CN102557706B - 锡青铜与碳化硅陶瓷复合件及其制造方法 - Google Patents
锡青铜与碳化硅陶瓷复合件及其制造方法 Download PDFInfo
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Abstract
本发明提供一种锡青铜与碳化硅陶瓷复合件的制造方法,该方法主要包括在热压烧结炉中通过施加铝箔和镍箔作为连接介质层,实现锡青铜与碳化硅陶瓷的固相扩散连接。本发明还提供一种由上述制造方法制得的锡青铜与碳化硅陶瓷复合件。锡青铜与碳化硅通过上述制造方法连接具有较高的结合力。锡青铜与碳化硅陶瓷复合件包括一锡青铜件、一碳化硅陶瓷件及连接该锡青铜件与该碳化硅陶瓷件的连接层,该连接层包括一第一过渡层、一铝层、一第二过渡层、一镍层及一第三过渡层。
Description
技术领域
本发明涉及一种金属与陶瓷的复合件及其制造方法,尤其涉及一种锡青铜与碳化硅陶瓷复合件及其制造方法。
背景技术
锡青铜在常温下具有较好的耐腐蚀性能,被广泛应用于制造各种工程结构和机械零件。然而,在高温、腐蚀性等较为恶劣的环境下,锡青铜的耐腐蚀性、耐磨性、抗冲蚀性、耐高温性能等已经很难满足现代生产技术的进一步需求。而碳化硅陶瓷具有硬度高、高温抗腐蚀、耐磨损、抗冲蚀等优点。因此,锡青铜和碳化硅陶瓷连接在一起制备成复合结构,对于锡青铜在恶劣环境中应用具有非常重要的意义。
目前,实现锡青铜与碳化硅陶瓷的连接主要是在两者间添加中间单层或多层金属层,在高温下实现两者的扩散连接。采用单层金属层难于形成热膨胀系数的阶梯式变化,在降低热应力上作用有限,锡青铜与碳化硅陶瓷的结合力欠佳。而目前采用的多层金属层更注重中间金属层的活性和相互间的反应,未能充分考虑到热膨胀系数要形成阶梯式变换,不能大幅降低热应力。
发明内容
有鉴于此,有必要提供一种易于实现的、可获得较高连接强度的锡青铜与碳化硅陶瓷复合件。
另外,还有必要提供一种制造上述复合件的制造方法。
一种锡青铜与碳化硅陶瓷复合件,该锡青铜与碳化硅陶瓷复合件包括一锡青铜件、一碳化硅陶瓷件及连接该锡青铜件与该碳化硅陶瓷件的连接层,该连接层包括一第一过渡层、一铝层、一第二过渡层、一镍层及一第三过渡层,该第一过渡层位于碳化硅陶瓷件与铝层之间,第一过渡层主要由铝碳化合物及硅铝化合物组成,该第二过渡层位于铝层与该镍层之间,第二过渡层主要由铝镍化合物及铝镍固溶体组成,该第三过渡层位于镍层与锡青铜件之间,第三过渡层主要由镍铜固溶体及镍铜化合物组成。
一种锡青铜与碳化硅陶瓷复合件的制造方法,包括以下步骤:
提供一锡青铜件、一碳化硅陶瓷件、一铝箔及一镍箔;
对该碳化硅陶瓷件、锡青铜件、铝箔及镍箔分别进行打磨和清洗;
将碳化硅陶瓷件、铝箔、镍箔及锡青铜件放入一连接模具中,使铝箔和镍箔夹放在碳化硅陶瓷件与锡青铜件之间,并且铝箔与碳化硅陶瓷件相邻,镍箔与锡青铜件相邻,所述铝箔和镍箔的厚度均分别为0.1~0.5mm;
将连接模具放入一热压烧结炉中,在保护气氛下进行固相扩散连接;
待冷却后取出锡青铜与碳化硅陶瓷复合件。
上述锡青铜与碳化硅陶瓷复合件的制造方法在热压烧结炉中通过施加铝箔和镍箔作为中间介质层,实现碳化硅陶瓷件与锡青铜件的固相扩散连接。在碳化硅陶瓷件一侧施加膨胀系数与碳化硅陶瓷相近的铝箔作为连接介质,铝与碳化硅陶瓷较容易发生反应结合,在锡青铜一侧施加热膨胀系数与锡青铜相近的镍箔作为连接介质,且镍的膨胀系数介于锡青铜与铝之间,同时镍与铝能实现良好结合;如此,碳化硅陶瓷、铝、镍、锡青铜的热膨胀系数逐渐增大,形成了碳化硅陶瓷至锡青铜的阶梯式变化,有效降低了热应力,提高了结合力。且各金属间产生的金属间化合物较少,不会造成结合强度下降。
附图说明
图1为本发明较佳实施例的锡青铜与碳化硅陶瓷复合件的剖面示意图。
图2为制造图1所示的锡青铜与碳化硅陶瓷复合件的设备示意图。
主要元件符号说明
锡青铜与碳化硅陶瓷复合件 10
碳化硅陶瓷件 20
锡青铜件 30
铝箔 40
镍箔 50
连接模具 70
上压头 72
下压头 74
中模 76
连接层 80
第一过渡层 81
铝层 82
第二过渡层 83
镍层 84
第三过渡层 85
热压烧结炉 100
具体实施方式
图1所示本发明较佳实施例的锡青铜与碳化硅陶瓷复合件10剖面示意图。锡青铜与碳化硅陶瓷复合件10包括该碳化硅陶瓷件20、该锡青铜件30及连接该锡青铜件30与该碳化硅陶瓷件20的连接层80。该连接层80包括一第一过渡层81、一铝层82、一第二过渡层83、一镍层84及一第三过渡层85。该第一过渡层81位于碳化硅陶瓷件20与铝层82之间。第一过渡层81主要由铝碳化合物及硅铝化合物组成,如碳化铝等。该第二过渡层83位于铝层82与该镍层84之间,其为铝层82与镍层84连接的过渡层。第二过渡层83主要由铝镍化合物及铝镍固溶体组成。该第三过渡层85位于镍层84与锡青铜件30之间,其为镍层84与锡青铜件30连接的过渡层。第三过渡层85主要由镍铜固溶体及镍铜化合物组成。因为锡青铜中含有原子百分含量不高于10%的锡(Sn),因此第三过渡层85还包括镍锡化合物及镍锡固溶体。
该锡青铜与碳化硅陶瓷复合件10的连接层80致密均匀,无裂缝,无孔隙。经测试,该锡青铜与碳化硅陶瓷复合件10的锡青铜/碳化硅陶瓷界面的剪切强度可达50~80MPa,抗拉强度达60~100MPa。
请参阅图2,所述复合件10的制造方法主要包括如下步骤:
(1)提供待连接的碳化硅陶瓷件20和锡青铜件30,同时提供铝箔40和镍箔50作为连接介质。该铝箔40的厚度大约为0.1~0.5mm,镍箔50的厚度大约为0.1~0.5mm。
(2)对碳化硅陶瓷件20、锡青铜件30、铝箔40和镍箔50分别进行打磨、清洗,并吹干。本实施例用金刚石砂纸打磨碳化硅陶瓷件20,用碳化硅砂纸对锡青铜件30、铝箔40和镍箔50进行打磨,使碳化硅陶瓷件20、锡青铜件30、铝箔40和镍箔50表面较为平整。碳化硅陶瓷件20、锡青铜件30、铝箔40和镍箔50放入盛装有乙醇溶液的超声波清洗器中进行振动清洗5~15分钟,以除去碳化硅陶瓷件20、锡青铜件30、铝箔40和镍箔50表面杂质及油污等。清洗后吹干备用。
(3)将碳化硅陶瓷件20、铝箔40、镍箔50、锡青铜件30依序层叠放置于放入一连接模具70中,使铝箔40和镍箔50位于碳化硅陶瓷件20与锡青铜件30之间,并且铝箔40与碳化硅陶瓷件20相邻,镍箔50与锡青铜件30相邻。该连接模具70包括上压头72、下压头74及中模76。该中模76具有一模腔(图未标),用于容置待连接工件。该上压头72和下压头74分别从两端将放置于模腔中的工件压紧。该连接模具70可以为石墨材料制成。
(4)将连接模具70放入一热压烧结炉100中,在保护气氛下使工件进行固相扩散连接。连接模具70放入热压烧结炉100后对热压烧结炉100抽真空至10-3Pa级,本实施例中,对热压烧结炉100抽真空至5×10-3Pa。然后充入氩气作为保护气氛,充入氩气直至热压烧结炉100内压力为0.3~0.6MPa。在保护气氛下将热压烧结炉100升温,并在如下工艺参数下对工件进行固相扩散连接:升温速率为1~20℃/min,连接时温度为680~980℃,连接时温度的保温时间为40~80min,轴向压力为10~50MPa。轴向压力的具体施加方法为:上压头72和下压头74开始对工件施加10MPa的轴向压力,加热,在温度到达300℃后慢慢增大轴向压力,直至温度为连接时温度时,轴向压力为最大值。
(5)待冷却后取出锡青铜件30与碳化硅陶瓷件20的复合件。
上述锡青铜与碳化硅陶瓷复合件的制造方法在热压烧结炉100中通过铝箔40和镍箔50作为中间介质层,实现碳化硅陶瓷件20与锡青铜件30的固相扩散连接。在碳化硅陶瓷件一侧施加膨胀系数与碳化硅陶瓷相近的铝箔作为连接介质,铝与碳化硅陶瓷较容易发生反应结合,在锡青铜一侧施加热膨胀系数与锡青铜相近的镍箔作为连接介质,且镍的膨胀系数介于锡青铜与铝之间,同时铝与镍能实现良好结合;如此,碳化硅陶瓷、铝、镍、锡青铜的热膨胀系数逐渐增大,形成了碳化硅陶瓷至锡青铜热膨胀系数的阶梯式变化,有效降低了热应力提高结合力。且各金属间产生的金属间化合物较少,不会造成结合强度下降。
Claims (5)
1.一种锡青铜与碳化硅陶瓷复合件的制造方法,包括以下步骤:
提供一锡青铜件、一碳化硅陶瓷件、一铝箔及一镍箔;
将碳化硅陶瓷件、铝箔、镍箔及锡青铜件放入一连接模具中,使铝箔和镍箔夹放在碳化硅陶瓷件与锡青铜件之间,并且铝箔与碳化硅陶瓷件相邻,镍箔与锡青铜件相邻,所述铝箔和镍箔的厚度均分别为0.1~0.5mm;
将连接模具放入一热压烧结炉中,在保护气氛下使碳化硅陶瓷件、铝箔、镍箔及锡青铜件连接为锡青铜与碳化硅陶瓷复合件;
待冷却后取出锡青铜与碳化硅陶瓷复合件。
2.如权利要求1所述的锡青铜与碳化硅陶瓷复合件的制造方法,其特征在于:所述连接模具放入热压烧结炉后,对热压烧结炉抽真空至10-3Pa级,然后充入氩气作为保护气氛,充入氩气后热压烧结炉内压力为0.3~0.6MPa,并在保护气氛下将热压烧结炉升温。
3.如权利要求2所述的锡青铜与碳化硅陶瓷复合件的制造方法,其特征在于:所述固相扩散连接是在如下工艺参数下进行:升温速率为1~20℃/min,连接时温度为680~980℃,连接时温度的保温时间为40~80min,轴向压力为10~50MPa。
4.如权利要求1所述的锡青铜与碳化硅陶瓷复合件的制造方法,其特征在于:该连接模具包括一上压头和一下压头,该上压头和下压头分别从两端将放置于连接模具中的碳化硅陶瓷件、铝箔、镍箔及锡青铜件压紧并对该碳化硅陶瓷件、铝箔、镍箔及锡青铜件施加轴向压力。
5.如权利要求1所述的锡青铜与碳化硅陶瓷复合件的制造方法,其特征在于:所述打磨和清洗步骤是指用金刚石砂纸打磨碳化硅陶瓷件,用碳化硅砂纸对锡青铜件、铝箔和镍箔进行打磨,再用盛装有乙醇的超声波清洗器进行振动清洗5~15分钟。
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