CN102645141A

CN102645141A - Signal, energy and chemical connecting method of safe, arm and fire integrated microcomponent

Info

Publication number: CN102645141A
Application number: CN2011100414200A
Authority: CN
Inventors: 赵越; 娄文忠; 宋荣昌
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-02-21
Filing date: 2011-02-21
Publication date: 2012-08-22

Abstract

The invention relates to a connecting method for signals, energy and chemical in a safe, arm and fire integrated microcomponent which is designed based on a microsystem integration technique. The invention provides a method for connecting the safe, arm and fire integrated microcomponent by combining a microelectronic packaging technique and a firework component charging technique. Not only can the problem in the control and fire integrated design of a safe, arm and fire integrated chip, but also the problem in the electric connection with a macrocomponent is solved. More importantly, in combination with methods such as adhesive-filling charging and chemical pressing, the problems in the separate design and the modular assembly of fire pieces, primers and boosters are solved.

Description

Safety, Xie Baoyu get angry integrated micromodule signal, energy and medicament method of attachment

Technical field

What the present invention relates to is the method for attachment of inner each key element of core micromodule, specifically is based on the safety of micro-system integrated technology design, the method for attachment of Xie Baoyu ignition (Safe, Arm and Fire) integrated micromodule internal signal, energy and medicament.

Background technology

Separating guarantor (Safe Arm) assembly safely, is that middle assurance ignition control device normally acts on the key mechanism of getting angry with the processing of duties at ordinary times safety.Along with the complicacy gradually of function, the power consumption of internal information treatment circuit increases, so reduce the energy consumption of detonator, development low energy detonating technique becomes inevitable.At present elementary sparking gear is just progressively developed to the low energy fuse that the based semiconductor bridge/metal bridge ignition part is made by bridge silk detonator.Semiconductive bridge/metal bridge is exported the two kinds of forms that mainly contain under the effect under the energy that detonates; The output of detonating under the high energy condition is main with plasma form; Be main with thermal output under the low-energy condition; The part that requires under the thermal output condition to get angry closely contacts with primer mixture, priming, otherwise can't form reliable detonation to the transmission of next stage priming system.So semiconductive bridge/metal bridge priming system often forms semiconductive bridge/metal bridge detonator with primer mixture, priming Work Packages in a housing at present, use as a standard package.But this type of detonator volume is bigger, simultaneously because firing circuit is to carry out packing into after board-level circuit is connected through lead with the semiconductive bridge detonator, causes the reliable action rate of electric spark workpiece still to be difficult to guarantee.Development along with integrated circuit technique; There has been special integrated circuit to bring into use; The processing technology of semiconductive bridge/metal bridge and integrated circuit processing technology are compatible fully, with little ignition part and signal processing and the integrated interconnections that can reduce inside of initiation control circuit monolithic, reduce the circuit volume; Increase reliability and anti-overload ability, reduce simultaneously and produce and packaging cost.But this connected mode to integrated integrated chip of getting angry part and treatment circuit and other elements reaches the connectivity problem of the ignition part that under this connected mode, brings and primer mixture, priming and has proposed great challenge.

Summary of the invention

The purpose of this invention is to provide the method for attachment of a kind of safety, Xie Baoyu ignition (Safe, Arm and Fire) integrated micromodule internal signal, energy and medicament based on the design of micro-system integrated technology.

The objective of the invention is to realize like this: safety, Xie Baoyu get angry the composition of integrated micromodule comprise MEMS-CMOS safety, Xie Baoyu get angry integrated chip, separation detonate electric capacity, initiation control IGCT, anti-earial drainage diode, primer mixture, primary explosive column, film flying, electric connection line/contact pin, connect PCB circuit board, housing, mechanical connection screw and the pillar of chip.The connectivity problem of core is that MEMS-CMOS safety, Xie Baoyu are got angry little ignition part and the primer mixture in the integrated chip, the annexation between the priming, and in order to achieve this end other annexations that micromodule inside lays under tribute.The little ignition part of semiconductive bridge/metal bridge is followed the hot melt effect under the low energy initiation conditions; Require primer mixture to contact with no gap, ignition part surface, the connected mode of chip and pcb board is limited simultaneously, has only formal dress and upside-down mounting dual mode; Silicon materials are more crisp in addition, and the anti-pressure ability of chip is limited.Take all factors into consideration the connection restriction of above three aspects; The connected mode of MEMS-CMOS safety, Xie Baoyu ignition integrated chip and pcb board adopts the form of chip BGA upside-down mounting; Simultaneously on the pcb board that chip issues, drive locating hole; Make the center, hole get angry the position of part on the chip; For guaranteeing that detonation reliably forms, adopt the directed mode of transmitting amplified energy of two-stage priming to amplify the ignition effect of ignition part, and add a substrate that has the propagation of explosion hole through locating hole on the pcb board and chip location.First order primer mixture closely contacts with the ignition part, and second level priming closely contacts with primer mixture.For guaranteeing primer mixture and get angry part and closely contact, avoid simultaneously because primer mixture is too responsive in the pressing process, acts on, primer mixture is covered to get angry part surperficial through locating hole getting angry part surface coating or the mode through injecting glue.Be to guarantee the pressing density of second level priming, in advance priming is pressed in the joint pencil, the pencil that presses medicine is put into the detonating primer on the substrate and compressed, booster explosive is closely contacted with primer mixture.Power supply, separation are detonated discrete component mounter such as electric capacity, initiation control IGCT, anti-earial drainage diode on another piece pcb board, and two pcb boards connect the connection that is welded through binding post.Abundant for guaranteeing two mechanical connection intensity and gaps between the pcb board, between two pcb boards, add pillar to guarantee the gap combination process needs of two pcb boards, connect two pcb boards through screw simultaneously.

The present invention can also comprise some characteristics like this:

1, said MEMS-CMOS safety, Xie Baoyu ignition integrated chip can adopt lead-in wire bonding mode to be connected with the connected mode of pcb board.

2, can use the twisted-pair feeder punch through mode to connect between said micromodule pcb board.

It is littler that the core parts that adopt the manufacturing of MEMS-CMOS processing technology and traditional discrete component, frame for movement and PCB circuit are compared size, and reliability improves, and the processing uniformity is better, and cost is lower.But since undersized, cause micro element to be connected difficulty with the traditional macro system.Get angry integrated micromodule through microelectronic packaging technology is combined with firer's element powder charge technology with safety, Xie Baoyu; Safety, the control of Xie Baoyu ignition integrated chip, the integrated design problem of getting angry had both been solved; Solved the problem that is electrically connected with macroscopical element again, the most important thing is to combine methods such as injecting glue powder charge, pressing to solve and get angry the separate design and the modularization packing problem of part and primer mixture booster explosive.

1, compatible with existing packaging technology, be convenient to batch machining, can reduce production costs;

2, connection reliability is high, and volume is little, can be used for Small-Caliber Ammunition;

3, realized getting angry the separating of part and medicine, system combines with reasonable security, can improve security greatly.

Product of the present invention is applicable to the security system that adopts MEMS, CMOS processes, the signal and the energy connectivity problem of getting angry part and special chip.

Description of drawings

Figure1, chip BGA connects schematic three dimensional views

Figure2, ignition part and primer mixture, priming connection layout

Figure3, the ignition part is connected profile with primer mixture, priming under the BGA connected mode

Figure4, integrated micromodule is electrically connected and medicine annexation figure

Figure5, another kind of chip lead bonding connects schematic three dimensional views

Figure6, the ignition part is connected profile with primer mixture, priming under the lead-in wire bonding mode

Specific embodiments

For example the present invention is done more detailed description below in conjunction with accompanying drawing: combine Fig. 1, the composition that chip of the present invention connects embodiment comprises pad (4), locating hole (5) and screw hole (6) on safety, Xie Baoyu ignition integrated chip (1), BGA soldered ball (2), PCB circuit board (3), the pcb board.Safety is separated to protect with ignition integrated chip (1) circuit layer and is faced PCB circuit board (3) upper surface; Location back SAF bonding pads and the last corresponding bonding pad (4) of PCB circuit board (3) over against; Between pad, add BGA soldered ball (2), the mode through the hot reflux weldering is welded soldered ball (3) respectively to be connected with the both sides pad.The little ignition part in the chip after being welded and the center of the locating hole (5) on the pcb board (3) over against.

