CN102623798A - Multilayer ceramic antenna and preparation method thereof - Google Patents
Multilayer ceramic antenna and preparation method thereof Download PDFInfo
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- CN102623798A CN102623798A CN2012101068515A CN201210106851A CN102623798A CN 102623798 A CN102623798 A CN 102623798A CN 2012101068515 A CN2012101068515 A CN 2012101068515A CN 201210106851 A CN201210106851 A CN 201210106851A CN 102623798 A CN102623798 A CN 102623798A
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Abstract
The invention discloses a multilayer ceramic antenna and a preparation method thereof. The ceramic antenna comprises ceramic dielectrics and multilayer radiation conductor belts and is characterized by further comprising a first peripheral end sealing metal, the multilayer conductor belts extend together to a certain side surface of the ceramic dielectrics, and the first peripheral end sealing metal performs end sealing for the side surface so that an interconnection among layers of the radiation conductor belts is achieved. According to the multilayer ceramic antenna and the preparation method thereof, the multilayer conductor belts inside the multilayer ceramic antenna extend together to a certain side surface of the ceramic dielectrics, by the aid of the peripheral end sealing metal on the side surface, the interconnection among layers of multilayer radiation conductor belts is achieved; by means of the peripheral end sealing metal on a ceramic dielectric feed-in surface, electrical connections between the radiation conductor belts and outer microstrip feeder lines are achieved; and by means of the usage of the end sealing metal, the problems of a long production cycle and an increase of costs of mass production caused by using through holes are solved, and the requirement for the processing accuracy is low, thereby the processing difficulty is lowered and the production efficiency is improved.
Description
Technical field
The invention belongs to microwave components and design and produce technical field, be specifically related to the design of a kind of multi-layer porcelain antenna and preparation method thereof.
Background technology
As the important component part of radio-frequency front-end in the wireless communication system, antenna occupies critical role in the design of entire wireless communication system.Antenna is being born the main effect that receives in the system with the emission electromagnetic signal, and the quality of its performance is directly connected to the whole running of communication system.Along with radio spectrum resources the day be becoming tight with mobile terminal device present volume miniaturization day by day; Function is diverse trends day by day, often needs integrated a plurality of antennas in the single mobile terminal, and this makes the high-performance of antenna; Low cost, miniaturization requires to become designer's focus.
More popular portable antenna technology is generally used LTCC technology at present, and it is satisfied basically to adopt multilayer ceramic structure to make that the antenna miniaturization requirement is able to.Because ceramic component need interconnect between multi-layer conductive, the traditional solution that interconnects at multi-layer conductive is punching, and filled conductive medium in the hole is then at the accurate silk screen of ceramics surface printing, printed conductor; Another kind of settling mode does not need punching, but need print the silk screen of accurately aiming in the side, generates the side of band printed conductor figure then on the edge of, solves the problem that multi-layer conductive interconnects in this way.First method need be beaten big metering-orifice on ceramics, can only buy a ceramics at every turn, and efficient is very low, and when adding man-hour in enormous quantities, drilling process is consuming time huge, seriously reduces production efficiency; Second method has been saved punching, but need be in the side extra printing screen, not only increased cost, and silk screen to accurately aim at the silk screen on surface, in case aim at deviation is arranged, interconnection will be affected, even can't interconnect.In producing large batch of ceramic component process, interconnection and the contradiction of enhancing productivity between inner multi-layer conductive are demanded industry urgently and are solved.
Summary of the invention
The objective of the invention is to have proposed a kind of multi-layer porcelain antenna in order to solve the problems referred to above that existing multi-layer porcelain antenna exists.
For achieving the above object; The technical scheme that the present invention adopts is: a kind of multi-layer porcelain antenna comprises ceramic dielectric and the multilayer radiation conductor band that is arranged in ceramic dielectric; It is characterized in that; Also comprise the first peripheral end-blocking metal, said multilayer radiation conductor band extends to a certain side of ceramic dielectric jointly, and end-blocking is carried out in the said side of the said first peripheral end-blocking metal pair to make between multilayer radiation conductor belt interconnected.
Further, said multi-layer porcelain antenna also comprises the second peripheral end-blocking metal that is arranged at ceramic dielectric feed-in face, is used for the radiation conductor band and is electrically connected with outside microstrip feed line.
To said structure, the invention allows for a kind of preparation method of multi-layer porcelain antenna, specifically comprise following steps:
Step 1: hydrostomia, the ceramics green ceramic chip that is adopted is dried drying condition: 80～90 ℃ of temperature, 25～35 minutes time;
Step 2: section, cut according to the ceramics of size needs after hydrostomia;
Step 3: make location hole, diaphragm can be accurately corresponding with the silk screen position when making silk screen printing;
Step 4: silk screen printing makes every layer of ceramics green ceramic chip form antenna metal tape figure through the precise silk screen printing;
Step 5: lamination promptly the ceramics green ceramic chip that prints figure, forms a complete multilager base plate base substrate;
Step 6: deburring, the edge of multilager base plate base substrate is repaired;
Step 7: wait static pressure, the multilager base plate base substrate is waited static pressure, promptly utilize the thermoplasticity of ceramics green ceramic chip to wait static pressure, the said static pressure process that waits is carried out in vacuum environment;
Step 8: cutting, before sintering, cut to form filter individual to the laminated ceramic chips behind the lamination;
Step 9: binder removal, before sintering, the organic gel in the laminated ceramic chips is removed;
Step 10: sintering, the ceramic green behind the binder removal is put into agglomerating plant binder removal sintering, sintering temperature is 850～950 ℃;
Step 11: the end-blocking silver ink firing, carry out end-blocking with silver powder to the ceramic dielectric both sides.
Beneficial effect of the present invention: the inner multilayer radiation conductor band of the multi-layer porcelain antenna among the present invention extends to a certain side of ceramic dielectric jointly, through the peripheral end-blocking metal of this side, has realized between multilayer radiation conductor belt interconnected; The further peripheral end-blocking metal through ceramic dielectric feed-in face is realized being electrically connected of radiation conductor band and outside microstrip feed line; Through using the end-blocking metal to avoid the production cycle that use brought of through hole long, produce the problem that cost increases in batches, and lower to requirement on machining accuracy, reduced difficulty of processing, improved production efficiency.
Description of drawings
Fig. 1 is the multi-layer porcelain antenna structural representation of the embodiment of the invention one.
Fig. 2 is the multi-layer porcelain antenna structural representation of the embodiment of the invention two.
Fig. 3 is preparation method's schematic flow sheet of multi-layer porcelain antenna provided by the invention.
Description of reference numerals: 1 medium substrate; 2 microstrip feed lines; 3 multilayer radiation conductor bands; 4 ceramic dielectrics; 5 second peripheral end-blocking metals; 6 first peripheral end-blocking metals.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is done further explanation.
The multi-layer porcelain antenna structure of embodiment one is as shown in Figure 1: comprise; Ceramic dielectric 4 and the multilayer radiation conductor band 3 that is arranged in ceramic dielectric 4; Also comprise the first peripheral end-blocking metal 6; Said multilayer radiation conductor band 3 extends to a certain side of ceramic dielectric 4 jointly, and end-blocking is carried out in the said side of the said first peripheral end-blocking metal pair to make between multilayer radiation conductor belt interconnected.
The a certain side here is appreciated that to multilayer radiation conductor band ends at this side, so need it is carried out end-blocking, forms interconnected so that end at the multilayer radiation conductor band of this side.
Here multi-layer porcelain antenna also comprises the second peripheral end-blocking metal 5 that is arranged at ceramic dielectric feed-in face, is used for radiation conductor band 3 and is electrically connected with outside microstrip feed line 2.
Among the embodiment one shown in Figure 1: LTCC ceramic dielectric 5 is positioned at medium substrate 1 top; In the LTCC ceramic dielectric, vertically place three layers of snakelike metal antenna band from top to bottom, the ground floor and the second layer are measure-alike, are staggered; The 3rd layer of size is less than the second layer, for consistency from top to bottom is arranged.One deck curved conductor band that wherein is positioned at the top links to each other with microstrip feed line through the end-blocking conductor belt of ceramic dielectric side; The end-blocking conductor belt of opposite side is used to connect the curved conductor band of the inner the top of ceramic dielectric and the two-layer curved conductor band of below, and the three-layer metal antenna is formed by the copper conductor printing on the ceramic dielectric, and the conductor belt of both sides is formed by the silver conductor end-blocking.
