CN102637527A - A multilayer ceramic electronic part and a manufacturing method thereof - Google Patents
A multilayer ceramic electronic part and a manufacturing method thereof Download PDFInfo
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- CN102637527A CN102637527A CN2012100285539A CN201210028553A CN102637527A CN 102637527 A CN102637527 A CN 102637527A CN 2012100285539 A CN2012100285539 A CN 2012100285539A CN 201210028553 A CN201210028553 A CN 201210028553A CN 102637527 A CN102637527 A CN 102637527A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 127
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000843 powder Substances 0.000 claims abstract description 64
- 239000002245 particle Substances 0.000 claims abstract description 63
- 239000002131 composite material Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 33
- 238000002360 preparation method Methods 0.000 claims description 22
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 238000010304 firing Methods 0.000 claims description 11
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims description 10
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000006121 base glass Substances 0.000 claims description 5
- GEZAXHSNIQTPMM-UHFFFAOYSA-N dysprosium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Dy+3].[Dy+3] GEZAXHSNIQTPMM-UHFFFAOYSA-N 0.000 claims description 4
- UZLYXNNZYFBAQO-UHFFFAOYSA-N oxygen(2-);ytterbium(3+) Chemical compound [O-2].[O-2].[O-2].[Yb+3].[Yb+3] UZLYXNNZYFBAQO-UHFFFAOYSA-N 0.000 claims description 4
- MTZOKGSUOABQEO-UHFFFAOYSA-L barium(2+);phthalate Chemical compound [Ba+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O MTZOKGSUOABQEO-UHFFFAOYSA-L 0.000 claims 2
- 239000000395 magnesium oxide Substances 0.000 claims 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims 2
- 229910003454 ytterbium oxide Inorganic materials 0.000 claims 2
- 229940075624 ytterbium oxide Drugs 0.000 claims 2
- 238000005245 sintering Methods 0.000 abstract description 17
- 230000002708 enhancing effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 142
- 238000009413 insulation Methods 0.000 description 23
- 229910002113 barium titanate Inorganic materials 0.000 description 8
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 8
- 238000010276 construction Methods 0.000 description 8
- 230000004523 agglutinating effect Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000008602 contraction Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000004069 differentiation Effects 0.000 description 3
- 229910002367 SrTiO Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Provided are a multilayer ceramic electronic part and a manufacturing method thereof. The multilayer ceramic electronic part comprises: an active layer which is stacked alternatively by a dielectric layer and an internal electrode layer, wherein the dielectric layer is formed by a dielectric composite containing ceramic powder with particles of an average size being 100-300nm; a cover layer which is arranged on at least one of the top and the bottom of the active layer and is prepared from a dielectric composite that contains the same ceramic powder with that of the active layer, and the average particle size of the ceramic powder is 50-250nm; and an external electrode that is electrically connected with the internal electrode layer. According to the embodiment of the utility model, the multilayer ceramic electronic part is sintered to be uniform to minimize the unmatching situation of sintering shrinkage, thereby enhancing the reliability.
Description
The cross reference of related application
The application requires to be committed on February 9th, 2011 priority of the korean patent application No.10-2011-0011551 of Korea S Department of Intellectual Property, and the full content of this application is introduced among the application with for referencial use.
Technical field
The present invention relates to a kind of laminated ceramic electronic component and preparation method thereof, the appearance of fault of construction (like hole, crack etc.) strengthens its reliability after can firing through minimizing.
Background technology
Recently, along with developing rapidly of electrical equipment and electronic product microminiaturization, lighting and multifunction, the microminiaturization and the high capacitanceization of laminated ceramic electronic component, the multi-layer ceramic capacitance (MLCC) that particularly is applied to electrical equipment and electronic product has also obtained development.
Therefore, the dielectric layer that is applied to multi-layer ceramic capacitance is attenuation and height multiple stratification day by day.
The emphasis that exploitation over capacity multi-layer ceramic capacitance will be considered is to carry out electric capacity and guarantee high reliability according to applied voltage.
Usually, the reliability of said multi-layer ceramic capacitance is by the evaluation result decision to hot insulation resistance (heat insulation resistance) and hygrometric state insulation resistance (humidity insulation resistance).
Hot insulation resistance depends primarily on material aspect (for example, dielectric and the degradation characteristics of internal electrode, the tiny fault of construction etc. of preparation electric capacity).
In addition, the hygrometric state insulation resistance depend on structure aspects (for example, fault of construction such as the hole that when compression/cutting, occurs or peel off, internal electrode do not use the zone or fire after the crack that occurs easily of interlayer etc., and the hole in the outer electrode etc.).
Well-known is that in multi-layer ceramic capacitance, the hygrometric state insulation resistance is the direct cause of low insulation resistance (IR low) owing to use DC power supply.Especially, this phenomenon can frequently occur in through in the multi-layer ceramic capacitance small-sized, over capacity that piles up ultra-thin dielectric layer preparation hundreds of or more multilayer.
Summary of the invention
One aspect of the present invention provides a kind of laminated ceramic electronic component and preparation method thereof, and the appearance of fault of construction (like hole, crack etc.) strengthens its reliability after can firing through minimizing.
According to an aspect of the present invention; A kind of laminated ceramic electronic component is provided; This laminated ceramic electronic component comprises: active layer is dielectric layer and the interior electrode layer alternated that the dielectric composition of the ceramic powder of 100-300nm forms by containing average particle size particle size wherein; The cover layer that is formed at that one side at least in said active layer end face and the bottom surface goes up and forms by the dielectric composition that contains the ceramic powder identical with the ceramic powder of said active layer, the average particle size particle size of said ceramic powder is 50-250nm; And the outer electrode that is electrically connected with interior electrode layer.
The average particle size particle size that forms said tectal said ceramic powder can be than the little 50-100nm of average particle size particle size of the ceramic powder that forms said active layer.
Said ceramic powder can be for being selected from by barium titanate (BaTiO
3) sill, plumbous composite perofskite sill (lead composite perovskite-based material) and strontium titanates (SrTiO
3) at least a in the group formed of sill.
Said cover layer can be than said dielectric layer thickness 3-10 times of said active layer.
Said dielectric layer can have the thickness of 0.5-1.5 μ m.
Said dielectric composition can further contain magnesia (MgO), rare earth oxide, manganese oxide (MnO) and borosilicate base glass (borosilicate-based glass).
Said rare earth oxide can be for being selected from by yittrium oxide (Y
2O
3), holimium oxide (Ho
2O
3), dysprosia (Dy
2O
3) and ytterbium oxide (Yb
2O
3) at least a in the group formed.
According to a further aspect in the invention; The preparation method of laminated ceramic electronic component is provided; This method comprises: the preparation active layer, and wherein, alternated is dielectric layer and the interior electrode layer that the dielectric composition of the ceramic powder of 100-300nm forms by containing average particle size particle size; The cover layer that preparation is formed by the dielectric composition that contains the ceramic powder identical with the ceramic powder of said active layer, the average particle size particle size of said ceramic powder are 50-250nm; Form laminate (laminate) through piling up said cover layer on the one side at least in said active layer end face and bottom surface; Prepare green chip (green chip) through cutting said laminate; Prepare ceramic sintered bodies (ceramic sintered body) through firing said green chip then.
Description of drawings
To make below in conjunction with the detailed description of accompanying drawing and of the present inventionly above-mentionedly more clearly to be understood with others, characteristic and other advantage, wherein:
Fig. 1 is the sketch map of multi-layer ceramic capacitance according to the embodiment of the present invention;
Fig. 2 is the cross sectional view along the said multi-layer ceramic capacitance of the A-A ' line of Fig. 1; And
Fig. 3 is expression preparation method's of the multi-layer ceramic capacitance of another execution mode according to the present invention process chart.
Embodiment
To combine the accompanying drawing specific embodiments of the invention to be described in detail below.
But the present invention can present multiple different form, and not should be understood to and be subject to here the execution mode that proposes.More properly, these execution modes are provided so that make the present invention open with intactly comprehensively, and scope of the present invention is conveyed to those skilled in the art fully.In the accompanying drawings, for clear, the shape and size of element can enlarge, and represent identical or similar element with identical reference number in full.
Fig. 1 is the sketch map of expression according to the multi-layer ceramic capacitance of embodiment of the present invention, and Fig. 2 is the cross sectional view along the said multi-layer ceramic capacitance of the A-A ' line of Fig. 1.
