency all need harmonic oscillator.It is little that dielectric resonance has volume, lightweight, the advantages such as quality factor are high, good stability.Particularly be convenient to be applied in microstrip circuit or microwave integrated circuit and millimere-wave band, be subject to very large attention, develop very fast.The sub-dielectric constant of existing ceramic resonance between 20-40, dielectric constant higher than 40 ceramic material, its loss increases sharply, the product of its quality factor and resonance frequency often lower than 40000GHz, be thus unfavorable for make harmonic oscillator.
[summary of the invention]
Technical problem to be solved by this invention is: provide a kind of Meta-material harmonic oscillator LTCC part containing metal micro structure linked together with the adjustment portion with high Qf and preparation method thereof, not only dielectric constant is high but also Qf is also high for the Meta-material harmonic oscillator of this structure, meets the requirement of Meta-material harmonic oscillator to dielectric constant and Qf.
The present invention solves the problems of the technologies described above adopted technical scheme: a kind of Meta-material harmonic oscillator based on LTCC, the adjustment portion that the ceramic powder that it is 50000GHz ~ 200000GHz that described Meta-material harmonic oscillator comprises by Qf is made and the LTCC part prepared lower than the ceramic powder of 950 DEG C by sintering temperature, described LTCC part comprises ceramic substrate and is attached to the multiple metal micro structures on described ceramic substrate.
Described Meta-material harmonic oscillator also comprises the adhesive linkage part connecting adjustment portion and LTCC part.
The dielectric constant preparing the ceramic powder of described adjustment portion is 40 ~ 70.
The dielectric constant preparing the ceramic powder of described LTCC part is 30 ~ 50.
The ceramic powder preparing described adjustment portion is A (B
1/3c
2/3) O
3-Xwt%SnO
2, wherein A is Ba, Sr or Ca, and B is Ni, Co, Sr, Ca, Mn, Cd, Zn or Mg, and C is Nb or Ta, X is 0 ~ 10; Or the ceramic powder preparing described adjustment portion is ZnTiNb
2o
8-0.8TiO
2.
The ceramic powder preparing described LTCC part is BaZn
2ti
4o
11-Xwt%TeO
2, BaTi
4o
9-Ywt%Nd
2o
3, (Li
1/2nd
1/2) TiO
3or (Li
1/2sm
1/2) TiO
3, wherein X is 0 ~ 6, Y is 0 ~ 10.
Based on a preparation method for the Meta-material harmonic oscillator of LTCC, described preparation method comprises the following steps:
Preparation adjustment portion: be the adjustment portion that the ceramic powder of 50000GHz ~ 200000GHz makes described Meta-material harmonic oscillator by Qf;
Preparation LTCC part: sintering temperature is mixed with ceramic size lower than the ceramic powder of 950 DEG C, then curtain coating makes green band, green band processes binder removal after multiple metal micro structure, is finally incubated at 850 DEG C ~ 950 DEG C and sinters for 1 ~ 5 hour, obtain LTCC part;
The adjustment portion of preparation and LTCC part are connected to form required Meta-material harmonic oscillator.
When preparing described LTCC part, in described ceramic powder, add sintering agent.
Based on a preparation method for the Meta-material harmonic oscillator of LTCC, described preparation method comprises the following steps:
Preparation adjustment portion: be the adjustment portion that the ceramic powder of 50000GHz ~ 200000GHz makes described Meta-material harmonic oscillator by Qf;
Preparation LTCC part: sintering temperature is mixed with ceramic size lower than the ceramic powder of 950 DEG C, then curtain coating makes multi-disc green band, the green band needing metal micro structure processes multiple metal micro structure, then according to the green band, the binder removal that design green band and the containing metal micro-structural laminated without metal micro structure, last insulation at 850 DEG C ~ 950 DEG C sinters for 1 ~ 5 hour, obtains the LTCC part containing multiple layer metal micro-structural;
The adjustment portion of preparation and LTCC part are connected to form required Meta-material harmonic oscillator.
When preparing described LTCC part, in described ceramic powder, add sintering agent.
Compared with prior art, beneficial effect of the present invention is: the dielectric constant of the Meta-material harmonic oscillator adopting LTCC technology (low temperature co-fired technology) to prepare can reach 80, but because the loss ratio of pottery that can be low temperature co-fired is larger, so make the Qf of Meta-material harmonic oscillator reduce, in order to both meet high dielectric (dielectric constant is 50 ~ 70), meet again the performance of high Qf (Qf can reach 20000GHz), therefore the present invention prepare containing metal micro structure LTCC part with the adjustment portion with high Qf link together based on LTCC Meta-material harmonic oscillator, assigned to improve the Qf of whole Meta-material harmonic oscillator by the adjusting portion with high Qf, and this preparation technology is simple, easy to operate, can large-scale industry make.
