CN102608723A - Wafer-grade camera lens module - Google Patents
Wafer-grade camera lens module Download PDFInfo
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- CN102608723A CN102608723A CN2011100223152A CN201110022315A CN102608723A CN 102608723 A CN102608723 A CN 102608723A CN 2011100223152 A CN2011100223152 A CN 2011100223152A CN 201110022315 A CN201110022315 A CN 201110022315A CN 102608723 A CN102608723 A CN 102608723A
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- lens module
- ring surface
- wafer scale
- camera lens
- bore
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Abstract
The invention discloses a wafer-grade camera lens module, comprising a fixed shell and a lens module, wherein the fixed shell is provided with a first positioning face, a light incidence opening and a shell axial center; and the first positioning face is located at the inner side of the fixed shell. The lens module is arranged inside the fixed shell and is provided with a positioning part, a lens part and a lens axial center. The light incidence opening of the fixed shell exposes the lens part of the lens module; the lens part and the positioning part of the lens module are arranged in the same surface of the lens module; the first positioning face of the fixed shell is in contact with the positioning part of the lens module; and the shell axial center of the fixed shell is overlapped with the lens axial center of the lens module.
Description
Technical field
The present invention relates to a kind of optical module, and particularly relate to a kind of wafer scale camera lens module (waferlevel lens module).
Background technology
Along with the module microminiaturization of electronic product and the trend of low priceization, (Wafer LevelModule, WLM) appearance of technology receives much concern the wafer scale module.The technology of wafer scale module mainly is to utilize the manufacturing technology of wafer scale, and with the volume microminiaturization of electronic product and reduce cost.Wherein, The technology of wafer scale module also can be applied to make on the camera lens of image sensing module; And make camera lens module on volume, be able to obtain reduction, and then can be applicable on the camera model of electronic installation (like notebook computer, mobile phone etc.) far beyond traditional camera lens module.
The wafer scale camera lens module is because of developing toward the microminiaturization direction, so the requirement for offset error also relatively improves in assembling at present.In assembling process, no matter be cutting to lens module, or the axes alignment after the cutting, both all can produce the tolerance of part.Therefore, the tolerance of in assembling process, being accumulated can cause the centrally aligned degree of stability of axle center and CMOS CIS of lens module not good, and then (CMOS Camera Module, qualification rate CCM) is not high to cause the CMOS camera lens module.
Summary of the invention
The object of the present invention is to provide a kind of wafer scale camera lens module, have a good structural design, in assembling process, the quality that can avoid causing because of axes alignment descends or qualification rate descends.
For reaching above-mentioned purpose, the present invention provides a kind of wafer scale camera lens module, and it comprises a stationary housing and a lens module.Stationary housing has one first locating surface, a light inlet opening and a housing axle center, and wherein first locating surface is positioned at the stationary housing inboard.Lens module is disposed in the stationary housing, and has a location division, a lens section and a lens axle center.Wherein, The light inlet opening of stationary housing exposes the lens section of lens module; The lens section of lens module and position point are on the same surface of lens module; First locating surface of stationary housing contacts with the location division of lens module, and the lens axis coinciding of the housing axle center of stationary housing and lens module.
In one embodiment of this invention, the first above-mentioned locating surface is one first ring surface.The axle center of first ring surface and housing axis coinciding.
In one embodiment of this invention, the first above-mentioned ring surface has one first bore and one second bore.First bore is less than or equal to second bore.
In one embodiment of this invention, above-mentioned stationary housing has more one second locating surface.Second locating surface is one second ring surface.The axle center of second ring surface and housing axis coinciding.
In one embodiment of this invention, the second above-mentioned ring surface has one the 3rd bore and four-hole footpath.The 3rd bore is more than or equal to the four-hole footpath.
In one embodiment of this invention, first bore of the first above-mentioned ring surface is more than or equal to the 3rd bore of second ring surface.
In one embodiment of this invention, above-mentioned stationary housing has more a location groove.First locating surface and second locating surface are positioned at detent.Second locating surface is relative with first locating surface.
In one embodiment of this invention, the location division of above-mentioned lens module is a location projection.Locator protrusions has one the 3rd ring surface.The 3rd ring surface conforms in fact with the size of first ring surface.
In one embodiment of this invention, above-mentioned locator protrusions has more one the 4th ring surface.The 4th ring surface conforms in fact with the size of second ring surface.
In one embodiment of this invention, the normal of the first above-mentioned locating surface is vertical with the housing axle center.
In one embodiment of this invention, above-mentioned first locating surface and locator protrusions are tangent.
In one embodiment of this invention, the location division of above-mentioned lens module is the extension of its lens section.