The multi-layer porcelain antenna structure of embodiment two is as shown in Figure 2: similar with instance one; LTCC ceramic dielectric 4 is positioned at medium substrate 1 top; The two-layer snakelike metal antenna band 3 of vertical from top to bottom placement in the LTCC ceramic dielectric, the ground floor and the second layer are measure-alike, are staggered.One deck curved conductor band that wherein is positioned at the top links to each other with microstrip feed line through the second peripheral end-blocking metal 5 of ceramic dielectric side; The first peripheral end-blocking metal 6 of opposite side is used to connect the inner two-layer curved conductor band of ceramic dielectric, and the double layer of metal antenna is formed by the copper conductor printing on the ceramic dielectric, and the conductor belt of both sides is formed by the silver conductor end-blocking.
The technological process that practical implementation instance of the present invention is adopted is as shown in Figure 3, specifically comprises following steps:
Step 1: hydrostomia, the ceramics green ceramic chip that is adopted is dried drying condition: 80～90 ℃ of temperature, 25～35 minutes time;
Step 2: section, cut according to the ceramics of size needs after hydrostomia;
Step 3: make location hole, diaphragm can be accurately corresponding with the silk screen position when making silk screen printing;
Step 4: silk screen printing makes every layer of ceramics green ceramic chip form antenna metal tape figure through the precise silk screen printing;
Step 5: lamination, promptly the ceramics green ceramic chip that prints figure, at pressure 150bar, 35 ℃ of temperature overlap together under the condition of 10 seconds time, form a complete multilager base plate base substrate;
Step 6: deburring, the edge of multilager base plate base substrate is repaired;
Step 7: wait static pressure, the multilager base plate base substrate is waited static pressure, promptly utilize the thermoplasticity of ceramics green ceramic chip to wait static pressure, wait the static pressure process in vacuum environment, to carry out, the said hydrostatic pressure condition that waits is: pressure 22MPa, time 15min, 55 ℃ of temperature;
Step 8: cutting, before sintering, cut to form filter individual to the laminated ceramic chips behind the lamination;
Step 9: binder removal, before sintering, the organic gel in the laminated ceramic chips is removed, avoid sintering after pottery become powder;
Step 10: sintering, the ceramic green behind the binder removal is put into stove binder removal sintering, sintering temperature is 850～950 ℃;
Step 11: the end-blocking silver ink firing, carry out end-blocking with silver powder to the ceramic dielectric both sides.
Above-mentioned technical process is compared the step of having saved punching with conventional procedure, it is interconnected finally to replace punching to accomplish through end-blocking.Avoid the production cycle that use brought of through hole long, produced the problem that cost increases in batches, and lower to requirement on machining accuracy, reduced difficulty of processing, improved production efficiency.
The inner multilayer radiation conductor band of multi-layer porcelain antenna among the present invention extends to a certain side of ceramic dielectric jointly, through the peripheral end-blocking metal of this side, realizes between terrible multilayer radiation conductor belt interconnected; The further peripheral end-blocking metal through ceramic dielectric feed-in face is realized being electrically connected of radiation conductor band and outside microstrip feed line; Through using the end-blocking metal to avoid the production cycle that use brought of through hole long, produce the problem that cost increases in batches, and lower to requirement on machining accuracy, reduced difficulty of processing, improved production efficiency.
Above instance is merely preferred example of the present invention, and use of the present invention is not limited to this instance, and is all within spirit of the present invention and principle, any modification of being made, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. multi-layer porcelain antenna; Comprise; Ceramic dielectric and the multilayer radiation conductor band that is arranged in ceramic dielectric is characterized in that, also comprise the first peripheral end-blocking metal; Said multilayer radiation conductor band extends to a certain side of ceramic dielectric jointly, and end-blocking is carried out in the said side of the said first peripheral end-blocking metal pair to make between multilayer radiation conductor belt interconnected.
2. multi-layer porcelain antenna according to claim 1 is characterized in that, said multi-layer porcelain antenna also comprises the second peripheral end-blocking metal that is arranged at ceramic dielectric feed-in face, is used for the radiation conductor band and is electrically connected with outside microstrip feed line.
