CN102549783A - 用于led的反射基底 - Google Patents
用于led的反射基底 Download PDFInfo
- Publication number
- CN102549783A CN102549783A CN2010800320014A CN201080032001A CN102549783A CN 102549783 A CN102549783 A CN 102549783A CN 2010800320014 A CN2010800320014 A CN 2010800320014A CN 201080032001 A CN201080032001 A CN 201080032001A CN 102549783 A CN102549783 A CN 102549783A
- Authority
- CN
- China
- Prior art keywords
- led
- tube core
- underfill
- base
- led tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
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- 229910052710 silicon Inorganic materials 0.000 description 4
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- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/503951 | 2009-07-16 | ||
US12/503,951 US8431423B2 (en) | 2009-07-16 | 2009-07-16 | Reflective substrate for LEDS |
PCT/IB2010/052830 WO2011007275A1 (en) | 2009-07-16 | 2010-06-22 | Reflective substrate for leds |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102549783A true CN102549783A (zh) | 2012-07-04 |
CN102549783B CN102549783B (zh) | 2016-08-03 |
Family
ID=42732454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080032001.4A Active CN102549783B (zh) | 2009-07-16 | 2010-06-22 | 用于led的反射基底 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8431423B2 (zh) |
EP (1) | EP2454764B1 (zh) |
JP (1) | JP2012533186A (zh) |
KR (1) | KR101737655B1 (zh) |
CN (1) | CN102549783B (zh) |
ES (1) | ES2737427T3 (zh) |
TW (1) | TWI523272B (zh) |
WO (1) | WO2011007275A1 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107706284A (zh) * | 2017-09-12 | 2018-02-16 | 厦门多彩光电子科技有限公司 | 一种led封装方法及封装结构 |
CN108598241A (zh) * | 2017-04-18 | 2018-09-28 | 烨曜贸易(重庆)有限公司 | Led封装件的系统和制造方法 |
CN109983589A (zh) * | 2015-12-29 | 2019-07-05 | 亮锐控股有限公司 | 具有侧面反射器和磷光体的倒装芯片led |
CN110050353A (zh) * | 2016-12-15 | 2019-07-23 | 亮锐控股有限公司 | 具有高近场对比率的led模块 |
CN110350069A (zh) * | 2013-07-24 | 2019-10-18 | 晶元光电股份有限公司 | 包含波长转换材料的发光管芯及相关方法 |
CN111052422A (zh) * | 2017-09-01 | 2020-04-21 | 科锐公司 | 发光二极管、部件及相关方法 |
TWI765491B (zh) * | 2020-03-27 | 2022-05-21 | 中國商京東方科技集團股份有限公司 | 顯示基板及其製備方法、顯示裝置 |
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US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
US9461201B2 (en) | 2007-11-14 | 2016-10-04 | Cree, Inc. | Light emitting diode dielectric mirror |
US9362459B2 (en) * | 2009-09-02 | 2016-06-07 | United States Department Of Energy | High reflectivity mirrors and method for making same |
US9435493B2 (en) * | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
US9105824B2 (en) | 2010-04-09 | 2015-08-11 | Cree, Inc. | High reflective board or substrate for LEDs |
US8803201B2 (en) * | 2011-01-31 | 2014-08-12 | Cree, Inc. | Solid state lighting component package with reflective layer |
US9012938B2 (en) * | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
JPWO2012002580A1 (ja) * | 2010-07-01 | 2013-09-02 | シチズンホールディングス株式会社 | Led光源装置及びその製造方法 |
US8764224B2 (en) | 2010-08-12 | 2014-07-01 | Cree, Inc. | Luminaire with distributed LED sources |
JP5893633B2 (ja) * | 2010-10-12 | 2016-03-23 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | Ledサブマウント上の高反射性コーティング |
TW201232851A (en) * | 2011-01-18 | 2012-08-01 | Siliconware Precision Industries Co Ltd | Package having emitting element and method for manufacturing the same |
JP5582048B2 (ja) * | 2011-01-28 | 2014-09-03 | 日亜化学工業株式会社 | 発光装置 |
DE102011013821B4 (de) * | 2011-03-14 | 2024-05-23 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterchips |
EP2500623A1 (en) | 2011-03-18 | 2012-09-19 | Koninklijke Philips Electronics N.V. | Method for providing a reflective coating to a substrate for a light-emitting device |
JP5666962B2 (ja) * | 2011-03-28 | 2015-02-12 | 日東電工株式会社 | 発光ダイオード装置およびその製造方法 |
US9728676B2 (en) | 2011-06-24 | 2017-08-08 | Cree, Inc. | High voltage monolithic LED chip |
US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
KR101961310B1 (ko) * | 2012-07-09 | 2019-07-17 | 엘지이노텍 주식회사 | 발광 장치 |
KR101287633B1 (ko) * | 2012-12-12 | 2013-07-24 | 유버 주식회사 | 칩온보드형 uv led 패키지의 제조방법 |
CN104937326B (zh) | 2013-01-25 | 2018-10-26 | 亮锐控股有限公司 | 照明组件和用于制造照明组件的方法 |
US20140208689A1 (en) | 2013-01-25 | 2014-07-31 | Renee Joyal | Hypodermic syringe assist apparatus and method |
TWI514632B (zh) * | 2013-03-29 | 2015-12-21 | Lextar Electronics Corp | 封裝製程 |
