CN102569536A - Method for manufacturing encapsulation structure for light-emitting diode - Google Patents
Method for manufacturing encapsulation structure for light-emitting diode Download PDFInfo
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- CN102569536A CN102569536A CN2010105748044A CN201010574804A CN102569536A CN 102569536 A CN102569536 A CN 102569536A CN 2010105748044 A CN2010105748044 A CN 2010105748044A CN 201010574804 A CN201010574804 A CN 201010574804A CN 102569536 A CN102569536 A CN 102569536A
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- led
- package structure
- manufacturing approach
- storage tank
- light
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Abstract
The invention relates to a method for manufacturing an encapsulation structure for a light-emitting diode, which comprises the following steps: providing an encapsulation carrier, wherein two lead frames are arranged on the encapsulation carrier, the encapsulation carrier comprises a first surface, an accommodation groove is formed on the first surface, and the accommodation groove is enclosed by a bottom wall and a side wall; adhering a light-emitting diode chip to the bottom of the accommodation groove, and electrically connecting the light-emitting diode chip with the two lead frames through metal wires; dropping encapsulation glue solution into the accommodation groove by using a plastic pin, meanwhile moving the plastic pin; and curing the encapsulation glue solution to form an encapsulation layer, thereby obtaining the encapsulation structure for the light-emitting diode.
Description
Technical field
The present invention relates to manufacture of semiconductor, relate in particular to a kind of manufacturing approach of package structure for LED.
Background technology
A lot of light-emitting diodes (Light Emitting Diode, LED) encapsulating structure all comprises a reflector structure, encapsulating material is filled in this reflector.In the manufacture process of package structure for LED, comprise the step of a some glue, use plastic pin that the packaging plastic drop of glue is gone in the reflector, glue slowly flows and is paved with the entire emission cup, then through the formation package structure for LED that is heating and curing.As depicted in figs. 1 and 2; General plastic pin is not move in giving the process of an encapsulating structure point glue; Plastic pin is positioned at directly over the reflector, glue is all splashed in the reflector, but because glue has certain viscosity; Mobile relatively poor; And, cause colloid to spill into the reflector outside near the limit of plastic pin and packaging plastic can't evenly fill up from reflector easily, thereby influence the light-emitting uniformity and the color rendering of package structure for LED because plastic pin often do not wait from the distance on each limit of reflector.
Summary of the invention
In view of this, be necessary to provide a kind of and can prevent that glue from overflowing and the manufacturing approach of the package structure for LED that evenly do not fill up.
A kind of manufacturing approach of package structure for LED may further comprise the steps:
Package carrier is provided, two lead frames are arranged on this package carrier, package carrier comprises first surface, is formed with storage tank on this first surface, and storage tank is surrounded by a diapire and a sidewall;
Light-emitting diode chip for backlight unit is attached at the bottom of said storage tank, and electrically connects through plain conductor with said two lead frames;
Use plastic pin in said storage tank, to drip the encapsulation glue, move this plastic pin when dripping the encapsulation glue;
Solidify said encapsulation glue and form encapsulated layer, obtain package structure for LED.
In the manufacturing approach of package structure for LED; Because this plastic pin moves when dripping the encapsulation glue; Make glue can be evenly distributed in the storage tank; Avoid packaging plastic liquid to spill into storage tank outside or crawling is even, thereby improve the light-emitting uniformity and the color rendering of package structure for LED.
Description of drawings
Fig. 1-Fig. 2 is a prior art dispensing method sketch map.
Fig. 3 is the manufacturing approach flow chart of a kind of package structure for LED of providing of embodiment of the present invention.
Fig. 4-Fig. 9 is the manufacturing approach sketch map of a kind of package structure for LED of providing of embodiment of the present invention.
The main element symbol description
Package structure for LED 10
Diapire 114
Light-emitting diode chip for backlight unit 13
Encapsulated layer 14
Embodiment
Below will combine accompanying drawing that the present invention is done further detailed description.
See also Fig. 3 to Fig. 9, the manufacturing approach of a kind of package structure for LED that embodiment of the present invention provides may further comprise the steps.
Step S301 a: package carrier 11 is provided, two lead frames 12 are arranged on this package carrier 11.Said package carrier 11 comprises opposite first 111 and second surface 112.Be formed with a storage tank 113 on this first surface 111.Said storage tank 113 is surrounded by diapire 114 and sidewall 115.Said diapire 114 can be formed in one or adopt mode such as viscose glue affixed with sidewall 115, in this execution mode, said diapire 114 is one-body molded with sidewall 115.Said package carrier 11 can adopt high heat conduction and electrical insulating material to process, and this high heat conduction and electrical insulating material can be selected from graphite, silicon, pottery, type brill, epoxy resin or silane epoxy resins etc.Said each lead frame 12 1 end expose on the diapire 114 of storage tank 113, and the other end exposes on the second surface 112 of package carrier 11.Said lead frame 12 can adopt metal or metal alloy to process.
Step S302: light-emitting diode chip for backlight unit 13 is attached on the diapire 114 of said storage tank 113 or on the lead frame 12.Particularly, this light-emitting diode chip for backlight unit 13 can be fixed on the diapire 114 or lead frame 12 of storage tank 113 through adhesion glue.Said light-emitting diode chip for backlight unit 13 electrically connects through plain conductor 131 and said two lead frames 12.What be worth explanation is that this light-emitting diode chip for backlight unit 13 can also utilize the mode of covering crystalline substance (flip-chip) or eutectic (eutectic) to electrically connect said two lead frames 12.Preferably, said sidewall 115 can reflect the light that light-emitting diode chip for backlight unit 13 sends, with the light direction of control light-emitting diode chip for backlight unit 13.
Step S303: control plastic pin 20 drips encapsulation glue 30 in said storage tank 113, covers said light-emitting diode chip for backlight unit 13 and said diapire 114.Move said plastic pin 20 when dripping encapsulation glue 30, make said encapsulation glue 30 can be distributed in uniformly in the said storage tank 113.The direction that should move can be a straight line, also can be curve, can be the direction of extending along said plain conductor 131, also can be the direction along these storage tank 113 broads.The material of said encapsulation glue 30 can be silica gel (silicone), epoxy resin (epoxy) or its composition.Said encapsulation glue 30 can also comprise the fluorescence transition material, and this fluorescent transition material can be garnet-base fluorescent material, silicate-base fluorescent material, orthosilicate base fluorescent powder, sulfide base fluorescent powder, thiogallate base fluorescent powder and nitride based fluorescent material.
Step S304: solidify said encapsulation glue 30 and form encapsulated layer 14, said encapsulated layer 14 can be protected influences such as light-emitting diode chip for backlight unit 13 dust, aqueous vapor.So just formed said package structure for LED 10.
In the manufacturing approach of the package structure for LED that embodiment of the present invention provides; Because this plastic pin moves when dripping the encapsulation glue; Make glue can be evenly distributed in the storage tank; Avoid packaging plastic liquid to spill into storage tank outside or crawling is even, thereby improve the light-emitting uniformity and the color rendering of package structure for LED.
It is understandable that, for the person of ordinary skill of the art, can make change and the distortion that other various pictures are answered by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (9)
1. the manufacturing approach of a package structure for LED may further comprise the steps:
Package carrier is provided, two lead frames are arranged on this package carrier, package carrier comprises first surface, is formed with storage tank on this first surface, and storage tank is surrounded by a diapire and a sidewall;
Light-emitting diode chip for backlight unit is attached at the bottom of said storage tank, and electrically connects through plain conductor with said two lead frames;
Use plastic pin in said storage tank, to drip the encapsulation glue, move this plastic pin when dripping the encapsulation glue;
Solidify said encapsulation glue and form encapsulated layer, obtain package structure for LED.
2. the manufacturing approach of package structure for LED as claimed in claim 1, it is characterized in that: said plastic pin moving direction is a straight line.
3. the manufacturing approach of package structure for LED as claimed in claim 2 is characterized in that: the direction that said plastic pin moving direction extends along said plain conductor.
4. the manufacturing approach of package structure for LED as claimed in claim 2, it is characterized in that: said plastic pin moving direction is the direction along the storage tank broad.
5. the manufacturing approach of package structure for LED as claimed in claim 1, it is characterized in that: the material of said encapsulation glue is silica gel, epoxy resin or its composition.
6. the manufacturing approach of package structure for LED as claimed in claim 1, it is characterized in that: said encapsulation glue comprises the fluorescence transition material.
7. the manufacturing approach of package structure for LED as claimed in claim 6 is characterized in that: said fluorescent transition material is a kind of in garnet-base fluorescent material, silicate-base fluorescent material, orthosilicate base fluorescent powder, sulfide base fluorescent powder, thiogallate base fluorescent powder or the nitride based fluorescent material.
8. the manufacturing approach of package structure for LED as claimed in claim 1 is characterized in that: said lead frame is positioned at the storage tank bottom, and said light-emitting diode chip for backlight unit is attached on this lead frame.
9. the manufacturing approach of package structure for LED as claimed in claim 1 is characterized in that: the mode that said light-emitting diode chip for backlight unit utilizes plain conductor to connect, cover crystalline substance or eutectic electrically connects said two lead frames.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105748044A CN102569536A (en) | 2010-12-07 | 2010-12-07 | Method for manufacturing encapsulation structure for light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105748044A CN102569536A (en) | 2010-12-07 | 2010-12-07 | Method for manufacturing encapsulation structure for light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102569536A true CN102569536A (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105748044A Pending CN102569536A (en) | 2010-12-07 | 2010-12-07 | Method for manufacturing encapsulation structure for light-emitting diode |
Country Status (1)
| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6805541B1 (en) * | 1999-02-15 | 2004-10-19 | Kabushiki Kaisha Toshiba | Resin encapsulating apparatus used in a manufacture of a semiconductor device |
| CN2850711Y (en) * | 2005-12-19 | 2006-12-27 | 邓朝旭 | Glue dispenser for producing luminous diode |
| CN101515623A (en) * | 2009-03-26 | 2009-08-26 | 徐春云 | LED glue dispensing method |
| CN101230959B (en) * | 2008-02-04 | 2010-11-10 | 林万炯 | Flexible water-proof LED lamp belt and embedding technique thereof |
| CN102412344A (en) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | Light emitting diode (LED) packaging method |
-
2010
- 2010-12-07 CN CN2010105748044A patent/CN102569536A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6805541B1 (en) * | 1999-02-15 | 2004-10-19 | Kabushiki Kaisha Toshiba | Resin encapsulating apparatus used in a manufacture of a semiconductor device |
| CN2850711Y (en) * | 2005-12-19 | 2006-12-27 | 邓朝旭 | Glue dispenser for producing luminous diode |
| CN101230959B (en) * | 2008-02-04 | 2010-11-10 | 林万炯 | Flexible water-proof LED lamp belt and embedding technique thereof |
| CN101515623A (en) * | 2009-03-26 | 2009-08-26 | 徐春云 | LED glue dispensing method |
| CN102412344A (en) * | 2010-09-23 | 2012-04-11 | 展晶科技(深圳)有限公司 | Light emitting diode (LED) packaging method |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |