CN103581572A - Wafer-level optical module and combination method thereof - Google Patents
Wafer-level optical module and combination method thereof Download PDFInfo
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- CN103581572A CN103581572A CN201210274298.6A CN201210274298A CN103581572A CN 103581572 A CN103581572 A CN 103581572A CN 201210274298 A CN201210274298 A CN 201210274298A CN 103581572 A CN103581572 A CN 103581572A
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- wafer scale
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Abstract
The invention relates to a wafer-level optical module which comprises a sensor, a lens with the at least wafer level and a bracket. The sensor is used for converting images into electric signals. The space is formed in a first surface of the bracket so as to contain the sensor, and a second surface is provided at the position, opposite to the first surface, of the bracket so as to be combined with the lens with the at least wafer level.
Description
Technical field
The present invention is relevant a kind of wafer scale optics (WLO) module, particularly about a kind of wafer scale optical module with bracket (bracket).
Background technology
Wafer scale optics (WLO) technology is a kind of wafer level semiconductor technology, can be in order to manufacture compact optical element, and wafer scale lens for example.Wafer level optical elements is generally used in the camera module of mobile device (for example mobile phone).Image sensor is another critical elements of camera module, in order to be the signal of telecommunication by the video conversion by wafer scale lens, to represent the image of acquisition.
Wafer scale lens and image sensor are combined into after wafer scale optical module, and focusing becomes the important pointer that determines pick-up image quality.Fig. 1 shows that tradition is through the profile of the wafer scale optical module 100 of combination, and it comprises image sensor 11 and wafer scale lens 12.As shown in Figure 1, image sensor 11 directly engages (for example gummed) in wafer scale lens 12.The dislocation (misalignment) that the focusing of the wafer scale optical module 100 through combining is probably subject between image sensor 11 and wafer scale lens 12 affects.
The combination of tradition wafer scale optical module also can be used threaded adjustment mechanism (not shown), by screw thread to adjust the distance between wafer scale lens and image sensor.Although this kind of mechanism can be promoted the accuracy of focusing, yet threaded adjustment mechanism is that manpower is intensive, and is unfavorable for miniaturization.
Therefore need the wafer scale optics mechanism that proposes a kind of novelty badly, in order to promote the usefulness of wafer scale optical module, for example focusing.
As can be seen here, above-mentioned existing wafer scale optics, in product structure, manufacture method and use, obviously still has inconvenience and defect, and is urgently further improved.Therefore how to found a kind of new wafer scale optical module and combined method thereof, also becoming the current industry utmost point needs improved target.
Because the defect that above-mentioned existing wafer scale optics exists, the inventor is based on being engaged in this type of product design manufacture abundant practical experience and professional knowledge for many years, and the utilization of cooperation scientific principle, positive research and innovation in addition, to founding a kind of new wafer scale optical module and combined method thereof, can improve general existing wafer scale optics, make it have more practicality.Through constantly research, design, and after repeatedly studying sample and improving, finally create the present invention who has practical value.
Summary of the invention
Main purpose of the present invention is, overcome the defect that existing wafer scale optics exists, and provide a kind of new wafer scale optical module and combined method thereof, technical problem to be solved makes transducer and wafer scale lens be easy to combination, can allow sensor alignment in wafer scale optical module, or accurately control the distance of transducer and wafer scale lens.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of wafer scale optical module proposing according to the present invention, wherein comprises: transducer, in order to being the signal of telecommunication by video conversion; Wafer scale lens at least; And bracket, at its first surface, provide space with accommodating this transducer, and at relative this first surface place, provide second surface, in order in conjunction with these wafer scale lens.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid wafer scale optical module, wherein said transducer is image sensor.
Aforesaid wafer scale optical module, wherein said wafer scale lens package is containing lenticule.
Aforesaid wafer scale optical module, the width of wherein said bracket is greater than the width of this transducer, makes this transducer be able to be combined with these wafer scale lens by this bracket.
Aforesaid wafer scale optical module, wherein said transducer comprises initiatively array, its non-center that is positioned at this transducer.