WO2014184757A1 (en) * | 2013-05-15 | 2014-11-20 | Koninklijke Philips N.V. | Light emitting device with an optical element and a reflector |
EP2854186A1 (en) * | 2013-09-26 | 2015-04-01 | Seoul Semiconductor Co., Ltd. | Light source module, fabrication method therefor, and backlight unit including the same |
US11024781B2 (en) * | 2014-01-07 | 2021-06-01 | Lumileds Llc | Glueless light emitting device with phosphor converter |
JP6544076B2 (ja) * | 2014-12-26 | 2019-07-17 | 日亜化学工業株式会社 | 発光装置 |
US10658546B2 (en) | 2015-01-21 | 2020-05-19 | Cree, Inc. | High efficiency LEDs and methods of manufacturing |
JP6632834B2 (ja) * | 2015-08-24 | 2020-01-22 | スタンレー電気株式会社 | 発光装置 |
US9831104B1 (en) * | 2015-11-06 | 2017-11-28 | Xilinx, Inc. | Techniques for molded underfill for integrated circuit dies |
KR102481646B1 (ko) | 2015-11-12 | 2022-12-29 | 삼성전자주식회사 | 반도체 발광소자 패키지 |
KR20170075897A (ko) | 2015-12-23 | 2017-07-04 | 삼성전자주식회사 | 발광 다이오드 패키지 |
KR20180100157A (ko) | 2015-12-29 | 2018-09-07 | 루미리즈 홀딩 비.브이. | 측면 반사기들 및 인광체를 갖는 플립 칩 led |
CN109791968A (zh) | 2016-07-26 | 2019-05-21 | 克利公司 | 发光二极管、组件和相关方法 |
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US11121298B2 (en) | 2018-05-25 | 2021-09-14 | Creeled, Inc. | Light-emitting diode packages with individually controllable light-emitting diode chips |
USD902448S1 (en) | 2018-08-31 | 2020-11-17 | Cree, Inc. | Light emitting diode package |
US11335833B2 (en) | 2018-08-31 | 2022-05-17 | Creeled, Inc. | Light-emitting diodes, light-emitting diode arrays and related devices |
US11233183B2 (en) | 2018-08-31 | 2022-01-25 | Creeled, Inc. | Light-emitting diodes, light-emitting diode arrays and related devices |
US11101411B2 (en) | 2019-06-26 | 2021-08-24 | Creeled, Inc. | Solid-state light emitting devices including light emitting diodes in package structures |
KR102211319B1 (ko) * | 2019-09-11 | 2021-02-03 | (주)솔라루체 | Led 모듈 |
US11756947B2 (en) | 2020-02-06 | 2023-09-12 | Lumileds Llc | Light-emitting diode lighting system with wirebonded hybridized device |
US11575074B2 (en) | 2020-07-21 | 2023-02-07 | Lumileds Llc | Light-emitting device with metal inlay and top contacts |
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CN101208811A (zh) * | 2005-08-05 | 2008-06-25 | 松下电器产业株式会社 | 半导体发光装置 |
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-
2010
- 2010-06-22 EP EP10732750.4A patent/EP2454764B1/en active Active
- 2010-06-22 KR KR1020127003954A patent/KR101737655B1/ko active IP Right Grant
- 2010-06-22 CN CN201080032001.4A patent/CN102549783B/zh active Active
- 2010-06-22 WO PCT/IB2010/052830 patent/WO2011007275A1/en active Application Filing
- 2010-06-22 ES ES10732750T patent/ES2737427T3/es active Active
- 2010-06-22 JP JP2012520127A patent/JP2012533186A/ja active Pending
- 2010-07-13 TW TW099123012A patent/TWI523272B/zh active
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110350069A (zh) * | 2013-07-24 | 2019-10-18 | 晶元光电股份有限公司 | 包含波长转换材料的发光管芯及相关方法 |
CN110350069B (zh) * | 2013-07-24 | 2023-06-30 | 晶元光电股份有限公司 | 包含波长转换材料的发光管芯及其制作方法 |
CN109983589A (zh) * | 2015-12-29 | 2019-07-05 | 亮锐控股有限公司 | 具有侧面反射器和磷光体的倒装芯片led |
CN109983589B (zh) * | 2015-12-29 | 2022-04-12 | 亮锐控股有限公司 | 具有侧面反射器和磷光体的倒装芯片led |
CN110050353A (zh) * | 2016-12-15 | 2019-07-23 | 亮锐控股有限公司 | 具有高近场对比率的led模块 |
CN108598241A (zh) * | 2017-04-18 | 2018-09-28 | 烨曜贸易(重庆)有限公司 | Led封装件的系统和制造方法 |
CN108598241B (zh) * | 2017-04-18 | 2021-05-28 | 烨曜贸易(重庆)有限公司 | Led封装件的系统和制造方法 |
CN111052422A (zh) * | 2017-09-01 | 2020-04-21 | 科锐公司 | 发光二极管、部件及相关方法 |
CN111052422B (zh) * | 2017-09-01 | 2023-10-31 | 科锐Led公司 | 制造发光二极管器件的方法 |
CN107706284A (zh) * | 2017-09-12 | 2018-02-16 | 厦门多彩光电子科技有限公司 | 一种led封装方法及封装结构 |
TWI765491B (zh) * | 2020-03-27 | 2022-05-21 | 中國商京東方科技集團股份有限公司 | 顯示基板及其製備方法、顯示裝置 |
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CN102549783B (zh) | 2016-08-03 |
TW201114067A (en) | 2011-04-16 |
US20110012149A1 (en) | 2011-01-20 |
US8431423B2 (en) | 2013-04-30 |
TWI523272B (zh) | 2016-02-21 |
JP2012533186A (ja) | 2012-12-20 |
ES2737427T3 (es) | 2020-01-14 |
EP2454764B1 (en) | 2019-06-12 |
WO2011007275A1 (en) | 2011-01-20 |
KR101737655B1 (ko) | 2017-05-18 |
EP2454764A1 (en) | 2012-05-23 |
KR20120048630A (ko) | 2012-05-15 |
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