3. the preparation method of a multi-layer porcelain antenna specifically comprises following steps:
Step 1: hydrostomia, the ceramics green ceramic chip that is adopted is dried drying condition: 80～90 ℃ of temperature, 25～35 minutes time;
Step 2: section, cut according to the ceramics of size needs after hydrostomia;
Step 3: make location hole, diaphragm can be accurately corresponding with the silk screen position when making silk screen printing;
Step 4: silk screen printing makes every layer of ceramics green ceramic chip form antenna metal tape figure through the precise silk screen printing;
Step 5: lamination promptly the ceramics green ceramic chip that prints figure, forms a complete multilager base plate base substrate;
Step 6: deburring, the edge of multilager base plate base substrate is repaired;
Step 7: wait static pressure, the multilager base plate base substrate is waited static pressure, promptly utilize the thermoplasticity of ceramics green ceramic chip to wait static pressure, the said static pressure process that waits is carried out in vacuum environment;
Step 8: cutting, before sintering, cut to form filter individual to the laminated ceramic chips behind the lamination;
Step 9: binder removal, before sintering, the organic gel in the laminated ceramic chips is removed;
Step 10: sintering, the ceramic green behind the binder removal is put into agglomerating plant binder removal sintering, sintering temperature is 850～950 ℃;
Step 11: the end-blocking silver ink firing, carry out end-blocking with silver powder to the ceramic dielectric both sides.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101068515A CN102623798A (en) | 2012-04-13 | 2012-04-13 | Multilayer ceramic antenna and preparation method thereof |
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| CN2012101068515A CN102623798A (en) | 2012-04-13 | 2012-04-13 | Multilayer ceramic antenna and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430125A (en) * | 2015-11-13 | 2016-03-23 | 深圳百工精艺材料技术有限公司 | Functional mobile phone back shell and preparation method thereof |
| CN106129606A (en) * | 2016-06-29 | 2016-11-16 | 北京小米移动软件有限公司 | Ceramic antenna and there is its rear cover structure |
| CN104319469B (en) * | 2014-10-16 | 2017-02-15 | 云南云天化股份有限公司 | Preparation method for micro-strip ceramic antenna |
| CN115566414A (en) * | 2022-11-16 | 2023-01-03 | 西安创联电气科技（集团）有限责任公司 | Multilayer microwave dielectric ceramic filter antenna and preparation method thereof |
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| CN101026259A (en) * | 2007-03-13 | 2007-08-29 | 华南理工大学 | Zigzag LTCC dual-band chip antenna |
| CN101227026A (en) * | 2007-12-27 | 2008-07-23 | 上海交通大学 | Polymetal interconnecting layer combined aerial on chip |
| CN102354803A (en) * | 2011-06-02 | 2012-02-15 | 西北工业大学 | Ceramic Bluetooth antenna |
| CN202585727U (en) * | 2012-04-13 | 2012-12-05 | 电子科技大学 | Multilayer ceramic antenna |
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2012
- 2012-04-13 CN CN2012101068515A patent/CN102623798A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101026259A (en) * | 2007-03-13 | 2007-08-29 | 华南理工大学 | Zigzag LTCC dual-band chip antenna |
| CN101227026A (en) * | 2007-12-27 | 2008-07-23 | 上海交通大学 | Polymetal interconnecting layer combined aerial on chip |
| CN102354803A (en) * | 2011-06-02 | 2012-02-15 | 西北工业大学 | Ceramic Bluetooth antenna |
| CN202585727U (en) * | 2012-04-13 | 2012-12-05 | 电子科技大学 | Multilayer ceramic antenna |
Non-Patent Citations (1)
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| 唐 伟等: "基于LTCC 工艺的蓝牙天线设计与制造", 《电子元件与材料》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104319469B (en) * | 2014-10-16 | 2017-02-15 | 云南云天化股份有限公司 | Preparation method for micro-strip ceramic antenna |
| CN105430125A (en) * | 2015-11-13 | 2016-03-23 | 深圳百工精艺材料技术有限公司 | Functional mobile phone back shell and preparation method thereof |
| CN106129606A (en) * | 2016-06-29 | 2016-11-16 | 北京小米移动软件有限公司 | Ceramic antenna and there is its rear cover structure |
| CN115566414A (en) * | 2022-11-16 | 2023-01-03 | 西安创联电气科技（集团）有限责任公司 | Multilayer microwave dielectric ceramic filter antenna and preparation method thereof |
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Application publication date: 20120801 |