CN102569592B - LED packaging method, LED and LED illuminator - Google Patents
LED packaging method, LED and LED illuminator Download PDFInfo
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- CN102569592B CN102569592B CN201010585661.7A CN201010585661A CN102569592B CN 102569592 B CN102569592 B CN 102569592B CN 201010585661 A CN201010585661 A CN 201010585661A CN 102569592 B CN102569592 B CN 102569592B
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Abstract
The invention applies to the field of illumination, providing an LED packaging method, an LED and an LED illuminator. The LED packaging method comprises the steps of: performing die bonding and wire welding for the LED chips in a same waveband to prepare a batch of LED semi-products; blending fluorescent glue to make the lighting color of the LED semi-products coated by the fluorescent glue same with the color of a sample plate color area from artificial vision; coating the fluorescent glue on the batch of LED semi-products and solidifying the fluorescent glue to prepare a batch of LEDs; and splitting light and color of the LEDs and determining an color area with a color that is same with that of the sample plate color area from artificial vision. According to the embodiment of the invention, in the process of LED packaging, the fluorescent glue is appropriately blended so as to make the lighting color of the LED semi-products coated by the fluorescent glue same with the color of the sample plate color area from artificial vision to split the light and color of the batch of LEDs and determine the color area with a color that is same with that of the sample plate color area from artificial vision, therefor, for the batches before and next, LED chips in different wavebands can be adopted to prepare the LEDs with consistent lighting color.
Description
Technical field
The invention belongs to lighting field, particularly relate to a kind of LED encapsulation method, LED and LED light device.
Background technology
Recent years, along with the development of society, LED illumination industry is advanced by leaps and bounds, and the demand of market to LED light source increases.The disposable supply of material of supplier cannot meet those to the glow color coherence request of LED light source comparatively strict and customers that consumption is large.If be divided into twice or repeatedly supply and the consistency of the glow color of batch LED light source before and after can not ensureing, cause the production of this kind of customers to stay cool, bring huge obstruction indirectly to the development of LED illumination industry.
Although traditional handicraft makes the LED finished product of the LED chip encapsulation of front and back batch different-waveband when color-division and model light source falls into district of the same colour, but there is larger difference in the glow color of glow color and model light source, this great problem faced for current LED illumination industry.
Summary of the invention
The object of the embodiment of the present invention is to provide a kind of LED encapsulation method, though the LED being intended to the LED chip encapsulation of batch different-waveband before and after solving falls into district of the same colour with model light source when color-division, there is the problem of larger difference in the glow color of glow color and model light source.
The embodiment of the present invention is achieved in that a kind of LED encapsulation method, comprises the following steps:
The LED chip die bond of the same band is wired in support, obtained a collection of LED semi-finished product;
Allotment fluorescent glue, makes the color in the half-finished glow color of LED and the model look district be coated with through described fluorescent glue upper consistent in artificial vision;
Described fluorescent glue is coated this batch of LED semi-finished product, solidify described fluorescent glue, obtained a collection of LED;
To this batch of LED color-division, and determine the look district consistent with the color in described model look district by artificial vision.
Another object of the embodiment of the present invention is to provide a kind of LED, and described LED adopts above-mentioned method for packing to obtain.
Another object of the embodiment of the present invention is to provide a kind of LED light device, and described LED light device has above-mentioned LED.
The embodiment of the present invention is suitably allocated fluorescent glue in the process of LED, make the color in the half-finished glow color of LED and the model look district be coated with through this fluorescent glue upper consistent in artificial vision, to obtained a collection of LED color-division, and determine the look district consistent with the color in model look district by artificial vision, front and back batch can adopt the LED chip of different-waveband to make the consistent LED of glow color.
Accompanying drawing explanation
Fig. 1 is the flow chart of the LED encapsulation method that the embodiment of the present invention provides;
Fig. 2 is the structural representation of the LED that the embodiment of the present invention provides;
Fig. 3 is the spectral distribution graph of model light source;
Fig. 4 is distinguished as consistent spectral distribution graph with model light source colour after a collection of LED color-division on artificial vision;
Fig. 5 is the spectral distribution graph of impregnation sample;
Target practice figure when Fig. 6 is a collection of LED color-division on chromatic diagram CIE1931;
Target practice figure when Fig. 7 is another batch of LED color-division on chromatic diagram CIE1931;
Fig. 8 is the target practice conjunction figure of Fig. 6 and Fig. 7;
Fig. 9 is the flow chart of color comparison after many batches of LED color-divisions.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The embodiment of the present invention is suitably allocated fluorescent glue in the process of LED, make the color in the half-finished glow color of LED and the model look district be coated with through this fluorescent glue upper consistent in artificial vision, to obtained a collection of LED color-division, and determine the look district consistent with the color in model look district by artificial vision, front and back batch can adopt the LED chip of different-waveband to make the consistent LED of glow color.
The LED encapsulation method that the embodiment of the present invention provides comprises the following steps:
The LED chip die bond of the same band is wired in support, obtained a collection of LED semi-finished product;
Allotment fluorescent glue, makes the color in the half-finished glow color of LED and the model look district be coated with through described fluorescent glue upper consistent in artificial vision;
Described fluorescent glue is coated this batch of LED semi-finished product, solidify described fluorescent glue, obtained a collection of LED;
To this batch of LED color-division, and determine the look district consistent with the color in described model look district by artificial vision.
The LED that the embodiment of the present invention provides adopts above-mentioned method for packing to obtain.
The LED light device that the embodiment of the present invention provides has above-mentioned LED.
For positive white light LEDs, realization of the present invention is described in detail below.
Fig. 1 shows the realization flow of the LED encapsulation method that the embodiment of the present invention provides, and details are as follows.
In step S101, the LED chip die bond of the same band is wired in support, obtained a collection of LED semi-finished product;
The LED chip that the embodiment of the present invention adopts is the blue-light LED chip of arbitrary wave band in 440nm ~ 465nm, if dominant wavelength is the blue-light LED chip of 442.5 ~ 445nm, 452.5 ~ 455nm or 462.5 ~ 465nm.Usually, the width of each wave band is 2.5nm.
First, the blue-light LED chip 1 of one or two the same band is fixedly arranged in support 2 by insulating cement or elargol; Secondly, between the positive and negative electrode of this blue-light LED chip 1 and the positive and negative electrode of support 2, weld gold thread 3, apply suitable voltage in support pin 4 two ends, blue-light LED chip 1 just can be luminous.As shown in Figure 2, support 2 is concave shaped support.
In step s 102, allotment fluorescent glue, makes the color in the half-finished glow color of LED and the model look district be coated with through this fluorescent glue upper consistent in artificial vision;
In the embodiment of the present invention, a corresponding model light source in model look district, and a model light source is by the upper consistent LED sample composition of multiple (being generally 5 ~ 10) glow color artificial vision, the glow color of glow color needed for user of this LED sample.
First, according to the wave band of above-mentioned blue-light LED chip and the predetermined model light source of user or model look district, prewired a kind of fluorescent glue.The proportioning of this fluorescent glue is roughly determined by the wave band of blue-light LED chip and model light source or model look district.
Such as, existing two batches of blue-light LED chips, its wave band is respectively 442.5 ~ 445nm and 452.5-455nm.And the predetermined model look district of user is look district 1-4F1 (1-4F1 is the title in model look district, a fritter special color domain space on CIE1931 chromatic diagram), this model look district is the look district at positive white light place.Thus the glow color of made white light LEDs need be upper consistent in artificial vision with the color of model look district 1-4F1.
From Fig. 3 and Fig. 4, the glow color of the LED that the LED chip of different-waveband is made is distinguished as unanimously on artificial vision, but its spectral distribution is different.
