CN102586826A - Gold plating method and gold plating device for connector - Google Patents
Gold plating method and gold plating device for connector Download PDFInfo
- Publication number
- CN102586826A CN102586826A CN2011100091312A CN201110009131A CN102586826A CN 102586826 A CN102586826 A CN 102586826A CN 2011100091312 A CN2011100091312 A CN 2011100091312A CN 201110009131 A CN201110009131 A CN 201110009131A CN 102586826 A CN102586826 A CN 102586826A
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- gold
- electroplate liquid
- junctor
- absorbent module
- contact
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Abstract
The invention provides a gold plating method and a gold plating device for a connector. The gold plating device for the connector is used for carrying out gold plating processing on the connector, wherein the connector comprises a plurality of flanges; each flange comprises a contact point; the gold plating device for the connector comprises an electroplating bath, an anode plate, a power supply device, an adsorption assembly and an electroplating liquid providing device; the electroplating bath is used for containing electroplating liquid; the electroplating liquid contains a gold-containing compound; the anode plate is soaked in the electroplating liquid; one end of the power supply device is connected with the anode plate and the other end of the power supply device is connected with the connector; the connector is used as a cathode; the power supply device is used for providing a current; gold ions are dissociated from the gold-containing compound by the anode plate; the adsorption assembly is partly immersed into the electroplating bath, is used for adsorbing part of the gold ions and is contacted with the contact point; the electroplating liquid providing device is used for collecting part of the electroplating liquid; the electroplating liquid providing device comprises at least one spray nozzle; and the at least one spray nozzle is used for spraying part of the electroplating liquid to the adsorption assembly. According to the invention, the using cost of gold can be reduced.
Description
Technical field
The present invention relates to a kind of gold plating method and gold-plated device thereof of junctor, particularly a kind of only at the gold plating method and the gold-plated device thereof of the gold-plated junctor of the point of contact of junctor.
Background technology
Junctor (connector) is in order to linking together two or more electronic packages, or electronic package is connected to electricinstallation.For example unicircuit (IC or chip) is electrically connected to a printed substrate through junctor.But the effect that junctor also can provide repeated isolation and installing electronic package to be connected to another electronic package, when electronic package fault or palpus upgrading, user or operator only must pull down electronic package and change, and need not change whole electronic packages.
As shown in Figure 1; The one side of junctor 2a comprises a plurality of flanges (flange) 21a; Each flange comprises point of contact (tip) 211a; Contact generation by point of contact 211a with the metal gasket (figure does not show) of electronic package and electrically connect, the another side of junctor 2a then can electrically connect with another electronic package (figure does not show), uses making electronic package and another electronic package produce electric connection.Though the material of flange 21a has been selected metal (like stainless steel or copper etc.) for use, for fear of burning and higher conductive effectiveness is provided, can be gold-plated on flange 21a.The 211a yet the real functional region that electrically contacts with the electronic package generation of flange 21a only has point of contact; Non-functional zone beyond the point of contact 211a also can be gold-plated; This will cause cost to increase, and price of gold grows to even greater heights in recent years, and this manufacturing cost also can constantly rise.
The junctor made from the circuit card mode at present, its selectivity craft of gilding all need pass through technologies such as overlay film, exposure, development, gold-plated and striping, and be consuming time extremely long, and also gold-plated in the non-functional zone, causes the cost increase.
Therefore, be necessary to provide a kind of gold plating method and gold-plated device thereof of junctor, to improve above-mentioned existing problem.
Summary of the invention
Main purpose of the present invention is that a kind of gold plating method and gold-plated device thereof that reduces the junctor of gold-plated cost is being provided.
The gold-plated device of junctor of the present invention is used for a connector is carried out gold-plated processing; Wherein this junctor comprises a plurality of flanges; Each flange comprises a point of contact, and the gold-plated device of this junctor comprises a plating tank, a positive plate, an electric supply installation, an absorbent module and an electroplate liquid generator; This plating tank is in order to hold an electroplate liquid, and this electroplate liquid comprises a gold-containing compound; This positive plate is soaked in this plating tank; One end of this electric supply installation is connected with this positive plate, and the other end then is connected with this junctor, and wherein this junctor is as negative electrode, and this electric supply installation via this positive plate, makes this gold-containing compound dissociate gold ion in order to an electric current to be provided; This absorbent module partly immerses in this plating tank, contacts in order to this gold ion of absorbed portion and with this point of contact; This electroplate liquid generator is in order to collect this electroplate liquid of part, and this electroplate liquid generator comprises at least one nozzle, and this at least one nozzle is in order to be sprayed to this absorbent module with this electroplate liquid of part.