With reference to figure 1 and Fig. 2; Laminated ceramic electronic component according to embodiment of the present invention; Especially; Multi-layer ceramic capacitance 100 comprises active layer 101, is the dielectric layer 111 and interior electrode layer 112 alternated that the dielectric composition of the ceramic powder of 100-300nm forms by containing average particle size particle size wherein; Be formed at said active layer 101 end faces and the bottom surface one side cover layer 102 going up and formed by the dielectric composition that contains the ceramic powder identical with the ceramic powder of said active layer 101 at least, the average particle size particle size of said ceramic powder is 50-250nm; And the outer electrode 120a and the 120b that are electrically connected with interior electrode layer 112.
Hereinafter, with the multi-layer ceramic capacitance of describing in detail as the laminated ceramic electronic component instance.
Usually, through alternately piling up the ceramic dielectric layer and the metal inside electrode layer disposes said multi-layer ceramic capacitance.Form the top layer and the bottom through piling up the dielectric layer that is thicker than the interior dielectric layer therebetween.
In this case, the interior dielectric zone definitions adjacent with said metal inside electrode layer is said active layer, and not adjacent with said interior electrode layer outmost dielectric area is defined as said cover layer.
Usually, said active layer has better agglutinating property than said cover layer, and main cause is following:
The first, in the sintering process of said multi-layer ceramic capacitance, from said metal inside electrode layer introduce the dielectric powder, ceramic powder is waited until the said dielectric layer, thereby promoted the sintering of said active layer.
The second, under sintering temperature, said cover layer has more substantial relatively residual carbon than said active layer, has postponed the sintering of said dielectric powder.
Because said cover layer is different with said active layer agglutinating property, the sintering contraction can occurs and not match, thereby possibly cause the tiny crack of generation between said cover layer and the said active layer.
Multi-layer ceramic capacitance according to the embodiment of the present invention makes through the dielectric composition that utilizes two kinds of ceramic powders with varying particle size to prepare respectively to be used for said active layer 101 and said cover layer 102; And compressing tablet (sheet casting) and pile up the dielectric composition that makes, thereby reduce agglutinating property difference.
Said ceramic powder can but be not limited to make by ceramic material with high-k.For example, can use barium titanate (BaTiO
3) sill, plumbous composite perofskite sill and strontium titanates (SrTiO
3) sill etc.
Particularly, for the dielectric composition that is used to form said active layer 101, can use average particle size particle size to be the ceramic powder of 100-300nm especially barium titanate (BaTiO
3).
Further, for the dielectric composition that is used to form said cover layer 102, can use average particle size particle size to be the ceramic powder of 50-250nm especially barium titanate (BaTiO
3).
In addition, the said dielectric composition that is used to form said cover layer 102 can adopt the ceramic powder identical with the ceramic powder of said active layer 101, thereby the sintering contraction that reduces when firing does not simultaneously match.
As stated, according to the embodiment of the present invention, be used to form the particle size of said active layer and said tectal ceramic powder, can reduce the appearance of firing back fault of construction (like hole, crack etc.) significantly through differentiation.
Therefore, according to the embodiment of the present invention,, can strengthen the reliability of said multi-layer ceramic capacitance owing to fault of construction (like hole, crack etc.) can not occur.
Be used to form the average particle size particle size of said tectal said ceramic powder can be than the average particle size particle size of the ceramic powder that is used to form said active layer little 50-100nm.
When the difference between particle size when 50nm is following, the difference of agglutinating property is little, the situation that causes having identical particle size ceramic powder with use is compared, and can not obtain the enhancing of reliability.
In addition, when the difference between particle size surpasses 100nm, increased the difference of agglutinating property, the multi-layer ceramic capacitance that causes having identical particle size ceramic powder with use according to association area is compared, and reliability is poorer.
Simultaneously, according to the embodiment of the present invention said laminated ceramic electronic component has excellent reliability, hygrometric state insulation resistance and hot insulation resistance.
When use has the ceramic powder of identical particle size; Firing is in to the sufficient temperature range of dense sintering (densely sinter) said active layer, to carry out, so so that have the said cover layer of low frit property and relatively fire not exclusively and many holes are arranged.
Therefore, utilize the hygrometric state insulation resistance meeting deterioration of the multi-layer ceramic capacitance of association area with identical particle size ceramic powder.