Usually, fluorescent glue is formed by glue, the first fluorescent material, the second fluorescent material and the 3rd fluorescent material Homogeneous phase mixing, and the mass percent of each component is 1: 0.0001 ~ 0.4: 0.0001 ~ 0.4: 0.0001 ~ 0.4.The model look district of made white light LEDs is 1-4F1, and the fluorescent glue proportioning of mating with the blue-light LED chip that wave band is 442.5 ~ 445nm is as follows:
Then, the fluorescent glue of this proportioning is coated LED semi-finished product, make impregnation sample, each made impregnation sample is 8 ~ 10.
Then, light impregnation sample, tested the colour temperature of this impregnation sample by spectrum test analyzer, according to complementary colors principle, if the colour temperature of impregnation sample is higher, add yellow fluorescent powder, if the colour temperature of impregnation sample is on the low side, reduce yellow fluorescent powder.As shown in Figure 5, the colour temperature of impregnation sample is higher, known fluorescent glue lacks yellow fluorescent powder, in the fluorescent glue prepared in advance, repeatedly add yellow fluorescent powder on a small quantity, until the colour temperature of impregnation sample is in the reference color temperature (CCT:5000K-8000K) of positive white light.
The embodiment of the present invention is by the glow color of artificial vision's comparison impregnation sample and model light source, after the colour temperature of impregnation sample mixes up, if the glow color of the glow color of impregnation sample and model light source visually there are differences in work, then fine tuning is carried out to the proportioning of fluorescent glue, until the glow color of impregnation sample is upper consistent in artificial vision with the glow color of model light source.
Finally, determine that the model look district of made white light LEDs is 1-4F1, and the fluorescent glue proportioning of mating with the blue-light LED chip that wave band is 442.5 ~ 445nm is as follows:
Similarly, can determine that the model look district of made white light LEDs is 1-4F1, and the fluorescent glue proportioning of mating with the blue-light LED chip that wave band is 452.5 ~ 455nm is as follows:
As shown in Figure 6, when adopting the white light LEDs color-division made by small size blue-light LED chip (square piece) that wave band is 442.5-445nm, (the X1:0.308 of its chromaticity coordinates on CIE1931 chromatic diagram; Y1:0.33) near.
And during the white light LEDs color-division made by small size blue-light LED chip (square piece) adopting wave band to be 452.5-455nm, (the X2:0.301 of its chromaticity coordinates on CIE1931 chromatic diagram; Y2:0.323) near, as shown in Figure 7.
As shown in Figure 8, the white light LEDs made by LED chip of above-mentioned two wave bands is when color-division, and its chromaticity coordinates is respectively with (X1=0.308; And (X2=0.301 Y1=0.33); Y2=0.323) ovalize distribution is put centered by; Show the solid colour of the white light LEDs made by LED chip of different-waveband, but the chromaticity coordinate of LED is different.
In step s 103, fluorescent glue is coated this batch of LED semi-finished product, solidify this fluorescent glue, obtained a collection of LED;
The embodiment of the present invention will determine that the fluorescent glue of proportioning coats the LED semi-finished product of respective batch, through baking, fluorescent glue is solidified, thus the LED of obtained respective batch.
In a glue process, artificial vision's comparison is carried out to the glow color of LED, and then control point glue amount, make the glow color of LED fall into model look district as much as possible.
In step S104, to this batch of LED color-division, and determine the look district consistent with the color in model look district by artificial vision.
The LED color-division of same batch is multiple look districts by light splitting machine by the embodiment of the present invention, the glow color fallen into the LED in district of the same colour is consistent, then determines the look district identical or corresponding with model look district by artificial vision's comparison.
Such as, adopt wave band to be fall into the glow color of the LED of look district 1-4F1 with the color of model look district 1-4F1 when artificial vision goes up consistent after the white light LEDs color-division made of the blue-light LED chip of 442.5-445nm, then the direct title 1-4F1 by model look district gives this crowd of LED color-division Shi Se district 1-4F1.
And adopt wave band to be that the color of the glow color and model look district 1-4F1 falling into the LED of look district 1-4F1 after the white light LEDs color-division made of the blue-light LED chip of 452.5-455nm there are differences on artificial vision.By artificial vision's comparison, find that the glow color falling into the white light LEDs of look district 2-3E3 is consistent with the color of model look district 1-4F1, then give this crowd of LED color-division Shi Se district 2-3E3 by the title 1-4F1 in this model look district.Such front and back batch can adopt the LED chip of different-waveband to obtain the consistent white light LEDs of glow color.
As shown in Figure 9, during color-division, first batch of LED (adopting A band LED chip) is divided into a, b, c isochrome district, second batch of LED (adopting B wave band LED chip) is divided into d, e, f isochrome district, and the 3rd batch of LED (adopting C-band LED chip) is divided into g, h, i isochrome district.By artificial vision's comparison, first batch of look district is the glow color of the LED of a and the solid colour of model look district u, and the LED called after look district u being a by first batch of look district puts in storage; Second batch of look district is the glow color of the LED of e and the solid colour of model look district u, and the LED called after look district u being e by second batch of look district puts in storage; The rest may be inferred, and the LED called after look district u being g by the 3rd batch of look district puts in storage.Thus obtain a large amount of LEDs consistent with the color of model look district u, and the consistency of front and back batch glow color is good.Thus the glow color adopting the blue-light LED chip of different-waveband (the arbitrary wave band of 440 ~ 465nm) to make white light LEDs can be compared, with the white light LEDs that batch glow color before and after making is consistent, in order to meet those to the glow color coherence request of LED the comparatively strict and user that consumption is large.
Be to be understood that, this method for packing also can be used for the encapsulation of blue white light LEDs (CCT:8000K-35000K), yellow white light LEDs (CCT:3600K-4500K) or warm white LED (CCT:2500K-3500K), even the LED of other color (as pink).
The embodiment of the present invention is suitably allocated fluorescent glue in the process of LED, make the color in the half-finished glow color of LED and the model look district be coated with through this fluorescent glue upper consistent in artificial vision, to obtained a collection of LED color-division, and determine the look district consistent with the color in model look district by artificial vision, front and back batch can adopt the LED chip of different-waveband to make the consistent LED of glow color.The color that the white light LEDs adopting this method for packing to make can select the blue-light LED chip of broadband (440nm ~ 465nm) to solve between LED different batches cannot ensure consistent problem, in order to meet those to LED glow color coherence request the comparatively strict and user that consumption is large.For fear of the bottleneck of existing light splitting technology, the embodiment of the present invention fundamentally solves the color inconsistence problems between batch white light LEDs of made front and back.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. a LED encapsulation method, is characterized in that, described method for packing comprises the following steps:
S101: the LED chip die bond of the same band is wired in support, obtained a collection of LED semi-finished product;
S102: allotment fluorescent glue, make the color in the half-finished glow color of LED and the model look district be coated with through described fluorescent glue upper consistent in artificial vision, this step is specially:
According to the wave band of described LED chip and the predetermined model light source of user or model look district, prewired fluorescent glue;
Prewired fluorescent glue is coated LED semi-finished product, makes impregnation sample;
Light described impregnation sample, if the glow color of the glow color of described impregnation sample and described model light source there are differences on artificial vision, then fine tuning is carried out to the proportioning of described fluorescent glue, until the glow color of described impregnation sample is upper consistent in artificial vision with the glow color of described model light source;
S103: described fluorescent glue is coated this batch of LED semi-finished product, solidify described fluorescent glue, obtained a collection of LED;
S104: to this batch of LED color-division obtained in S103 step, and determine the look district consistent with the color in described model look district by artificial vision.
2. LED encapsulation method as claimed in claim 1, it is characterized in that, described LED is white light LEDs, and the LED chip of described the same band is the blue-light LED chip of arbitrary wave band in 440nm ~ 465nm; Described fluorescent glue is formed by glue, the first fluorescent material, the second fluorescent material and the 3rd fluorescent material Homogeneous phase mixing, and the mass percent of each component is 1:0.0001 ~ 0.4:0.0001 ~ 0.4:0.0001 ~ 0.4.
3. LED encapsulation method as claimed in claim 1, it is characterized in that, described model look district is corresponding with model light source, and the upper consistent LED sample of multiple glow color artificial vision falls into same model look district.
4. LED encapsulation method as claimed in claim 3, is characterized in that, described prewired fluorescent glue is coated LED semi-finished product, further comprising the steps of after making the step of impregnation sample:
Tested the colour temperature of described impregnation sample by spectrum test analyzer, according to complementary colors principle, the fluorescent material of the corresponding complementary color spectral wavelength of selective exitation, carries out coarse adjustment to prewired fluorescent glue, and the colour temperature of described impregnation sample is in required reference color temperature.
5. the LED encapsulation method as described in claim 1 or 3, is characterized in that, this batch of LED color-division is multiple look districts, the glow color fallen into the LED in district of the same colour is consistent, determines the look district identical or corresponding with described model look district by artificial vision's comparison.
6. LED encapsulation method as claimed in claim 5, is characterized in that, describedly determines that the concrete steps in the look district identical or corresponding with described model look district are by artificial vision's comparison:
Light the LED falling into assorted district in described model light source and this batch, and cover the exiting surface of described model light source and LED by blank sheet of paper;
Differentiate the LED consistent with the glow color of described model light source by artificial vision, give look district corresponding in this LED by the title in the model look district corresponding to described model light source.
7. LED encapsulation method as claimed in claim 2, is characterized in that, described first fluorescent material is yellow green fluorescence powder partially, and described second fluorescent material is yellow fluorescent powder, and described 3rd fluorescent material is orange fluorescent powder.
8. a LED, is characterized in that, described LED adopts the method for packing according to any one of claim 1 ~ 7 to obtain.
9. a LED light device, is characterized in that, described LED light device has LED according to claim 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010585661.7A CN102569592B (en) | 2010-12-13 | 2010-12-13 | LED packaging method, LED and LED illuminator |
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| CN201010585661.7A CN102569592B (en) | 2010-12-13 | 2010-12-13 | LED packaging method, LED and LED illuminator |
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| CN102569592A CN102569592A (en) | 2012-07-11 |
| CN102569592B true CN102569592B (en) | 2015-05-27 |
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| CN107579060A (en) * | 2017-09-13 | 2018-01-12 | 深圳市未林森科技有限公司 | A kind of integrated dual-colored LED lamp and its manufacture method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1466228A (en) * | 2002-07-03 | 2004-01-07 | 诠兴开发科技股份有限公司 | Package structure for composite LED and method thereof |
| CN101436625A (en) * | 2007-11-13 | 2009-05-20 | 宁波安迪光电科技有限公司 | Packaging method for white light LED |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI309480B (en) * | 2006-07-24 | 2009-05-01 | Everlight Electronics Co Ltd | Led packaging structure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1466228A (en) * | 2002-07-03 | 2004-01-07 | 诠兴开发科技股份有限公司 | Package structure for composite LED and method thereof |
| CN101436625A (en) * | 2007-11-13 | 2009-05-20 | 宁波安迪光电科技有限公司 | Packaging method for white light LED |
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Address after: 518000 Guangdong province Shenzhen Pingshan New District Industrial Zone poly Longshan Road No. 3 Patentee after: Shenzhen rectangular group Limited by Share Ltd Address before: 518000 Guangdong province Shenzhen Pingshan New District Industrial Zone poly Longshan Road No. 3 Patentee before: Shenzhen ChangFang Semiconductor Light Co., Ltd. |
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