[accompanying drawing explanation]
Fig. 1 is a kind of structural representation that the present invention is based on LTCC Meta-material harmonic oscillator;
Fig. 2 is the another kind of structural representation that the present invention is based on LTCC Meta-material harmonic oscillator.
[embodiment]
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with embodiment and accompanying drawing, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
A kind of Meta-material harmonic oscillator based on LTCC, as shown in Figure 1, Meta-material harmonic oscillator comprise by Qf be 50000GHz ~ 200000GHz, dielectric constant be 40 ~ 70 ceramic powder make adjustment portion 1, be 30 ~ 50 by dielectric constant, LTCC part 2 that sintering temperature is prepared lower than the ceramic powder (i.e. low-temperature co-fired ceramic powder) of 950 DEG C and the adhesive linkage part 3 that connects adjustment portion and LTCC part, wherein LTCC part 2 comprises ceramic substrate and is attached to the multiple metal micro structures on ceramic substrate.The dielectric constant of adjustment portion and LTCC part can not be too wide in the gap, is to make this two-part performance match.
Adopt the Meta-material harmonic oscillator of this structure, that the dielectric constant of Meta-material harmonic oscillator owing to adopting LTCC technology to prepare can reach 80, but because the loss ratio of pottery that can be low temperature co-fired is larger, so make the Qf of Meta-material harmonic oscillator reduce, in order to both meet high dielectric (dielectric constant is 50 ~ 70), meet again the performance of high Qf (Qf can reach 20000GHz), therefore the present invention prepare containing metal micro structure LTCC part with the adjustment portion with high Qf link together based on LTCC Meta-material harmonic oscillator, assigned to improve the Qf of whole Meta-material harmonic oscillator by the adjusting portion with high Qf.
Wherein metal micro structure is the plane with certain geometrical shape or stereochemical structure that are made up of wire, as I shape, snowflake type etc.; The ceramic powder of preparation adjustment portion 1 is A (B
1/3c
2/3) O
3-Xwt%SnO
2or be ZnTiNb
2o
8-0.8TiO
2, wherein A is Ba, Sr or Ca, and B is Ni, Co, Sr, Ca, Mn, Cd, Zn or Mg, and C is Nb or Ta, X is 0 ~ 10; The ceramic powder of preparation LTCC part 2 is BaZn
2ti
4o
11-Xwt%TeO
2, BaTi
4o
9-Ywt%Nd
2o
3, (Li
1/2nd
1/2) TiO
3or (Li
1/2sm
1/2) TiO
3deng, wherein X is 0 ~ 6, Y is 0 ~ 10, as long as ceramic powder meets and low temperature co-firedly substantially can to adopt.
Based on a preparation method for the Meta-material harmonic oscillator of LTCC, described preparation method comprises the following steps:
Preparation adjustment portion: be 50000GHz ~ 200000GHz by Qf, dielectric constant be 40 ~ 70 ceramic powder make the adjustment portion of described Meta-material harmonic oscillator, dry pressing or other technology can be adopted to prepare adjustment portion;
Preparation LTCC part: be 30 ~ 50 by dielectric constant, sintering temperature is mixed with ceramic size lower than the ceramic powder (i.e. low-temperature co-fired ceramic powder) of 950 DEG C, then curtain coating makes green band, green band processes binder removal after multiple metal micro structure, last insulation at 850 DEG C ~ 950 DEG C sinters for 1 ~ 5 hour, obtains LTCC part; Or be 30 ~ 50 by dielectric constant, sintering temperature is mixed with ceramic size lower than the ceramic powder (i.e. low-temperature co-fired ceramic powder) of 950 DEG C, then curtain coating makes multi-disc green band, the green band needing metal micro structure processes multiple metal micro structure, then according to the green band, the binder removal that design green band and the containing metal micro-structural laminated without metal micro structure, last insulation at 850 DEG C ~ 950 DEG C sinters for 1 ~ 5 hour, obtains the LTCC part containing multiple layer metal micro-structural;
Adjustment portion and LTCC are partly processed the overall dimension of preset requirement by waveguide mode and resonance frequency, as cylinder or annular, be then connected to form required Meta-material harmonic oscillator.
