CN102540365B - Optical integrated structure and manufacturing method thereof - Google Patents

Optical integrated structure and manufacturing method thereof Download PDF

Info

Publication number
CN102540365B
CN102540365B CN201210040365.8A CN201210040365A CN102540365B CN 102540365 B CN102540365 B CN 102540365B CN 201210040365 A CN201210040365 A CN 201210040365A CN 102540365 B CN102540365 B CN 102540365B
Authority
CN
China
Prior art keywords
passive component
optical
optical passive
metal
detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210040365.8A
Other languages
Chinese (zh)
Other versions
CN102540365A (en
Inventor
刘丰满
万里兮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Center for Advanced Packaging Co Ltd
Original Assignee
Institute of Microelectronics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Microelectronics of CAS filed Critical Institute of Microelectronics of CAS
Priority to CN201210040365.8A priority Critical patent/CN102540365B/en
Publication of CN102540365A publication Critical patent/CN102540365A/en
Application granted granted Critical
Publication of CN102540365B publication Critical patent/CN102540365B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

The invention discloses a new optical integrated structure which can effectively reduce the manufacturing cost, simplify the process steps and improve the yield, comprising: the invention relates to a laser, an optical passive device and a detector, wherein the optical passive device is connected with the laser or the detector, the optical passive device is connected with the outside through an optical waveguide, the bottom metal of the optical passive device is connected with the outside through a metal hole, and the back electrode of the laser or the detector is connected with the bottom metal of the optical passive device through a metal wire.

