CN102548188A - Printed circuit board, computer and radiating method - Google Patents
Printed circuit board, computer and radiating method Download PDFInfo
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- CN102548188A CN102548188A CN2010106037270A CN201010603727A CN102548188A CN 102548188 A CN102548188 A CN 102548188A CN 2010106037270 A CN2010106037270 A CN 2010106037270A CN 201010603727 A CN201010603727 A CN 201010603727A CN 102548188 A CN102548188 A CN 102548188A
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Abstract
The invention provides a printed circuit board, a computer and a radiating method. The printed circuit board comprises a circuit board body, a heating component, a power supply component and an ion radiating component, wherein the heating component is arranged on the circuit board body; the power supply component is arranged on the circuit board body and provided with a positive electrode and a negative electrode; the ion radiating component is arranged on the circuit board body and positioned in a preset range at the periphery of the heating component, and comprises an emitting electrode and a receiving electrode; the emitting electrode is connected with the positive electrode of the power supply component, the receiving electrode is connected with the negative electrode of the power supply component, and when the power supply component supplies power to the ion radiating component, the emitting electrode discharges so as to ionize the air to generate electric ions which drive air to move to the receiving electrode. According to the invention, the temperature of a shell of the computer can be reduced effectively.
Description
Technical field
The present invention relates to field of computer technology, relate in particular to a kind of printed circuit board (PCB), computer and heat dissipating method.
Background technology
In the existing notebook computer; Radiator fan is installed on CPU (Central Processing Unit usually; Central processing unit) near; Under the not enough situation of radiator fan blast, heat generating component that distance C PU is far away such as card of surfing Internet etc. then can't be by efficiently radiates heats, and then influence the computer casing temperature rise around it.
In the prior art, can perhaps around distance C PU heat generating component far away, offer air inlet, reduce near the air inlet of CPU, get into to force cold air air inlet from afar, thereby reduce the computer casing temperature through improving the rotating speed of radiator fan.Yet high-revolving fan will produce bigger system noise, in addition, reduces the heat radiation that near the air inlet of CPU also will certainly influence CPU.
Summary of the invention
In view of this, the present invention provides a kind of printed circuit board (PCB), computer and heat dissipating method, can effectively reduce the case temperature of computer.
For addressing the above problem, the present invention provides a kind of printed circuit board (PCB), comprising:
The circuit board body;
Heat generating component is arranged on the said circuit board body;
Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole;
The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole.
Preferably; Said ion radiating subassembly is provided with first pin and second pin; Said ion radiating subassembly is fixed on the said circuit board body through said first pin and said second pin, and an end of said first pin is connected with the positive pole of said power supply module, and the other end is connected with said emitter; One end of said second pin is connected with the negative pole of said power supply module, and the other end is connected with said receiving pole.
Preferably, said emitter is made up of tip-like metal or wire metal, and said receiving pole is made up of sheet metal.
The present invention also provides a kind of computer, comprises housing and the printed circuit board (PCB) that is arranged at said enclosure interior, and said printed circuit board (PCB) comprises:
The circuit board body;
Heat generating component is arranged on the said circuit board body;
Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole;
The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole.
Preferably, offer ventilating opening on the housing of said ion radiating subassembly periphery.
The present invention also provides a kind of computer, the printed circuit board (PCB) and the radiator fan that comprise housing and be arranged at said enclosure interior, and said printed circuit board (PCB) comprises:
The circuit board body;
Central processing unit is arranged on the said circuit board body, and said radiator fan is arranged at said central processing unit side;
Heat generating component is arranged on the said circuit board body;
Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole;
The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole.
Preferably, offer ventilating opening on the housing of said ion radiating subassembly periphery.
The present invention also provides a kind of computer, the printed circuit board (PCB) and the radiator fan that comprise housing and be arranged at said enclosure interior, and said printed circuit board (PCB) comprises: the circuit board body; Central processing unit is arranged on the said circuit board body, and said radiator fan is arranged at said central processing unit side; Heat generating component is arranged on the said circuit board body; Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole; The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole;
Said computer also comprises: detection components is used to detect the unlocking condition that whether satisfies said ion wind radiating subassembly, and obtains a testing result; First control assembly is used for when said testing result is represented to satisfy the unlocking condition of said ion wind radiating subassembly, and controlling said power supply module is said ion radiating subassembly power supply.