Wherein, when preparing LTCC part, if the sintering temperature of the low-temperature co-fired ceramic powder adopted is not very desirable, in the ceramic powder can prepared to it, 7wt% ~ 10wt% sintering agent is added, as BaO-CuO-B
2o
3system, reduces the temperature in sintering process; Metal micro structure is the plane with certain geometrical shape or stereochemical structure that are made up of wire, as I shape, snowflake type etc., screen printing technique can be adopted to prepare metal micro structure, also can adopt the technology such as other etchings, photoetching, ion quarter.
Embodiment one
The material purity below related to be 99.5% and more than.
With Ba (Zn
1/3nb
2/3) O
3-3wt%SnO
2ceramic powder prepares adjustment portion: Ba (Zn
1/3nb
2/3) O
3the raw material that ceramic powder uses are BaCO
3, ZnO and Nb
2o
5, take with mol ratio 3: 1: 1, with zirconia or alumina globule with deionized water or absolute ethyl alcohol ball milling 2 ~ 24 hours, being heated to 1000 DEG C ~ 1300 DEG C insulations 1 ~ 24 hour with the programming rate of 1 ~ 10 DEG C/min after oven dry, lower the temperature with stove, after being down to room temperature, take out Ba (Zn
1/3nb
2/3) O
3powder also adds the SnO of 3wt%
2use zirconia or alumina globule with deionized water or absolute ethyl alcohol ball milling 1 ~ 24 hour after abundant mixing, oven dry adds PVA granulation afterwards and dry-pressing becomes cylinder or annular sample, sample is heated to 1400 DEG C ~ 1500 DEG C insulations with the programming rate of 1 ~ 10 DEG C/min again after being first heated to 300 DEG C ~ 600 DEG C binder removals with the programming rate of 1 ~ 10 DEG C/min and sinters for 3 ~ 24 hours, lower the temperature with stove after sintering, sample after sintering is finally heated to 1250 DEG C ~ 1350 DEG C insulations tempering in 3 ~ 24 hours with the programming rate of 2 ~ 7 DEG C/min, stand-by with carrying out surface finish after stove cooling, acquisition adjustment portion is stand-by,
Use BaZn
2ti
4o
11-1wt%TeO
2ceramic powder prepares LTCC part: BaZn
2ti
4o
11the raw material that ceramic powder uses are BaO, ZnO and TiO
2, take with mol ratio 1: 2: 4, with zirconia or alumina globule with deionized water or absolute ethyl alcohol ball milling 2 ~ 24 hours; Being heated to 900 DEG C ~ 1100 DEG C insulation 3-24 hour with the programming rate of 2 ~ 7 DEG C/min after oven dry, lower the temperature with stove; To the BaZn after pre-burning
2ti
4o
11ceramic powder adds the TeO of 1wt%
2, 10wt% BaCu (B
2o
5) sintering agent fully mixes rear employing casting technology and prepare the green band that thickness is 20 μm ~ 200 μm, the screen-printed metal micro-structural of more than 325 orders is adopted again on green band, the metal adopted is the silver-colored palladium slurry that silver slurry or palladium content are lower, the rear also binder removal of the profile cutting needed according to design, binder removal process is for being first warming up to 400 DEG C with 1 DEG C ~ 2 DEG C, be incubated 1 ~ 2 hour, 850 DEG C ~ 950 DEG C are warming up to again with 3 DEG C ~ 5 DEG C, finally at 850 DEG C ~ 920 DEG C, be incubated 1 ~ 5 hour, stand-by with carrying out surface finish after stove cooling, obtain LTCC part;
Adjustment portion and LTCC part are processed by waveguide mode and resonance frequency the overall dimension meeting designing requirement, then both is connected to form the required Meta-material harmonic oscillator based on LTCC.
Adhesive both wherein connecting is cyanoacrylate acids adhesive, also can be the low-loss adhesive etc. of other types.This preparation technology is simple, easy to operate, can large-scale industry make.
Embodiment two
The material purity below related to be 99.5% and more than.