Absorbent module can be rotated by a drive device drives, and in the part absorbent module immersion plating groove, to absorb electroplate liquid, by the rotation of absorbent module, makes absorbent module all to be bedewed by electroplate liquid.Perhaps absorbent module also not driven device drive and rotate, part absorbent module immersion plating groove only, and part is bedewed by electroplate liquid.Again, absorbent module contacts in order to the ADSORPTION OF GOLD ion and with point of contact.
The electroplate liquid generator is in order to collect parcel plating liquid, and it is to pass through pipeline to extract the electroplate liquid in the plating tank by pump (pump).And the electroplate liquid generator comprises at least one nozzle, in order to parcel plating liquid is sprayed to the contact surface of absorbent module and flange point of contact.
The gold plating method of junctor of the present invention comprises the following steps: to provide an electroplate liquid; One absorbent module is provided; Make this absorbent module immerse this electroplate liquid so that this absorbent module ADSORPTION OF GOLD ion; The contact surface of the nozzles spray electroplate liquid of electroplate liquid generator to this absorbent module and point of contact; And mobile junctor is so that the point of contact contact absorbent module of junctor; Make gold ion on point of contact, be reduced to gold atom by this.
The present invention also provides a kind of gold plating method of junctor; Be used for the gold-plated processing of a connector, wherein this junctor comprises a plurality of flanges, and each flange comprises a point of contact; The gold plating method of this junctor comprises the following steps to provide an electroplate liquid, and wherein this electroplate liquid comprises gold ion; One absorbent module is provided, this absorbent module of part is immersed in this electroplate liquid, so that this absorbent module absorbed portion gold ion; One electroplate liquid generator is provided, and in order to collect this electroplate liquid of part, this electroplate liquid generator also comprises at least one nozzle, in order to this electroplate liquid of part is sprayed to this absorbent module; Move this junctor so that this this absorbent module of point of contact contact of this junctor; And make gold ion on this point of contact, be reduced to gold atom by this.
Gold ion after the present invention dissociates by absorbent module absorption, absorbent module contacts with point of contact again, gold ion is reducible be gold atom to point of contact, avoid gold to be plated to entire flange, can reduce golden use cost.
Description of drawings
Fig. 1 is the synoptic diagram about the junctor of prior art.
Fig. 2 is the side schematic view about an embodiment of the gold-plated device of junctor of the present invention.
Fig. 3 is the enlarged diagram of junctor, absorbent module and electroplate liquid generator joint about Fig. 2.
Fig. 4 is the synoptic diagram of the point of contact of the junctor produced about the present invention.
Fig. 5 is the flow chart of steps about an embodiment of the gold plating method of junctor of the present invention.
The primary clustering nomenclature:
Gold-plated device 1 nozzle 51 of junctor
Conductive through hole 22 flanges 21,21a
Electroplate liquid generator 50 pipelines 92
Embodiment
For let above-mentioned and other purposes of the present invention, feature and advantage can be more obviously understandable, the hereinafter spy enumerates preferred embodiment, and cooperates appended accompanying drawing, elaborates as follows.
Please refer to Fig. 2 and Fig. 3, about gold-plated schematic representation of apparatus according to the junctor of one embodiment of the invention.
As shown in Figure 2; The gold-plated device of junctor of the present invention is used for junctor 2 is carried out gold-plated processing; Wherein junctor comprises a plurality of flange 21, a plurality of conductive through hole 22 and conductive layer 23, and wherein each flange 21 comprises point of contact 211, and flange 21 electrically connects with conductive layer 23.It is noted that the material of flange 21 is a metal, such as copper, copper alloy, titanium, titanium alloy or stainless steel etc.Flange 21 slightly is bending, so flange 21 has supportive, but the present invention is not as limit.It is noted that the profile of flange 21 is not exceeded with shown in Figure 2; For instance, the profile of flange also can be the planchet shape, and its point of contact is the central point of planchet shape.
The gold-plated device 1 of junctor comprises plating tank 10, positive plate 20, electric supply installation 30, absorbent module 40, electroplate liquid generator 50 and drive unit 60.Plating tank 10 is in order to hold electroplate liquid 81, and electroplate liquid 81 comprises gold-containing compound; In one embodiment of this invention, electroplate liquid 81 comprises potassium auric cyanide (KAu (CN)
2) and additive such as gloss-imparting agent, but gold-containing compound does not exceed with potassium auric cyanide.Positive plate 20 is arranged in the plating tank, with the anode when electroplating.In one embodiment of this invention, positive plate 20 is a platinum titanium mesh, but the present invention is not as limit.One end of electric supply installation 30 is connected with positive plate 20, and the other end of electric supply installation 30 is connected with junctor 2, and wherein junctor 2 is as negative electrode, and electric supply installation 30 makes the gold-containing compound in the electroplate liquid 81 dissociate gold ion in order to electric current to be provided; In one embodiment of this invention, electric supply installation 30 is a RF.
In one embodiment of this invention, the material of absorbent module 40 is a cloth, every any cloth with adsorptive liquid function all can, but the present invention is not as limit.For instance, absorbent module 40 also can be metal organic synthesis thing.Drive unit 60 can drive absorbent module 40 and rotate, and in one embodiment of this invention, drive unit 60 is made up of roller, and absorbent module 40 is by the drive of drive unit 60, and part immersion plating groove 10 in regular turn contains the electroplate liquid 81 of gold ion with absorption.It is noted that because of absorbent module 40 parts continue to keep moisture state in the immersion plating groove 10, and electroplate liquid 81 has electroconductibility, so when electric supply installation 30 was supplied power, absorbent module 40 also can have the anodic effect.
When junctor 2 carries out need only point of contact 211 being contacted with absorbent module 40 when gold-plated, absorbent module 40 adsorbed gold ions can be reduced on gold atom to the point of contact 211, accomplish gold-plated processing.As shown in Figure 4; By the gold-plated device 1 of junctor of the present invention, can complicated originally selectivity craft of gilding be shortened to single craft of gilding, except that reducing man-hour; Also can be only gold-plated on point of contact 211; And need not be as in the prior art, must be gold-plated on full wafer flange 21, can significantly reduce manufacturing cost.It is noted that rotate though drive absorbent module 40 with drive unit 60 in one embodiment of this invention, the present invention is not as limit; The present invention also can make absorbent module 40 not rotate, and only moves junctor 2 and point of contact 211 is contacted with absorbent module 40.
Like Fig. 2 and shown in Figure 3; For fear of more when point of contact 211 quantity or when point of contact 211 areas are big; Cause absorbent module 40 adsorbed gold ion amounts can't evenly be plated on the point of contact 211 inadequately, so electroplate liquid generator 50 is arranged on the below of absorbent module 40 and point of contact 211 contact surfaces.Electroplate liquid generator 50 is in order to holding portion electroplate liquid 81, the electroplate liquid 81 in the electroplate liquid generator 50 can be via pipeline 92 through pump 91 by drawing in the plating tank 10.Electroplate liquid generator 50 comprises a plurality of nozzles 51; When carrying out gold-plated processing; Nozzle 51 can extract electroplate liquid 81 (for example also can draw through pump 91) and be sprayed to absorbent module 40, because of absorbent module 40 also has the anodic function, so the gold-containing compound of electroplate liquid 81 also can dissociate gold ion; Keep the gold ion concentration on the absorbent module 40 certain, guarantee gold-plated quality on each point of contact 211.It is noted that only do not exceed with shown in Figure 2 in the position that electroplate liquid generator 50 is provided with.
