CN102651288B - Electric switch and method - Google Patents

Abstract

A kind of electric switch and method.For must, one or more embodiments of the invention relates to switch to another state of switch assembly and method from a state.In some examples, switch module can be moved to PCB by the first conductive contact from printed circuit board (PCB) (PCB) by power spring or element the second conductive contact and switch to another electric contact from an electric contact.Such as, in one embodiment, conductive component groove in the pcb moves.In another embodiment, when power spring moves to the second conductive contact from the first conductive contact, the compression stress acting on power spring is reduced.

Description

Electric switch and method

Cross-Reference to Related Applications

This application claims that the U.S. of the Serial No. 13/035,769 submitted on February 25th, 2011 is special The rights and interests of profit application, are hereby incorporated by reference its entire disclosure at this.

Background technology

Electric measuring instrument, such as digital multimeter (DMMs), can be typically configured to measure multiple electricity ginseng Number, such as voltage, electric current and resistance.Many DMMs can switch between each group of input, often group Input or passage support that the major part of DMM measures function.Therefore, electric measuring instrument typically comprises use In the electric switch selected between various passages.

In some electric measuring instrument, external switch can be arranged on for selecting between channels On printed circuit board (PCB) (PCB).In other instruments, the PCB of electric measuring instrument can be configured and shape Become switch.Generally, this PCB switch includes the contact on multiple PCB surface, and one or many Individual power spring, this power spring is configured to when depressed, with in corresponding multiple contacts Individual make electrical contact with.In order to electric measuring instrument being arranged at the first state, by least one power spring Against the first contact being formed on PCB.In order to electric measuring instrument being arranged at the second state, will Power spring moves to the second position, and such as, its extruding power spring and the second contact contact.When Power spring is when PCB moves to the second contact from the first contact, and the free end of power spring is along One and second contact surface and PCB scraping.Therefore, in this switch, owing to frictional force is executed It is added on power spring, switches to another state from a state so that power spring therein weares and teares. The abrasion causing the end of power spring can also damage contact and PCB potentially.

Summary of the invention

This summary is provided, to introduce the selection of the concept of reduced form, the concept of this reduced form with Lower detailed description part will be described with.This summary is not intended as indicating the pass of claimed subject matter Key feature, is intended to be used to assist the scope determining claimed subject matter.

According to aspects of the present invention, it is provided that a kind of switch module.Switch module can include substrate, cunning Plate, at least one conductive component, and insulator.Substrate can have at least one first conduction and touch Point.Slide plate can be fixed to substrate, and has profile surface.At least one conductive component Can be configured to when at least one conductive component is in primary importance, touch with at least one first conduction Point electrical connection.Insulator can be configured to keep at least one conductive component.Insulator can be along slide plate Molded surface moves, and can be configured to move at least one conductive component from primary importance Two positions.When the first conductive contact is in the second position, conductive component leaves the first conductive contact one Set a distance.

According to aspects of the present invention, it is provided that one include printed circuit board (PCB), the first conductive contact and The switch module of insulator.Printed circuit board (PCB) can include at least one groove.This at least one groove is permissible There is the first end and the second end.First conductive contact can be arranged at the end of at least one groove. Insulator can include at least one conductive component, and this conductive component is configured to be positioned at least one In groove, and can move at least one groove, to selective contact with the first conductive contact.

According to aspects of the present invention, it is provided that a kind of by electricity equipment switch to the second state from the first state Method.The method can include being compressed at least one power spring on the first corresponding conductive contact, So that electricity equipment is arranged at the first state.Power spring can be kept by insulator.The method can be entered One step includes the part along molded surface slip insulator, with by least one power spring from first Corresponding conductive contact moves to the second corresponding conductive contact.A part along molded surface slip insulator The amount that this at least one power spring is compressed can be reduced.The method may further include at least One power spring is compressed on the second corresponding conductive contact, so that electricity equipment is arranged at the second state.

