CN102576927B - 例如用于rfid应答器系统的天线结构 - Google Patents
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- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
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- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
本发明涉及一种用于远程RFID芯片(2)的天线结构,该天线结构包括:基板(3)、由所述基板(3)支承的导电材料(1)形成的天线(15)以及用于将天线(15)耦合至电路(2)的耦合装置(11a,11b)。根据本发明,天线(15)是磁偶极子,并且耦合装置(11a,11b)是由天线导体(1)的延伸部(11a,11b)来形成的。
Description
本发明涉及根据权利要求1的前序部分所述的天线结构。
本发明还涉及该天线结构的制造方法。
天线例如与远程识别电路一起使用。
迄今为止,UHFRFID应答器市场已被划分成便宜的标签和在金属平台上也能够应用的更昂贵的刚性标签。典型的刚性应答器大且昂贵,因而,仅能够应用在大且昂贵的物品上。某些小的刚性标签已经进入了市场,但是其性能比大的刚性标签明显要差。
在当今市场上,已经可利用某些小的可金属安装的RFID应答器。在本上下文中,可以将“小”定义为:应答器的占用面积(footprintarea)小于10cm2,并且最大尺寸小于波长的四分之一(在867MHz下为86mm)。通常,这些小标签的问题在于,使应答器的尺寸很小常常导致某些折衷。实际上,这些折衷缩小了读取范围,而读取范围是用于评价无源RFID系统的可靠性和性能的关键参数。
首先,通过尺寸限制降低了应答器的辐射效率。这基本上是不能完全克服的物理事实,只能利用例如最佳材料来最小化。但对于非常小的天线,与降低的辐射效率相比,微芯片与天线之间的很差的阻抗匹配通常引起读取范围的甚至更大一部分损失。通常,最佳操作所需的天线与微芯片之间的共轭阻抗耦合不能用非常小的天线和当前方法来实现。利用非常小的标签的最典型的方案是仅提供电抗耦合,这是部分方案。在具有天线的更复杂的无线电系统(诸如,移动设备和基站)的情况下,通常使用分立部件(电容器和电感器)或微带元件(microstripelement)来获得所需的该阻抗匹配。对于小的RFID标签,微带元件是一种太大的方式。分立部件应当足够小,但是使用分立部件毫无疑问是出于成本和加工性能的原因。
当今市场上存在的小的金属安装的应答器具有稍微折衷的性能。除了小天线的低辐射效率外,这些应答器的读取范围由于微芯片与天线之间很差的阻抗匹配而显著减小。
有若干不同类型的RFID应答器:无源RFID应答器、半无源(或电池辅助的无源)RFID应答器和有源RFID应答器、以及能够电感地、电容地或借助于射频辐射场来进行连接的RFID应答器。无源应答器由对准它们的RF场来生成它们所需的电能。在有源应答器和半无源应答器中,存在单独的电池或其他电源。电感连接的RFID和远程传感器系统通常在100kHz至125kHz或13.56MHz的频率下工作。
本发明的最优选实施例涉及能够使用射频辐射场读取的无源RFID应答器,但是天线类型在如下所有应用中都是有利的:要求天线具有长的读取距离和小尺寸,并且要求天线能够附接至某个基部,例如,货物或者封装件的表面。这样的表面通常是平坦的。最有利地适于本发明的频率是869MHz和2.45GHz。
RFID应答器是一种包括天线和具有存储器的微电路的小型设备,当微电路接收到来自读取设备的传输命令并且读取设备利用无线电信号来照射微电路时,微电路通过反向散射来传输其存储器的内容。无源RFID应答器中没有电池,而是无源RFID应答器根据向其发送的无线电信号来提取其需要的工作功率。应答器与读取设备之间的功率和信息的传输可以借助于磁场、电场或辐射的无线电信号而进行。在很多应答器应用中,阅读器与应答器之间的距离很长(甚至达到若干米)是很重要的。
