CN102680111A - Infrared thermal imager capable of measuring heating area of object and measuring method thereof - Google Patents

Abstract

The invention discloses an infrared thermal imager capable of measuring the heating area of an object and a measuring method and relates to the technical field of infrared photoelectron. The infrared thermal imager comprises an infrared detection part and an imaging measurement part which are connected, wherein the infrared detection part comprises a lens and an infrared detector connected with the lens; the imaging measurement part comprises an imaging operation module connected with the infrared detector and also comprises a laser rangefinder, an angle measuring component and a driving circuit which are respectively connected with the imaging operation module; the driving circuit is also connected with a display circuit; the imaging operation module calculates measuring parameters of the laser rangefinder and the angle measuring component, obtains the area of the heating zone with the specific temperature on the surface of a target object, and displays by the display circuit. The invention has the advantages that the area of the zone at a specific temperature interval of the surface of the object is measured and displayed while an infrared thermal image of the object is measured simultaneously, the result is more accurate and the error is small.

Description

But a kind of thermal infrared imager of Measuring Object heating area and measuring method thereof

Technical field

The present invention relates to the infrared optoelectronic technical field, but specifically be a kind of thermal infrared imager and measuring method thereof of Measuring Object heating area.

Background technology

Thermal infrared imager is a kind of infrared energy of accepting measured target, thereby obtains the instrument of Infrared Thermogram, and this thermography is corresponding with the heat distribution field of body surface.Popular, thermal infrared imager is exactly the invisible infrared energy that object is sent, and changes visible heat picture into, lets people observe the distribution situation of body surface temperature intuitively.

Along with the develop rapidly of the level of the productive forces, thermal infrared imager is used widely in increasing industry, and environmental protection and energy-conservation industry receives the attention of government day by day because of its huge economic and social benefit.The core that environmental protection and energy-conservation industry is paid close attention to is an energy consumption, and energy consumption generally to be form with heat show, but thermal infrared imager is visual with thermal phenomenon because of it and the function of thermometric, has become important detecting instrument in environmental protection and energy saving assessment and the Energy Management Contract work.But only obtain temperature parameter and can't calculate energy consumption, another call parameter is exactly the area in body surface specified temp zone.

Because temperature province with the naked eye can't observe, promptly use thermal infrared imager observation, some temperature province receives temperature and other restrictions, and like charged, high temperature etc., people can't contact temperature province, therefore have no idea to measure with conventional survey instrument; The temperature province that we were concerned about in addition, promptly warm territory, irregular geometric figures normally, and be not easy with thermography in other relatively figures of rule compare, therefore adopt method relatively to measure the temperature area, error is also bigger.General both at home and abroad at present thermal infrared imager is of a great variety, and the part thermal infrared imager can accomplish to measure the temperature of any one pixel point in the whole thermal map, but all can't directly measure the area in body surface specified temp zone from thermal infrared imager.

Summary of the invention

To the defective that exists in the prior art; But the object of the present invention is to provide a kind of thermal infrared imager and measuring method thereof of Measuring Object heating area; Can be in the Measuring Object Infrared Thermogram; Measure and demonstrate the interval region area of body surface specified temp, and the result is more accurate, error is less.

For reaching above purpose; But the present invention provides a kind of thermal infrared imager of Measuring Object heating area; Comprise continuous infrared acquisition part and imaging measurement part, said infrared acquisition partly comprises camera lens and connected infrared eye, and imaging measurement partly comprises the imaging computing module that links to each other with infrared eye; Also comprise the laser range finder, measurement of angle assembly, the driving circuit that are connected with the imaging computing module respectively, said driving circuit also connects a display circuit.

On the basis of technique scheme, said imaging computing module comprises signal processing circuit, imaging circuit and computing circuit.

On the basis of technique scheme, the said display circuit of said driving circuit drives, display circuit is provided with the display that is positioned at the thermal infrared imager outside surface, and laser range finder is provided with the range finding camera lens.

On the basis of technique scheme, said measurement of angle assembly comprises that level decides angle rotating disc and vertical outer corner measurement module, and level is decided angle ω _FixedIt is definite value.

The present invention also provides a kind of measuring method based on above-mentioned thermal infrared imager; Comprise the steps: that S1. infrared acquisition part changes the infrared radiation of target object into electric signal; And import in the imaging computing module, the imaging computing module changes electric signal into figure signal; S2. the level that comprises of measurement of angle assembly is decided the angle rotating disc, utilizes level to decide angle rotating disc and laser range finder, and meter is calculated the horizontal vertical distance L of target object and thermal infrared imager; S3. the measurement of angle assembly is measured the vertical corner γ between said thermal infrared imager and the target object, and laser range finder measurement target object is to the distance L between the said thermal infrared imager _Survey, calculate the level angle ω of thermal infrared imager and measurement target in conjunction with horizontal vertical range L; S4. the inner computing circuit of the computing module that forms images is according to said horizontal vertical distance L and level angle ω; Combine this infrared thermal imagery instrument parameter again; Calculate the said imaging computing module of target object surface assigned temperature heating region area S5. with figure signal and target object surface assigned temperature heating region area; Behind overdrive circuit, show respectively through the display in the display circuit.

On the basis of technique scheme, said level is decided the level of angle rotating disc and is decided angle ω _FixedIt is definite value.

On the basis of technique scheme, the detailed step of said step S2 is: S21. decides the angle rotating disc first with the said thermal infrared imager level of rotating to, and arrives the distance between the said thermal infrared imager through laser range finder measurement target object, is labeled as L _{Survey 1}, and with L _{Survey 1}Deposit the imaging computing module in; S22. with the said thermal infrared imager level of rotating to decide the angle rotating disc another then, and, be labeled as L through the distance of laser range finder measurement target object between the said thermal infrared imager _{Survey 2}, and with L _{Survey 2}Deposit the imaging computing module in; S23. the formula that the computing module that forms images calculates the horizontal vertical distance L of target object and thermal infrared imager is L=

On the basis of technique scheme, the computing formula of level angle ω is

among the said step S3

On the basis of technique scheme, said computing circuit calculates the target object surface, and the heating region area formula under assigned temperature is:

$S={\mathrm{NL}}^2\frac{\mathrm{Sin}\mathrm{\α}\mathrm{Sin}\mathrm{\β}}{\mathrm{Cos}\left(\frac{2\mathrm{\ω}+\mathrm{\α}}{2}\right)\mathrm{Cos}\left(\frac{2\mathrm{\ω}-\mathrm{\α}}{2}\right)\mathrm{Cos}\left(\frac{2\mathrm{\γ}+\mathrm{\β}}{2}\right)\mathrm{Cos}\left(\frac{2\mathrm{\γ}-\mathrm{\β}}{2}\right)}\·H\·V,$ Wherein S is said assigned temperature heating region area; N is the sum of assigned temperature heating region pixel, and L is said horizontal vertical distance, and α is the horizontal field of view angle of thermal infrared imager; β is the vertical field of view angle of thermal infrared imager; γ is said vertical corner, and ω is said level angle, and H is that horizontal pixel number, the V of thermal infrared imager is the vertical pixel number of thermal infrared imager.

On the basis of technique scheme; Said thermal infrared imager does not have corner in level; Be that ω is 0 o'clock, assigned temperature heating region area is

Beneficial effect of the present invention is: at target object is under the situation that can't contact such as charged, high temperature; Use thermal infrared imager to observe the Infrared Thermogram while of body surface; Can also measure the heating area in object assigned temperature zone, the arbitrary temp region area that supplies people to choose its concern is measured; Even the heating region area of certain temperature of target object surface is an irregular geometric figures, also can show its area more exactly, for energy consumption detects and assessment provides the area parameters in specified temp zone, as the foundation of energy consumption calculation.

Description of drawings

But Fig. 1 is the structured flowchart of the thermal infrared imager of embodiment of the invention Measuring Object heating area;

Fig. 2 is the method flow diagram of the embodiment of the invention;

Fig. 3 is the instrumentation plan of embodiment of the invention horizontal vertical distance L.

Reference numeral:

Infrared acquisition part 1, camera lens 11, infrared eye 12; Imaging measurement part 2, imaging computing module 21, laser range finder 22, measurement of angle assembly 23, driving circuit 24, display circuit 25.

Embodiment

Below in conjunction with accompanying drawing and embodiment the present invention is done further explain.

As shown in Figure 1, but the thermal infrared imager of the present invention's Measuring Object heating area comprises infrared acquisition part 1 and imaging measurement part 2, and the two links to each other.Outer probe portion 1 comprises camera lens 11 and connected infrared eye 12, and camera lens 11 is taken in target object, and changes the infrared radiation of target object into electric signal through infrared eye 12.Imaging measurement partly comprises imaging computing module 21, laser range finder 22, measurement of angle assembly 23, driving circuit 24 and display circuit 25.Said imaging computing module 21 is connected with infrared eye 12, is used for receiving the electric signal that infrared eye 12 transmits, and imaging computing module 21 inside comprise signal processing circuit, imaging circuit and computing circuit.Laser range finder 22, measurement of angle assembly 23, driving circuit 24 are connected to imaging computing module 21 respectively; Wherein laser range finder 22 laser range finders are provided with the range finding camera lens; Behind the picked-up target object, distance between laser range finder 22 measurement target objects and the said thermal infrared imager; Measurement of angle assembly 23 comprises that level decides angle rotating disc and vertical outer corner measurement module, and level is decided the level of angle rotating disc and decided angle ω _FixedBe definite value, measurement of angle assembly 23 can be measured calculating with the angle that horizontally rotates between the target object with vertical corner (being the elevation angle or the angle of depression) to said thermal infrared imager; Driving circuit 24 connects a display circuit 25, and is used for driving this display circuit 25, and display circuit 25 also is provided with the display that is positioned at the thermal infrared imager outside surface.

As shown in Figure 2, but the present invention is based on the measuring method of the thermal infrared imager of said Measuring Object heating area, comprise the steps:

S1. infrared acquisition part 1 is through camera lens 11 picked-up target objects, and infrared eye 12 changes the infrared radiation of target object into electric signal, and imports in the imaging measurement part 2, and imaging computing module 21 changes electric signal into figure signal.

S2. the measurement of angle assembly comprises that level decides the angle rotating disc, and level is decided the level of angle rotating disc and decided angle ω _FixedBe definite value, ω for example _Fixed=3 °.Utilize level to decide angle rotating disc and laser range finder, meter is calculated the horizontal vertical distance L of target object and thermal infrared imager, is illustrated in figure 3 as the instrumentation plan of horizontal vertical distance L, and its concrete measuring process is following:

S21. the said thermal infrared imager level of rotating to is decided the angle rotating disc first, and arrive the distance between the said thermal infrared imager, be labeled as L through laser range finder measurement target object _{Survey 1}, and with L _{Survey 1}Deposit the imaging computing module in;

S22. with the said thermal infrared imager level of rotating to decide the angle rotating disc another then, and, be labeled as L through the distance of laser range finder measurement target object between the said thermal infrared imager _{Survey 2}, and with L _{Survey 2}Deposit the imaging computing module in;

S23. the computing module that forms images calculates the formula of horizontal vertical distance L of target object and thermal infrared imager for

S3. the measurement of angle assembly is measured the vertical corner γ between said thermal infrared imager and the target object, and laser range finder measurement target object is to the distance L between the said thermal infrared imager _Survey, in conjunction with horizontal vertical range L, calculating the level angle ω of thermal infrared imager and measurement target, the computing formula of level angle ω does

L wherein _SurveyCan choose above-mentioned L _{Survey 1}Or L _{Survey 2}Any value.

S4. the inner computing circuit of the computing module that forms images combines this infrared thermal imagery instrument parameter again according to said horizontal vertical distance L and level angle ω, calculates the surperficial assigned temperature heating region of target object area.The computing formula of being utilized is:

$S={\mathrm{NL}}^2\frac{\mathrm{Sin}\mathrm{\α}\mathrm{Sin}\mathrm{\β}}{\mathrm{Cos}\left(\frac{2\mathrm{\ω}+\mathrm{\α}}{2}\right)\mathrm{Cos}\left(\frac{2\mathrm{\ω}-\mathrm{\α}}{2}\right)\mathrm{Cos}\left(\frac{2\mathrm{\γ}+\mathrm{\β}}{2}\right)\mathrm{Cos}\left(\frac{2\mathrm{\γ}-\mathrm{\β}}{2}\right)}\·H\·V$ Formula 1,

Wherein S is said assigned temperature heating region area; N is the sum of assigned temperature heating region pixel, and L is said horizontal vertical distance, and α is the horizontal field of view angle of thermal infrared imager; β is the vertical field of view angle of thermal infrared imager; γ is said vertical corner, and ω is said level angle, and H is that horizontal pixel number, the V of thermal infrared imager is the vertical pixel number of thermal infrared imager.Because thermal infrared imager can accomplish to measure the temperature of any one pixel in the whole thermal map; That is to say that each pixel all has a definite temperature value; Therefore we are input to the assigned temperature of target object surface heat region area in the thermal infrared imager of the present invention; Thermal infrared imager of the present invention can extract under this assigned temperature, the total N of all pixels.And L, α, H, V are said thermal infrared imager when dispatching from the factory, and the concrete parameter of set inside is known, and HV is the maximum survey area of said thermal infrared imager when full frame.

S5. said imaging computing module behind overdrive circuit, shows figure signal and target object surface assigned temperature heating region area S respectively through the display in the display circuit.

In addition, when said thermal infrared imager does not have corner in level, promptly ω is 0 o'clock, carries it in the formula 1, draws assigned temperature heating region area to be:

$S=4\frac{{\mathrm{NL}}^2\mathrm{Tan}\left(\frac{\mathrm{\α}}{2}\right)\mathrm{Sin}\mathrm{\β}}{H\·V\·(\mathrm{Cos}2\mathrm{\γ}+\mathrm{Cos}\mathrm{\β})}$ Formula 2.

The present invention is not limited to above-mentioned embodiment, for those skilled in the art, under the prerequisite that does not break away from the principle of the invention, can also make some improvement and retouching, and these improvement and retouching also are regarded as within protection scope of the present invention.The content of not doing in this instructions to describe in detail belongs to this area professional and technical personnel's known prior art.

Claims (10)

1. but the thermal infrared imager of a Measuring Object heating area; Comprise continuous infrared acquisition part and imaging measurement part; It is characterized in that: said infrared acquisition partly comprises camera lens and connected infrared eye; Imaging measurement partly comprises the imaging computing module that links to each other with infrared eye, also comprises the laser range finder, measurement of angle assembly, the driving circuit that are connected with the imaging computing module respectively, and said driving circuit also connects a display circuit.

2. but the thermal infrared imager of Measuring Object heating area as claimed in claim 1 is characterized in that: said imaging computing module comprises signal processing circuit, imaging circuit and computing circuit.

3. but the thermal infrared imager of Measuring Object heating area as claimed in claim 1 is characterized in that: the said display circuit of said driving circuit drives, and display circuit is provided with the display that is positioned at the thermal infrared imager outside surface, and laser range finder is provided with the range finding camera lens.

4. but the thermal infrared imager of Measuring Object heating area as claimed in claim 1 is characterized in that: said measurement of angle assembly comprises that level decides angle rotating disc and vertical outer corner measurement module, and level is decided angle ω _FixedIt is definite value.

5. the measuring method based on thermal infrared imager in the claim 1 is characterized in that, comprises the steps:

S1. the infrared acquisition part changes the infrared radiation of target object into electric signal, and imports in the imaging computing module, and the imaging computing module changes electric signal into figure signal;

S2. the level that comprises of measurement of angle assembly is decided the angle rotating disc, utilizes level to decide angle rotating disc and laser range finder, and meter is calculated the horizontal vertical distance L of target object and thermal infrared imager;

S3. the measurement of angle assembly is measured the vertical corner γ between said thermal infrared imager and the target object, and laser range finder measurement target object is to the distance L between the said thermal infrared imager _Survey, calculate the level angle ω of thermal infrared imager and measurement target in conjunction with horizontal vertical range L;

S4. the inner computing circuit of the computing module that forms images combines this infrared thermal imagery instrument parameter again according to said horizontal vertical distance L and level angle ω, calculates the surperficial assigned temperature heating region of target object area;

S5. said imaging computing module behind overdrive circuit, shows figure signal and target object surface assigned temperature heating region area respectively through the display in the display circuit.

6. the measuring method of thermal infrared imager as claimed in claim 5, it is characterized in that: said level is decided the level of angle rotating disc and is decided angle ω _FixedIt is definite value.

7. the measuring method of thermal infrared imager as claimed in claim 6, it is characterized in that: the detailed step of said step S2 is:

S21. the said thermal infrared imager level of rotating to is decided the angle rotating disc first, and arrive the distance between the said thermal infrared imager, be labeled as L through laser range finder measurement target object _{Survey 1}, and with L _{Survey 1}Deposit the imaging computing module in;

S22. with the said thermal infrared imager level of rotating to decide the angle rotating disc another then, and, be labeled as L through the distance of laser range finder measurement target object between the said thermal infrared imager _{Survey 2}, and with L _{Survey 2}Deposit the imaging computing module in;

S23. the computing module that forms images calculates the formula of horizontal vertical distance L of target object and thermal infrared imager for

8. the measuring method of thermal infrared imager as claimed in claim 5 is characterized in that: the computing formula of level angle ω is

among the said step S3

9. the measuring method of thermal infrared imager as claimed in claim 5 is characterized in that: said computing circuit calculates the target object surface, and the heating region area formula under assigned temperature is: $S={\mathrm{NL}}^2\frac{\mathrm{Sin}\mathrm{\α}\mathrm{Sin}\mathrm{\β}}{\mathrm{Cos}\left(\frac{2\mathrm{\ω}+\mathrm{\α}}{2}\right)\mathrm{Cos}\left(\frac{2\mathrm{\ω}-\mathrm{\α}}{2}\right)\mathrm{Cos}\left(\frac{2\mathrm{\γ}+\mathrm{\β}}{2}\right)\mathrm{Cos}\left(\frac{2\mathrm{\γ}-\mathrm{\β}}{2}\right)}\·H\·V,$ Wherein S is said assigned temperature heating region area; N is the sum of assigned temperature heating region pixel, and L is said horizontal vertical distance, and α is the horizontal field of view angle of thermal infrared imager; β is the vertical field of view angle of thermal infrared imager; γ is said vertical corner, and ω is said level angle, and H is that horizontal pixel number, the V of thermal infrared imager is the vertical pixel number of thermal infrared imager.

10. the measuring method of thermal infrared imager as claimed in claim 9, it is characterized in that: said thermal infrared imager does not have corner in level, and promptly ω is 0 o'clock, and assigned temperature heating region area does $S=4\frac{{\mathrm{NL}}^2\mathrm{Tan}\left(\frac{\mathrm{\α}}{2}\right)\mathrm{Sin}\mathrm{\β}}{H\·V\·(\mathrm{Cos}2\mathrm{\γ}+\mathrm{Cos}\mathrm{\β})}.$

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