Aforesaid wafer scale optical module, wherein said bracket tool asymmetrical shape, whereby, when this transducer is incorporated into the first surface of this bracket, the center superposition of the active array of this transducer is in the optical axis of these wafer scale lens.
Aforesaid wafer scale optical module, the first surface of wherein said bracket and the distance between second surface determine the focusing between this transducer and this wafer scale lens.
Aforesaid wafer scale optical module, is characterized in that more comprising infrared filter, between this bracket and this wafer scale lens, in order to intercept the infrared ray entering.
Aforesaid wafer scale optical module, is characterized in that more comprising lens barrel, in order to support this wafer scale lens.
The object of the invention to solve the technical problems also realizes by the following technical solutions.The combined method of a kind of wafer scale optical module proposing according to the present invention, wherein comprises: provide transducer, in order to being the signal of telecommunication by video conversion; At least wafer scale lens are provided; The space that accommodating this transducer provides at the first surface of bracket; And in conjunction with second surface and this wafer scale lens of this bracket, this second surface this first surface place relatively wherein.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The combined method of aforesaid wafer scale optical module, wherein said transducer is image sensor.
The combined method of aforesaid wafer scale optical module, wherein said wafer scale lens package is containing lenticule.
The combined method of aforesaid wafer scale optical module, the width of wherein said bracket is greater than the width of this transducer, makes this transducer be able to be combined with these wafer scale lens by this bracket.
The combined method of aforesaid wafer scale optical module, wherein said transducer comprises initiatively array, its non-center that is positioned at this transducer.
The combined method of aforesaid wafer scale optical module, wherein said bracket tool asymmetrical shape, whereby, when this transducer is incorporated into the first surface of this bracket, the center superposition of the active array of this transducer is in the optical axis of these wafer scale lens.
The combined method of aforesaid wafer scale optical module, the first surface of wherein said bracket and the distance between second surface determine the focusing between this transducer and this wafer scale lens.
The combined method of aforesaid wafer scale optical module, is characterized in that more comprising and inserts infrared filter between this bracket and this wafer scale lens, in order to intercept the infrared ray entering.
The combined method of aforesaid wafer scale optical module, is characterized in that more comprising and uses lens barrel to support this wafer scale lens.
The present invention compared with prior art has obvious advantage and beneficial effect.From above technical scheme, main technical content of the present invention is as follows: according to the embodiment of the present invention, wafer scale optical module comprises transducer, at least wafer scale lens and bracket.Transducer is in order to being the signal of telecommunication by video conversion.Bracket provides a space with accommodating transducer at its first surface, and at relative first surface place, provides second surface with in conjunction with wafer scale lens.A combined method for wafer scale optical module, wherein comprises: provide transducer, in order to being the signal of telecommunication by video conversion; At least wafer scale lens are provided; The space that accommodating this transducer provides at the first surface of bracket; And in conjunction with second surface and this wafer scale lens of this bracket, this second surface this first surface place relatively wherein.
By technique scheme, wafer scale optical module of the present invention and combined method thereof at least have following advantages and beneficial effect: make transducer and wafer scale lens be easy to combination, can allow sensor alignment in wafer scale optical module, or accurately control the distance of transducer and wafer scale lens.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of specification, and for above and other objects of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, be described in detail as follows.
Accompanying drawing explanation
Fig. 1 shows that tradition is through the profile of the wafer scale optical module of combination.
Fig. 2 A shows the sectional exploded view of the wafer scale optical module of the embodiment of the present invention.
Fig. 2 B shows the section constitutional diagram of the wafer scale optical module of Fig. 2 A.
Fig. 3 shows the vertical view of the transducer of Fig. 2 A, Fig. 2 B.
Fig. 4 shows the perspective exploded view of another wafer scale optical module of the embodiment of the present invention.
100: wafer scale optical module
11: image sensor
12: wafer scale lens
200: wafer scale optical module
201: wafer scale optical module
21: transducer
211: active array
22: bracket
221: first surface
222: second surface
23: wafer scale lens
24: optical axis
25: infrared filter
26: lens barrel
D: distance
Embodiment
For further setting forth the present invention, reach technological means and the effect that predetermined goal of the invention is taked, below in conjunction with accompanying drawing and preferred embodiment, wafer scale optical module and its embodiment of combined method, structure, method, step, feature and effect thereof to proposing according to the present invention, be described in detail as follows.