本发明旨在至少消除现有技术中的一些缺陷,以产生全新类型的天线和用于制造该天线的方法。
本发明涉及实现尤其用于远程操作的高性能、小型且低成本的全平台应答器的技术方案。
本发明基于使用磁偶极子作为远程RFID应答器中的天线(发射器)。在本发明的有利方案中,通过天线的集成部分、通过电容式阻抗变换器形成从发射器到微芯片的共轭阻抗匹配。小的磁偶极子(环形)天线的馈电阻抗的电阻部分非常低。这种类型的天线的电抗是正的,并且与电阻相比,该电抗非常高。另一方面,微芯片的阻抗是电容式的,并且实部大于非匹配环形天线中的阻抗的实部。这使得能够通过使用电容式阻抗变换器来实现磁偶极子天线与微芯片之间的极好的共轭阻抗匹配。新的制造天线的方法提供了将该电容式变换器并且因而将极好的阻抗匹配作为天线的一部分,而无需任何外部元件。
在以下文献中描述了其他现有技术:
US2009/0096696描述了一种具有经修改的偶极天线的RFID。
US2006/0208900描述了一种RFID天线。
US6,456,243,其中提出了多频磁性偶极天线结构以及重新使用天线的体积的方法。
US2009/0085750描述了一种扩展式RFID标签。
EP1818861描述了一种RFID标签制造方法和RFID标签。
JP2003249814描述了具有用于非接触式射频标识的调谐电容器的环形天线。
US2009/0002253描述了一种用于非接触式数据载体的多用途天线配置。
本发明涉及全平台UHFRFID应答器(或标签),该应答器的尺寸很小,但是仍然提供很长的读取范围。本发明还包括实现应答器的低成本且高可靠性的制造过程的方案。很好的性能和平台容限(tolerance)是建立在将磁偶极子用作发射器并且甚至更重要地提供天线与微芯片之间的共轭阻抗匹配的基础上的。这在使用小型应答器的情况下通常是很困难的。通过新的实现阻抗变换器的方式来实现阻抗匹配。这是用标准处理和廉价且普通的材料来实现的。
更具体地,根据本发明的天线结构的特征在于权利要求1的特征部分中所述的内容。
根据本发明的方法的特征还在于权利要求8的特征部分中所述的内容。
借助于本发明获得了相当多的优点。
可以通过本发明来实现长的读取范围、小尺寸、平台容限和低成本。
可以用如下应答器来对例如大量的金属物加标签,该应答器与现有应答器相比在具有相应的读取范围的情况下更小且更便宜。
因此,天线类型不受其所附接的表面的影响。此外,根据本发明实施例的天线类型对于制造而言是经济的。另外,传感器结构也可以很容易且以低成本与例如RFID电子设备组合。
下面,将根据附图、借助于实施方式的示例解释本发明。
图1示出了根据本发明的一种天线结构的透视图。
图2示出了根据本发明的一种天线结构的截面侧视图。
图3示意性地示出了根据本发明的应答器的等同电路。
图4示出了根据本发明的另一种天线结构的透视图。
图5示出了根据本发明的另一种天线结构的俯视图。
图6a用俯视图更详细地示出了图4的一个可能实施例。
图6b用俯视图示出了图4的一个优选实施例。
在根据本发明的小型应答器中,基本构思是在没有昂贵的分立部件的情况下进行阻抗匹配。进行阻抗匹配所需的电容器是由天线结构的金属层和介电层形成的,从而将这些电容器集成为应答器的一部分,而不使用昂贵的附加元件。在这种类型的集成电容器的情况下,可以获得非常高的Q值,这是因为它们的面积与表面安装部件相比很大,并且接触电阻是可忽略的。本发明还包括将微芯片、集成电容器和天线本身进行结合的新的原理,这保持该结构仍简单且容易处理。标签可以例如通过在一片塑料周围卷绕柔性镶嵌物来制成。也可以使用印刷电路板技术来进行制造。在使用印刷电路板技术来进行制造的情况下,仅需要在标签的端部处穿过整个板的两个通孔。不需要任何特殊的材料,诸如,具有高介电常数的材料(有时用于小型应答器)。然而,诸如PE或PP的便宜塑料是用于应答器的非常好的基材。具有金属图案和微芯片的柔性镶嵌物可以使用廉价的标准卷对卷处理来制成,卷对卷处理由于其用于制造标签应答器的用途而存在。使用集成的分立电容来调节微芯片的阻抗的自由允许我们使用磁偶极子作为发射器,同时仍然能够获得微芯片的适当阻抗。学术上为磁偶极子的垂直磁环是一种非常有效的小型发射器。不同于电偶极子,该垂直磁环不受近场干扰的影响。因此,可以容易地将应答器制成为平台容忍的,从而允许也在金属表面上使用应答器,金属表面对于RFID应答器而言是最具挑战性的安装平台。磁偶极子仅有的大问题(馈电阻抗对于微芯片而言太低)现在可以通过由集成的电容器形成的阻抗变换器来克服。形成用于阻抗变换器的电容器的方法使得能够容易地改变电容值,并且因而使各种阻抗匹配。因此,可以基于例如特定应用的需要来自由地选择天线本身的尺寸。
非常小的应答器尤其在具有很高的内部Q值的情况下的一个普遍问题是天线的带宽很窄。这对制造过程的容限提出了具有挑战性的要求,因为尺寸的小变化可能导致读取范围很大程度地减小。根据本发明的应答器还包括对这个问题的解决方案。由于这种类型的处理中的典型制造误差是金属层之间的未对准,所以电容器被制成不对称的,使得尽管这些层相对于彼此未对准,但它们的截面面积不会变化。
下面,图1中绘出了应答器的结构。图1是具有通过弯曲天线导体来制造的应答器的实际功能原型的透明中间层的结构的透视图,天线导体在这种情况下是在塑料砖形式的基板3周围的箔镶嵌物1。图2示出了通过弯曲所制造的应答器的侧视图。应答器10包括包含薄塑料载体箔5上的金属图案的镶嵌物1和微芯片2。该薄且柔性的镶嵌物1卷绕在塑料砖3周围,以形成天线结构15和阻抗变换电容器11a和11b。阻抗变换电容器11a和11b是由在点4a和4b的区域中与自身重叠的镶嵌物1形成的。参照以上描述,本发明的一个构思是使得每个连接电容器的上电极和下电极不对称,以使得一个电极(通常为嵌入的电极)较大,而另一个较小的电极制造在较大电极的区域上。通过这种方式,较小的电极限定了电容器的电容值。通过选择较小电极以使其面积能够易于精确地制造或者之后精确地调整,可以实现微芯片2与天线15之间的非常好的耦合。换言之,电容器的电极对11a和11b是由具有不同面积的电极形成的。在附图中,镶嵌物的重叠部分之间具有可选的薄塑料片5。可以选择镶嵌物的塑料载体的材料以及尺寸,使得将不需要该附加部分。图3示出了该结构的等同电路。由于小型磁环发射器是电感式的,因此其由天线电感La与天线电阻Ra的串联连接来表示。集成的电容器Cp(并联电容)等同于图2的11b,以及Cs(串联电容)等同于11a。
替选地,根据图5,耦合电极11a和11b可以以具有长且窄的弯曲的电极间隙30的并联指状电极的形式形成在相同的平面上。电容器11a和11b的值可以根据间隙30的长度和宽度来调节。
图4示出了通过印刷电路板(PCB)技术制造的类似结构。通过使用这种技术,应答器包含具有如下三个金属层的天线导体1以形成天线结构15以及阻抗变换电容器11a和11b:接地层13、中间层14和顶层16。这些层通过通孔12彼此连接。这也是实际原型的截面图。两个应答器原型(图1和图4)的尺寸是50mm*10mm*3mm,但该技术还实现了更小的应答器。使用这种技术以及廉价的标准材料所设计的最小原型的尺寸是9mm*9mm*3mm。
本发明实现了各种尺寸和形状因子的应答器。尺寸和形状因子可以根据客户的需求以及基于应用的需求来确定。已设计从50*10*3mm3降至最小9*9*3mm3的原型(尺寸以mm为单位)。
图6a中呈现了通过本发明的一个优选实施例解决的问题。在图6a中,导电顶层16与导电中间层14未对准,因此,未获得电容器11b的设计值,但电容器11b的电容小于设计值。
在图6b中,通过使导电中间层14在电容器11b的区域的中间形成得较小来解决这个对准问题。换言之,在正常的制造过程中,使得两个电极中的一个电极较小,而且处于与较大的电极完全重叠的位置。通过这种方式,顶层16的很小的未对准不影响电容器11b的电容值。相应地,在电容器11b的区域中,可以使得顶层16较小,同时保持中间层14大于顶层。
基于PCB处理的制造所需的所有技术都容易获得,并且已解决与制造有关的主要问题。还没有任何商业伙伴实施通过弯曲来实现的替选制造方法。
本发明旨在针对远程RFID应答器,远程RFID应答器是指读取范围能够超过1米的应答器。
在本发明的一种具体方案中,对于867MHz应答器,结构的尺寸如下:
环形面积(环的横截面):50mm*3mm
电容器11a的间隙:0.2mm
电容器11b的间隙:0.2mm