According to aspects of the present invention, the method from the first state, electricity equipment being switched to the second state is permissible Move to primary importance including by the conducting element of electricity equipment.Conducting element can be positioned to be formed at print In groove in printed circuit board.When conducting element is in primary importance, conducting element is electrically coupled to be formed In the first conductive contact of the end of groove, electricity equipment is arranged at the first state.The method is permissible Farther include to move to the second position conducting element away from the first conductor contact point from primary importance, will Electricity equipment is arranged at the second state.

Accompanying drawing explanation

When read in conjunction with the accompanying drawings, with reference to described in detail below, the aforementioned aspect of the present invention and some are adjoint Advantage will become better understood by, wherein:

Fig. 1 is the top isometric view of the switch module according to aspect of the present invention；

Fig. 2 is the bottom isometric view of the switch module of Fig. 1；

Fig. 3 A is the switch module cross section that the aspect according to the present invention illustrates the Fig. 2 being in primary importance Figure；

Fig. 3 B is the horizontal stroke that the aspect according to the present invention illustrates the switch module of Fig. 3 A in an intermediate position Sectional view；

Fig. 3 C is the horizontal stroke that the aspect according to the present invention illustrates the switch module of Fig. 3 A being in the second position Sectional view；

Fig. 4 is the cross-sectional view of another switch module of the aspect according to the present invention.

Detailed description of the invention

Although the example below with describe illustrative examples, it should be appreciated that, without departing from this In the case of bright spirit and scope, can make a variety of changes wherein.In this respect, below tie The detailed description that conjunction accompanying drawing is illustrated is intended merely as the description of the various embodiments of disclosed theme, and Being not intended to only represent these embodiments, wherein, in accompanying drawing, identical numeral represents identical element. It is only used as example or example offer in each embodiment described by this invention, is not intended that than other Embodiment is more preferably or advantageously.Illustrative example provided herein is not intended as the exhaustive present invention Or limit the invention to disclosed precise forms.Therefore, without departing from the spirit of the present invention and model In the case of enclosing, can make a variety of changes wherein.Similarly, identical or substantially in order to realize Similar result, any step described herein can be exchanged with each other with other steps, can be maybe step Rapid combination.

Following discussion provides the example of one or more switch module and uses its method.Always Must describe, one or more embodiments of the invention relates to switch module and for by switch module The method switching to another state from a state, such as, switch to open mode from closure state, Vice versa.In certain embodiments, switch module can be configured to by by conductive component (such as Spring, bar, element etc.) touch from suprabasil first conduction being positioned at such as printed circuit board (PCB) (PCB) Point is mobile switches to another state from a state to being positioned at suprabasil second conductive contact.As with Under be more fully described, embodiments of the invention can be configured to reduce when by conductive component from first Conductive contact moves the mill to the conductive component of switch module time the second conductive contact (that is, switching) Damaging, what the conductive component of this switch module included conductive component and conductive contact and this switch associates portion Part.Such as, in one embodiment, conductive component (such as spring, element, rod, bar etc.) exists When moving in the groove in PCB, thereby eliminate contacting between conductive component with PCB surface.At another In embodiment, when conductive component moves to the second conductive contact from the first conductive contact across PCB surface Time, decrease frictional force and/or other power acting on conductive component and/or PCB.

Although switch module can be illustrated according to electric measuring instrument and describe, but it should be appreciated that Method described herein and assembly may be used for any electric equipment needing use electric switch or the like. And, although the example of example relates to commutator herein, but it should be appreciated that switch module can Throw, including single-throw switch being applied to any quantity.In the example of single-throw switch, work as power spring When the permission electric current that contacts with single conductive contact flows through, switch module may be at closure state, or Person when power spring and single conductive contact separate prevention electric current flow through time, switch module may be at beat Open state.Should be further known to, electric switch described herein is applied to any amount of electrode.

Turning now to Fig. 1 and 2, it is shown that according to top and the end of the switch module 100 of aspect of the present invention Portion's isometric view.Switch module 100 includes the substrate of such as PCB 102, slide plate 104 and such as The insulator of switch body 106, its (such as, via keeping arm 108) is slidably retained at PCB 102 On.As will be described in more detail, switch body 106 is positioned on PCB 102, and is configured to Moving between the first location and the second location relative to PCB 102, primary importance is by switch module 100 Being arranged at the first state, switch module 100 is arranged at the second state by the second position.Therefore, switch Assembly 100 may be configured between the first electricity condition and the second electricity condition, such as at first passage With switch the electric equipment being associated between second channel.