Fig. 2 A shows the sectional exploded view of the wafer scale optical module 200 of the embodiment of the present invention, and Fig. 2 B shows the section constitutional diagram of the wafer scale optical module 200 of Fig. 2 A.In this manual, wafer level optical elements refers to use the set miniaturization optical element of taking into account manufacture of semiconductor technology.Whereby, wafer scale optical module 200 can make the cost of end product (for example camera module of mobile device) and be suitable for miniaturization.
In the present embodiment, wafer scale optical module 200 mainly comprises transducer 21, bracket 22 and wafer scale lens 23(lenticule for example at least).The transducer 21 of the present embodiment is image sensor, and for example complementary metal oxide semiconductor (CMOS) image sensor or charge coupled cell (CCD), in order to being the signal of telecommunication by video conversion.
The bracket 22 of the present embodiment provides a space at its first surface 221, in order to accommodating transducer 21.Bracket 22 provides second surface 222 at relative first surface 221 places, for example, in order to combination (gummed) wafer scale lens 23.Though Fig. 2 A and Fig. 2 B illustration convex surface wafer scale lens 23, wafer scale lens 23 can be also concave surface, and the quantity of wafer scale lens 23 is also not limited to diagram person.
According to one of feature of the present embodiment, as shown in Fig. 2 A, Fig. 2 B figure, the width of bracket 22 is greater than the width of transducer 21.Even if the size of wafer scale lens 23 is generally greater than transducer 21, transducer 21 can be by bracket 22 and easily and 23 combinations of wafer scale lens.
Fig. 3 shows the vertical view of the transducer 21 of Fig. 2 A, Fig. 2 B.As shown in the figure, the active array 211 of transducer 21 is generally not positioned at transducer 21 center.According to another feature of the present embodiment, as shown in Fig. 2 A, Fig. 2 B, the bracket 22 of the present embodiment has asymmetrical shape, whereby, when transducer 21 is incorporated into the first surface 221 of bracket 22, the active array 211 center of transducer 21 can roughly overlap at the optical axis 24 of wafer scale lens 23 or wafer scale optical module 200.
According to the another feature of the present embodiment, as shown in Fig. 2 A, Fig. 2 B, transducer 21 and wafer scale lens 23(that is, first surface 221 and second surface 222) between distance d can accurately control to reach the required focusing of wafer scale optical module 200.Whereby, no longer need traditional complex mechanism (for example threaded adjustment mechanism) to adjust the distance between lens and transducer.In practice, the multiple bracket 22 of the tool different distance d that can first manufacture and classify, then, for a certain transducer 21 and wafer scale lens 23, can select applicable bracket 22 to combine.
Fig. 4 shows the perspective exploded view of another wafer scale optical module 201 of the embodiment of the present invention.As shown in Figure 4, the bracket of the present embodiment 22 indirectly with 23 combinations of wafer scale lens, but not direct and wafer scale lens 23 combinations as shown in Fig. 2 A, Fig. 2 B.In the present embodiment, infrared ray (IR) filter 25 is between bracket 22 and wafer scale lens 23, in order to stop the infrared ray entering.Moreover the present embodiment is used lens barrel 26 with supporting wafer level lens 23.
The above, it is only preferred embodiment of the present invention, not the present invention is done to any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet not in order to limit the present invention, any those skilled in the art, do not departing within the scope of technical solution of the present invention, when can utilizing the method for above-mentioned announcement and technology contents to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solution of the present invention, any simple modification of above embodiment being done according to technical spirit of the present invention, equivalent variations and modification, all still belong in the scope of technical solution of the present invention.
Claims (18)
1. a wafer scale optical module, is characterized in that comprising:
Transducer, in order to being the signal of telecommunication by video conversion;
Wafer scale lens at least; And
Bracket, provides space with accommodating this transducer at its first surface, and at relative this first surface place, provides second surface, in order in conjunction with these wafer scale lens.
2. wafer scale optical module as claimed in claim 1, is characterized in that wherein said transducer is image sensor.
