CN102569539A - Design method of special LED (Light-Emitting Diode) radiating device - Google Patents
Design method of special LED (Light-Emitting Diode) radiating device Download PDFInfo
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- CN102569539A CN102569539A CN2010106039878A CN201010603987A CN102569539A CN 102569539 A CN102569539 A CN 102569539A CN 2010106039878 A CN2010106039878 A CN 2010106039878A CN 201010603987 A CN201010603987 A CN 201010603987A CN 102569539 A CN102569539 A CN 102569539A
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- endothermic box
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- heat abstractor
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Abstract
The invention relates to a design method of a special LED (Light-Emitting Diode) radiating device, belonging to the technical field of electronic elements. The related LED is characterized in that: a heat-absorbing box is connected with a PN junction tube chip of the LED; a cooling liquid in the device is driven to circulate by using power generated by a micro water pump; heat produced by the chip and absorbed by the heat-absorbing box is brought onto a radiating fin for radiating heat; and a cooled liquid reflows to the heat-absorbing box, so that continuous circular heat radiating is performed. After the design method is adopted, a large amount of heat produced by the working LED can be radiated effectively, the luminous efficiency of the LED is increased, and the service life of the LED is prolonged effectively. The design method has a substantial technical characteristic, a remarkable technical advancement and a very wide application prospect.
Description
Technical field
The present invention relates to a kind of method for designing of LED heat abstractor of characteristic, belong to the electronic component technology field.
Background technology
Along with succeeding in developing of high-power and high-luminance LED chip and improving constantly of the efficient of giving out light thereof, increasing great power LED applies to lighting field in recent years.But along with improving constantly of LED power, the heat of its generation is also more and more, the higher requirement that therefore heat dissipation technology of LED light fixture is also proposed; Traditional heat dissipating method has just been done some and has been improved on encapsulation technology, can not satisfy the heat radiation requirement of high-power LED lamp, yet after adopting technical scheme of the present invention; Can rapidly and efficiently heat be distributed; Reduced the failure rate of LED, prolonged the useful life of LED, be with a wide range of applications.
Summary of the invention
The object of the invention is exactly the problems referred to above that exist in the prior art in order to solve, and a kind of method for designing of LED heat abstractor of characteristic is provided.
The object of the invention is realized through following technical scheme:
A kind of method for designing of LED heat abstractor of characteristic; Relate to LED; Wherein: endothermic box is connected with the PN junction die of LED, utilizes the cooling liquid circulation in the powered device that micro pump produces, the heat that the chip that endothermic box is absorbed produces takes fin to and dispels the heat; Cooled liquid is back to endothermic box once more, carries out continuous cycle heat radiation.
The method for designing of the LED heat abstractor of above-mentioned a kind of characteristic, wherein: described heat abstractor is by endothermic box, circulation pipe, micro pump, and fin is formed.
Further, the method for designing of the LED heat abstractor of above-mentioned a kind of characteristic, wherein: described endothermic box and fin adopt the copper aluminum compound structure.
Further, the method for designing of the LED heat abstractor of above-mentioned a kind of characteristic, wherein: described endothermic box surface should be tried one's best bright and clean level and smooth, to reduce the contact heat resistance between endothermic box and the led chip.
Further; The method for designing of the LED heat abstractor of above-mentioned a kind of characteristic, wherein: coat heat-conducting silicone grease between the contact-making surface of described endothermic box and led chip, the one of which side is contacted with chip earlier; Carry out the transition to whole surface again, avoid retaining between the contact-making surface air.
Further, the method for designing of the LED heat abstractor of above-mentioned a kind of characteristic, wherein: it is thin as far as possible that described heat-conducting silicone grease should be smeared, and can the slit between chip and the endothermic box be filled up to get final product.
Again further, the method for designing of the LED heat abstractor of above-mentioned a kind of characteristic, wherein: described cooling liquid can adopt water, ethylene glycol solution, salt solution, silicone oil etc.
The outstanding substantive distinguishing features and the obvious improvement of technical scheme of the present invention is mainly reflected in: adopt technical scheme of the present invention; The a large amount of heats that produce in the time of can effectively LED being worked shed; Thereby improved the luminous efficiency of LED, and the useful life that has effectively prolonged LED.Therefore have broad application prospects.
The object of the invention, advantage and characteristics will make an explanation through the non-limitative illustration of following preferred embodiment.These embodiment only are the prominent examples of using technical scheme of the present invention, and all technical schemes of taking to be equal to replacement or equivalent transformation and forming all drop within the scope of requirement protection of the present invention.
Embodiment
A kind of method for designing of LED heat abstractor of characteristic; Relate to LED; Its special feature is: endothermic box is connected with the PN junction die of LED, utilizes the cooling liquid circulation in the powered device that micro pump produces, the heat that the chip that endothermic box is absorbed produces takes fin to and dispels the heat; Cooled liquid is back to endothermic box once more, carries out continuous cycle heat radiation.
We know that LED core luminous component is the PN junction die that is made up of P type and N type semiconductor, and the terminal voltage of PN junction constitutes certain potential barrier; Potential barrier descends when adding forward bias voltage, and the majority carrier in P district and N district spreads to the other side, because electron mobility is more much bigger than hole mobility; So a large amount of electronics can occur to the diffusion of P district, constitute injection, the hole-recombination on these electronics and the valence band to P district minority carrier; The energy that compound tense produces partly converts luminous energy to makes the LED lamp luminous, and part then converts heat to, so the PN junction chip is the root that produces heat; The present invention distributes heat from the root of heat.
Specifically, this radiator structure is mainly by endothermic box, micro pump, fin, and circulation pipe and cooling fluid are formed, and cooling fluid can adopt water, ethylene glycol solution, salt solution, silicone oil, and endothermic box and fin adopt copper aluminum composite material.In order to reduce the contact heat resistance of endothermic box and chip chamber, make the floor surface of endothermic box smooth as far as possible, and between endothermic box and chip, smear heat-conducting silicone grease; For better heat conduction; What silicone grease was coated with should approach as far as possible, can the slit between chip and the endothermic box be filled up to get final product, and the one of which side is contacted with chip earlier; Carry out the transition to whole surface again, can avoid retaining between the contact-making surface air like this.
Can find out through above-mentioned text description: after adopting technical scheme of the present invention, the heat that produces in the time of can rapidly and efficiently LED being worked distributes, and has reduced the failure rate of LED, has prolonged the useful life of LED, is with a wide range of applications.
Claims (7)
1. the method for designing of the LED heat abstractor of a characteristic; Relate to LED; It is characterized in that: endothermic box is connected with the PN junction die of LED, utilizes the cooling liquid circulation in the powered device that micro pump produces, the heat that the chip that endothermic box is absorbed produces takes fin to and dispels the heat; Cooled liquid is back to endothermic box once more, carries out continuous cycle heat radiation.
2. the method for designing of the LED heat abstractor of a kind of characteristic according to claim 1 is characterized in that: described heat abstractor is by endothermic box, circulation pipe, micro pump, and fin is formed.
3. the method for designing of the LED heat abstractor of a kind of characteristic according to claim 2 is characterized in that: described endothermic box and fin employing copper aluminum compound structure.
According to claim the method for designing of LED heat abstractor of 1 a kind of characteristic of stating, it is characterized in that: described endothermic box surface should be tried one's best bright and clean level and smooth, to reduce the contact heat resistance between endothermic box and the led chip.
5. the method for designing of the LED heat abstractor of a kind of characteristic according to claim 1; It is characterized in that: coat heat-conducting silicone grease between the contact-making surface of described endothermic box and led chip; The one of which side is contacted with chip earlier, carry out the transition to whole surface again, avoid retaining between the contact-making surface air.
6. the method for designing of the LED heat abstractor of a kind of characteristic according to claim 5 is characterized in that: it is thin as far as possible that described heat-conducting silicone grease should be smeared, and can the slit between chip and the endothermic box be filled up to get final product.
7. the method for designing of the LED heat abstractor of a kind of characteristic according to claim 1, it is characterized in that: described cooling liquid can adopt water, ethylene glycol solution, salt solution, silicone oil etc.
Priority Applications (1)
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CN2010106039878A CN102569539A (en) | 2010-12-24 | 2010-12-24 | Design method of special LED (Light-Emitting Diode) radiating device |
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CN2010106039878A CN102569539A (en) | 2010-12-24 | 2010-12-24 | Design method of special LED (Light-Emitting Diode) radiating device |
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CN102569539A true CN102569539A (en) | 2012-07-11 |
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CN2010106039878A Pending CN102569539A (en) | 2010-12-24 | 2010-12-24 | Design method of special LED (Light-Emitting Diode) radiating device |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101319774A (en) * | 2008-06-24 | 2008-12-10 | 杨洪武 | Passive radiator and heat radiating device of road lamp |
CN101718400A (en) * | 2009-12-11 | 2010-06-02 | 深圳市众明半导体照明有限公司 | Large-angle LED illuminating device |
CN101846246A (en) * | 2008-11-25 | 2010-09-29 | 斯坦雷电气株式会社 | Liquid cooled LED light |
CN101922629A (en) * | 2009-06-10 | 2010-12-22 | 斯坦雷电气株式会社 | Liquid cooling LED light source and possess the solar cell evaluation device of liquid cooling LED light source |
-
2010
- 2010-12-24 CN CN2010106039878A patent/CN102569539A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101319774A (en) * | 2008-06-24 | 2008-12-10 | 杨洪武 | Passive radiator and heat radiating device of road lamp |
CN101846246A (en) * | 2008-11-25 | 2010-09-29 | 斯坦雷电气株式会社 | Liquid cooled LED light |
CN101922629A (en) * | 2009-06-10 | 2010-12-22 | 斯坦雷电气株式会社 | Liquid cooling LED light source and possess the solar cell evaluation device of liquid cooling LED light source |
CN101718400A (en) * | 2009-12-11 | 2010-06-02 | 深圳市众明半导体照明有限公司 | Large-angle LED illuminating device |
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Application publication date: 20120711 |