Based on above-mentioned; In exemplary embodiment of the present invention; Stationary housing has an axisymmetric microstructure in the optics effective diameter, and this axisymmetric microstructure can be fitted to each other with the location division of lens module when stationary housing and lens module assembling, the tolerance that is caused during with the reduction axes alignment.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended accompanying drawing to elaborate as follows.
Description of drawings
Figure 1A to Fig. 1 D is respectively the cut-open view of lens module before cutting of different embodiments of the invention;
Fig. 2 A and Fig. 2 B are the cut-open view of the lens module of one embodiment of the invention;
Fig. 3 is the cut-open view of the lens module of another embodiment of the present invention;
Fig. 4 A and Fig. 4 B are the cut-open view of the lens module of another embodiment of the present invention;
Fig. 4 C is the cut-open view of the lens module of another embodiment of the present invention;
Fig. 5 A and Fig. 5 B are the cut-open view of the lens module of another embodiment of the present invention;
Fig. 6 A and Fig. 6 B are the cut-open view of the lens module of another embodiment of the present invention.
The main element symbol description
100,100 ', 100 ", 100 " ', 100a, 100b: wafer scale camera lens module
110: lens module
112,112 ', 112 ", 112 " ': the location division
113,113 ', 113 ": the 3rd ring surface
114: lens section
115: the four ring surfaces
116: substrate
120: stationary housing
122,122 ', 122 ": first locating surface, first ring surface
123: the second locating surfaces, second ring surface
124: the light inlet opening
125,125 ': detent
200: CIS
C1: lens axle center
C2: housing axle center
D1: first bore
D2: second bore
D3: the 3rd bore
D4: four-hole footpath
Embodiment
Figure 1A to Fig. 1 D illustrates the cut-open view of lens module before cutting of different embodiments of the invention.Please refer to Figure 1A to Fig. 1 D, in exemplary embodiment of the present invention, lens module utilizes the manufacturing technology of wafer scale before cutting, on its substrate 116, forms a plurality of location microstructure and a plurality of lens microstructure.With Figure 1A is example, and after the lens module cutting, each lens module 110 comprises a location division 112 and a lens section 114 at least.Figure 1A to Fig. 1 C is respectively the locator protrusions microstructure illustration location division 112,112 ' and 112 of arc, trapezoidal and rectangle with the square section ", but the present invention is not limited to this.Fig. 1 D illustrative location division 112 " ' then be the extension around the lens section 114, and as the usefulness of location.
What need to specify is that if overlook its structure by the top of lens module 110, then the location division 112,112 ' and 112 " to be respectively one be the ring-type microstructure of symcenter with lens axle center C1, but the present invention is not limited to this.
Fig. 2 A and Fig. 2 B illustrate the cut-open view of the lens module of one embodiment of the invention.Please refer to Fig. 2 A and Fig. 2 B, in the present embodiment, wafer scale camera lens module 100 comprises a stationary housing 120 and a lens module 110.At this, lens module 110 for example is Figure 1A person of illustrating.Wafer scale camera lens module 100 is suitable for and a CMOS CIS 200 assembling, and forming a CMOS image sensing module, but the present invention is not limited to this.In the present embodiment, the material of stationary housing 120 for example be can high temperature resistant (more than 250 ℃) thermosets.
In the present embodiment, stationary housing 120 has one first locating surface 122, a light inlet opening 124 and a housing axle center C2.First locating surface 122 is positioned at the inboard of stationary housing 120.Lens module 110 is disposed in the stationary housing 120.The light inlet opening 124 of stationary housing 120 exposes the lens section 114 of lens module 110, so that lens section 114 can receive the image strip from environment.The lens section 114 and the location division 112 of lens module 110 are positioned on the same surface of lens module 110.So; First locating surface, 122 close-fittings (tightly fit) through stationary housing 120 are in the location division 112 of lens module 110; Can make the housing axle center C2 of stationary housing 120 overlap (axes alignment that is both) with the lens axle center C1 of lens module 110; And then reduce the tolerance that axes alignment is caused when assembling, for example tolerance is controlled within 10 microns (um).
What need to specify is, in the present embodiment, if overlook its structure by the top of wafer scale camera lens module 100, first locating surface 122 of stationary housing 120 is one to be first ring surface of symcenter with housing axle center C2, but the present invention is not limited to this.In other words, in the present embodiment, first locating surface 122 is one first ring surface.The axle center of first ring surface (not illustrating) overlaps with the housing axle center C2 of stationary housing 120.In addition, first ring surface 122 has one first bore d1 and one second bore d2, and wherein the first bore d1 is less than the second bore d2, shown in Fig. 2 B.
On the other hand, the location division 112 of present embodiment is that a square section is the locator protrusions of arc, because first locating surface 122 of stationary housing 120 is tight with at the location division 112 of lens module 110, therefore first locating surface 122 is tangent with the locator protrusions of this arc.
