CN102673116B - Method for eliminating satellite points of printed device - Google Patents
Method for eliminating satellite points of printed device Download PDFInfo
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- CN102673116B CN102673116B CN201210163747.XA CN201210163747A CN102673116B CN 102673116 B CN102673116 B CN 102673116B CN 201210163747 A CN201210163747 A CN 201210163747A CN 102673116 B CN102673116 B CN 102673116B
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- printing
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- satellite point
- asterism
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Abstract
The invention relates to the technical field of printed devices and discloses a method for eliminating satellite points (23) of a printed device (22). The method includes the steps: placing the printed device (22) which is provided with the satellite points (23) after being subjected to noncontact printing into an etchant solution for 1-50 seconds; and then drying the printed device (22) after rinsing the printed device (22) via purified water so as to eliminate the satellite points (23) of the printed device (22). The printed device (22) made of metal materials is required to be oxidized at first, and then treated through other subsequent steps. Since the thickness of the satellite points (23) of the printed device (22) is greatly smaller than that of the main body of the printed device (22), the satellite points (23) of printed patterns are effectively eliminated and the main body of the printed device (22) is maintained by the method of overall cleaning, and quality of the printed device (22) is improved with lower cost.
Description
Technical field
The present invention relates to print components and parts technical field, especially a kind of processing method of eliminating printing device centre halfback asterism.
Background technology
" satellite point " refer in printing process, fall outside target area or with printing body portion from scattered ink dot.The appearance of satellite point can make printing device that deformation to a certain degree occurs conventionally, and the print product of high-precision requirement can be produced and be had a strong impact on as the quality of the printing components and parts for electronics, optical field.And in contactless typography, ink not shifts by forme as traditional typography, but be directly injected on substrate, therefore when ink is in course of injection and with substrate contact, have more loose point and produce, the contact printing technique that " satellite point " phenomenon is more traditional is even more serious.
In view of this, how academia for avoiding satellite point also to do a large amount of research in contactless printing, and research emphasis mainly concentrates on the mechanism of production of satellite point, and optimizes targetedly ameliorative measure.But because the generation reason of satellite point is varied, in printing process, how to reduce as far as possible and even avoid satellite point to study also more complicated, relate to ink character, typography and print pre-treatment aspect, contained multiple subjects such as physical chemistry, hydrodynamics, Electronic Control, the optimization ameliorative measure that research institute obtains also can only be applied to certain the class specific ink under certain specific typography.
In addition, in specific function printing application, current various minimizings and avoid the measure of satellite point to be also subject to otherwise limitation.For example, in printed electronic field, the improvement of ink and substrate must guarantee not change physics, chemistry and the electric property of functional material self, thereby is subject to larger restriction.Study a kind of method at printing post processing satellite point extremely urgent.
Summary of the invention
For addressing the above problem, the printing process that the present invention aims at off-contact printing formula provides a kind of method of eliminating satellite point.
The method of this elimination printing device centre halfback asterism, comprises the steps: to carry out corrosion reaction by being placed in etchant solution by the device with satellite point after contactless printing; Dry up through rinsing, the satellite point in described device is eliminated again.
Wherein, for the device of above type, corresponding etchant solution is one or more in inorganic acid or organic acid.Corrode satellite point completely and save device overall structure from damage for reaching, control described corrosion reaction and be 1 ~ 50 second for good.
Described in said method, device is formed by contactless printing process by ink, and described device is taking one or more in metal-organic composite material, metal oxide as main component.
Specifically, described etchant solution employing concentration is 0.01 ~ 1 mol/L acetic acid aqueous solution or concentration are 0.01 ~ 1 mol/L hydrochloric acid.
The present invention is applicable to contactless print process, comprises any in ink-jet printing process, air-flow spray printing method, electrohydrodynamics spray printing method or videograph.
The present invention also provides the another kind of method of eliminating printing device centre halfback asterism, comprise the steps: first to carry out oxidation processes by the device with satellite point after contactless printing, then be placed in etchant solution and carry out corrosion reaction, dry up through rinsing, the satellite point in described device is eliminated.