The present invention also provides a kind of gold plating method of junctor; Be used for the gold-plated processing of junctor; Be example promptly below, specify each step of the gold plating method of junctor of the present invention, but it is noted that with the gold-plated device 1 of Fig. 2 and junctor of the present invention shown in Figure 3; As long as can reach the object of the invention, method of the present invention is not exceeded with the gold-plated device 1 that is applied in Fig. 2 and junctor shown in Figure 3.
As shown in Figure 5, the present invention at first carries out step S71: electroplate liquid is provided.
As shown in Figure 2, in one embodiment of this invention, electroplate liquid 81 comprises gold-containing compound and gold ion, and electroplate liquid 81 is arranged in the plating tank 10, about the producing method of gold-containing compound and gold ion, in the foregoing description explanation, so repeat no more at this.
Then carry out step S72: absorbent module is provided.
In one embodiment of this invention, the material of absorbent module 40 is a cloth, but the present invention is not as limit.
Then carry out step S73: make absorbent module immersion plating liquid so that absorbent module absorption contains the electroplate liquid of gold ion.
As shown in Figure 2, in one embodiment of this invention, drive unit 60 can drive absorbent module 40 and rotate, and makes in absorbent module 40 rotations and the immersion plating groove 10, contains the electroplate liquid of gold ion with absorption.It is noted that drive unit 60 is not a necessary assembly of the present invention, absorbent module 40 also can not rotated, and keeps stationary state.
Then carry out step S74: the contact surface that sprays electroplate liquid to absorbent module and point of contact.
Wherein step S74 also comprises step S741 and step S742.
Step S741: the electroplate liquid generator is provided.
About the explanation of electroplate liquid generator 50, in the foregoing description explanation, so repeat no more at this.
Step S742: with the contact surface of nozzles spray parcel plating liquid to absorbent module and point of contact.
As shown in Figure 3; Step S742 sprays electroplate liquid 81 to absorbent module 40 with the nozzle 51 of electroplate liquid generator 50; The gold-containing compound of electroplate liquid 81 also can dissociate gold ion, keeps the gold ion concentration on the absorbent module 40 certain, guarantees quality gold-plated on the point of contact 211.
Carry out step S75 at last: move junctor so that the point of contact contact absorbent module of junctor.
In one embodiment of this invention, move junctor 2 so that the point of contact 211 of junctor 2 contacts with absorbent module 40, owing to absorbent module 40 can be considered anode, point of contact 211 is regarded as negative electrode, thus gold ion reducible be on gold atom to the point of contact 211.
To sum up institute is old, and no matter the present invention everywhere all shows it totally different in the characteristic of known technology with regard to purpose, means and effect, earnestly asks the inspector to perceive, and grants quasi patent early, makes Jiahui society, and the true feeling moral just.Only it should be noted that above-mentioned many embodiment give an example for the ease of explanation, the present invention's interest field required for protection should be as the criterion so that the scope of claims is said naturally, but not only limits to the foregoing description.
Claims (9)
1. the gold-plated device of a junctor is used for a connector is carried out gold-plated processing, and wherein this junctor comprises a plurality of flanges, and each flange comprises a point of contact, and the gold-plated device of this junctor comprises:
One plating tank, this plating tank is in order to hold an electroplate liquid, and this electroplate liquid comprises a gold-containing compound;
One positive plate, this positive plate are soaked in this electroplate liquid;
One electric supply installation, an end of this electric supply installation is connected with this positive plate, and the other end then is connected with this junctor, and wherein this junctor is as negative electrode, and this electric supply installation via this positive plate, makes this gold-containing compound dissociate gold ion in order to an electric current to be provided;
One absorbent module, this absorbent module partly immerse in this plating tank, contact in order to this gold ion of absorbed portion and with this point of contact; And
One electroplate liquid generator, this electroplate liquid generator is in order to collect this electroplate liquid of part, and this electroplate liquid generator comprises at least one nozzle, and this at least one nozzle is in order to be sprayed to this absorbent module with this electroplate liquid of part.
2. the gold-plated device of junctor as claimed in claim 1 also comprises a drive unit, uses so that this absorbent module is rotated.
3. the gold-plated device of junctor as claimed in claim 1 also comprises a pump and a pipeline, wherein this electroplate liquid of part in this electroplate liquid generator via this pipeline through this pump by drawing in this plating tank.
4. the gold-plated device of junctor as claimed in claim 1, wherein this absorbent module comprises cloth.
5. the gold plating method of a junctor is used for the gold-plated processing of a connector, and wherein this junctor comprises a plurality of flanges, and each flange comprises a point of contact, and the gold plating method of this junctor comprises the following steps:
One electroplate liquid is provided, and wherein this electroplate liquid comprises gold ion;
One absorbent module is provided, this absorbent module of part is immersed in this electroplate liquid, so that this absorbent module absorbed portion gold ion;
One electroplate liquid generator is provided, and in order to collect this electroplate liquid of part, this electroplate liquid generator also comprises at least one nozzle, in order to this electroplate liquid of part is sprayed to this absorbent module;
Move this junctor so that this this absorbent module of point of contact contact of this junctor; And
Make gold ion on this point of contact, be reduced to gold atom by this.
6. the gold plating method of junctor as claimed in claim 5 wherein makes the mode that this absorbent module immerses this electroplate liquid comprise this absorbent module of rotation.
7. the gold plating method of junctor as claimed in claim 5, wherein this absorbent module comprises cloth.
8. the gold plating method of junctor as claimed in claim 5, wherein this electroplate liquid places in the plating tank.
9. the gold plating method of junctor as claimed in claim 5, the step of wherein spraying part this electroplate liquid to this absorbent module also comprises the contact surface with this at least one nozzles spray part this electroplate liquid to this absorbent module and this point of contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100091312A CN102586826A (en) | 2011-01-17 | 2011-01-17 | Gold plating method and gold plating device for connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100091312A CN102586826A (en) | 2011-01-17 | 2011-01-17 | Gold plating method and gold plating device for connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102586826A true CN102586826A (en) | 2012-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100091312A Pending CN102586826A (en) | 2011-01-17 | 2011-01-17 | Gold plating method and gold plating device for connector |
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| Country | Link |
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| CN (1) | CN102586826A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114959848A (en) * | 2022-06-08 | 2022-08-30 | 苏州晶洲装备科技有限公司 | Horizontal electroplating device, horizontal electroplating method and application of photovoltaic cell |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3904489A (en) * | 1973-07-13 | 1975-09-09 | Auric Corp | Apparatus and method for continuous selective electroplating |
| JPS61295395A (en) * | 1985-06-21 | 1986-12-26 | Electroplating Eng Of Japan Co | Brush plating method for connector terminal |
| US4683045A (en) * | 1985-12-16 | 1987-07-28 | Electroplating Engineers Of Japan, Limited | Partial plating device |
| CN1667879A (en) * | 2004-03-09 | 2005-09-14 | 日商宽氏股份有限公司 | Electronic connector terminal, a method for plating, and a terminal stack |
| CN101403132A (en) * | 2007-11-08 | 2009-04-08 | 匡优新 | Ejection apparatus for electroplating assembly line |
-
2011
- 2011-01-17 CN CN2011100091312A patent/CN102586826A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3904489A (en) * | 1973-07-13 | 1975-09-09 | Auric Corp | Apparatus and method for continuous selective electroplating |
| JPS61295395A (en) * | 1985-06-21 | 1986-12-26 | Electroplating Eng Of Japan Co | Brush plating method for connector terminal |
| US4683045A (en) * | 1985-12-16 | 1987-07-28 | Electroplating Engineers Of Japan, Limited | Partial plating device |
| CN1667879A (en) * | 2004-03-09 | 2005-09-14 | 日商宽氏股份有限公司 | Electronic connector terminal, a method for plating, and a terminal stack |
| CN101403132A (en) * | 2007-11-08 | 2009-04-08 | 匡优新 | Ejection apparatus for electroplating assembly line |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114959848A (en) * | 2022-06-08 | 2022-08-30 | 苏州晶洲装备科技有限公司 | Horizontal electroplating device, horizontal electroplating method and application of photovoltaic cell |
| CN114959848B (en) * | 2022-06-08 | 2024-03-26 | 苏州晶洲装备科技有限公司 | Horizontal electroplating device, horizontal electroplating method and application of photovoltaic cell |
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Application publication date: 20120718 |