电容器11a的有效面积:5mm2
电容器11b的有效面积:6mm2
在具有这些参数的原型的情况下,已经测量出4m的读取范围(使用NXPUcodeG2XM微芯片)。
Claims (15)
1.一种用于远程射频识别RFID芯片(2)的天线结构,所述天线结构包括:
·基板(3),
·由所述基板(3)支承的导电材料形成的天线(15),以及
·用于将所述天线(15)耦合至所述RFID芯片(2)的耦合装置(11a,11b),
其特征在于,
·所述天线(15)是磁偶极子,以及
·所述耦合装置(11a,11b)是由所述天线(15)的天线导体(1)的重叠或平行延伸部形成的,其中,在所述耦合装置中形成有与所述RFID芯片(2)的并联电容和串联电容。
2.根据权利要求1所述的天线结构,其特征在于,所述天线结构包括所述RFID芯片(2)。
3.根据权利要求1所述的天线结构,其特征在于,所述耦合装置(11a,11b)是通过具有不同但完全重叠的面积的电极对、由所述天线导体(1)的重叠延伸部形成的,由此较小的面积限定所述耦合装置(11a,11b)的电容值。
4.根据权利要求1至3中任一项所述的天线结构,其特征在于,所述天线(15)和所述耦合装置(11a,11b)是通过在基板(3)周围卷绕所述天线导体(1)来形成的。
5.根据权利要求1至3中任一项所述的天线结构,其特征在于,所述天线(15)和所述耦合装置(11a,11b)是通过印刷电路板技术来形成的。
6.根据权利要求5所述的天线结构,其特征在于,通孔(12)用于形成所述天线(15)。
7.根据权利要求1至3中任一项所述的天线结构,其特征在于,所述RFID芯片(2)与所述天线(15)之间的共轭阻抗匹配是通过使用集成在所述天线(15)中的电容式阻抗变换器来实现的。
8.一种用于形成用于远程射频识别RFID芯片(2)的天线结构的方法,所述方法包括以下步骤:
·在基板(3)上由导电材料形成天线(15),以及
·形成用于将所述天线(15)耦合至所述RFID芯片(2)的耦合装置(11a,11b),
其特征在于,
·将所述天线(15)形成为磁偶极子,以及
·将所述耦合装置(11a,11b)形成为所述天线(15)的天线导体(1)的重叠或平行延伸部,其中,在所述耦合装置中形成有与所述RFID芯片(2)的并联电容和串联电容。
9.根据权利要求8所述的方法,其特征在于,将所述RFID芯片(2)连接至所述耦合装置(11a,11b)。
10.根据权利要求8或9所述的方法,其特征在于,通过具有不同但完全重叠的面积的电极对、由所述天线导体(1)的重叠延伸部来形成所述耦合装置(11a,11b),由此较小的面积限定所述耦合装置(11a,11b)的电容值。
11.根据权利要求8或9所述的方法,其特征在于,通过在基板(3)周围卷绕所述天线导体(1)来形成所述天线(15)和所述耦合装置(11a,11b)。
12.根据权利要求8或9所述的方法,其特征在于,通过印刷电路板技术来形成所述天线(15)和所述耦合装置(11a,11b)。
13.根据权利要求12所述的方法,其特征在于,使用通孔(12)来形成所述天线(15)。
14.根据权利要求8或9所述的方法,其特征在于,通过使用集成在所述天线(15)中的电容式阻抗变换器来实现所述RFID芯片(2)与所述天线(15)之间的共轭阻抗匹配。
15.一种权利要求1中所限定的天线在平台上的用途,所述用途使得由所述天线(15)引起的磁场被布置成与所述平台平行,以使所述平台的材料的影响最小化。
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CN102576927A (zh) | 2012-07-11 |
US9082058B2 (en) | 2015-07-14 |
FI20095965A0 (fi) | 2009-09-18 |
KR101657157B1 (ko) | 2016-09-19 |
US20150311578A1 (en) | 2015-10-29 |
EP2478586A4 (en) | 2014-03-12 |
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