CN102554392B - 一种利用激光和高散热材料进行焊接的装置及方法 - Google Patents
一种利用激光和高散热材料进行焊接的装置及方法 Download PDFInfo
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- CN102554392B CN102554392B CN201010610510.2A CN201010610510A CN102554392B CN 102554392 B CN102554392 B CN 102554392B CN 201010610510 A CN201010610510 A CN 201010610510A CN 102554392 B CN102554392 B CN 102554392B
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- heat
- laser
- molten bath
- guide hole
- heat sink
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- 239000000463 material Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 30
- 238000009413 insulation Methods 0.000 claims abstract description 29
- 230000004927 fusion Effects 0.000 claims abstract description 18
- 239000012943 hotmelt Substances 0.000 claims abstract description 17
- 238000010276 construction Methods 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 8
- 239000010439 graphite Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000011133 lead Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 239000010453 quartz Substances 0.000 claims description 5
- 239000011135 tin Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 5
- 239000004020 conductor Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000001149 thermolysis Methods 0.000 abstract 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010610510.2A CN102554392B (zh) | 2010-12-28 | 2010-12-28 | 一种利用激光和高散热材料进行焊接的装置及方法 |
Applications Claiming Priority (1)
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CN201010610510.2A CN102554392B (zh) | 2010-12-28 | 2010-12-28 | 一种利用激光和高散热材料进行焊接的装置及方法 |
Publications (2)
Publication Number | Publication Date |
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CN102554392A CN102554392A (zh) | 2012-07-11 |
CN102554392B true CN102554392B (zh) | 2016-01-20 |
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CN201010610510.2A Expired - Fee Related CN102554392B (zh) | 2010-12-28 | 2010-12-28 | 一种利用激光和高散热材料进行焊接的装置及方法 |
Country Status (1)
Country | Link |
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CN (1) | CN102554392B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106735681A (zh) * | 2016-12-28 | 2017-05-31 | 无锡市雷克莱特电器有限公司 | 全自动超导体微焊接设备用石墨烯焊头结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85201033U (zh) * | 1985-04-01 | 1986-01-08 | 南开大学 | 自冷式二氧化碳激光器 |
JP2002316261A (ja) * | 2001-04-19 | 2002-10-29 | Sony Corp | 半田付け装置および半田付け方法 |
CN1862895A (zh) * | 2005-04-22 | 2006-11-15 | Tdk株式会社 | 焊料分配器 |
CN1984741A (zh) * | 2004-06-01 | 2007-06-20 | 焊接技术有限公司 | 用于硬钎焊的方法和设备 |
CN202129528U (zh) * | 2010-12-28 | 2012-02-01 | 常州碳元科技发展有限公司 | 一种利用激光和高散热材料进行焊接的装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4453969B2 (ja) * | 2004-09-24 | 2010-04-21 | Tdk株式会社 | 半田ボールの接合方法および接合装置 |
CN101117723B (zh) * | 2007-07-30 | 2011-01-05 | 赣南师范学院 | 氟化体系共电沉积制备Gd-Mg中间合金的方法 |
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2010
- 2010-12-28 CN CN201010610510.2A patent/CN102554392B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN85201033U (zh) * | 1985-04-01 | 1986-01-08 | 南开大学 | 自冷式二氧化碳激光器 |
JP2002316261A (ja) * | 2001-04-19 | 2002-10-29 | Sony Corp | 半田付け装置および半田付け方法 |
CN1984741A (zh) * | 2004-06-01 | 2007-06-20 | 焊接技术有限公司 | 用于硬钎焊的方法和设备 |
CN1862895A (zh) * | 2005-04-22 | 2006-11-15 | Tdk株式会社 | 焊料分配器 |
CN202129528U (zh) * | 2010-12-28 | 2012-02-01 | 常州碳元科技发展有限公司 | 一种利用激光和高散热材料进行焊接的装置 |
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CN102554392A (zh) | 2012-07-11 |
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Address after: 213149 Jiangsu city of Changzhou province Wujin Dragon Road Economic Development Zone No. 2 Applicant after: TANYUAN TECHNOLOGY Co.,Ltd. Address before: 213149 Jiangsu city of Changzhou province Wujin Dragon Road Economic Development Zone No. 2 Applicant before: Jiangsu carbon dollar Polytron Technologies Inc. Address after: 213149 Jiangsu city of Changzhou province Wujin Dragon Road Economic Development Zone No. 2 Applicant after: Jiangsu carbon dollar Polytron Technologies Inc. Address before: 213149 Jiangsu city of Changzhou province Wujin Dragon Road Economic Development Zone No. 2 Applicant before: CHANGZHOU TANYUAN TECHNOLOGY DEVELOPMENT Co.,Ltd. |
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