CN102605336A - Magnetron sputtering method for capacitance touch control screen production - Google Patents
Magnetron sputtering method for capacitance touch control screen production Download PDFInfo
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- CN102605336A CN102605336A CN201210096164XA CN201210096164A CN102605336A CN 102605336 A CN102605336 A CN 102605336A CN 201210096164X A CN201210096164X A CN 201210096164XA CN 201210096164 A CN201210096164 A CN 201210096164A CN 102605336 A CN102605336 A CN 102605336A
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Abstract
The invention discloses a magnetron sputtering method for capacitance touch control screen production. The method comprises the following steps that: a cavity with a sputtering space is provided, a substrate is arranged in the sputtering space of the cavity, a target is arranged in the sputtering space of the cavity and is positioned at one side of the substrate, an electrode is connected onto the target, a magnetic field deflection coil is arranged right under the target, the inside of the sputtering space is in a vacuum state, in addition, plasma is introduced for bombarding the target, and atoms of the target are sputtered out and are deposited on the substrate in a targeted way through receiving the reflecting effect of the magnetic field reflection coil. Through adopting the mode, the target falling path is controlled, indium tin oxide (ITO) conductive material patterns required by customers can be sputtered in one step, the use of multilayer mask plates is not needed, the method is simple and convenient, the materials are obviously saved, the cost is also obviously reduced, and meanwhile, the small-batch customized product trial making requirement and the great-batch production requirement can be simultaneously met.
Description
Technical field
The present invention relates to the magnetic control sputtering plating field, particularly relate to a kind of magnetic control sputtering plating method that capacitance type touch control screen is produced that is used for.
Background technology
Along with high-speed development of science and technology, snafu variation has taken place in electronic product, along with the appearance of recent touch electronics product; The touch-control product receives pursuing of people more and more; Not only it can save the space, be convenient for carrying, but and the user through finger or pointer etc. direct control just; Use comfortable, very convenient.For example, the common personal digital assistant (PDA) of existing market, touch-control class mobile phone, portable notebook computer or the like have all strengthened the input to touch technology, use so touch-control device must have more widely in every field in the future.
At present, the structure of capacitance type touch-control panel is that carrier substrate, cover-plate glass, FPC soft arranging wire by electro-conductive material constitutes.Wherein the carrier glass of electro-conductive material is ITO (tin indium oxide) base material again, and its ME is very complicated, and the cost proportion that occupies capacitance plate is higher.Known techniques is called sputter, is commonly referred to as magnetic control sputtering plating, belongs to the high-speed low temperature sputtering method, like Fig. 1, adopts bombardment ray bombardment target, and electro-conductive material such as tiny flakes are dropped on the carrier substrate.This processing requirement vacuum tightness is about 1 * 10-3Torr; Promptly the vacuum state of 1.3 * 10-3Pa charges into the rare gas element argon gas in the sputter space of a cavity; And between electro-conductive material carrier substrate (anode) and metal targets (negative electrode), add high voltage direct current, because the electron excitation inert gas that photoglow produces produces plasma body; Plasma body is driven the atom of metal targets out of, makes material random deposition on the target on the electro-conductive material carrier substrate; Use specified Mask (mask plate) illumination web plate to cover on the ITO then, use the chemical liquid etching, perhaps the mode of laser-induced thermal etching is carried out the circuit etching to the ITO electro-conductive material on the base material, etches the ITO electro-conductive material figure of customer demand.In the production process of capacitance plate, generally need 2～5 layers of mask plate, just can etch the ITO electro-conductive material figure of customer demand.The advantage of this kind jet-plating method is to produce in enormous quantities quick, but its air purity for equipment, operator, operating environment all has strict requirement, for the such small serial production of appearance screen customized of current trend, and complex process, with high costs.
In order to overcome above-mentioned shortcoming, though industry has also proposed some terms of settlement pointedly at present, such as mode through the soft mould material printing conductive material of use; But the material speciality of mould material makes its high temperature reliability, and transmittance all can significantly decrease, and the life-span can be short more a lot of than glass baseplate; Though small serial production has superiority; But when customer approval appearance screen, when transferring mass production to, the cost of this mode is still very high.
Therefore need be for users provide a kind of easier, low cost method solves above problem.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of magnetic control sputtering plating method that capacitance type touch control screen is produced that is used for, and need not the layered mask plate, can disposable sputter goes out the ITO electro-conductive material figure of customer demand, realizes that low cost draws a design.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of magnetic control sputtering plating method that capacitive touch screen is produced that is used for is provided, and described method comprises:
Provide one to have sputter spatial cavity;
Make a base material be located in the sputter space of said cavity;
Make a target be located in the sputter space of said cavity, and be positioned at a side of said base material, at said target
Connect an electrode on the material;
One magnetic core logical circuit deflection coil is set under said target;
Make said sputter interior volume be vacuum state, and feed the said target of plasma bombardment;
The atom of said target is spilt, and receives the deflection of said magnetic core logical circuit deflection coil, targetedly is deposited on the said base material.
In preferred embodiment of the present invention, said magnetic core logical circuit deflection coil comprises line deflector coil and row deflector coil.
In preferred embodiment of the present invention, said line deflector coil is connected with the sawtooth current that is provided by a line-scan circuit, is created in the magnetic field of horizontal direction linear change.
In preferred embodiment of the present invention, said row deflector coil is connected with the sawtooth current that is provided by a column scan circuit, is created in the linear magnetic field that changes of vertical direction.
In preferred embodiment of the present invention, the vacuum tightness of said vacuum state remains on 1.3 * 10
-3Pa.
The invention has the beneficial effects as follows: the path that the present invention falls through the control target; The ITO electro-conductive material figure that can disposable sputter goes out customer demand; Reduced the expense of mask plate, method is easy, has both obviously practiced thrift material; Significantly reduced cost again, the customizing products that can satisfy short run simultaneously has a fling at demand and production demand.
Description of drawings
Fig. 1 is the synoptic diagram of known techniques sputter process;
Fig. 2 is the structural representation that the present invention is used for the magnetic control sputtering plating method of capacitance type touch control screen production;
Fig. 3 is the schema that the present invention is used for the magnetic control sputtering plating method of capacitance type touch control screen production.
The mark of each parts is following in the accompanying drawing: 1, target, 2, base material, 3, plasma body, 4, line deflector coil, 5, the row deflector coil, 6, electrode, 7, cavity, 8, the sputter space.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present invention is set forth in detail, thereby protection scope of the present invention is made more explicit defining so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that.
See also Fig. 2 and Fig. 3, the embodiment of the invention comprises:
A kind of magnetic control sputtering plating method that is used for capacitive touch screen production may further comprise the steps:
Provide one have a sputter space 8 cavity 7;
Make a base material 2 be located in the sputter space 8 of said cavity 7;
Make a target 1 be located in the sputter space 8 of said cavity 7, and be positioned at a side of said base material 2, on said target 1, connect an electrode 6;
One magnetic core logical circuit deflection coil is set under said target 1; Said magnetic core logical circuit deflection coil comprises line deflector coil 4 and row deflector coil 5; Line deflector coil 4 is connected with the sawtooth current that is provided by line-scan circuit (figure does not show); Be created in the magnetic field of linear change on the horizontal direction, make the target 1 that falls do horizontal direction scanning; Row deflector coil 5 is connected with the sawtooth current that is provided by column scan circuit (figure does not show), is created in the magnetic field of linear change on the vertical direction, makes the target 1 that falls make vertical scan direction; Electric current through the control magnetic deflection coil targetedly drops on the said base material 2 said target 1, thereby forms the ITO electro-conductive material figure of customer demand, need not to use the layered mask plate;
Make 8 inside, said sputter space be vacuum state, the vacuum tightness of said vacuum state remains on 1.3 * 10
-3Pa feeds plasma body 3 in said sputter space 8, wherein said plasma body 3 contains positively charged argon ion, the said target 1 of said plasma body 3 bombardments;
The atom of said target 1 is spilt, and around the path that said target 1 falls, receives the deflection of said magnetic core logical circuit deflection coil, thereby said target 1 targetedly is deposited on the said base material 2.
The path that the present invention falls through control target 1; The ITO electro-conductive material figure that can disposable sputter goes out customer demand; Reduced the expense of one deck mask plate at least, method is easy, has both obviously practiced thrift material; Significantly reduced cost again, the customizing products that can satisfy short run simultaneously has a fling at demand and production demand.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification sheets of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (5)
1. one kind is used for the magnetic control sputtering plating method that capacitive touch screen is produced, and it is characterized in that described method comprises:
Provide one to have sputter spatial cavity;
Make a base material be located in the sputter space of said cavity;
Make a target be located in the sputter space of said cavity, and be positioned at a side of said base material, on said target, connect an electrode;
One magnetic core logical circuit deflection coil is set under said target;
Make said sputter interior volume be vacuum state, and feed the said target of plasma bombardment;
The atom of said target is spilt, and receives the deflection of said magnetic core logical circuit deflection coil, targetedly is deposited on the said base material.
2. the magnetic control sputtering plating method that is used for capacitive touch screen production according to claim 1 is characterized in that said magnetic core logical circuit deflection coil comprises line deflector coil and row deflector coil.
3. the magnetic control sputtering plating method that is used for capacitive touch screen production according to claim 2 is characterized in that said line deflector coil is connected with the sawtooth current that is provided by a line-scan circuit, is created in the magnetic field of horizontal direction linear change.
4. the magnetic control sputtering plating method that is used for capacitive touch screen production according to claim 2 is characterized in that said row deflector coil is connected with the sawtooth current that is provided by a column scan circuit, is created in the linear magnetic field that changes of vertical direction.
5. the magnetic control sputtering plating method that is used for capacitive touch screen production according to claim 1 is characterized in that the vacuum tightness of said vacuum state remains on 1.3 * 10
-3Pa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210096164XA CN102605336A (en) | 2012-04-05 | 2012-04-05 | Magnetron sputtering method for capacitance touch control screen production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210096164XA CN102605336A (en) | 2012-04-05 | 2012-04-05 | Magnetron sputtering method for capacitance touch control screen production |
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| Publication Number | Publication Date |
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| CN102605336A true CN102605336A (en) | 2012-07-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210096164XA Pending CN102605336A (en) | 2012-04-05 | 2012-04-05 | Magnetron sputtering method for capacitance touch control screen production |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103823593A (en) * | 2014-02-27 | 2014-05-28 | 蓝思科技（长沙）有限公司 | Method for preparing cover glass with colorful window frame and application of cover glass |
-
2012
- 2012-04-05 CN CN201210096164XA patent/CN102605336A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103823593A (en) * | 2014-02-27 | 2014-05-28 | 蓝思科技（长沙）有限公司 | Method for preparing cover glass with colorful window frame and application of cover glass |
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| C06 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice |
Addressee: Jiangsu Zhaoyang Photoelectric Technology Co., Ltd. Document name: Notification of before Expiration of Request of Examination as to Substance |
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| DD01 | Delivery of document by public notice |
Addressee: Jiangsu Zhaoyang Photoelectric Technology Co., Ltd. Document name: Notification that Application Deemed to be Withdrawn |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120725 |