On the other hand, when in the sufficient temperature range of said cover layer to dense sintering, firing, the said active layer with high agglutinating property has relatively been fired excessively, thereby produces uneven small structure.
In addition, said metal inside electrode layer extremely lumps, so so that hot insulation resistance can deterioration.
According to the embodiment of the present invention, the particle size that is used for the ceramic powder of said active layer 101 and said cover layer 102 through differentiation can be fired said active layer and said cover layer to even sintering simultaneously.
Because such sintering circuit has reduced the sintering contraction and has not matched, thereby prevented the appearance in hole and crack, so so that can make the multi-layer ceramic capacitance with excellent reliability, hygrometric state insulation resistance and hot insulation resistance.
Said cover layer 102 can be formed on the one side at least in said active layer 101 end faces and the bottom surface, and when said cover layer 102 is formed on said active layer 101 end faces and the two sides, bottom surface, can reduce the crack occurrence rate significantly.
Said cover layer can be than the said dielectric layer thickness 3-10 of said active layer doubly, and said dielectric layer thickness is limited especially.But single dielectric layer thickness can be 1.5 μ m, preferably, 0.5-1.5 μ m, thus realize ultra-thin high power capacity electric capacity.
According to the embodiment of the present invention, the dielectric composition that is used to prepare said active layer 101 contains the barium titanate (BaTiO as ceramic dielectric material separately with the dielectric composition that is used to prepare said cover layer 102
3), and remaining ceramic additive powder can be applied to two kinds of compositions equably.
In two kinds of compositions, the composition of said ceramic additive powder can be identical with size.
Said dielectric composition may further include magnesia (MgO), rare earth oxide, manganese oxide (MnO) and borosilicate base glass.
Said rare earth oxide is not limited especially.For example, said rare earth oxide can be for being selected from by yittrium oxide (Y
2O
3), holimium oxide (Ho
2O
3), dysprosia (Dy
2O
3) and ytterbium oxide (Yb
2O
3) at least a in the group formed.
According to the object of the invention, the content of said dielectric composition can be varied.For example; With respect to the said ceramic powder of 100 molecular weight parts (parts by molecular weight), the content of said dielectric composition can be the magnesia (MgO) of 0.5-2.0 molecular weight part, the rare earth oxide of 0.1-1.0 molecular weight part, the manganese oxide (MnO) of 0.05-1.0 molecular weight part, the borosilicate base glass of 1.0-3.0 molecular weight part.
As stated; Said multi-layer ceramic capacitance according to the embodiment of the present invention, the outer electrode 120a and the 120b that comprise the ceramic sintered bodies 110 that contains said active layer 101 and said cover layer 102 and be formed at said ceramic sintered bodies 110 outsides and be electrically connected with said interior electrode layer.
Structure and the said cover layer 102 that said active layer 101 has dielectric layer 111 and interior electrode layer 112 alternated utilizes the particle size ceramic powder different with the particle size of the ceramic powder that is used for said active layer 101 and makes.
Therefore, according to the embodiment of the present invention, the particle size that is used for said active layer and said tectal ceramic powder is different each other, thus evenly said active layer of sintering and said cover layer.As a result, fault of construction (like hole, crack etc.) can be reduced, the multi-layer ceramic capacitance of excellent reliability can be obtained to have thus.
Fig. 3 is expression preparation method's of the multi-layer ceramic capacitance of another execution mode according to the present invention process chart.
With reference to figure 3; The preparation method of laminated ceramic electronic component; Particularly the preparation method according to the multi-layer ceramic capacitance of another embodiment of the present invention can comprise: the preparation active layer; Wherein, alternated is dielectric layer and the interior electrode layer that the dielectric composition of the ceramic powder of 100-300nm forms by containing average particle size particle size; The cover layer that preparation is formed by the dielectric composition that contains the ceramic powder identical with the ceramic powder of said active layer, the average particle size particle size of said ceramic powder are 50-250nm; Form laminate through piling up said cover layer on the one side at least in said active layer end face and bottom surface; Prepare green chip (green chip) through cutting said laminate; Prepare ceramic sintered bodies through firing said green chip then.
At first, can prepare active layer 101, wherein, alternated is dielectric layer and the interior electrode layer that the dielectric composition of the ceramic powder of 100-300nm forms by containing average particle size particle size.
When the said active layer 101 of preparation, can prepare a plurality of earlier like raw cook (green sheet) that Fig. 3 described.
Can pass through hybrid ceramic powder, adhesive and solvent and form slurry, become embrane method (doctor blade method) that said slurry is processed the thick thin slice of several μ m through scraper.
The conducting resinl of the internal electrode that further, can on said raw cook, be used for being described like (b) makes said interior electrode layer 112.
As stated, can make said active layer 101, said raw cook and carrier film are separated through on said raw cook, forming said interior electrode layer 112, and as (c) in describe a plurality of raw cooks are overlapped.
Then, described, can be prepared the said cover layer 102 that makes by the dielectric composition that contains the ceramic powder identical with the ceramic powder of said active layer 101 like (d).
, like (e) described, through piling up said cover layer 102 and make laminate on the one side at least in said active layer 101 end faces and bottom surface kind in the HTHP pressed thereafter.Then, described like (f), the laminate of handling after will suppressing through cutting is cut to preliminary dimension, thereby makes the green chip of being described like (g).
, through plasticizing, fire and polishing make said ceramic sintered bodies 110, and carry out preparation and the electroplating work procedure of said outer electrode 120a and 120b, thereby accomplish said laminated ceramic electronic component thereafter, especially, the preparation of multi-layer ceramic capacitance 100.
According to the embodiment of the present invention, can fire said active layer and said cover layer to even sintering simultaneously through the particle size that differentiation is used for said active layer 101 and said cover layer 102 ceramic powders.
Because such sintering process has reduced the sintering contraction and has not matched, thereby prevented the appearance in hole and crack, so so that can make the multi-layer ceramic capacitance with excellent reliability, hygrometric state insulation resistance and hot insulation resistance.
Hereinafter, will describe execution mode of the present invention in more detail, but scope of the present invention is not limited to this according to embodiment and Comparative Examples.
Embodiment 1-20
In embodiment 1-20, earlier with two kinds of barium titanate (BaTiO that contain varying particle size according to embodiment of the present invention
3) dielectric composition in each mixing and be dispersed in the organic solvent.
Then, form slurry and slurry is painted film that thickness is about 2 μ m and prepare and be used for said active layer and said tectal molding sheet (molding sheet) through adding organic bond.
Then, the offset printing of nickel (Ni) internal electrode to the dielectric sheet that is used for said active layer, and is stacked into the said dielectric sheet that is printed on internal electrode on it 100 layers laminate.
In addition, again will be used for top and bottom that tectal dielectric sheet be stacked on said laminate thereafter.
, said laminate carried out isostatic cool pressing and cutting, thereby make sample thereafter.
At 300 ℃ of this sample of following heat treatment 4h to remove organic bond, dispersant etc. and to use incinerator control temperature and atmosphere this sample of sintering in 1050-1150 ℃ of scope.
In this case, the partial pressure of oxygen in the control firing atmosphere is 10
-9-10
-13Individual standard atmospheric pressure.
Fire to make outer electrode and to fire the back through carrying out the preparation that electroplating work procedure is accomplished sample through using copper (Cu) to make sintered sample under 700-900 ℃, carry out electrode at electrode.
Following table 1 expression dielectric composition of the present invention, and utilize the evaluation result about electrical characteristics and reliability of the multi-layer ceramic capacitance sample of the embodiment 1-20 that said dielectric composition makes to see table 2.
Comparative Examples 1-13
Multi-layer ceramic capacitance according to Comparative Examples 1-13 makes through the preparation method identical with embodiment 1-20, except being used for the said barium titanate (BaTiO of said active layer
3) and be used for said tectal said barium titanate (BaTiO
3) the difference of difference of two kinds of particle sizes, make it depart from scope of the present invention.
To compare according to the electrical characteristics of the multi-layer ceramic capacitance of Comparative Examples 1-13 and the evaluation result of reliability and the electrical characteristics of embodiment 1-20 and the evaluation result of reliability.