As in Fig. 2 best seen from, PCB 102 is to have contrary first surface 112 and the second table The most smooth element in face 114.Such as Fig. 3 A-3C best illustration, PCB 102 includes multiple being fixed on Or the conductive contact 118 being formed on the first surface 112 of PCB 102.Conductive contact 118 can be by Any it is configured to allow for material that electronics flows through or multiple material is constituted.In one embodiment, example As, conductive contact 118 is made up of copper, and plates noble metal, such as gold.Conductive contact 118 can To be suitably spaced apart from each other, in order to by each conductive contact 118 and other conductive contact 118 electricity every From.It should be appreciated that conductive contact 118 can be through the trace in being formed from PCB 102 and PCB Other element (not shown) electric connections on 102.

Can also include one or more elongated open 120 with reference to Fig. 1 and 2, PCB 102, this is elongated Opening 120 extends to second surface 114 from the first surface 112 of PCB 102, be consequently formed one or Multiple grooves.As will be discussed in more detail below, opening 120 is configured to receive one or more holding arm 108.It should be appreciated that PCB 102 can be made up of any material or different materials, and configure Become: 1) mechanically support the element being mounted thereon, such as switch body 106；And 2) electric isolution Electric contact 118 formed thereon.PCB 102 may be constructed ball bearing made, and switch module 100 is for being somebody's turn to do A part for circuit, or PCB 102 could be for electric equipment (the such as digital versatile that is associated Table) main and/or unique printed circuit board (PCB), it includes switch module 100.Therefore, PCB 102 It is possible not only to be formed a part for switch module 102, and may be provided on it electric for other And the connection between the mount point of mechanical part.

Switch module 100 farther includes the slide plate having first surface 122 with second surface 124 104, as in Fig. 2 Yu 3A-3C best seen from.In the embodiment illustrated, the of slide plate 104 Second surface 114 interfaces on two surfaces 124 and PCB 102, and PCB 102 can be fixed to Second surface 114.On the other hand, the first surface 122 of slide plate 104 can include one or more Profile 128, its purpose will be described in detail later.

As described briefly above, switch body 106 can in such as Fig. 3 A first of the position of example Put and such as Fig. 3 C moves between the second position of the position of example.As in Fig. 1 best seen from, In order to affect the motion of switch body 106, in one embodiment, switch body 106 is via transfer arm 132 It is bonded to actuator 130.In one embodiment, actuator 130 may be mounted on PCB 102. In other embodiments, actuator 130 can separate installation with PCB 102.In either case, Transfer arm 132 is moved, so that open in the direction that actuator 130 can be configured to along being indicated by arrow B Close body 106 also to move along the direction indicated by arrow B.In other embodiments, can first with Switch body 106 is manually activated between the second position.And, relative to each other may not be used in first and second position Must be linear.

Turning now to Fig. 3 A-3C, illustrate the viewgraph of cross-section of switch module 100, each illustrate It is in the switch module of various location.Switch body 106 defines the most smooth surface 134, and it can With first surface 112 interfaces with PCB 102, and can be by insulant or multiple insulation material Material is made.When switch body 106 in figure 3 a shown in primary importance and Fig. 3 C shown in second Moving between putting, it can carry one or more conductive component, such as compression spring 136.Each lead Electrical spring 136 includes the first end 138 and the second end 140.Further, each power spring 136 is the most fixed Position becomes the first end 138 of power spring 136 can be fixed to switch body 106, and power spring Second end 140 of 136 stretches out from the surface 134 of switch body 106.Power spring 136 can be by Any material or multiple material are constituted, and this material is configured to allow for electronics and flows through, and provide elastic, To work as spring.In one embodiment, power spring 136 is with or without expensive The copper of metal-plated.

Being positioned the most by this way in switch body 106 in power spring 136, i.e. when When switch body 106 moves to first or the second position, it is allowed to power spring 136 is arranged to and two phases Adjacent conductive contact 118 phase electric connection or electrical connection.Such as, the second end of each power spring 136 140 all can be configured to when the first position of the position during switch body 106 is in such as Fig. 3 A, Contact the first corresponding conductive contact 118, and it is configured to the position in switch body 106 is in such as Fig. 3 C During the second position put, contact the second corresponding conductive contact 118.Though it is shown that five power springs 136, it is understood that, any amount of power spring can be set according to the structure of switch module 136.In certain embodiments, power spring 136 can be compression spring.Power spring 136 non- Limitative examples can include hanger spring, leaf spring, c-type spring or can be relative to conductive contact 118 any other springs being biased power.

Switch body 106 may further include one or more insulation component 144.Insulation component 144 Can be positioned between each adjacent power spring 136, in order to auxiliary electrically insulates each power spring 136.Insulation component 144 can be integrally formed with the switch body 106 of example as shown in figs. 3 a-3 c, or it Can be fixed to switch body 106.

Turning now to Fig. 1 and 2, as described briefly above, switch body 106 can include one or many Individual holding arm 108, one of this holding arm 108 surface being fixed to switch body 106 or with switch body 106 One of surface global formation, for movably switch body being maintained at PCB 102.At Fig. 1 With in the embodiment shown in 2, each holding arm 108 may each comprise arm section 146, and it is along switches set Part 100 extends, such as along the outward flange of PCB 102 or through an opening 120 in PCB 102. Flange 148 is fixed to the outer end of each arm section 146 or overall with the outer end of each arm section 146 Molding.In an illustrated embodiment, flange 148 can extend along the direction being perpendicular to arm section 146. As in Fig. 2 best seen from, in order to switch body 106 being maintained at the first surface 112 of PCB 102 Upper or first surface 112 adjacent to PCB 102, keep the flange 148 of arm 108 can be configured to The first surface 122 of slide plate 104 engages.

When assembling, keep arm 108 that switch body 106 is maintained at the first surface 112 of PCB 102 Upper or first surface 112 adjacent to PCB 102, meanwhile, still allows for switch body 106 along PCB 102 First surface 112 move between first and second positions.Additionally, holding arm 108 can be to cunning Plate 104 applies suitable power, to offset the biasing force acting on PCB 102 via power spring 136. In an illustrated embodiment, the flange 148 of arm 108 is kept to can be configured to first along slide plate 120 Slide in surface 122.Therefore, each flange 148 of arm 108 is kept all to can be configured to work as switches set Part 100, when primary importance moves to the second position, slides along corresponding profile 128.When often Individual flange 148 along corresponding profile 128 slide time, relative to the geometry of this profile, The value being put on the power on the first surface 112 of PCB 102 by power spring 136 is reduced.Effect Reduction in the amount that the reduction of the power of switch body 104 is compressed corresponding to each power spring 136.

Now by describing, switch module 100 is shown during from Fig. 3 A, the primary importance of example switches to Fig. 3 C The example of the operation of the second position of example.In figure 3 a in the primary importance of example, power spring 136 Electrically connect with the corresponding conductive contact 118 being formed on PCB 102.Such as example in Fig. 3 A, incite somebody to action Power spring 136 is loaded onto compressive state, in order to have reduction length Y.So, compression conductive spring The surface of 136 pairs of corresponding conductive contacts 118 is biased power, for improving being electrically connected between them Connect.As it has been described above, keep the flange 148 of arm 108 to may be configured to payment by power spring 136 The biasing force applied, thus switch body 106 is held in suitable position.

When switch body 106 moves to the second position from primary importance, keep the flange 148 of arm 108 Along being slided by the profile 128 of the slide plate 104 exemplified by the centre position in Fig. 3 B.Such as Fig. 3 B Shown in, when flange 148 slides along the concave surface profile 128 of slide plate 104, by power spring 136 Putting on the biasing force on PCB 102 or on conductive contact 118 forces switch body 106 away from PCB 102 First surface 112 so that power spring 136 become reduce compression.Such as, such as Fig. 3 B institute Showing, power spring 136 has length Y of compression ', it is more than the compression of the spring 136 in Fig. 3 A Length Y.It therefore reduces act on first surface 112 and the power spring 136 of PCB 102 Power.In one embodiment, power spring 136 may be at position shown in Fig. 3 B or along briquetting roller Non-compressed state in any position in wide 128 paths.

According to explanation described above, it should be appreciated that, the second end 140 edge of power spring 136 The first surface 112 of PCB 102, including the part slip along conductive contact 118, when abiding by with molding Time advance in profile 128 path, put on also being reduced with joint efforts of the second end 140.Therefore, also reduce Put on frictional force and/or other power of second end 140 of power spring 136.In some embodiment In, so can reduce the abrasion of the second end 140 to power spring 136.Similarly, it is also possible to Reduce and put on PCB 102 and/or the frictional force of conductive contact 118 and/or other power.Real at some Execute in example, so can reduce the abrasion and/or damage caused by PCB 102 and/or conductive contact 118 Bad.

When switch body 106 arrives the second position by Fig. 3 C example, power spring 136 can return To being enough to power spring 136 is arranged to be electrically connected the state more compressed with conductive contact 118. In fig. 3 c in the embodiment of example, power spring 136 is back to compressive state, in order to have compression Length Y.When being in the position of example in Fig. 3 A, each compression in the position of example in Fig. 3 C Biasing force is put on the surface of corresponding conductive contact 118 by power spring 136.Further, as above Described, keep the flange 148 of arm 108 to can be configured to offset the power applied by power spring 136, Thus switch body 106 is held on PCB 102 suitable position.

In alternative embodiments, slide plate 104 can be fixed to the first surface 112 of PCB 102. In this alternate embodiment, slide plate 104 can be arranged between switch body 106 and PCB 102. Especially, the second surface 124 of slide plate 104 can be fixed to the first surface 112 of PCB 102, and The inner surface 134 of switch body 106 may be located on the first surface 122 of slide plate 104 or adjacent to cunning The first surface 122 of plate 104.In this embodiment, switch body 106 can be configured to along slide plate 104 First surface 122 slide.However, it should be understood that, on the first surface 122 of slide plate 104 Profile can be convex surface.So, convex surface profile part reduces and puts on PCB 102 And the power of each power spring 136.

In other alternate embodiments, it is possible to use cam or pivotal arm reduce and pass through power spring Act on the value of the power of PCB 102.It is to say, cam or pivotal arm are coupled to switch body 106, Switch body 106 is moved away from the first surface 112 of PCB 102, thus reduces by conduction bullet Spring 136 acts on the value of the power on its surface.In another alternate embodiment, on slide plate 104 Profile 128 can be integrated with the first surface 112 of PCB 102 or second surface 114.

Turning now to Fig. 4, it illustrates the another of the switch module 200 that formed according to aspects of the present invention One exemplary embodiments.Switch module 200 on material with operation with before embodiment a lot of of description Element is substantially the same.But, as will be described in detail, switch module 200 is in many aspects It is different from switch module 100.So that ensuing explanation is clear, the phase isomorphism of switch module 200 The reference of part is similar in appearance to the component for describing switch module 100, but is 200 references Series.

As in Fig. 4 best seen from, it is the cross-sectional view of switch module 200 in an intermediate position, Switch module 200 includes PCB 202 and insulator, such as switch body 206.PCB 202 can be as The PCB described with reference to Fig. 1-3, and include first surface 212 and contrary second surface 214. PCB 202 farther includes one or more to be formed at elongated opening 272 therein.One or more Opening 272 can orient on PCB 202, thus by arrow B in the longitudinal axis of opening 272 and Fig. 4 The direction of motion of instruction aligns.Each opening 272 all includes the first end 274 and the second end 276.To the greatest extent Pipe depicts six openings 272 in the diagram, it is understood that, any quantity in any direction Opening 272, the most any amount of row, can be arranged in PCB 202.Such as, a reality Executing in example, PCB 202 includes that ten are formed at opening therein, becomes five grooves of two row.Show as in Fig. 4 Example, one or more openings 272 can extend to PCB 202 from the first surface 212 of PCB 202 Second surface 214, be consequently formed elongated groove.But, in alternative embodiments, one or Multiple openings 272 can extend partially by PCB 202 from first surface 212.Replaceable at this Embodiment in, opening 272 forms passage, each has bottom surface not shown in FIG. 4.

Switch module 200 farther includes paired conductive contact 218, every pair all with opening 272 phase Association.In an illustrated embodiment, each conductive contact 218 can be formed at each of opening 272 End.It is to say, conductive contact 218 can be formed at the first end 274 of each opening 272, And conductive contact 218 can be formed at the second end 276 of each opening 272.Conductive contact 218 Material that electronics flows through can be configured to allow for or multiple material is constituted by any.It should be appreciated that Conductive contact 218 can trace (not shown) through being formed from PCB 202 with on PCB 202 Other element (not shown) be electrically connected.In one embodiment, conductive contact 218 is by copper Become, and be plated with noble metal, such as gold.In certain embodiments, of conductive contact 218 Or multiple edge can be with bevel.

Referring now still to Fig. 4, switch module 200 includes insulator, such as, carry one or more conductive element The switch body 206 of part 236.Switch body 304 includes the most smooth table with first surface 212 interfaces Face 234.The surface 234 that conducting element 236 can be configured to from switch body 206 stretches out.Especially, The Part I of each conducting element 236 all can be fixed to switch body 206, thus conducting element 236 Part II stretch out from the surface 234 of switch body 204.Including multiple conducting element 236 Embodiment in, such as in Fig. 4 one of example, conducting element 236 is oriented to and any other Conducting element 236 separate.Conducting element 236 is further positioned into corresponding in PCB 202 The orientation of opening 272 and location.It is to say, each conducting element 236 is all in switch body 206 Middle orientation, to align with the respective openings 272 in PCB 202.Switch body 206 can be further Including keeping arm 208, this holding arm 208 is fixed on switch body 206 or is integrally formed with switch body 206, For movably switch body being maintained at PCB 202.

In an embodiment of the present invention, one or more conducting elements 236 can be that any being configured to is worked as When a part for conducting element 236 adjoins conductive contact 218, it is electrically connected with corresponding conductive contact 218 The conducting element connect.In one embodiment, conducting element 236 can be spring.Conducting element 236 Non-limiting example can include leaf spring, c-type spring, helical spring or be configured to and conductive contact The 218 any spring suitably made electrical contact with or elements.In other embodiments, conductive component be bar, Rod etc..In one embodiment, conducting element 236 is copper conducting element, and it can or can not It is plated with noble metal, such as gold.

When assembling, such as example in Fig. 4, switch body 206 is positioned the first surface of PCB 202 On 212, thus each conducting element 236 may be contained within the respective openings 272 in PCB 202.As Described briefly above, switch body 206 can be held in PCB 202 movably by keeping arm 208 On.According to the position of the switch body 206 on PCB 202, keep arm 208 can extend through similar The opening in the PCB 202 of the opening 120 of example in Fig. 1, and/or along such as the PCB of Fig. 1 example

The outward flange of 202 extends.The flange 248 of each holding arm 208 can be disposed against PCB 202 Second surface 214, so that switch body 206 is held on the surface of PCB 202.

In certain embodiments of the present invention, switch body 206 can hands between first and second positions Dynamic actuating.In other embodiments, the actuator referring for example to the actuator 130 described in Fig. 1 is permissible For affecting switch body 206 by the transfer arm 132 motion from primary importance to the second position.The most just Being to say, switch module 200 can be configured to when actuator 130 (Fig. 1) makes transfer arm 132 along arrow When one direction of head B instruction is moved, switch to the second state from the first state.

Fig. 4 illustrates switch module 200 in an intermediate position, thus conducting element 236 not with respectively Individual conductive contact 218 contacts.When actuator 130 makes switch body 206 move to primary importance, That is, towards the conductive contact 218 being positioned at the first end 274 of opening 272, conducting element 236 is in phase The opening 272 answered moves, until at the first end 274 of conducting element 236 and each opening 272 Conductive contact 218 phase physical contact.When switch module 200 is in primary importance, and each lead When a part for electric device 236 is all electrically connected with corresponding conductive contact 218, switch module 200 It is arranged at the first state.

Similarly, when actuator 130 makes switch body 206 move to the second position, i.e. towards Being positioned at the conductive contact 218 at the second end 276 of opening 272, conducting element 236 is at corresponding opening Move in 272, until the conductive contact 218 at the second end 276 of conducting element 236 and opening 272 Phase physical contact.When switch module 200 is in the second position, and the one of each conducting element 236 When part is all electrically connected with corresponding conductive contact 218, switch module 200 is arranged at the second shape State.It should be appreciated by the person skilled in the art that can be with the switch module 200 of modified example, for appointing The electrode of what quantity.Therefore, it can use any amount of groove according to purpose expected from switch module With any amount of conductive contact.

Various principles, representative embodiment and the operator scheme of the present invention are done in preceding description Describe.But, it is intended to the aspect of the present invention of protection is not construed to disclosed specific embodiment Restriction.Further, embodiment described herein will be as example rather than restriction.Should be appreciated that It is, without departing from the spirit of the invention, can by other means and use equivalent Make change and change.Therefore, it should be clear that be contemplated that all these change, change with And equivalent each falls within the spirit and scope of claim theme.

Claims (12)

1. a switch module, including:

Substrate, it has flat surfaces and at least one first conductive contact；

Slide plate, it is fixed to the described flat surfaces of described substrate, and described slide plate has molded surface；

At least one conductive component, it is configured to, when at least one conductive component described is in primary importance, electrically connect with at least one first conductive contact described with compressive state；And

Insulator, it is configured to keep at least one conductive component described, wherein, described insulator can move along the described molded surface of described slide plate, and it is configured to move reducing at least one conductive component described in compressive state to the second position from described primary importance, wherein, when at least one conductive component described is in the described second position, at least one conductive component described is arranged from described first conductive contact certain distance.

Switch module the most according to claim 1, wherein, described substrate includes at least one second conductive contact, wherein, at least one conductive component described is further configured to electrically connect with at least one second conductive contact described in the described second position with compressive state, and wherein, described insulator can move between described primary importance and the described second position along the molded surface of described slide plate.

Switch module the most according to claim 2, wherein, described substrate is printed circuit board (PCB), this printed circuit board (PCB) includes the first flat surfaces and the second flat surfaces, at least one first conductive contact wherein said and at least one second conductive contact described are positioned on described first flat surfaces, and described slide plate is positioned on described second flat surfaces.

Switch module the most according to claim 3, wherein, described molded surface is concave surface.

Switch module the most according to claim 2, wherein, described substrate includes the first flat surfaces and the second flat surfaces, and wherein, at least one first conductive contact described, at least one second conductive contact described and described slide plate are positioned on described first flat surfaces of described substrate.

Switch module the most according to claim 5, wherein, described molded surface is convex surface.

Switch module the most according to claim 2, wherein, at least one conductive component described includes multiple power spring, described switch module farther includes multiple first conductive contact and the second conductive contact, wherein, each power spring is configured to electrically connect with corresponding in corresponding first conductive contact and corresponding second conductive contact.

8. method electricity equipment being switched to the second state from the first state, described method includes:

Being compressed to by least one power spring on the first corresponding conductive contact, so that described electricity equipment is arranged at described first state, described power spring is kept by insulator；

Along the molded surface described insulator of slip, so that at least one power spring described is moved to the second corresponding conductive contact from the described first corresponding conductive contact, wherein, reduce, along the described molded surface described insulator of slip, the amount that at least one power spring described is compressed；And

At least one power spring described is compressed on the described second corresponding conductive contact, so that described electricity equipment is arranged at described second state.

Method the most according to claim 8, wherein, described molded surface is one of concave surface or convex surface.

Method the most according to claim 8, wherein, the described first corresponding conductive contact is on the first flat surfaces of printed circuit board (PCB) to described second corresponding conductive contact.

11. methods according to claim 8, wherein, at least one power spring described selects from one group, and this group includes helical spring, leaf spring and c-type spring.

12. methods according to claim 8, wherein, make at least one power spring described decompressed to non-compressed state along the described molded surface described insulator of slip.