CN102629654A - Light emitting diode packaging structure - Google Patents
Light emitting diode packaging structure Download PDFInfo
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- CN102629654A CN102629654A CN2011100611641A CN201110061164A CN102629654A CN 102629654 A CN102629654 A CN 102629654A CN 2011100611641 A CN2011100611641 A CN 2011100611641A CN 201110061164 A CN201110061164 A CN 201110061164A CN 102629654 A CN102629654 A CN 102629654A
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- Prior art keywords
- emitting diode
- light
- led
- package structure
- reflecting material
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- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000463 material Substances 0.000 claims abstract description 93
- 239000005022 packaging material Substances 0.000 abstract 3
- 238000005286 illumination Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Abstract
The invention discloses a light emitting diode packaging structure. The light emitting diode packaging structure comprises a carrier plate, a light emitting diode, a packaging material and a reflecting material. The light emitting diode is arranged on the carrier plate. The packaging material covers the light emitting diode. The reflecting material is arranged on the packaging material and is positioned right above the light-emitting diode.
Description
Technical field
The present invention relates to a kind of encapsulating structure, and particularly relate to a kind of package structure for LED.
Background technology
(Light-Emitting Diode mainly is that to be converted into the mode of luminous energy through electric energy luminous LED) to light-emitting diode.The main composition material of light-emitting diode is a semiconductor, wherein contain the hole ratio of positively charged higher be called P type semiconductor, contain electronegative electronic ratio higher be called N type semiconductor.P type semiconductor and N type semiconductor joint form the PN junction face.When the positive pole of light-emitting diode and negative pole two ends apply voltage, electronics will combine with the hole.Electronics with just send after the hole combines with the form of light.
Since light-emitting diode have the life-span long, temperature is low, the energy utilization rate advantages of higher, light-emitting diode has been widely used in screen backlight, desk lamp, mini light night, large-scale display board, traffic sign, automobile with the 3rd brake light, mobile phone power-on indicator light etc. in recent years.Conventional light source is replaced by light-emitting diode gradually.
Because the light that light-emitting diode penetrates has directive property, in order to make the application of light-emitting diode more extensive, how industry makes light-emitting diode have the function of lateral emitting if also being devoted to study.
Summary of the invention
The present invention is relevant for a kind of package structure for LED, and it utilizes the design of reflecting material to make light-emitting diode have the function of lateral emitting, and has good illumination efficiency.
According to an aspect of the present invention, a kind of package structure for LED is proposed.Package structure for LED comprises support plate, light-emitting diode, encapsulating material and reflecting material.Light-emitting diode is arranged on the support plate.Encapsulating material covers light-emitting diode.Reflecting material is arranged on the encapsulating material, and be positioned at light-emitting diode directly over.
According to a further aspect in the invention, a kind of package structure for LED is proposed.Package structure for LED comprises support plate, light-emitting diode, reflection frame and encapsulating material.Light-emitting diode is arranged on the support plate.Reflection is set up and is placed on the light-emitting diode, and be positioned at light-emitting diode directly over.Encapsulating material covers light-emitting diode and reflection frame.
For letting the foregoing of the present invention can be more obviously understandable, hereinafter is special lifts various embodiment, and conjunction with figs., elaborates as follows:
Description of drawings
Fig. 1 illustrates the sketch map of the package structure for LED of first embodiment.
Fig. 2 illustrates the sketch map of the package structure for LED of second embodiment.
Fig. 3 illustrates the sketch map of the package structure for LED of the 3rd embodiment.
Fig. 4 illustrates the sketch map of the package structure for LED of the 4th embodiment.
Description of reference numerals
100,200,300,400: package structure for LED
110,410: support plate
120,420: light-emitting diode
130,250,430: encapsulating material
131: groove
131a: bottom surface
140,340: reflecting material
460: the reflection frame
461: bullet
462: support
T1, T2: tip
Embodiment
The present invention is arranged at the light-emitting diode top with reflecting material, so that package structure for LED has the function of lateral emitting, and has good illumination efficiency.Below propose various embodiment and be elaborated, embodiment in order to as the example explanation, is not the scope in order to restriction desire protection of the present invention only.In addition, the accompanying drawing clipped element among the embodiment is with clear demonstration technical characterstic of the present invention.
First embodiment
Please with reference to Fig. 1, it illustrates the sketch map of the package structure for LED 100 of first embodiment.Package structure for LED 100 comprises support plate 110, light-emitting diode 120, encapsulating material 130 and reflecting material 140.Support plate 110 for example be printed circuit board (PCB) (PCB), metal core substrate (Metal CorePCB, MCPCB), ceramic substrate (Ceramic substrate) or copper base (Direc Bond Cu, DBC).Light-emitting diode 120 is arranged on the support plate 110.Encapsulating material 130 covers light-emitting diode 120.The material of reflecting material 140 for example is the material that aluminium, gold or copper etc. have high reflectance.The reflecting material 140 of present embodiment for example is to be arranged on the encapsulating material 130 (but not limiting to), and be positioned at light-emitting diode 120 directly over.
As shown in Figure 1, the encapsulating material 140 of present embodiment has groove 131.Groove 131 be positioned at light-emitting diode 120 directly over, reflecting material 140 is filled in the groove 131.In the present embodiment, groove 131 for example is a pyramidal structure.The structure of groove 131 is not limited thereto, and in other embodiments, groove 131 also can be the various structures that can ccontaining reflecting material 140 of round barrel shape structure, tetragonal body structure, semicircular structure or other.
The reflecting material 140 of present embodiment is filled in the groove 131, so reflecting material 140 also forms the same structure.For instance, the groove 131 of present embodiment is a cone structure, so reflecting material 140 also is a cone structure.The structure of reflecting material 140 is not limited thereto, and in other embodiments, reflecting material 140 also can be arranged in pairs or groups groove 131 and formed round barrel shape structure, tetragonal body structure, semicircular structure or other various structures that can reflect the light of light-emitting diode 120.
In addition, reflecting material 140 can fill up whole groove 131, also can only be filled in the groove 131 of part, for example be eight minutes full, look designer's demand and decide.Preferably, when reflecting material 140 occupied scopes contain the scope that light-emitting diode 120 makes progress luminous, can the light of upwards launching be reflected towards side, to reach preferred side emitting effect.
Reflecting material 140 with the pyramidal structure of Fig. 1 is an example, and the tip T 1 of reflecting material 140 is towards light-emitting diode 120.Thus, light-emitting diode 120 is after upwards the light of emission is run into the inclined-plane of reflecting material 140, can be naturally be that launch towards the side radiant type in the center of circle with the tip T 1 of reflecting material 140.
In the present embodiment, reflecting material 140 is close to the surface of encapsulating material 130.Be not mingled with other materials between reflecting material 140 and the encapsulating material 130.Thus, can promote the reflecting effect of reflecting material 140 effectively.
According to light-emitting diode 120 structures of present embodiment, reflecting material 140 can make reflecting material 140 be arranged at light-emitting diode 120 tops through being arranged at the design of groove 131.Thus, package structure for LED 100 has the function of lateral emitting, and has good illumination efficiency.
Second embodiment
Please with reference to Fig. 2, it illustrates the sketch map of the package structure for LED 200 of second embodiment.Package structure for LED 100 differences of the package structure for LED 200 of present embodiment and first embodiment are also to cover another layer encapsulating material 250 on reflecting material 140 and the peripheral encapsulating material 130, and all the other something in common are repeated description no longer.
As shown in Figure 2, the encapsulating material 250 and the encapsulating material 130 of present embodiment have intactly coated reflecting material 140.Thus, the phenomenon that can avoid reflecting material 140 oxidation to take place or peel off.And the scope that encapsulating material 250 covers contains reflecting material 140 and encapsulating material 130.The coverage of encapsulating material 250 is not limited thereto, and in other embodiments, the scope that encapsulating material 250 covers can also only cover reflecting material 140, looks designer's demand and decides.
In addition, in an embodiment, encapsulating material 250 and encapsulating material 130 can be selected the same material for use, promote the bond strength of encapsulating material 250 and encapsulating material 130.Perhaps, in other embodiments, encapsulating material 250 also can be selected material different for use with encapsulating material 130, lets light produce refraction, and forms special effect.
According to the package structure for LED 200 of present embodiment, reflecting material 140 can be embedded within encapsulating material 250 and the encapsulating material 130, makes reflecting material 140 be arranged at light-emitting diode 120 tops.Thus, package structure for LED 200 has the function of lateral emitting, and has good illumination efficiency.
The 3rd embodiment
Please with reference to Fig. 3, it illustrates the sketch map of the package structure for LED 300 of the 3rd embodiment.Package structure for LED 100 differences of the package structure for LED 300 of present embodiment and first embodiment are that reflecting material 340 is filled in the mode of groove 131, and all the other something in common are repeated description no longer.
As shown in Figure 3, the reflecting material 340 of present embodiment is arranged at the bottom surface 131a of groove 131, and forms film like structures.Reflecting material 340 can be layed in whole bottom surface 131a, also can only be layed in the bottom surface 131a of part, for example is 80% bottom surface 131a or 50% bottom surface 131a, looks designer's demand and decides.
In addition, the thickness of reflecting material 340 can be 0.05～0.3 millimeter (mm), the material of visual reflex material 340 and designer's demand and decide.
According to the package structure for LED 300 of present embodiment, the design of the bottom surface 131a that reflecting material 340 can be through being layed in groove 131 makes reflecting material 340 be arranged at light-emitting diode 120 tops.Thus, package structure for LED 300 has the function of lateral emitting, and has good illumination efficiency.
The 4th embodiment
Please with reference to Fig. 4, it illustrates the sketch map of the package structure for LED 400 of the 4th embodiment.Package structure for LED 100 differences of the package structure for LED 400 of present embodiment and first embodiment are to utilize reflection frame 460 to carry out the reflection of light, and all the other something in common are repeated description no longer.
As shown in Figure 3, package structure for LED 400 comprises support plate 410, light-emitting diode 420, reflection frame 460 and encapsulating material 430.Light-emitting diode 420 is arranged on the support plate 410.The reflection frame 460 be arranged on the light-emitting diode 420, and be positioned at light-emitting diode 420 directly over.430 of encapsulating materials cover light-emitting diode 420 and reflection frame 460.
In the present embodiment, reflection frame 460 comprises bullet 461 and support 462.Bullet 461 be positioned at light-emitting diode 420 directly over.Support 462 is thin-line-shaped hollow structure, is connected in bullet 461 and support plate 410, with cone of support body 461.
The structure of reflection frame 460 is not limited to be made up of 461 of bullets, and in he embodiment, reflection frame 460 can also be made up of cube, spheroid, column.
In the present embodiment, the tip T 2 of bullet 461 is towards light-emitting diode 420.Thus, light-emitting diode 420 is after upwards the light of emission is run into the inclined-plane of bullet 461, can be naturally be that launch towards the side radiant type in the center of circle with the tip T 2 of bullet 461.
According to the package structure for LED 400 of present embodiment, the bullet 461 of reflection frame 460 can make bullet 461 can be arranged at light-emitting diode 420 tops through the design of support 462.Thus, package structure for LED 400 has the function of lateral emitting, and has good illumination efficiency.
In sum, though the present invention discloses as above with various preferred embodiments, so it is not in order to limit the present invention.Those of ordinary skill in the technical field is not breaking away from the spirit and scope of the present invention, when doing various changes and retouching under the present invention.Therefore, protection scope of the present invention defines and is as the criterion when looking claim.
Claims (11)
1. package structure for LED comprises:
Support plate;
Light-emitting diode is arranged on this support plate;
First encapsulating material covers this light-emitting diode; And
Reflecting material is arranged on this first encapsulating material, and be positioned at this light-emitting diode directly over.
2. package structure for LED as claimed in claim 1, wherein this first encapsulating material has groove, this groove be positioned at this light-emitting diode directly over, this reflecting material is filled in this groove.
3. package structure for LED as claimed in claim 1, wherein this first encapsulating material has groove, this groove be positioned at this light-emitting diode directly over, this reflecting material is arranged at the bottom surface of this groove.
4. package structure for LED as claimed in claim 1, wherein this reflecting material is a pyramidal structure.
5. package structure for LED as claimed in claim 4, wherein the tip of this reflecting material of pyramidal structure is towards this light-emitting diode.
6. package structure for LED as claimed in claim 1, wherein this reflecting material is close to the surface of this first encapsulating material.
7. package structure for LED as claimed in claim 1 also comprises:
Second encapsulating material is arranged on this first encapsulating material and this reflecting material.
8. package structure for LED comprises:
Support plate;
Light-emitting diode is arranged on this support plate;
The reflection frame, be arranged on this light-emitting diode, and be positioned at this light-emitting diode directly over; And
Encapsulating material covers this light-emitting diode and this reflection frame.
9. package structure for LED as claimed in claim 8, wherein this reflection frame comprises:
Bullet, be positioned at this light-emitting diode directly over.
10. package structure for LED as claimed in claim 9, wherein the tip of this bullet is towards this light-emitting diode.
11. package structure for LED as claimed in claim 9, wherein this reflection frame also comprises:
Support connects this bullet and this support plate, to support this bullet.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100104140A TW201234667A (en) | 2011-02-08 | 2011-02-08 | Light-emitting diode package structure |
| TW100104140 | 2011-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102629654A true CN102629654A (en) | 2012-08-08 |
Family
ID=46587870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100611641A Pending CN102629654A (en) | 2011-02-08 | 2011-03-14 | Light emitting diode packaging structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102629654A (en) |
| TW (1) | TW201234667A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI705586B (en) * | 2014-09-26 | 2020-09-21 | 晶元光電股份有限公司 | Light-emitting device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020185651A1 (en) * | 2001-06-08 | 2002-12-12 | Sommers Mathew L. | Light-emitting diode (LED) package and packaging method for shaping the external light intensity distribution |
| CN100461473C (en) * | 2005-03-18 | 2009-02-11 | 三星电机株式会社 | Side-emitting LED package having scattering area and backlight apparatus incorporating the LED lens |
| CN101615642A (en) * | 2008-06-25 | 2009-12-30 | 富准精密工业(深圳)有限公司 | Light-emitting diode |
| US7872273B2 (en) * | 2008-03-28 | 2011-01-18 | Industrial Technology Research Institute | Light emitting device |
| CN201715280U (en) * | 2010-01-04 | 2011-01-19 | 金芃 | LED side-emitting type light source |
-
2011
- 2011-02-08 TW TW100104140A patent/TW201234667A/en unknown
- 2011-03-14 CN CN2011100611641A patent/CN102629654A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020185651A1 (en) * | 2001-06-08 | 2002-12-12 | Sommers Mathew L. | Light-emitting diode (LED) package and packaging method for shaping the external light intensity distribution |
| CN100461473C (en) * | 2005-03-18 | 2009-02-11 | 三星电机株式会社 | Side-emitting LED package having scattering area and backlight apparatus incorporating the LED lens |
| US7872273B2 (en) * | 2008-03-28 | 2011-01-18 | Industrial Technology Research Institute | Light emitting device |
| CN101615642A (en) * | 2008-06-25 | 2009-12-30 | 富准精密工业(深圳)有限公司 | Light-emitting diode |
| CN201715280U (en) * | 2010-01-04 | 2011-01-19 | 金芃 | LED side-emitting type light source |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201234667A (en) | 2012-08-16 |
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Application publication date: 20120808 |