In conjunction with Fig. 2,3, the composition of the embodiment of medicine connected mode of the present invention has added metal substrate (7), the pencil that detonates (8), primer mixture and priming (9) on the basis that the aforementioned electric connectivity scenario is formed.Concrete embodiment is; With the mode of primer mixture (9) through injecting glue powder charge or coating; Instil or be coated to the ignition part surface on the SAF chip (1) through locating hole (5); The mode of priming (9) through pressing is pressed in the pencil that detonates (8); Satisfy the requirement of priming pressing density, metal substrate (7) upper surface through method for milling process with pcb board (3) on the consistent boss of locating hole (5) shape, with pack into locating hole (5) and make metal substrate (7) upper surface and pcb board (3) lower surface bonds of boss; The pencil that assembles is packed into through the pencil installing hole that detonates in the middle of substrate (7) convex platform, and make tight being connected of contact realization medicine and initiation piece of priming surface and primer mixture surface.

In conjunction with Fig. 4, SAF chip (5) links to each other with other outward elements and power supply with upper strata pcb board (11) through pcb board (3), binding post (10) among the present invention.

In conjunction with Fig. 5,6, the another kind of composition that is electrically connected the specific embodiment of the implementation that is connected with medicine comprises pad (205) and the screw hole (206) on safety, Xie Baoyu ignition integrated chip (201), soldered ball (202), lead-in wire (203), pcb board (204), the pcb board among the present invention.Safety is separated to protect with ignition integrated chip (201) circuit layer and PCB circuit board (204) upper surface and is placed in the same way; The pad of location back SAF chip (201) and the last corresponding bonding pad (205) of PCB circuit board (204) mode through the ball bonding bonding that goes between makes solder joint and pad (205) conducting on the pcb board (204) on the SAF chip (201).The medicine connected mode with before a kind of implementation identical.

Claims

1. a safety, Xie Baoyu get angry the method for attachment of integrated micromodule internal signal, energy and medicament; Its method of attachment is: the connected mode of MEMS-CMOS safety, Xie Baoyu ignition integrated chip and pcb board adopts the form of chip BGA upside-down mounting; Simultaneously on the pcb board that chip issues, drive locating hole; Make the center, hole get angry the position of part on the chip, primer mixture is covered get angry the part surface getting angry part surface coating or the mode through injecting glue through locating hole.Add a substrate that has the propagation of explosion hole through locating hole on the pcb board and chip location.In advance priming is pressed in the joint pencil, the pencil that presses medicine is put into the detonating primer on the substrate and compressed, booster explosive is closely contacted with primer mixture.Power supply, separation are detonated discrete component mounter such as electric capacity, initiation control IGCT, anti-earial drainage diode on another piece pcb board, and two pcb boards connect the connection that is welded through binding post.

2. signal method of attachment according to claim 1, safety, Xie Baoyu ignition integrated chip with the method for attachment of pcb board are: adopt the method for attachment of BGA soldered ball to be connected chip and pcb board.

3. signal method of attachment according to claim 1; The ignition part on safety, the Xie Baoyu ignition integrated chip and the method for attachment of primer mixture booster explosive are: with the mode of primer mixture through injecting glue powder charge or coating; Instil or be coated to the ignition part surface on the SAF chip through locating hole; The mode of priming through pressing is pressed in the pencil that detonates; The substrate that will have a boss is connected with pcb board through the pcb board locating hole, the pencil that assembles is packed into through the pencil installing hole that detonates in the middle of the substrate convex platform, and make that priming surface and primer mixture surface are tight to contact being connected of realization medicine and initiation piece.

4. signal method of attachment according to claim 1, safety, Xie Baoyu ignition integrated chip with the another kind of method of attachment of pcb board are: adopt the method for attachment of wire bonds to be connected chip and pcb board.