Fig. 3 illustrates the cut-open view of the lens module of another embodiment of the present invention.Please refer to Fig. 2 A and Fig. 3, the wafer scale camera lens module 100 ' of present embodiment is similar to the wafer scale camera lens module 100 of Fig. 2 A, is one trapezoidal but main between the two difference for example is the square section of the location division 112 ' of lens module 110.Therefore, in the present embodiment, location division 112 ' has one the 3rd ring surface, 113, the three ring surfaces 113 and conforms in fact with the size of first ring surface 122 ', to reach the effect of both close-fittings.
Fig. 4 A and Fig. 4 B illustrate the cut-open view of the lens module of another embodiment of the present invention.Please refer to Fig. 3 and Fig. 4 A, Fig. 4 B, the wafer scale camera lens module 100 of present embodiment " be similar to the wafer scale camera lens module 100 ' of Fig. 3, but main between the two difference for example is the location division 112 of lens module 110 " the square section be a rectangle.Therefore, in the present embodiment, except location division 112 " the 3rd ring surface 113 ' and first ring surface 122 " size conform in fact, first ring surface 122 " normal (not illustrating) vertical with the housing axle center C2 of stationary housing 120.In addition, in the present embodiment, first ring surface 122 " the first bore d1 equal its second bore d2, shown in Fig. 4 B.
Fig. 4 C illustrates the cut-open view of the lens module of another embodiment of the present invention.Please refer to Fig. 4 A to Fig. 4 C; The wafer scale camera lens module 100 of present embodiment " ' be similar to the wafer scale camera lens module 100 of Fig. 4 A "; But main between the two difference for example is the location division 112 of lens module 110 among Fig. 4 C " ' can be considered lens section 114 extension on every side, and the usefulness of conduct location.Therefore, in the present embodiment, for the location division 112 of the different external forms of arranging in pairs or groups " ', stationary housing 120 is its design of adaptability ground adjustment also, and like Fig. 4 C person of illustrating.It should be noted that in the present embodiment location division 112 " ' the 3rd ring surface 113 " with first ring surface 122 of stationary housing 120 " do not need close-fitting can reach the effect of location.
Fig. 5 A and Fig. 5 B illustrate the cut-open view of the lens module of another embodiment of the present invention.Please refer to Fig. 2 A, Fig. 5 A and Fig. 5 B, the wafer scale camera lens module 100a of present embodiment is similar to the wafer scale camera lens module 100 of Fig. 2 A, but main between the two difference is following.
In the present embodiment, stationary housing 120 also has one second locating surface 123 and a location groove 125.Wherein, first locating surface 122 and second locating surface 123 are positioned at detent 125, and second locating surface 123 and first locating surface 122 are against each other.In addition, if overlook its structure by the top of wafer scale camera lens module 100a, first locating surface 123 of stationary housing 120 is one to be second ring surface of symcenter with housing axle center C2, and its axle center (not illustrating) overlaps with the housing axle center C2 of stationary housing 120.In addition, second ring surface 123 has one the 3rd bore d3 and four-hole footpath d4, and wherein the 3rd bore d3 is greater than four-hole footpath d4, shown in Fig. 5 B.
It should be noted that in the present embodiment the first bore d1 of first ring surface 122 is greater than the 3rd bore d3 of second ring surface 123, and the square section of the detent 125 of present embodiment is one trapezoidal.
Fig. 6 A and Fig. 6 B illustrate the cut-open view of the lens module of another embodiment of the present invention.Please refer to Fig. 3, Fig. 5 A, Fig. 6 A and Fig. 6 B, the wafer scale camera lens module 100b of present embodiment is similar to the wafer scale camera lens module 100a of Fig. 5 A, but main between the two difference is following.In the present embodiment, the square section of detent 125 ' is a triangle, so the first bore d1 of first ring surface 122 of present embodiment equals the 3rd bore d3 of second ring surface 123, shown in Fig. 6 B.
In addition, the wafer scale camera lens module 100b of present embodiment is similar to the wafer scale camera lens module 100 ' of Fig. 3, but main between the two difference is following.In the present embodiment, location division 112 ' has one the 4th ring surface, 115, the four ring surfaces 115 and conforms in fact with the size of second ring surface 123, to reach the effect of both close-fittings.
In sum; In exemplary embodiment of the present invention; Stationary housing has an axisymmetric microstructure in the optics effective diameter, and this axisymmetric microstructure can be fitted to each other with the location division of lens module when stationary housing and lens module assembling, the tolerance that is caused during with the reduction axes alignment.