Preferably, the unlocking condition of said ion wind radiating subassembly is that the load that said central authorities are in device surpasses preset load threshold; Perhaps
The unlocking condition of said ion wind radiating subassembly is that the rotating speed of said radiator fan surpasses the preset rotation speed threshold value; Perhaps
The unlocking condition of said ion wind radiating subassembly is that the temperature in the said housing surpasses the preset temperature threshold value.
Preferably, said computer also comprises:
Second control assembly is used for when the unlocking condition of the said ion wind radiating subassembly of said testing result foot with thumb down and said ion radiating subassembly is current when being in opening, and controlling that said power supply module stops is said ion radiating subassembly power supply.
The present invention also provides a kind of heat dissipating method, is applied in the computer, and said computer comprises: housing and the printed circuit board (PCB) and the radiator fan that are arranged at said enclosure interior, and said printed circuit board (PCB) comprises: the circuit board body; Central processing unit is arranged on the said circuit board body, and said radiator fan is arranged at said central processing unit side; Heat generating component is arranged on the said circuit board body; Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole; The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole;
Said method comprising the steps of:
Detect whether satisfy the unlocking condition of said ion wind radiating subassembly, and obtain a testing result;
When said testing result was represented to satisfy the unlocking condition of said ion wind radiating subassembly, controlling said power supply module was said ion radiating subassembly power supply.
The present invention has following beneficial effect:
Around heat generating component, the ion radiating subassembly is set, can effectively takes away the heat of heat generating component.
Because the ion radiating subassembly does not have movable part fully, therefore can realize quiet heat radiation.
Because the ion heat radiation assembly structure is simple, therefore can be designed to smaller volume.
Can dispel the heat by the auxiliary heat dissipation fan, radiator fan need not maintain the state of running up, thereby reaches the purpose of noise reduction.From another point of view, system also need not to reduce performance and keeps radiator fan and be in the middle and slow speed of revolution operating condition, has improved the performance of system.
Description of drawings
Fig. 1 is the structural representation of the printed circuit board (PCB) of the embodiment of the invention;
Fig. 2 is the sketch map that the carbonium of the embodiment of the invention is moved to receiving pole by emitter;
Fig. 3 is a structural representation of the ion radiating subassembly of the embodiment of the invention;
Fig. 4 is the fixed form sketch map of the ion radiating subassembly of the embodiment of the invention;
Fig. 5 is a structural representation of the computer of the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing and embodiment, specific embodiments of the invention describes in further detail.
Be illustrated in figure 1 as the structural representation of the printed circuit board (PCB) of the embodiment of the invention; Said printed circuit board (PCB) comprises: circuit board body 101 be arranged at the heat generating component 102 on the said circuit board body 101; Said heat generating component 102 can produce heat when moving; Make the temperature of other assemblies of said heat generating component 102 or its periphery raise, in order to take away the heat that said heat generating component 102 produces, said printed circuit board (PCB) also comprises: an ion radiating subassembly 103 and be the power supply module 104 of said ion radiating subassembly 103 power supplies; Said ion radiating subassembly 103 all is arranged on the said circuit board body 101 with said power supply module 104; Said power supply module 104 has positive pole 1041 and negative pole 1042, and said ion radiating subassembly 103 is positioned at said heat generating component 102 peripheral preset range, and it comprises emitter 1031 and receiving pole 1032; Said emitter 1031 is connected with the positive pole 1041 of said power supply module 104; Said receiving pole 1032 is connected with the negative pole 1042 of said power supply module 104, and when said power supply module 104 was supplied power to said ion radiating subassembly 103, said emitter 1031 discharges made air ionization produce electron ion; Said electron ion drives air and moves to said receiving pole 1032, thereby produces the ion wind that can take away said heat generating component 102 heats.
Printed circuit board (PCB) through the foregoing description provides is provided with the ion radiating subassembly around heat generating component, can effectively take away the heat of heat generating component, and because the ion radiating subassembly does not have movable part fully, therefore can realize quiet heat radiation.
