CN102634809B - Secondary dry film removing liquid - Google Patents
Secondary dry film removing liquid Download PDFInfo
- Publication number
- CN102634809B CN102634809B CN2012101268511A CN201210126851A CN102634809B CN 102634809 B CN102634809 B CN 102634809B CN 2012101268511 A CN2012101268511 A CN 2012101268511A CN 201210126851 A CN201210126851 A CN 201210126851A CN 102634809 B CN102634809 B CN 102634809B
- Authority
- CN
- China
- Prior art keywords
- dry film
- secondary dry
- film removing
- removing liquid
- green oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Detergent Compositions (AREA)
Abstract
The invention relates to the technical field of circuit board processing, in particular relates to secondary dry film removing liquid. The secondary dry film removing liquid disclosed by the invention comprises the components in percentage by volume: 30%-45% of monoethanolamine, 20%-40% of ammonia water (with 20% of volume concentration), 15%-30% of tetramethyl ammonium hydroxide, 2%-6% of isopropyl alcohol and 0.2%-0.6% of benzotriazole. The secondary dry film removing liquid disclosed by the invention has completely no attack on protective green oil to ensure that the protective green oil is not damaged and has the advantages that the secondary dry film can be efficiently and rapidly removed, the film removing speed is increased by more than 5 times and the product quality is guaranteed while the production capacity is improved.
Description
Technical field
The present invention relates to the wiring board processing technique field, relate in particular to a kind of secondary dry film striping liquid.
Background technology
In the wiring board course of processing, after circuit machined printing protection green oil, exposed copper face need be processed through the heavy nickel gold of selectivity, wherein need paste the secondary dry film and complete selectivity.Because heavy nickel gold treatment temp is high, the time is long,, for guaranteeing plating can not to occur in treating processes, must guarantee the bonding force of secondary dry film and green oil, this also causes the difficulty of follow-up removal secondary dry film large, and technical requirements is high.It is mainly NaOH and some organic striping liquid that tradition is removed the secondary dry film, but slow because of its speed of response, can not meet production production capacity demand, if meet the demand of production production capacity by improving temperature and concentration, and again can the injury protection green oil.
Summary of the invention
The object of the present invention is to provide a kind of secondary dry film striping liquid, this striping liquid not only can the injury protection green oil, and can efficiently remove fast the secondary dry film, improves the production production capacity.
The present invention is achieved by the following technical programs: a kind of secondary dry film striping liquid; Comprise the following material that calculates according to volume percent:
Monoethanolamine 30% ~ 45%
Ammoniacal liquor 20% ~ 40%
Tetramethylammonium hydroxide 15% ~ 30%
Virahol 2.5% ~ 6%
Benzotriazole 0.2% ~ 0.6%.
Preferably, described ammoniacal liquor weight percent concentration is 20%.
The main component of dry film such as following table.
| Composition | Material | Characteristic |
| The polymer main chain | Thermoplastic polymer | Contain R 1--the COOH acid group |
| Monomer | Acrylic Acid Monomer | Contain R 2--the COOH acid group |
| Adhesive agent | Organic adhesion agent | Increase dry film and interface sticking power |
Tradition removal mechanism of oxide film: use mainly that NaOH and polymer main chain--COOH reacts and interrupts polymer main chain, make the dry film swelling complete striping.
Its reaction is as follows: NaOH+R
1--COOH → R
1--COONa+H
2O.
Removal mechanism of oxide film of the present invention: thereby owing to having used phase-transfer catalyst Tetramethylammonium hydroxide and high infiltration accelerator ammoniacal liquor to accelerate the transfer of the organic phase of hydroxyl OH-from the water to the organic membrane, and accelerate infiltration, diffusion.
Its reaction is as follows: R
1--COOH+R--NH
3→ R
1--COONH
3+ R--H
R
2--COOH+R--NH
3→R
2--COONH
3+R--H 。
The Virahol that adds in the pure and mild formula that generates in reaction can effectively dissolve organic adhesion agent, makes that striping is more thorough, speed is faster.
In a word, the present invention not only to the protection green oil fully without attacking, can the injury protection green oil, and can efficiently remove fast the secondary dry film, promote striping speed more than 50%, guaranteed product quality when improving throughput.
Embodiment
Embodiment 1, a kind of secondary dry film striping liquid; Comprise the following material that calculates according to volume percent:
Monoethanolamine 30%, ammoniacal liquor (weight percent concentration 20%) 37%, Tetramethylammonium hydroxide 30%, Virahol 2.8% and benzotriazole 0.2%.
Embodiment 2, a kind of secondary dry film striping liquid; Comprise the following material that calculates according to volume percent:
Monoethanolamine 45%, ammoniacal liquor (weight percent concentration 20%) 20%, Tetramethylammonium hydroxide 30%, Virahol 4.5% and benzotriazole 0.5%.
Embodiment 3, a kind of secondary dry film striping liquid; Comprise the following material that calculates according to volume percent:
Monoethanolamine 39%, ammoniacal liquor (weight percent concentration 20%) 40%, Tetramethylammonium hydroxide 15.5%, Virahol 5% and benzotriazole 0.5%.
Embodiment 4, a kind of secondary dry film striping liquid; Comprise the following material that calculates according to volume percent:
Monoethanolamine 43%, ammoniacal liquor (weight percent concentration 20%) 25%, Tetramethylammonium hydroxide 25.4%, Virahol 6% and benzotriazole 0.6%.