Table 1
Table 2
Note 1) hot insulation resistance evaluation criterion
*: poor (below the critical insulation resistance 3Vr)
△: normal (3-7Vr)
Zero: excellent (more than the 7Vr)
Note 2) hygrometric state insulation resistance evaluation criterion
*: poor (sample size with insulation fault level is more than 10)
△: normal (1-5)
Zero: excellent (0)
Can notice, compare to have excellent reliability from table 2, especially, improve the hygrometric state insulation resistance widely according to the sample of the embodiment of the invention with sample according to Comparative Examples.
Especially, in embodiment 10,12 and 17, can notice higher reliability and dielectric constant to have occurred.
As stated, in the laminated ceramic electronic component according to embodiment of the present invention, can reduce the fault of construction (like hole, crack etc.) after firing.
In addition, the laminated ceramic electronic component according to embodiment of the present invention has excellent reliability, hygrometric state insulation resistance and hot insulation resistance.
Though show and described the present invention in conjunction with execution mode, under the situation of the spirit and scope of the present invention that do not depart from subsidiary claims definition, apparent to those skilled in the art to modification and modification that the present invention makes.
Claims (14)
1. laminated ceramic electronic component, this laminated ceramic electronic component comprises:
Active layer is dielectric layer and the interior electrode layer alternated that the dielectric composition of the ceramic powder of 100-300nm forms by containing average particle size particle size wherein;
The cover layer that is formed at that one side at least in said active layer end face and the bottom surface goes up and forms by the dielectric composition that contains the ceramic powder identical with the ceramic powder of said active layer, the average particle size particle size of said ceramic powder is 50-250nm;
And the outer electrode that is electrically connected with interior electrode layer.
2. laminated ceramic electronic component according to claim 1 wherein, forms the average particle size particle size little 50-100nm of the average particle size particle size of said tectal said ceramic powder than the said ceramic powder that forms said active layer.
3. laminated ceramic electronic component according to claim 1, wherein, said ceramic powder is to be selected from least a in the group of being made up of barium phthalate base material, plumbous composite perofskite sill and strontium titanate base material.
4. laminated ceramic electronic component according to claim 1, wherein, said cover layer is than said dielectric layer thickness 3-10 times of said active layer.
5. laminated ceramic electronic component according to claim 1, wherein, said dielectric layer has the thickness of 0.5-1.5 μ m.
6. laminated ceramic electronic component according to claim 1, wherein, said dielectric composition further contains magnesia, rare earth oxide, manganese oxide and borosilicate base glass.
7. laminated ceramic electronic component according to claim 6, wherein, said rare earth oxide is to be selected from least a in the group of being made up of yittrium oxide, holimium oxide, dysprosia and ytterbium oxide.
8. the preparation method of laminated ceramic electronic component, this method comprises:
The preparation active layer, wherein, alternated is dielectric layer and the interior electrode layer that the dielectric composition of the ceramic powder of 100-300nm forms by containing average particle size particle size;
The cover layer that preparation is formed by the dielectric composition that contains the ceramic powder identical with the ceramic powder of said active layer, the average particle size particle size of said ceramic powder are 50-250nm;
Form laminate through piling up said cover layer on the one side at least in said active layer end face and bottom surface;
Prepare green chip through cutting said laminate; And
Prepare ceramic sintered bodies through firing said green chip.
9. method according to claim 8 wherein, forms the average particle size particle size little 50-100nm of the average particle size particle size of said tectal said ceramic powder than the said ceramic powder that forms said active layer.
10. method according to claim 8, wherein, said ceramic powder is to be selected from least a in the group of being made up of barium phthalate base material, plumbous composite perofskite sill and strontium titanate base material.
11. method according to claim 8, wherein, said cover layer is than said dielectric layer thickness 3-10 times of said active layer.
12. method according to claim 8, wherein, said dielectric layer has the thickness of 0.5-1.5 μ m.
13. method according to claim 8, wherein, said dielectric composition further contains magnesia, rare earth oxide, manganese oxide and borosilicate base glass.