In order to make air ionization produce electron ion; It is poor to have higher voltage between said emitter 1031 and the said receiving pole 1032; Generally; Voltage difference between said emitter 1031 and the said receiving pole 1032 is at least 1500 volts, that is to say, the positive pole 1041 and the voltage difference between the negative pole 1042 of said power module 104 are at least 1500 volts.The voltage that said power module 104 provides to said ion radiating subassembly 103 can be positive voltage; It also can be negative voltage; When the voltage that provides to said ion radiating subassembly 103 when said power module 104 is positive voltage; 1031 discharges of said emitter make air ionization produce carbonium, and when the voltage that provides to said ion radiating subassembly 103 when said power module 104 was negative voltage, said emitter 1031 discharges made air ionization produce negative ion.What no matter air ionization produced is carbonium or negative ion, and electron ion moves to said receiving pole 1032 by said emitter 1031.The sketch map that the carbonium that the ion radiating subassembly that is illustrated in figure 2 as the embodiment of the invention produces air ionization is moved to receiving pole by emitter; As can be seen from Figure 2, the ion on schedule that is moved to receiving pole 1032 by emitter 1031 can drive air molecule and move.
The air quantity size of the ion wind that said ion radiating subassembly 103 produces; The height of the magnitude of voltage that provides with said power supply module 104 is directly proportional; When the voltage that provides when said power supply module 104 uprises; The air quantity of the ion wind that said ion radiating subassembly 103 produces can become greatly, and when voltage step-down that said power supply module 104 provides, the air quantity of the ion wind of said ion radiating subassembly 103 generations can diminish.In the embodiment of the invention, can be through controlling the magnitude of voltage that said power supply module 104 provides for said ion radiating subassembly 103, thus control the size of the air quantity that said ion radiating subassembly 103 produces.
Said ion radiating subassembly 103 can be multiple structure, and generally, said emitter 1031 is made up of tip-like metal or wire metal, and said receiving pole 1032 is made up of sheet metal.Said ion radiating subassembly can only comprise an emitter 1031 and a receiving pole 1032, also can comprise a plurality of emitters 1031 or a plurality of receiving pole 1032.Be illustrated in figure 3 as a structural representation of the ion radiating subassembly of the embodiment of the invention; Said ion radiating subassembly comprises the emitter 1031 that is made up of a wire metal; And two receiving poles 1032 that constitute by sheet metal; Said two receiving poles 1032 are positioned at said emitter 1031 both sides, and said emitter 1031 is connected with the positive pole 1041 of said power supply module 104, and said two receiving poles 1032 all are connected with the negative pole 1042 of said power supply module 104.Because the structure of said ion radiating subassembly 103 is comparatively simple, therefore, can be designed to smaller volume.
Said ion radiating subassembly 103 can be fixed on the said circuit board body 101 in several ways; As shown in Figure 4; Can be provided with first pin 1033 and second pin 1034 by said ion radiating subassembly 103; Said ion radiating subassembly 103 is fixed on the said circuit board body 101 with said second pin 1034 through said first pin 1033, and an end of said first pin 1033 is connected with the positive pole 1041 of said power supply module 104, and the other end is connected with said emitter 1031; One end of said second pin 1034 is connected with the negative pole 1042 of said power supply module 104, and the other end is connected with said receiving pole 1032.But said first pin 1033 is the metal conductive material with said second pin 1034 and is designed to.
Concrete, can adopt SMT (Surface Mounted Technology, surface mounting technology) or other locking bond techniques, for example the mode of SCREW (screw) is fixed in said ion radiating subassembly 103 on the said circuit board body 101.
The embodiment of the invention also provides a kind of computer; Said computer comprises housing and the printed circuit board (PCB) that is arranged at said enclosure interior; The structure of the printed circuit board (PCB) in said printed circuit board (PCB) and the foregoing description is identical, comprising: circuit board body, heat generating component, power supply module and ion radiating subassembly, wherein; Said heat generating component, power supply module and ion radiating subassembly all are arranged on the said circuit board body, and said ion radiating subassembly is positioned at said heat generating component periphery preset range.Said power supply module has positive pole and negative pole; Said ion radiating subassembly comprises emitter and receiving pole, and said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module; When said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole, thereby produces the ion wind that can take away said heat generating component heat.
In addition, for the ion wind that makes said ion radiating subassembly produce can fully exchange with outside air, can also on the peripheral housing of said ion radiating subassembly, offer ventilating opening.
Ion radiating subassembly in the foregoing description can effectively be taken away the heat of heat generating component, reduces the temperature of heat generating component housing on every side, and because the ion radiating subassembly does not have movable part fully, therefore can realize quiet heat radiation.
The embodiment of the invention also provides a computer, and said computer comprises: printed circuit board (PCB), radiator fan and housing, said printed circuit board (PCB) and radiator fan all are arranged at said enclosure interior.Said printed circuit board (PCB) comprises again: the circuit board body and be arranged at heat generating component and the central processing unit on the said circuit board body, said radiator fan is arranged at the side of said central processing unit, is said central processing unit heat radiation.Said heat generating component also can produce heat when moving; When the said radiator fan of said heat generating component distance far away; And the less deficiency of the blast of said radiator fan is thought when said heat generating component dispels the heat; In order to take away the heat that said heat generating component produces; Said printed circuit board (PCB) also comprises: an ion radiating subassembly and be the power supply module of said ion radiating subassembly power supply, and said ion radiating subassembly and said power supply module all are arranged on the said circuit board body, and said power supply module has positive pole and negative pole.Said ion radiating subassembly is positioned at said heat generating component periphery preset range; It comprises emitter and receiving pole, and said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module; When said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole, thereby produces the ion wind that can take away said heat generating component heat.
The structure of the printed circuit board (PCB) in said printed circuit board (PCB) and the foregoing description is identical, no longer is repeated in this description.
In addition, for the ion wind that makes said ion radiating subassembly produce can fully exchange with outside air, can also on the peripheral housing of said ion radiating subassembly, offer ventilating opening.
One structural representation of the computer of the embodiment of the invention as shown in Figure 5; Housing 300 set inside of said computer have printed circuit board (PCB) 100 and radiator fan 200; Has a central processing unit (figure does not show) on the said printed circuit board (PCB) 100; Said radiator fan 200 is arranged at the side of said central processing unit, is said central processing unit heat radiation.Also be provided with a heat generating component (figure does not show) on the said printed circuit board (PCB) 100 and be arranged at the ion radiating subassembly 103 around the said heat generating component; Said ion radiating subassembly 103 is used to said heat generating component heat radiation; In addition; On the housing 300 around said radiator fan 200 and the said ion radiating subassembly 300, all be arranged at the ventilating opening 400 that is used to ventilate.
Because the ion radiating subassembly does not have movable part fully, therefore can realize quiet heat radiation.In addition, the ion radiating subassembly can also dispel the heat by the auxiliary heat dissipation fan, and radiator fan need not maintain the state of running up, thereby reaches the purpose of noise reduction.From another point of view, system also need not to reduce performance and keeps radiator fan and be in the middle and slow speed of revolution operating condition, has improved the performance of system.The embodiment of the invention also provides a computer, and said computer comprises: housing and the printed circuit board (PCB) and the radiator fan that are arranged at said enclosure interior, and said printed circuit board (PCB) comprises: the circuit board body; Central processing unit is arranged on the said circuit board body, and said radiator fan is arranged at said central processing unit side; Heat generating component is arranged on the said circuit board body; Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole; The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole.
Wherein, said radiator fan can be other heat generating component heat radiations of said central processing unit and said central processing unit periphery, and said ion radiating subassembly is the heat generating component heat radiation far away of the said central processing unit of distance.In order to save energy consumption, can when using said radiator fan just to be enough to, not open said ion radiating subassembly for said computer system heat radiation, when using said radiator fan deficiency to think said computer system heat radiation, open said ion radiating subassembly again.
Therefore, the computer of the embodiment of the invention also comprises: detection components is used to detect the unlocking condition that whether satisfies said ion wind radiating subassembly, and obtains a testing result; First control assembly is used for when said testing result is represented to satisfy the unlocking condition of said ion wind radiating subassembly, and controlling said power supply module is said ion radiating subassembly power supply, running after said ion radiating subassembly powers on.