Wherein, respectively for the device of the above-mentioned type, adopt described etchant solution be in inorganic acid or organic acid one or more.The described corrosion reaction time is within 10 ~ 60 minutes, to be good.
Second method provided by the invention need to be carried out oxidation processes to device, and described oxidation processes is by plasma reactor, described device to be carried out to plasma treatment 0.5 ~ 5 minute under the vacuum condition of 5-40Pa.
Described in this method, device is formed by contactless printing by ink, and described device is taking one or more of metal simple-substance or alloy as main component.
Specifically, the hydrochloric acid that the nitric acid that described etchant solution employing concentration is 0.5 ~ 2mol/L or concentration are 0.5 ~ 2mol/L.
The present invention is applicable to described contactless print process, comprises the one in ink-jet printing process, air-flow spray printing method, electrohydrodynamics spray printing method or videograph.
The invention provides the method for eliminating contactless printing device centre halfback asterism, reduce the demand of satellite point to meet printed electronic industry as far as possible.Technique of the present invention is simple, with low cost; Can be applicable in multiple contactless printing process, and can on the basis of existing printing technology, eliminate or reduce the satellite point occurring in printed patterns, processing mode more directly effectively, is conducive to the raising of printed electronic product quality, has broad application prospects.
Brief description of the drawings
Fig. 1 a is the structural representation of the embodiment of the present invention 1 printing device.
Fig. 1 b is the profile of the P-P ' face of Fig. 1 a.
Fig. 1 c is the structural representation that the embodiment of the present invention 2 ~ 3 is eliminated the device after satellite point.
Fig. 2 a is the structural representation of the embodiment of the present invention 2 ~ 3 printing devices.
Fig. 2 b is the profile of the Q-Q ' face of Fig. 2 a.
Fig. 2 c is the structural representation that the embodiment of the present invention 2 ~ 3 is eliminated the device after satellite point.
Detailed description of the invention
Below in conjunction with detailed description of the invention, the present invention is further illustrated.
The method of elimination printing components and parts satellite point of the present invention forms different components character for different inks, has different modes:
First method: be the printing device of metal-organic composite material, metal oxide for main component.Be about to be placed in etchant solution by the device with satellite point after contactless printing, corrode 1 ~ 50 second; Again by drying up after pure water rinsing, the satellite point in described device be eliminated (referring to following embodiment 1).
Second method: be the printing device of metal simple-substance or alloy for main component.Be about to by first carrying out plasma oxidation processing with the device of satellite point under 5-40Pa vacuum after contactless printing, controlling the reaction time is 0.5 ~ 5 minute, and then corrodes with described etchant solution, corrodes after 10 ~ 60 minutes; Again by drying up after pure water rinsing, the satellite point in described device be eliminated (referring to following embodiment 2, embodiment 3).
Embodiment 1
As shown in Figure 1a, the sheet glass that is 1.2 millimeters by thickness is made substrate 1 and is cut on demand 3 × 3 millimeters of square small pieces, is successively immersed in ethanol, isopropyl alcohol and water each ultrasonic 20 ~ 50 minutes, after taking-up, dries up with high pure nitrogen.Then on the above-mentioned substrate of handling well 1, pattern as requested carries out inkjet printing, forms device 12.Wherein, adopt zinc acetate-ethanolic solution of 0.1 ~ 0.8 mol/L to be made as ink, not, injection electric is controlled between 16 ~ 25 volts in the sprinkler selection 10 skin upgradings of ink-jet printer, print speed is 0.1 ~ 0.5 meter per second, and in print procedure, operating temperature range is controlled at 20 ~ 80 degrees Celsius.The device completing to be printed 12 is put into the sintering operation that carries out 200 ~ 500 degrees Celsius on warm table after drying.Obtained device 12 is placed under light microscope, can find to be scattered with in printed raceway groove the satellite point 13 of some, likely can affect the performance of device.