The present invention and traditional NaOH and organic striping liquid commonly used are compared contrast and experiment such as following table.
| Experimental program | 55 ° of C of 6%NaOH temperature | 15% 55 ° of C of organic striping liquid temp commonly used | 55 ° of C of 15% striping liquid temp of the present invention |
| Striping speed | Substantially substantially completed with the crosslinked place of green oil striping after coming off 12 minutes with the copper face contact position in 4 minutes 40 seconds | Demoulding was completed substantially in 3 minutes 50 seconds, but with the crosslinked place of green oil, residual film was arranged, and after 12 minutes, residual film is not removed | After 2 minutes, dry film is all removed, and there is no the dry film residual phenomena. |
| Film is broken | Larger sheet | Than strip | Equigranular |
| The protection green oil is apparent | Green oil is mute secretly unglazed, contacts with hard thing and produces cut | Green oil light cleaning is not existing abnormal | Green oil light cleaning is not existing abnormal |
As seen from the above table, under identical test conditions, the present invention and traditional NaOH and organic striping liquid phase ratio commonly used, striping speed has improved more than 50%, and can the injury protection green oil.
The above embodiment, be preferred embodiments of the present invention, is not to limit the scope of the present invention,, therefore all equivalences of doing according to the described structure of the present patent application the scope of the claims, feature and principle change or modify, all should comprise in patent claim of the present invention.
Claims (2)
1. secondary dry film striping liquid; It is characterized in that: comprise the following material that calculates according to volume percent:
Monoethanolamine 30% ~ 45%
Ammoniacal liquor 20% ~ 40%
Tetramethylammonium hydroxide 15% ~ 30%
Virahol 2.5% ~ 6%
Benzotriazole 0.2% ~ 0.6%;
The concentration of volume percent of wherein said secondary dry film striping liquid is 15%.
2. secondary dry film striping liquid according to claim 1, it is characterized in that: described ammoniacal liquor weight percent concentration is 20%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101268511A CN102634809B (en) | 2012-04-27 | 2012-04-27 | Secondary dry film removing liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101268511A CN102634809B (en) | 2012-04-27 | 2012-04-27 | Secondary dry film removing liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102634809A CN102634809A (en) | 2012-08-15 |
| CN102634809B true CN102634809B (en) | 2013-11-13 |
Family
ID=46619382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101268511A Expired - Fee Related CN102634809B (en) | 2012-04-27 | 2012-04-27 | Secondary dry film removing liquid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102634809B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107400893B (en) * | 2017-07-27 | 2020-02-21 | 苏州天承化工有限公司 | Fine circuit film removing liquid and film removing process |
| CN110113872A (en) * | 2019-04-29 | 2019-08-09 | 武汉利之达科技股份有限公司 | A kind of PCB moves back membrane process, manufacturing method and system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1849386A (en) * | 2003-06-18 | 2006-10-18 | 东京応化工业株式会社 | Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate |
| EP1945748A4 (en) * | 2005-10-13 | 2009-01-07 | Advanced Tech Materials | Metals compatible photoresist and/or sacrificial antireflective coating removal composition |
-
2012
- 2012-04-27 CN CN2012101268511A patent/CN102634809B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1849386A (en) * | 2003-06-18 | 2006-10-18 | 东京応化工业株式会社 | Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate |
| EP1945748A4 (en) * | 2005-10-13 | 2009-01-07 | Advanced Tech Materials | Metals compatible photoresist and/or sacrificial antireflective coating removal composition |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102634809A (en) | 2012-08-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2021144224A (en) | Polarizing plate, method of manufacturing the same, and image display device having the same | |
| WO2008153155A1 (en) | Surface treatment agent for forming pattern and pattern forming method using the treatment agent | |
| CN102634809B (en) | Secondary dry film removing liquid | |
| TWI514094B (en) | Stripper composition for thick negative photoresist | |
| JP2014212319A5 (en) | ||
| TW201432395A (en) | Composition for photoresist stripping solution and stripping method of photoresist using the same | |
| CN104177535A (en) | Water absorbing agent for drying machine and preparation method thereof | |
| CN105127616A (en) | Washing-free soldering flux | |
| JP2013256610A5 (en) | ||
| CN101531955B (en) | Washing liquid for solar cell silk screen printing process | |
| CN103555431A (en) | Printed circuit board cleaning agent and preparation method thereof | |
| JP2011071494A5 (en) | Semiconductor substrate recycling method | |
| CN101968610A (en) | Method for removing optical resist after all-wet etching process | |
| TW201113380A (en) | Indium adsorbent, indium adsorbent producing method, and indium adsorption method | |
| CN101506954A (en) | Multilayer film for wiring and wiring circuit | |
| TW200802601A (en) | Process for recovering damage of insulating film | |
| TW201011820A (en) | Processing method for semiconductor, and adhesive tape | |
| CN104772581B (en) | A kind of scaling powder | |
| CN102978908A (en) | Method for preparing metal chelating fiber through waste acrylic fiber | |
| CN105655239A (en) | Silicon wafer cleaning technology | |
| CN103424998A (en) | Photoresist removing method after polyimides are photoetched in micro-electromechanical system manufacturing process | |
| JP5437541B1 (en) | Resist stripper | |
| WO2007109501A3 (en) | Novel rinse solution to remove cross-contamination | |
| CN103451716A (en) | Plating layer stripping corrosion solution | |
| CN104640366A (en) | Copper face brown treating fluid used before printed circuit board resistance welding and copper face brown treating process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131113 Termination date: 20180427 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |