CN104936413A - Heat radiating device - Google Patents
Heat radiating device Download PDFInfo
- Publication number
- CN104936413A CN104936413A CN201410100663.0A CN201410100663A CN104936413A CN 104936413 A CN104936413 A CN 104936413A CN 201410100663 A CN201410100663 A CN 201410100663A CN 104936413 A CN104936413 A CN 104936413A
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- CN
- China
- Prior art keywords
- insulation board
- power supply
- conductive plate
- heat abstractor
- filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention provides a heat radiating device which integrally has a planar structure. The heat radiating device comprises an insulating board, a conductive board and a power supply. The power supply is connected with an external power supply for supplying high voltage to the heat radiating device. The insulating board comprises a metal filament. The power supply comprises an anode and a cathode. The anode is connected with the metal filament of the insulating board. The cathode is connected with the conductive board. The insulating board abuts against the conductive board. After the power supply supplies electric power to the heat radiating device, the metal filament ionizes adjacent air molecules for forming carbonium ions. The conductive board attracts the carbonium ions. A large amount of carbonium ions quickly move to the conductive board with negative electrons, and forced convection of air is formed, thereby realizing heat radiation.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly relate to a kind of to produce Forced Air Convection to strengthen the heat abstractor of radiating effect.
Background technology
The most of 3C sold on the market now or consumption electronic product, all design towards lightening trend, and inside limited space, increase increasing function, just cause chip power-consumption more and more higher thus, incident is that a large amount of heat energy is stayed interiors of products and cannot be discharged, and reduces usefulness and the life-span of assembly.
General frivolous electronic product solves the not enough method of heat radiation nothing more than the radiating subassembly such as radiation fin, heat-conducting glue, but because restriction spatially cannot add fan, be all use free convection mode to dispel the heat, forced convertion cannot be used to take heat energy out of product outside.Therefore, if the forced convertion of air can be produced at interiors of products, just radiating efficiency can be increased.
Summary of the invention
In view of this, the invention provides a kind of heat abstractor that Forced Air Convection can be made to increase radiating efficiency.
Heat abstractor provided by the invention comprises insulation board, conductive plate and power supply, and described insulation board is provided with filament, and the positive pole of described power supply is connected with conductive plate the forced convertion forming air with described insulation board with negative pole, thus realizes heat radiation.
Preferably, described heat abstractor entirety is slab construction, described insulation board and the laminating of described conductive plate.
Preferably, described insulation board is that insulating material is made, and described filament is connected conducting with the positive pole of described power supply, and described filament imbeds described insulation board in described insulation board forming process.
Preferably, described insulation board also comprises some first louvres, and described first louvre is evenly distributed on insulation board, and described filament extends along described louvre to be imbedded.
Preferably, described conductive plate is that electric conducting material is made, and described conductive plate is connected with the negative pole of described power supply, and described conductive plate comprises some second louvres, and described second louvre is uniformly distributed in described conductive plate and is oppositely arranged with described first louvre.
The heat abstractor provided in the specific embodiment of the invention is for dispelling the heat to electronic installation, heat abstractor utilizes filament point discharge effect, form Forced Air Convection, thus the heat of electronic installation inside is taken out of outside electronic installation, realize the high efficiency and heat radiation to electronic installation.
Accompanying drawing explanation
Fig. 1 is a schematic perspective view of an embodiment of heat abstractor of the present invention.
Fig. 2 is an assembling stereogram of heat abstractor in Fig. 1.
Fig. 3 is a three-dimensional exploded view of heat abstractor in Fig. 2.
Fig. 4 is that the filament of heat abstractor in Fig. 1 produces point discharge effect principle schematic diagram.
Fig. 5 is the radiating principle schematic diagram of heat abstractor in Fig. 1.
Main element symbol description
Electronic installation 10
Housing 11
Heat abstractor 20
Insulation board 200
Conductive plate 201
Power supply 203
Positive pole 2030
Negative pole 2031
Filament 2001
First louvre 2002
Second louvre 2010
Conductor 30
Carbonium 40
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1, heat abstractor 20 provided by the invention dispels the heat for giving electronic installation 10, and electronic installation 10 comprises housing 11, and heat abstractor 20 is installed in housing 11.
Refer to Fig. 2 and Fig. 3, heat abstractor 20 entirety is slab construction, and heat abstractor 20 comprises insulation board 200, conductive plate 201 and power supply 203.Power supply 203 comprises positive pole 2030 and negative pole 2031, the circuit that positive pole 2030 and insulation board 200 are laid is electrically connected, negative pole 2031 and conductive plate 201 are electrically connected, power supply 203 provides piezoelectricity for heat abstractor 20, in present embodiment, voltage is high-tension electricity, and high-tension electricity provides by common miniature transformer.
Insulation board 200 and conductive plate 201 are fitted, and insulation board 200 presses close to the heat generating components of electronic installation 10, and housing 11 pressed close to by conductive plate 201, insulation board 200 is isolation material, and conductive plate 201 is conductive material, in present embodiment, insulation board is plastic plate, and conductive plate is metallic plate.Insulation board 200 comprises the minimum filament of diameter 2001 and some first louvres 2002, and in present embodiment, the diameter of filament 2001 gets the filament between 0.025mm to 0.05mm.First louvre 2002 is uniformly distributed in insulation board 200, and filament 2001 is communicated with along the first louvre 2002 in insulation board 200 forming process imbeds insulation board 200, and one end of filament 2001 and the positive pole 2030 of power supply 203 are electrically connected.Conductive plate 201 comprises some second louvre 2010, second louvres 2010 and the first louvre 2002 is oppositely arranged, and one end of conductive plate 201 and the negative pole 2031 of power supply 203 are electrically connected.
Refer to Fig. 4, the heat abstractor 20 of the present invention utilizes point discharge effect to realize heat radiation.Point discharge effect refers to that the tip of energized conductor 30 is concentrated due to power line, and electric field is comparatively strong, and even neighbouring neutral air molecule is polarized ionize, and away from conductor, causes the disturbance of air.If conductor 30 tip band positive electricity, namely air molecule becomes cation because its electronics is taken away at positive electricity tip, now cation and the most advanced and sophisticated mutual exclusion of positive electricity, and accelerate to leave, these cations drive air to flow simultaneously, and the air ionization be constantly padded near positive pole tip, constantly repeat this process.
Refer to Fig. 5, during heat radiation, insulation board 200 connects positive pole 2030 to provide high pressure positive electricity, conductive plate 201 connects negative pole 2031 to provide high pressure negative electricity, because filament 2001 radius of curvature is minimum, can produce point discharge effect after connecting high pressure positive electricity, free ambient air molecule becomes carbonium 40, and moves towards electronegative conductive plate 201.Under the effect of point discharge effect, conductive plate 201 attracts the carbonium 40 by insulation board 200 dissociates to move toward the second louvre 2010.Moved toward the conductive plate 201 with high pressure negative electricity in a large number and rapidly by free positive charged ions 40, form the forced convertion of air, thus take the heat that electronic installation 10 produces out of housing 11, strengthen the radiating efficiency of electronic installation.
Claims (5)
1. a heat abstractor, it is characterized in that, described heat abstractor comprises insulation board, conductive plate and power supply, and described insulation board is provided with filament, the positive pole of described power supply is connected with conductive plate the forced convertion forming air with described insulation board with negative pole, thus realizes heat radiation.
2. heat abstractor as claimed in claim 1, it is characterized in that, described heat abstractor entirety is slab construction, described insulation board and the laminating of described conductive plate.
3. heat abstractor as claimed in claim 1, it is characterized in that, described insulation board is that insulating material is made, and described filament is connected conducting with the positive pole of described power supply, and described filament imbeds described insulation board in described insulation board forming process.
4. heat abstractor as claimed in claim 3, it is characterized in that, described insulation board also comprises some first louvres, and described first louvre is evenly distributed on insulation board, and described filament extends along described louvre to be imbedded.
5. heat abstractor as claimed in claim 4, it is characterized in that, described conductive plate is that electric conducting material is made, described conductive plate is connected with the negative pole of described power supply, described conductive plate comprises some second louvres, and described second louvre is uniformly distributed in described conductive plate and is oppositely arranged with described first louvre.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410100663.0A CN104936413B (en) | 2014-03-18 | 2014-03-18 | Heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410100663.0A CN104936413B (en) | 2014-03-18 | 2014-03-18 | Heat abstractor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104936413A true CN104936413A (en) | 2015-09-23 |
| CN104936413B CN104936413B (en) | 2017-09-29 |
Family
ID=54123286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410100663.0A Expired - Fee Related CN104936413B (en) | 2014-03-18 | 2014-03-18 | Heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104936413B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09130073A (en) * | 1995-11-06 | 1997-05-16 | Sanyo Electric Co Ltd | Electric device box for electronic circuit device |
| CN101146430A (en) * | 2006-09-15 | 2008-03-19 | 能缇精密工业股份有限公司 | Ion wind heat radiator |
| US20090262094A1 (en) * | 2008-04-22 | 2009-10-22 | Wintek Corporation | Electrostatic discharge protection device for touch panels |
| CN101662120A (en) * | 2008-08-26 | 2010-03-03 | 北京中视中科光电技术有限公司 | Ionic wind radiating device |
| CN102038973A (en) * | 2009-10-12 | 2011-05-04 | 孙家齐 | New method and device for air purification |
| CN102244049A (en) * | 2011-06-29 | 2011-11-16 | 鸿富锦精密工业（深圳）有限公司 | Circuit board assembly and heat radiation structure thereof |
| CN102548188A (en) * | 2010-12-14 | 2012-07-04 | 联想(北京)有限公司 | Printed circuit board, computer and radiating method |
-
2014
- 2014-03-18 CN CN201410100663.0A patent/CN104936413B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09130073A (en) * | 1995-11-06 | 1997-05-16 | Sanyo Electric Co Ltd | Electric device box for electronic circuit device |
| CN101146430A (en) * | 2006-09-15 | 2008-03-19 | 能缇精密工业股份有限公司 | Ion wind heat radiator |
| US20090262094A1 (en) * | 2008-04-22 | 2009-10-22 | Wintek Corporation | Electrostatic discharge protection device for touch panels |
| CN101662120A (en) * | 2008-08-26 | 2010-03-03 | 北京中视中科光电技术有限公司 | Ionic wind radiating device |
| CN102038973A (en) * | 2009-10-12 | 2011-05-04 | 孙家齐 | New method and device for air purification |
| CN102548188A (en) * | 2010-12-14 | 2012-07-04 | 联想(北京)有限公司 | Printed circuit board, computer and radiating method |
| CN102244049A (en) * | 2011-06-29 | 2011-11-16 | 鸿富锦精密工业（深圳）有限公司 | Circuit board assembly and heat radiation structure thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104936413B (en) | 2017-09-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191223 Address after: 314300 building B1, Jiuhong printing Park, No.1, Qianwang Road, Baibu Economic Development Zone, Haiyan County, Jiaxing City, Zhejiang Province Patentee after: Jiaxing Jiangxin Printing Technology Co., Ltd Address before: 518109, No. two, No. tenth, East Ring Road, Pinus tabulaeformis Industrial Zone, Longhua Town, Baoan District, Guangdong, Shenzhen, 2 Co-patentee before: Hon Hai Precision Industry Co., Ltd. Patentee before: Hongfujin Precision Industry (Shenzhen) Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170929 Termination date: 20200318 |
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| CF01 | Termination of patent right due to non-payment of annual fee |