In the present embodiment, the ink that above-mentioned zinc acetate-ethanolic solution is made is converted into zinc oxide and is solidified into the final pattern of device 12 after sintering operation.Fig. 1 b is the PP ' profile of Fig. 1 a, the device 12 that is zinc oxide for main component, and employing etchant solution is acetic acid aqueous solution.Above-mentioned device 12 is immersed in the acetic acid aqueous solution of 1 mol/L, soak and within 10 seconds, take out afterwards and use a large amount of pure water rinsings, then dry up with high pure nitrogen.The satellite point 13 of the lower zinc oxide of printing of microscope has been removed.Acetic acid is lower to the etching speed of zinc oxide, the corrosion rate of printing device 12 main bodys can be controlled, in the present embodiment, and because device 12 main body zinc oxide thickness are thicker, in said process, saved from damage, on device 12 after treatment, the zinc oxide of 30nm thickness is removed.Satellite point 13 on device 12 is because thinner thickness is all removed, as shown in Fig. 1 c.
For this device 12 taking zinc oxide as main component, in other embodiments, thickness that can first observe satellites point 13 and dense degree are determined concentration and the soak time of etchant solution, for thickness larger, satellite point that dense degree is high, can adjust acetic acid concentration higher than the present embodiment, soak time also can proper extension.General adjusting acetic acid is 0.01 ~ 1 mol/L in the concentration of its aqueous solution; Soak time is within 1 ~ 50 second, to be good.For the device taking metal oxide as main component, its method of eliminating satellite point can reference example 1, etchant solution can adopt inorganic acid or the organic acid that can dissolve this metal oxide, controls extent of corrosion by the concentration, the soak time etc. that regulate etchant solution.
Embodiment 2
Shown in Fig. 2 a, get Kapton and make flexible substrate 21, cut into 2 × 2 millimeters of square small pieces, be successively immersed in ethanol, isopropyl alcohol and water each ultrasonic 15 ~ 30 minutes and clean, after taking-up, dry up with high pure nitrogen.Print silver-colored ink with this flexible substrate 21 pattern as requested by air-flow spray printing method, be respectively source transistor, the drain electrode of 20 microns, 500 microns to obtain length, the width of raceway groove.The scope of print speed is 2 ~ 10 mm/second, and in print procedure, operating temperature range is controlled at 40 ~ 80 degrees Celsius.After printing completes, device 22 is put into the sintering operation that sintering baking oven carries out 150 ~ 300 degrees Celsius, the silver features 22 that acquisition can be conducted electricity.Obtained device 22 is placed under light microscope, can find to be scattered with in printed raceway groove the satellite point 23 of some, likely can affect transistorized performance.
In the present embodiment, the device 22 that completes printing is put into oxygen plasma reactor, carry out oxidation processes to impel silver features 22 surface oxidations under the vacuum of 5Pa pressure, the reaction time is controlled at 0.5 minute, and device 21 surfaces form oxide layer 24.Shown in Fig. 2 a, Fig. 2 b, printing device 22 main bodys are the thick oxide layer 24 of the about 20nm of Surface Creation only, and satellite point in raceway groove 23 is because thinner thickness is all oxidized.
By immersing in rare nitric acid of 0.5 mol/L through the device 22 of oxidation processes, after 10 minutes, take out and use a large amount of pure water rinsings, then dry up with high pure nitrogen.Rare nitric acid corrosion dissolution and the thick silver oxide of the surperficial 20nm of oxidized device 22 is corroded, due to simple substance silver itself compared with silver oxide more difficult and dilute nitric acid reaction, printing main body is saved from damage in said process, and satellite point 23 has all been eliminated (as shown in Figure 2 c) by dilute nitric acid dissolution.
For this device 22 taking silver as main component, in other embodiment, thickness that can first observe satellites point 23 and dense degree are determined concentration and the soak time of etchant solution, for thickness larger, satellite point that dense degree is high, can adjust etchant solution concentration higher than the present embodiment, soak time also can proper extension.The rare concentration of nitric acid of general adjusting is 0.5 ~ 2 mol/L; Soak time is within 10-60 minute, to be good.Satellite point 23 is eliminated rear device 22 thickness and is cut down 20-80nm, but device 22 main bodys can be saved from damage, as shown in Figure 2 c.
Embodiment 3
Shown in Fig. 2 a, Fig. 2 b, the sheet glass that is 0.8 millimeter by thickness is made substrate 21, cuts on demand 2 × 2 millimeters of square small pieces, is successively immersed in ethanol, isopropyl alcohol and water each ultrasonic 20 ~ 50 minutes, after taking-up, dries up with high pure nitrogen.Then on the above-mentioned substrate of handling well 21 pattern as requested, to utilize commercialization copper ink inkjet printing width be that 25 ~ 50 microns, spacing are the netted device 22 of 100 ~ 200 microns.Not, injection electric is controlled between 16 ~ 22 volts in the sprinkler selection 30 skin upgradings of printer, and print speed is 0.1 ~ 0.5 meter per second, and in print procedure, operating temperature range is controlled at 40 ~ 80 degrees Celsius.The device completing 22 to be printed is put into the sintering operation that sintering baking oven carries out 150 ~ 180 degrees Celsius after drying.Obtained device 22 is placed under light microscope, can find to be scattered with in printed raceway groove the satellite point 23 of some, can affect transistorized performance.
Oxygen plasma reactor put into by the device 22 that completes printing by the present embodiment, carries out oxidation processes to impel copper surface oxidation under 40Pa vacuum, and the reaction time was controlled within the scope of 5 minutes, and device 21 surfaces form oxide layer 24.Shown in Fig. 2 a, Fig. 2 b, the only thick oxide layer 24 of the about 100nm of Surface Creation of printing main body, the satellite point 23 on device 22 is because thinner thickness is all oxidized.
The present embodiment adopts watery hydrochloric acid as etchant solution, by immersing in the watery hydrochloric acid of 2 mol/L through the device 22 of oxidation processes, takes out and use a large amount of pure water rinsings after 60 minutes, then dries up with high pure nitrogen.Satellite point 23 under microscope in printed device 22 has been removed.The dissolving and the thick cupric oxide of the surperficial 100nm of oxidized device 22 is also corroded, because elemental copper itself is not reacted with watery hydrochloric acid, printing device 22 main bodys are saved from damage in said process, and satellite point 23 on device 22 all eliminates, as shown in Figure 2 c.
For this device 22 taking copper as main component, in other embodiments, thickness that can first observe satellites point 23 and dense degree are determined concentration and the soak time of etchant solution, for thickness less, satellite point that dense degree is low, can adjust etchant solution concentration lower than the present embodiment, soak time also can suitably shorten.Generally, regulating concentration of hydrochloric acid is 0.5 ~ 2 mol/L; Soak time is within 10-60 minute, to be good; Satellite point 23 is eliminated rear device 22 thickness and is cut down 20-10nm, but device 22 main bodys can be saved from damage.
For the device taking metal simple-substance or alloy as main component, its method of eliminating satellite point can reference example 2, embodiment 3, etchant solution can adopt and can not dissolve this metal simple-substance or alloy, the inorganic acid that can only dissolve its corresponding metal oxide or organic acid, controls extent of corrosion by the concentration, the soak time etc. that regulate etchant solution.Due to as the device taking metal simple-substance or alloy as main component in embodiment 2, embodiment 3, oxidized portion only acts on surface, higher to sour tolerance, and etching time can proper extension to hour; And compare the device taking metal oxide as main component in embodiment 1, lower to sour tolerance, therefore etching time was controlled in one minute, and need to do suitable adjustment according to the thickness of satellite point.
The method of elimination satellite point of the present invention is applicable to the contactless print process of the overwhelming majority, as ink-jet printing process, air-flow spray printing method, electrohydrodynamics spray printing method and videograph.
Above embodiment all can reach object of the present invention.
The invention provides the method for eliminating contactless printing device centre halfback asterism, reduce the demand of satellite point to meet printed electronic industry as far as possible.Technique of the present invention is simple, with low cost; Can be applicable in multiple contactless printing process, and can on the basis of existing printing technology, eliminate or reduce the satellite point occurring in printed patterns, processing mode more directly effectively, is conducive to the raising of printed electronic product quality.
In sum, be the detailed description to the specific embodiment of the invention, this case protection domain is not constituted any limitation, all employing equivalents or equivalence are replaced and the technical method of formation, within all dropping on rights protection scope of the present invention.