3. wafer scale optical module as claimed in claim 1, is characterized in that wherein said wafer scale lens package is containing lenticule.
4. wafer scale optical module as claimed in claim 1, is characterized in that the width of wherein said bracket is greater than the width of this transducer, makes this transducer be able to be combined with these wafer scale lens by this bracket.
5. wafer scale optical module as claimed in claim 1, is characterized in that wherein said transducer comprises initiatively array, its non-center that is positioned at this transducer.
6. wafer scale optical module as claimed in claim 5, it is characterized in that wherein said bracket tool asymmetrical shape, whereby, when this transducer is incorporated into the first surface of this bracket, the center superposition of the active array of this transducer is in the optical axis of these wafer scale lens.
7. wafer scale optical module as claimed in claim 1, is characterized in that the first surface of wherein said bracket and the distance between second surface determine the focusing between this transducer and this wafer scale lens.
8. wafer scale optical module as claimed in claim 1, is characterized in that more comprising infrared filter, between this bracket and this wafer scale lens, in order to intercept the infrared ray entering.
9. wafer scale optical module as claimed in claim 1, is characterized in that more comprising lens barrel, in order to support this wafer scale lens.
10. a combined method for wafer scale optical module, is characterized in that comprising:
Provide transducer, in order to being the signal of telecommunication by video conversion;
At least wafer scale lens are provided;
The space that accommodating this transducer provides at the first surface of bracket; And
In conjunction with second surface and this wafer scale lens of this bracket, relative this first surface place of this second surface wherein.
The combined method of 11. wafer scale optical modules as claimed in claim 10, is characterized in that wherein said transducer is an image sensor.
The combined method of 12. wafer scale optical modules as claimed in claim 10, is characterized in that wherein said wafer scale lens package is containing lenticule.
The combined method of 13. wafer scale optical modules as claimed in claim 10, is characterized in that the width of wherein said bracket is greater than the width of this transducer, makes this transducer be able to be combined with these wafer scale lens by this bracket.
The combined method of 14. wafer scale optical modules as claimed in claim 10, is characterized in that wherein said transducer comprises initiatively array, its non-center that is positioned at this transducer.
The combined method of 15. wafer scale optical modules as claimed in claim 14, it is characterized in that wherein said bracket tool asymmetrical shape, whereby, when this transducer is incorporated into the first surface of this bracket, the center superposition of the active array of this transducer is in the optical axis of these wafer scale lens.
The combined method of 16. wafer scale optical modules as claimed in claim 10, is characterized in that the first surface of wherein said bracket and the distance between second surface determine the focusing between this transducer and this wafer scale lens.
The combined method of 17. wafer scale optical modules as claimed in claim 10, is characterized in that more comprising and inserts infrared filter between this bracket and this wafer scale lens, in order to intercept the infrared ray entering.
The combined method of 18. wafer scale optical modules as claimed in claim 10, is characterized in that more comprising and uses lens barrel to support this wafer scale lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210274298.6A CN103581572A (en) | 2012-08-01 | 2012-08-01 | Wafer-level optical module and combination method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210274298.6A CN103581572A (en) | 2012-08-01 | 2012-08-01 | Wafer-level optical module and combination method thereof |
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| CN103581572A true CN103581572A (en) | 2014-02-12 |
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| CN201210274298.6A Pending CN103581572A (en) | 2012-08-01 | 2012-08-01 | Wafer-level optical module and combination method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105827910A (en) * | 2015-01-26 | 2016-08-03 | 全视技术有限公司 | Wafer-level lens packaging methods, and associated lens assemblies and camera modules |
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| CN102214666A (en) * | 2010-04-06 | 2011-10-12 | 胜开科技股份有限公司 | Manufacturing method and structure of a wafer level image sensor module with package structure |
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| US20050275051A1 (en) * | 2004-06-14 | 2005-12-15 | Farnworth Warren M | Prefabricated housings for microelectronic imagers and methods for packaging microelectronic imagers |
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| CN105827910A (en) * | 2015-01-26 | 2016-08-03 | 全视技术有限公司 | Wafer-level lens packaging methods, and associated lens assemblies and camera modules |
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Application publication date: 20140212 |