Though disclosed the present invention in conjunction with above embodiment; Yet it is not in order to limit the present invention; Be familiar with this operator in the technical field under any; Do not breaking away from the spirit and scope of the present invention, can do a little change and retouching, thus protection scope of the present invention should with enclose claim was defined is as the criterion.
Claims (12)
1. wafer scale camera lens module comprises:
Stationary housing has first locating surface, light inlet opening and housing axle center, and wherein this first locating surface is positioned at this stationary housing inboard; And
Lens module is disposed in this stationary housing, and has location division, lens section and lens axle center,
Wherein this light inlet opening exposes this lens section, and this lens section and this position point are on the same surface of this lens module, and this first locating surface contacts with this location division, and this housing axle center and this lens axis coinciding.
2. wafer scale camera lens module as claimed in claim 1, wherein this first locating surface is one first ring surface, the axle center of this first ring surface and this housing axis coinciding.
3. wafer scale camera lens module as claimed in claim 2, wherein this first ring surface has first bore and second bore, and this first bore is less than or equal to this second bore.
4. wafer scale camera lens module as claimed in claim 3, wherein this stationary housing also has second locating surface, and this second locating surface is second ring surface, the axle center of this second ring surface and this housing axis coinciding.
5. wafer scale camera lens module as claimed in claim 4, wherein this second ring surface has the 3rd bore and four-hole footpath, and the 3rd bore is more than or equal to this four-hole footpath.
6. wafer scale camera lens module as claimed in claim 5, wherein this first bore of this first ring surface is more than or equal to the 3rd bore of this second ring surface.
7. wafer scale camera lens module as claimed in claim 4, wherein this stationary housing also has detent, and this first locating surface and this second locating surface are positioned at this detent, and this second locating surface is relative with this first locating surface.
8. wafer scale camera lens module as claimed in claim 2, wherein this location division of this lens module is a location projection, and this locator protrusions has the 3rd ring surface, and the 3rd ring surface conforms in fact with the size of this first ring surface.
9. wafer scale camera lens module as claimed in claim 5, wherein this location division of this lens module is a location projection, and this locator protrusions also has the 4th ring surface, and the 4th ring surface conforms in fact with the size of this second ring surface.
10. wafer scale camera lens module as claimed in claim 1, wherein the normal of this first locating surface is vertical with this housing axle center.
11. wafer scale camera lens module as claimed in claim 1, wherein this location division of this lens module is a location projection, and this first locating surface and this locator protrusions are tangent.
12. wafer scale camera lens module as claimed in claim 1, wherein this location division of this lens module is the extension of this lens section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100223152A CN102608723A (en) | 2011-01-20 | 2011-01-20 | Wafer-grade camera lens module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100223152A CN102608723A (en) | 2011-01-20 | 2011-01-20 | Wafer-grade camera lens module |
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| Publication Number | Publication Date |
|---|---|
| CN102608723A true CN102608723A (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100223152A Pending CN102608723A (en) | 2011-01-20 | 2011-01-20 | Wafer-grade camera lens module |
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| CN (1) | CN102608723A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103581572A (en) * | 2012-08-01 | 2014-02-12 | 奇景光电股份有限公司 | Wafer-level optical module and combination method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1530683A (en) * | 2003-03-10 | 2004-09-22 | ������������ʽ���� | Camera device |
| CN101127312A (en) * | 2006-08-17 | 2008-02-20 | 三星电机株式会社 | Apparatus and method for assembling camera module |
| CN101652694A (en) * | 2007-03-30 | 2010-02-17 | 日本电产三协株式会社 | Lens driving device |
| US20100039716A1 (en) * | 2008-08-18 | 2010-02-18 | Asia Optical Co., Inc. | Lens assembly with a fitting structure |
| CN101672964A (en) * | 2008-09-11 | 2010-03-17 | 亚洲光学股份有限公司 | Lens set with embedding structure |
-
2011
- 2011-01-20 CN CN2011100223152A patent/CN102608723A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1530683A (en) * | 2003-03-10 | 2004-09-22 | ������������ʽ���� | Camera device |
| CN101127312A (en) * | 2006-08-17 | 2008-02-20 | 三星电机株式会社 | Apparatus and method for assembling camera module |
| CN101652694A (en) * | 2007-03-30 | 2010-02-17 | 日本电产三协株式会社 | Lens driving device |
| US20100039716A1 (en) * | 2008-08-18 | 2010-02-18 | Asia Optical Co., Inc. | Lens assembly with a fitting structure |
| CN101672964A (en) * | 2008-09-11 | 2010-03-17 | 亚洲光学股份有限公司 | Lens set with embedding structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103581572A (en) * | 2012-08-01 | 2014-02-12 | 奇景光电股份有限公司 | Wafer-level optical module and combination method thereof |
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Application publication date: 20120725 |