Use ZnTiNb
2o
8-0.8TiO
2ceramic powder prepares adjustment portion: ZnTiNb
2o
8the raw material that ceramic powder uses are ZnO, TiO
2and Nb
2o
5, take with mol ratio 1: 1: 1, with zirconia or alumina globule with deionized water or absolute ethyl alcohol ball milling 2 ~ 24 hours; Being heated to 1000 DEG C ~ 1300 DEG C insulations 1 ~ 12 hour with the programming rate of 2 ~ 7 DEG C/min after oven dry, lower the temperature with stove; After being down to room temperature, take out powder with ZnTiNb
2o
8: TiO
2=1: 0.8 mixed in molar ratio with zirconia or alumina globule with deionized water or absolute ethyl alcohol ball milling 2 ~ 24 hours, oven dry adds PVA granulation afterwards and dry-pressing becomes cylinder or annular sample, sample is heated to 1100 DEG C ~ 1300 DEG C insulations with the programming rate of 2 ~ 7 DEG C/min again after being first heated to 300 DEG C ~ 600 DEG C binder removals with the programming rate of 2 ~ 7 DEG C/min and sinters for 3 ~ 24 hours, after this sample finally with the cooling rate of 1 ~ 5 DEG C/min to 500 DEG C, stand-by with carrying out surface finish after stove cooling, obtain adjustment portion stand-by;
Use BaTi
4o
9-2wt%Nd
2o
3ceramic powder prepares LTCC part: BaTi
4o
9the raw material that ceramic powder uses are BaCO
3and TiO
2, take with mol ratio 1: 4, with zirconia or alumina globule with deionized water or absolute ethyl alcohol ball milling 2 ~ 24 hours; Being heated to 900 DEG C ~ 1100 DEG C insulation 3-24 hour with the programming rate of 2 ~ 7 DEG C/min after oven dry, lower the temperature with stove; After being down to room temperature, to the BaTi after pre-burning
4o
9the Nd of 2wt% is added in ceramic powder
2o
3, 7wt% BaCu (B
2o
5) sintering agent fully mixes rear employing casting technology and prepare the green band that thickness is 20 μm ~ 200 μm, the screen-printed metal micro-structural of more than 325 orders is adopted again on green band, the metal adopted is the silver-colored palladium slurry that silver slurry or palladium content are lower, the rear also binder removal of the profile cutting needed according to design, binder removal process is for being first warming up to 400 DEG C with 1 DEG C ~ 2 DEG C, be incubated 1 ~ 2 hour, 850 DEG C ~ 950 DEG C are warming up to again with 3 DEG C ~ 5 DEG C, finally at 850 DEG C ~ 920 DEG C, be incubated 1 ~ 5 hour, stand-by with carrying out surface finish after stove cooling, obtain LTCC part;
Adjustment portion and LTCC part are processed by waveguide mode and resonance frequency the overall dimension meeting designing requirement, then both is connected to form the required Meta-material harmonic oscillator based on LTCC.
Adhesive both wherein connecting is cyanoacrylate acids adhesive, also can be the low-loss adhesive etc. of other types.This preparation technology is simple, easy to operate, can large-scale industry make.
Embodiment three
Embodiment three is relative to the difference of above-mentioned two embodiments: when preparing harmonic oscillator LTCC part, curtain coating can go out multi-disc green band, the green band needing metal micro structure processes multiple metal micro structure, then the thickness needed for actual design laminates the green band of green band without metal micro structure and containing metal micro-structural, detailed process is first the ceramic chips after superimposed is heated to 60 DEG C ~ 80 DEG C, use the pressure pressing of 2 ~ 20MPa, binder removal process is first to be warming up to 400 DEG C ~ 600 DEG C with 0.5 DEG C ~ 3 DEG C subsequently, be incubated 1 ~ 2 hour, 850 DEG C ~ 950 DEG C are warming up to again with 3 DEG C ~ 5 DEG C, last insulation at 850 DEG C ~ 950 DEG C sinters for 1 ~ 5 hour, obtain the LTCC part containing multiple layer metal micro-structural.Other step is same as described above, does not repeat them here.
Embodiment four
Embodiment four is relative to the difference of above-mentioned three embodiments: prepare multi-disc adjustment portion and LTCC part respectively, as shown in Figure 2, by adjustment portion 1 and LTCC part 2 alternately laminated, be joined together to form Meta-material harmonic oscillator, other step is same as described above, does not repeat them here.Thickness according to actual required Meta-material harmonic oscillator controls two-part number, and the Meta-material harmonic oscillator of this structure only has separately relative to the adjustment portion of above-mentioned preparation and LTCC part that the Meta-material harmonic oscillator of one deck is better to electromagnetic response, performance is more mated.
Embodiment five
Embodiment five is relative to the difference of above-mentioned four embodiments: what the adhesive of adhesive linkage part adopted is glass paste, one deck glass paste is applied between conciliation part and LTCC part, then sintering curing, harmonic oscillator needed for formation, with glass paste as adhesive, make both bonding strengths larger, and the loss of glass material is low, is more suitable for the adhesive linkage as harmonic oscillator.Other steps are identical, just do not repeating.
In the above-described embodiments, only to invention has been exemplary description, but those skilled in the art can carry out various amendment to the present invention without departing from the spirit and scope of the present invention after reading present patent application.
Claims (8)
1. the Meta-material harmonic oscillator based on LTCC, it is characterized in that, the adjustment portion that the ceramic powder that it is 50000GHz ~ 200000GHz that described Meta-material harmonic oscillator comprises by Qf is made and the LTCC part prepared lower than the ceramic powder of 950 DEG C by sintering temperature, described LTCC part comprises ceramic substrate and is attached to the multiple metal micro structures on described ceramic substrate, wherein, the ceramic powder preparing described LTCC part is BaZn
2ti
4o
11-Xwt%TeO
2, BaTi
4o
9-Ywt%Nd
2o
3, (Li
1/2nd
1/2) TiO
3or (Li
1/2sm
1/2) TiO
3, wherein X is 0 ~ 6, Y is 0 ~ 10, and the ceramic powder preparing described adjustment portion is A (B
1/3c
2/3) O
3-Xwt%SnO
2, wherein A is Ba, Sr or Ca, and B is Ni, Co, Sr, Ca, Mn, Cd, Zn or Mg, and C is Nb or Ta, X is 0 ~ 10; Or the ceramic powder preparing described adjustment portion is ZnTiNb
2o
8-0.8TiO
2.
2. the Meta-material harmonic oscillator based on LTCC according to claim 1, is characterized in that, described Meta-material harmonic oscillator also comprises the adhesive linkage part connecting adjustment portion and LTCC part.
3. the Meta-material harmonic oscillator based on LTCC according to claim 1, is characterized in that, the dielectric constant preparing the ceramic powder of described adjustment portion is 40 ~ 70.
4. the Meta-material harmonic oscillator based on LTCC according to claim 1, is characterized in that, the dielectric constant preparing the ceramic powder of described LTCC part is 30 ~ 50.
5. based on a preparation method for the Meta-material harmonic oscillator of LTCC, it is characterized in that: described preparation method comprises the following steps:
Preparation adjustment portion: be the adjustment portion that the ceramic powder of 50000GHz ~ 200000GHz makes described Meta-material harmonic oscillator by Qf;
Preparation LTCC part: sintering temperature is mixed with ceramic size lower than the ceramic powder of 950 DEG C, then curtain coating makes green band, green band processes binder removal after multiple metal micro structure, is finally incubated at 850 DEG C ~ 950 DEG C and sinters for 1 ~ 5 hour, obtain LTCC part;
The adjustment portion of preparation and LTCC part are connected to form required Meta-material harmonic oscillator.
6. the preparation method of the Meta-material harmonic oscillator based on LTCC according to claim 5, is characterized in that: when preparing described LTCC part, in described ceramic powder, adds sintering agent.
7. based on a preparation method for the Meta-material harmonic oscillator of LTCC, it is characterized in that: described preparation method comprises the following steps:
Preparation adjustment portion: be the adjustment portion that the ceramic powder of 50000GHz ~ 200000GHz makes described Meta-material harmonic oscillator by Qf;
Preparation LTCC part: sintering temperature is mixed with ceramic size lower than the ceramic powder of 950 DEG C, then curtain coating makes multi-disc green band, the green band needing metal micro structure processes multiple metal micro structure, then according to the green band, the binder removal that design green band and the containing metal micro-structural laminated without metal micro structure, last insulation at 850 DEG C ~ 950 DEG C sinters for 1 ~ 5 hour, obtains the LTCC part containing multiple layer metal micro-structural;
The adjustment portion of preparation and LTCC part are connected to form required Meta-material harmonic oscillator.
8. the preparation method of the Meta-material harmonic oscillator based on LTCC according to claim 7, is characterized in that: when preparing described LTCC part, in described ceramic powder, adds sintering agent.
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| CN101538157A (en) * | 2009-04-11 | 2009-09-23 | 桂林工学院 | Tantalate microwave dielectric ceramic with high quality factor sintered at low temperature and preparation method thereof |
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| JP2009196885A (en) * | 2008-02-25 | 2009-09-03 | Samsung Electro-Mechanics Co Ltd | Low temperature co-fired ceramic substrate having diffusion barrier layer and method of manufacturing the same |
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