In addition, after said ion radiating subassembly unlatching, can also continue to detect,, can also control said ion radiating subassembly and close if detect the current unlocking condition that no longer satisfies said ion wind radiating subassembly.Therefore; The computer of the embodiment of the invention can also comprise: second control assembly; Be used for when the unlocking condition of the said ion wind radiating subassembly of said testing result foot with thumb down and said ion radiating subassembly is current when being in opening; Control said power supply module and stop to be said ion radiating subassembly power supply, said power supply module stops to after the said ion radiating subassembly power supply, and said ion radiating subassembly shuts down.
The unlocking condition of said ion wind radiating subassembly can surpass preset load threshold for the load that said central authorities are in device; Perhaps, the unlocking condition of said ion wind radiating subassembly also can surpass the preset rotation speed threshold value for the rotating speed of said radiator fan; Or the unlocking condition of said ion wind radiating subassembly can also surpass the preset temperature threshold value for the temperature in the said housing.The embodiment of the invention also provides a kind of heat dissipating method, is applied in the computer, and said computer comprises: housing and the printed circuit board (PCB) and the radiator fan that are arranged at said enclosure interior, and said printed circuit board (PCB) comprises: the circuit board body; Central processing unit is arranged on the said circuit board body, and said radiator fan is arranged at said central processing unit side; Heat generating component is arranged on the said circuit board body; Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole; The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole;
Said method comprising the steps of:
Step 1 detects whether satisfy the unlocking condition of said ion wind radiating subassembly, and obtains a testing result;
Step 2, when said testing result was represented to satisfy the unlocking condition of said ion wind radiating subassembly, controlling said power supply module was said ion radiating subassembly power supply.
In addition, after said ion radiating subassembly unlatching, can also continue to detect,, can also control said ion radiating subassembly and close if detect the current unlocking condition that no longer satisfies said ion wind radiating subassembly.Therefore; The heat dissipating method of the embodiment of the invention can also comprise: when the unlocking condition of the said ion wind radiating subassembly of said testing result foot with thumb down and said ion radiating subassembly is current when being in opening, control said power supply module and stop the step for said ion radiating subassembly power supply.
In the embodiment of the invention; Can also be after the said ion heat abstractor of control be opened; Further be in the rotating speed of the load of device, said radiator fan or the parameters such as temperature in the said housing according to said central authorities; Controlling said power supply module is the magnitude of voltage that said ion radiating subassembly provides, thereby controls the air quantity that said ion radiating subassembly produces.For instance; When the temperature in detecting said housing surpasses the preset temperature threshold value; Control said ion radiating subassembly and open, simultaneously, according to the temperature in the said housing; Controlling said power supply module is the magnitude of voltage that said ion radiating subassembly provides, thereby controls the size of the air quantity of the ion wind that said ion radiating subassembly produces.
Because the ion radiating subassembly does not have movable part fully, therefore can realize quiet heat radiation.In addition, the ion radiating subassembly can also dispel the heat by the auxiliary heat dissipation fan, and radiator fan need not maintain the state of running up, thereby reaches the purpose of noise reduction.From another point of view, system also need not to reduce performance and keeps radiator fan and be in the middle and slow speed of revolution operating condition, has improved the performance of system.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; Can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (11)
1. a printed circuit board (PCB) is characterized in that, comprising:
The circuit board body;
Heat generating component is arranged on the said circuit board body;
Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole;
The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole.
2. printed circuit board (PCB) as claimed in claim 1; It is characterized in that said ion radiating subassembly is provided with first pin and second pin, said ion radiating subassembly is fixed on the said circuit board body through said first pin and said second pin; One end of said first pin is connected with the positive pole of said power supply module; The other end is connected with said emitter, and an end of said second pin is connected with the negative pole of said power supply module, and the other end is connected with said receiving pole.
3. according to claim 1 or claim 2 printed circuit board (PCB) is characterized in that said emitter is made up of tip-like metal or wire metal, and said receiving pole is made up of sheet metal.
4. a computer comprises housing and the printed circuit board (PCB) that is arranged at said enclosure interior, it is characterized in that said printed circuit board (PCB) comprises:
The circuit board body;
Heat generating component is arranged on the said circuit board body;
Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole;
The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole.
5. computer as claimed in claim 4 is characterized in that, offers ventilating opening on the housing of said ion radiating subassembly periphery.
6. computer, the printed circuit board (PCB) and the radiator fan that comprise housing and be arranged at said enclosure interior is characterized in that, said printed circuit board (PCB) comprises:
The circuit board body;
Central processing unit is arranged on the said circuit board body, and said radiator fan is arranged at said central processing unit side;
Heat generating component is arranged on the said circuit board body;
Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole;
The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole.
7. computer as claimed in claim 6 is characterized in that, offers ventilating opening on the housing of said ion radiating subassembly periphery.
8. computer, the printed circuit board (PCB) and the radiator fan that comprise housing and be arranged at said enclosure interior is characterized in that, said printed circuit board (PCB) comprises:
The circuit board body;
Central processing unit is arranged on the said circuit board body, and said radiator fan is arranged at said central processing unit side;
Heat generating component is arranged on the said circuit board body;
Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole;
The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole;
Said computer also comprises:
Detection components is used to detect the unlocking condition that whether satisfies said ion wind radiating subassembly, and obtains a testing result;
First control assembly is used for when said testing result is represented to satisfy the unlocking condition of said ion wind radiating subassembly, and controlling said power supply module is said ion radiating subassembly power supply.
9. computer as claimed in claim 8 is characterized in that:
The unlocking condition of said ion wind radiating subassembly is that the load that said central authorities are in device surpasses preset load threshold; Perhaps
The unlocking condition of said ion wind radiating subassembly is that the rotating speed of said radiator fan surpasses the preset rotation speed threshold value; Perhaps
The unlocking condition of said ion wind radiating subassembly is that the temperature in the said housing surpasses the preset temperature threshold value.
10. like claim 8 or 9 described computers, it is characterized in that, also comprise:
Second control assembly is used for when the unlocking condition of the said ion wind radiating subassembly of said testing result foot with thumb down and said ion radiating subassembly is current when being in opening, and controlling that said power supply module stops is said ion radiating subassembly power supply.
11. a heat dissipating method is applied to it is characterized in that in the computer that said computer comprises: housing and the printed circuit board (PCB) and the radiator fan that are arranged at said enclosure interior, said printed circuit board (PCB) comprises: the circuit board body; Central processing unit is arranged on the said circuit board body, and said radiator fan is arranged at said central processing unit side; Heat generating component is arranged on the said circuit board body; Power supply module is arranged on the said circuit board body, and said power supply module has positive pole and negative pole; The ion radiating subassembly is arranged on the said circuit board body, and is positioned at said heat generating component periphery preset range; Said ion radiating subassembly comprises emitter and receiving pole; Said emitter is connected with the positive pole of said power supply module, and said receiving pole is connected with the negative pole of said power supply module, when said power supply module is supplied power to said ion radiating subassembly; Said emitter discharge makes air ionization produce electron ion, and said electron ion drives air and moves to said receiving pole;
Said method comprising the steps of:
Detect whether satisfy the unlocking condition of said ion wind radiating subassembly, and obtain a testing result;
When said testing result was represented to satisfy the unlocking condition of said ion wind radiating subassembly, controlling said power supply module was said ion radiating subassembly power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106037270A CN102548188A (en) | 2010-12-14 | 2010-12-14 | Printed circuit board, computer and radiating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010106037270A CN102548188A (en) | 2010-12-14 | 2010-12-14 | Printed circuit board, computer and radiating method |
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| CN104254195A (en) * | 2014-09-17 | 2014-12-31 | 苏州合欣美电子科技有限公司 | Active cooling type PCB (printed circuit board) |
| CN104936413A (en) * | 2014-03-18 | 2015-09-23 | 鸿富锦精密工业（深圳）有限公司 | Heat radiating device |
| CN108268069A (en) * | 2016-12-30 | 2018-07-10 | 北京小米移动软件有限公司 | Temprature control method, temperature control equipment and electronic equipment |
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Application publication date: 20120704 |