Claims (6)
1. a method of eliminating printing device centre halfback asterism, is characterized in that, comprises the steps: to carry out corrosion reaction by being placed in etchant solution by the device (22) with satellite point (23) after contactless printing; Dry up through rinsing, the satellite point (23) in described device (22) is eliminated again; Described etchant solution is one or more in inorganic acid or organic acid; The described corrosion reaction time is 1 ~ 50 second; Described device (22) is taking one or more in metal-organic composite material, metal oxide as main component; Described etchant solution is that concentration is that acetic acid aqueous solution or the concentration of 0.01 ~ 1 mol/L is 0.01 ~ 1 mol/L hydrochloric acid.
2. the method for eliminating according to claim 1 printing device centre halfback asterism, is characterized in that, described contactless print process comprises any in ink-jet printing process, air-flow spray printing method, electrohydrodynamics spray printing method or videograph.
3. a method of eliminating printing device centre halfback asterism, is characterized in that, comprises the steps:, by first carrying out oxidation processes by the device (22) with satellite point (23) after contactless printing, to be then placed in etchant solution and to carry out corrosion reaction; Dry up through rinsing, the satellite point (23) in described device (22) is eliminated again; Described etchant solution is one or more in inorganic acid or organic acid; The time of described corrosion reaction is 10 ~ 60 minutes; Described oxidation processes is by plasma reactor, described device (22) to be carried out to plasma treatment 0.5 ~ 5 minute under the vacuum condition of 5-40Pa.
4. the method for eliminating according to claim 3 printing device centre halfback asterism, is characterized in that, described device (22) taking in metal or alloy one or more as main component.
5. the method for eliminating according to claim 3 printing device centre halfback asterism, is characterized in that, described etchant solution is that concentration is the nitric acid of 0.5 ~ 2mol/L or the hydrochloric acid that concentration is 0.5 ~ 2mol/L.
6. the method for eliminating according to claim 3 printing device centre halfback asterism, is characterized in that, described contactless print process comprises the one in ink-jet printing process, air-flow spray printing method, electrohydrodynamics spray printing method or videograph.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210163747.XA CN102673116B (en) | 2012-05-24 | 2012-05-24 | Method for eliminating satellite points of printed device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210163747.XA CN102673116B (en) | 2012-05-24 | 2012-05-24 | Method for eliminating satellite points of printed device |
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| CN102673116A CN102673116A (en) | 2012-09-19 |
| CN102673116B true CN102673116B (en) | 2014-09-03 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5294291A (en) * | 1991-09-20 | 1994-03-15 | Hitachi, Ltd. | Process for the formation of a conductive circuit pattern |
| CN1822316A (en) * | 2005-02-18 | 2006-08-23 | 精工爱普生株式会社 | Method of manufacturing wiring board |
| CN101331811A (en) * | 2005-12-20 | 2008-12-24 | 三菱瓦斯化学株式会社 | Composition for removing residue from wiring board and cleaning method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6481393A (en) * | 1987-09-24 | 1989-03-27 | Nec Corp | Manufacture of printed wiring board |
| JP3754217B2 (en) * | 1999-01-13 | 2006-03-08 | 日本特殊陶業株式会社 | Method for manufacturing printed wiring board |
| JP2009158855A (en) * | 2007-12-27 | 2009-07-16 | Fujifilm Corp | Method of manufacturing printed wiring board and cleaning liquid therefor |
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2012
- 2012-05-24 CN CN201210163747.XA patent/CN102673116B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5294291A (en) * | 1991-09-20 | 1994-03-15 | Hitachi, Ltd. | Process for the formation of a conductive circuit pattern |
| CN1822316A (en) * | 2005-02-18 | 2006-08-23 | 精工爱普生株式会社 | Method of manufacturing wiring board |
| CN101331811A (en) * | 2005-12-20 | 2008-12-24 | 三菱瓦斯化学株式会社 | Composition for removing residue from wiring board and cleaning method |
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| CN102673116A (en) | 2012-09-19 |
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Granted publication date: 20140903 Termination date: 20200524 |