14. method according to claim 13, wherein, said rare earth oxide is to be selected from least a in the group of being made up of yittrium oxide, holimium oxide, dysprosia and ytterbium oxide.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110011551A KR20120091655A (en) | 2011-02-09 | 2011-02-09 | Multilayer ceramic electronic part and a manufacturing method thereof |
| KR10-2011-0011551 | 2011-02-09 |
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| CN102637527A true CN102637527A (en) | 2012-08-15 |
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| CN2012100285539A Pending CN102637527A (en) | 2011-02-09 | 2012-02-09 | A multilayer ceramic electronic part and a manufacturing method thereof |
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| JP (1) | JP2012169620A (en) |
| KR (1) | KR20120091655A (en) |
| CN (1) | CN102637527A (en) |
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| CN103632742A (en) * | 2012-08-22 | 2014-03-12 | 三星电机株式会社 | Conductive paste for internal electrodes, multilayer ceramic electronic component using the same, and method of manufacturing the same |
| CN105016724A (en) * | 2014-04-16 | 2015-11-04 | 三星电机株式会社 | Dielectric ceramic composition and multilayer ceramic capacitor containing the same |
| US9370102B2 (en) | 2012-12-28 | 2016-06-14 | Samsung Electro-Mechanics Co., Ltd. | Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic component |
| CN110875137A (en) * | 2018-08-30 | 2020-03-10 | 三星电机株式会社 | Multilayer ceramic electronic component |
| CN112992431A (en) * | 2021-04-16 | 2021-06-18 | 西安宏星电子浆料科技股份有限公司 | High-dispersion nickel inner electrode slurry for multilayer chip ceramic capacitor and preparation method thereof |
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| KR102392041B1 (en) | 2017-03-10 | 2022-04-27 | 삼성전자주식회사 | Dielectric material, metod of manufacturing thereof, and dielectric devices and electronic devices including the same |
| KR102363288B1 (en) | 2017-03-10 | 2022-02-14 | 삼성전자주식회사 | Dielectric material, metod of manufacturing thereof, and dielectric devices and electronic devices including the same |
| KR102325821B1 (en) | 2017-03-31 | 2021-11-11 | 삼성전자주식회사 | Two-dimensional perovskite material, dielectric material and multi-layered capacitor including the same |
| KR102515246B1 (en) * | 2021-03-19 | 2023-03-29 | 동의대학교 산학협력단 | A METHOD FOR PREPARING A NOVEL CsPbBr3/Glass COMPOSITE AND A CsPbBr3/Glass COMPOSITE PREPARED THEREBY |
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| JP2007123835A (en) * | 2005-09-27 | 2007-05-17 | Kyocera Corp | Laminated ceramic capacitor and manufacturing method thereof |
| JP2007266223A (en) * | 2006-03-28 | 2007-10-11 | Kyocera Corp | Laminated ceramic capacitor |
| CN101339847A (en) * | 2007-07-04 | 2009-01-07 | Tdk株式会社 | Ceramic electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103632742A (en) * | 2012-08-22 | 2014-03-12 | 三星电机株式会社 | Conductive paste for internal electrodes, multilayer ceramic electronic component using the same, and method of manufacturing the same |
| CN103632742B (en) * | 2012-08-22 | 2017-09-01 | 三星电机株式会社 | Conducting resinl for internal electrode and laminated ceramic electronic component and its manufacture method using the conducting resinl |
| US9370102B2 (en) | 2012-12-28 | 2016-06-14 | Samsung Electro-Mechanics Co., Ltd. | Embedded multilayer ceramic electronic component and printed circuit board having embedded multilayer ceramic electronic component |
| CN105016724A (en) * | 2014-04-16 | 2015-11-04 | 三星电机株式会社 | Dielectric ceramic composition and multilayer ceramic capacitor containing the same |
| CN105016724B (en) * | 2014-04-16 | 2019-12-10 | 三星电机株式会社 | Dielectric ceramic composition and multilayer ceramic capacitor containing the same |
| CN110875137A (en) * | 2018-08-30 | 2020-03-10 | 三星电机株式会社 | Multilayer ceramic electronic component |
| CN112992431A (en) * | 2021-04-16 | 2021-06-18 | 西安宏星电子浆料科技股份有限公司 | High-dispersion nickel inner electrode slurry for multilayer chip ceramic capacitor and preparation method thereof |
| CN112992431B (en) * | 2021-04-16 | 2021-08-03 | 西安宏星电子浆料科技股份有限公司 | High-dispersion nickel inner electrode slurry for multilayer chip ceramic capacitor and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120091655A (en) | 2012-08-20 |
| JP2012169620A (en) | 2012-09-06 |
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