Description

A kind of optical integrated structure and preparation method thereof
Technical field
The present invention relates to photoelectron, microelectronic packaging technology field, be specifically related to a kind of optical integrated structure and preparation method thereof.
Background technology
Photoelectron subassembly has two kinds of integration modes at present, and monolithic is integrated and mixing monolithic is integrated.Monolithic is integrated is that photonic device and electronic package are integrated on same substrate, mostly is the system integration.But the limitation that it is certain can not produce laser instrument in silicon chip.Another one is to mix integrated technology, allows different classes of device to select respectively most suitable material and best technique separately, then through envelope, turns technology and assembles, to obtain best performance.In present stage, due to silicon substrate laser restriction, mix and integrated application widely.At present based on hybrid planar light path (PLC) having integrated significant progress and widely application, a transitional solution is provided for monolithic is integrated, the silica-based hybrid planar light path technology maturation of one side, with low cost, the progress of encapsulation technology has promoted to mix the development of integrated technology on the other hand.At present upside-down mounting (Flip-chip) technology is widely used, by means of surface label technology, WDM optical filter, isolator etc. also can upside-down mounting on identical platform.Most optical transceiver is to fit together with discrete optical element, such as present BOSA structure.Therefore aligning, adjustment and integrity problem will greatly increase production cost and reduce output.
Summary of the invention
The problems such as the cost of manufacture existing in prior art is high in order to solve, complex process, the invention provides a kind of new optical integrated structure that can effectively reduce cost of manufacture, simplification processing step and raising yield and preparation method thereof.
Concrete technical scheme is realized by following steps:
A kind of optical integrated structure, it is characterized in that, comprise: a laser instrument, an optical passive component and a detector, described optical passive component is connected with described laser instrument, described optical passive component is connected by optical waveguide with outside, the bottom of described optical passive component is provided with metal level, described metal level is connected to outside by metal aperture, the back electrode of described laser instrument is connected by metal wire with the metal level of described optical passive component bottom, described detector is connected with integrated circuit, and plastic packaging is encapsulated on substrate.
Preferably, described optical integrated structure comprises: a laser instrument, an optical passive component and a detector, described optical passive component is connected with described detector, and described optical passive component is connected by optical waveguide with outside, and the bottom of described optical passive component is provided with metal level, described metal level is connected to outside by metal aperture, the back electrode of described detector is connected by metal wire with the metal level of described optical passive component bottom, and described laser instrument is connected with integrated circuit, and plastic packaging is encapsulated on substrate.
Preferably, described optical passive component adopts passive coupling mode to be connected with described laser instrument or described detector.
Preferably, the passive coupling of described optical passive component and described laser instrument or described detector adopts catoptron or grating.
Preferably, the back electrode of described laser instrument or described detector is connected by Bonding with the metal level of described optical passive component bottom.
Preferably, described optical passive component is any of two-way device, two-way above, array waveguide grating or passive wavelength division multiplexer.
Preferably, the substrate of described optical passive component is silicon, glass or SOI.
Preferably, described optical passive component is silicon waveguide or organic waveguide with the outside waveguide being connected.
Preferably, described laser instrument is edge-emitting laser, and described detector is face pick-up probe.
Preferably, described laser instrument is surface-emitting laser, and described detector is limit pick-up probe.
Preferably, described metal level and outside are connected to open-porous metal interconnection or conducting resinl interconnection.
A method for making for optics integrated mechanism, comprises the steps:
A makes optical passive component, and optical passive component is connected with laser instrument, aims at and is fixed on card extender;
B is connected with the metal level of described optical passive component bottom the back electrode of described laser instrument by metal wire, and plastic packaging is encapsulated on substrate;
C is in the punching of described optical passive component bottom surface metal, and the metal level of described optical passive component bottom is connected to outside by metal aperture, fills interconnecting metal, extraction electrode, and form metal routing and pad at encapsulation end face;
D forms optical waveguide fixed sturcture at packaging body, and described optical passive component and outside are connected by optical waveguide, detector is connected with integrated circuit, and plastic packaging is encapsulated on substrate scribing forming unit encapsulating structure;
The waveguide of E alignment light and optical passive component.
Preferably, a kind of method for making of optical integrated structure, also comprises the steps:
A makes optical passive component, and optical passive component is connected with detector, aims at and is fixed on card extender;
B is connected with the metal level of described optical passive component bottom the back electrode of described detector by metal wire, and plastic packaging is encapsulated on substrate;
C is in the punching of described optical passive component bottom surface metal, and the metal level of described optical passive component bottom is connected to outside by metal aperture, fills interconnecting metal, extraction electrode, and form metal routing and pad at encapsulation end face;
D forms optical waveguide fixed sturcture at packaging body, and described optical passive component and outside are connected by optical waveguide, laser instrument is connected with integrated circuit, and plastic packaging is encapsulated on substrate scribing forming unit encapsulating structure;
The waveguide of E alignment light and optical passive component.
Preferably, the metal level of described optical passive component bottom is made by sputter or electric plating method.
Preferably, the metal level of described optical passive component bottom and outside intercommunicated any in three kinds of dry etching, wet etching or laser drill crossed.
Preferably, described metal aperture is annular or cylindricality.
Integrated morphology of the present invention has laser instrument, detector, optical passive component, driving/receiving circuit and integrates, and laser instrument, detector and optical passive component adopt the feature of passive coupling.This structure integrates various devices by plastic package method.Can be for optical transceiver, photoelectricity integration module, can also be integrated for three-dimensional photoelectricity, realize a kind of photoelectricity integrated morphology, by technology such as location, transfer, plastic packagings, reach photoelectric device and mix integrated, reduce required operation to boost productivity, reduce costs, production cycle and cost decline to a great extent, simultaneously, simple for realizing the method technique of this structure, with low cost, convenient operation, efficiency is high.
Accompanying drawing explanation
Fig. 1: be a kind of optical integrated structure that the embodiment of the present invention provides.
Fig. 2: be a kind of optical integrated structure that another embodiment of the present invention provides.
101, integrated circuit 102, laser instrument 103, detector 104, optical waveguide
105, optical passive component 106, optical fiber 107, metal wire
108, metal level 109, metal aperture.
Embodiment
Below in conjunction with embodiment, the present invention is further described in detail, the embodiment providing is only in order to illustrate the present invention, rather than in order to limit the scope of the invention.
embodiment 1:
As shown in Figure 1, in the optical integrated structure that the present embodiment provides, laser instrument 102 and optical passive component 105 integrate, 103 minutes other employing upside-down mounting modes of integrated circuit 101 and detector are installed, also can select the mode of Bonding, two kinds of modes all need to have pad and cabling with ducting layer upper surface on plastic-sealed body.Optical passive component 105 is connected with outside by optical fiber 106 with outside.The bottom metal 108 of laser instrument 102 back electrodes and optical passive component 105 is connected by metal wire 107; The bottom metal layers 108 of optical passive component 105 is connected with outside by metal aperture 109.
embodiment 2:
As shown in Figure 2, in the optical integrated structure that the present embodiment provides, detector 103 and optical passive component 105 integrate, 102 minutes other employing upside-down mounting modes of integrated circuit 101 and laser instrument are installed, also can select the mode of Bonding, two kinds of modes all need to have pad and cabling with ducting layer upper surface on plastic-sealed body.Optical passive component 105 is connected with outside by optical fiber 106 with outside.The bottom metal layers 108 of detector 103 back electrodes and optical passive component 105 is connected by metal wire 107; The bottom metal 108 of optical passive component 105 is connected with outside by metal aperture 109.
embodiment 3:
The present embodiment is introduced the method for making of optical integrated structure with reference to Fig. 1.
Step 1, makes optical passive component, comprises coupled waveguide, steering structure, optically functional device, coupled structure, and forms cabling and pad at end face and bottom surface.
Step 2, in structure as shown in Figure 1, laser instrument 102 and optical passive component 105 are fixed on card extender by aligning, when with laser instrument 102 launching sites and optical passive component 105 received fields unmatched time, or the deviation of Z direction is larger, can adopts at card extender increase step and adjust.By back electrode and the optical passive component 105 bottom surface metal levels 108 of metal wire 107 connecting lasers 102, after plastic packaging, optical passive component 105 bottom surface metal level 108 punchings, then fill interconnecting metal, extraction electrode.And form metal routing and pad at plastic packaging end face.At plastic-sealed body, form optical waveguide fixed sturcture.
Step 3, the detector that upside-down mounting integrated circuit and face receive, scribing forming unit encapsulating structure.
Step 4, alignment light waveguide 106 and optical passive component.
embodiment 4:
The present embodiment is introduced the method for making of optical integrated structure with reference to Fig. 2.
Step 1, makes optical passive component, comprises coupled waveguide, steering structure, optically functional device, coupled structure, and forms cabling and pad at end face and bottom surface.
Step 2, in structure as shown in Figure 2, detector 103 and optical passive component 105 are fixed on card extender by aligning, when with detector 103 launching sites and optical passive component 105 received fields unmatched time, or the deviation of Z direction is larger, can adopts at card extender increase step and adjust.The back electrode and the optical passive component 105 bottom surface metal levels 108 that by metal wire 107, connect detector 103, after plastic packaging, optical passive component 105 bottom surface metal level 108 punchings, then fill interconnecting metal, extraction electrode.And form metal routing and pad at plastic packaging end face.At plastic-sealed body, form optical waveguide fixed sturcture.
Step 3, the laser instrument 102 that upside-down mounting integrated circuit and face receive, scribing forming unit encapsulating structure.
Step 4, alignment light waveguide 106 and optical passive component.
The all integrated circuit of the present invention once encapsulate, directly on wafer, carry out, testing of equipment once completes, utilize plastic packaging encapsulation technology, realize a kind of photoelectricity integrated morphology, by technology such as location, transfer, plastic packagings, reach photoelectric device mixing integrated, reduce required operation to boost productivity, reduce costs, production cycle and cost decline to a great extent.
The above is only preferred embodiment of the present invention, and the equivalence of doing according to structure, feature and principle described in patent claim of the present invention therefore all changes or modifies, and is included in patent claim of the present invention.

Claims (16)

1. an optical integrated structure, it is characterized in that, comprise: a laser instrument, one optical passive component and a detector, described optical passive component is connected with described laser instrument, described optical passive component is connected by optical waveguide with outside, the bottom of described optical passive component is provided with metal level, described metal level is connected to outside by metal aperture, the back electrode of described laser instrument is connected by metal wire with the metal level of described optical passive component bottom, described detector is connected with integrated circuit, and plastic packaging is encapsulated on substrate, described optical passive component adopts passive coupling mode to be connected with described laser instrument.
2. an optical integrated structure, it is characterized in that, comprise: a laser instrument, one optical passive component and a detector, described optical passive component is connected with described detector, described optical passive component is connected by optical waveguide with outside, the bottom of described optical passive component is provided with metal level, described metal level is connected to outside by metal aperture, the back electrode of described detector is connected by metal wire with the metal level of described optical passive component bottom, described laser instrument is connected with integrated circuit, and plastic packaging is encapsulated on substrate, described optical passive component adopts passive coupling mode to be connected with described detector.
3. optical integrated structure according to claim 1 and 2, is characterized in that, the passive coupling of described optical passive component and described laser instrument or described detector adopts catoptron or grating.
4. optical integrated structure according to claim 1 and 2, is characterized in that, described integrated circuit is connected by upside-down mounting or Bonding mode with described laser instrument or described detector.
5. optical integrated structure according to claim 1 and 2, is characterized in that, the back electrode of described laser instrument or described detector is connected by Bonding with the metal level of described optical passive component bottom.
6. optical integrated structure according to claim 1 and 2, is characterized in that, described optical passive component is any of two-way device, two-way above, array waveguide grating or passive wavelength division multiplexer.
7. optical integrated structure according to claim 1 and 2, is characterized in that, the substrate of described optical passive component is silicon, glass or SOI.
8. optical integrated structure according to claim 1 and 2, is characterized in that, described optical passive component is silicon waveguide or organic waveguide with the outside waveguide being connected.
9. optical integrated structure according to claim 1 and 2, is characterized in that, described laser instrument is edge-emitting laser, and described detector is face pick-up probe.
10. optical integrated structure according to claim 1 and 2, is characterized in that, described laser instrument is surface-emitting laser, and described detector is limit pick-up probe.
11. optical integrated structures according to claim 1 and 2, is characterized in that, described metal level and outside are connected to open-porous metal interconnection or conducting resinl interconnection.
The method for making of 12. 1 kinds of optics integrated mechanisms, is characterized in that, comprises the steps:
A makes optical passive component, and optical passive component is connected with laser instrument, aims at and is fixed on card extender;
B is connected with the metal level of described optical passive component bottom the back electrode of described laser instrument by metal wire, and plastic packaging is encapsulated on substrate;
C is in the punching of described optical passive component bottom surface metal, and the metal level of described optical passive component bottom is connected to outside by metal aperture, fills interconnecting metal, extraction electrode, and form metal routing and pad at encapsulation end face;
D forms optical waveguide fixed sturcture at packaging body, and described optical passive component and outside are connected by optical waveguide, detector is connected with integrated circuit, and plastic packaging is encapsulated on substrate scribing forming unit encapsulating structure;
The waveguide of E alignment light and optical passive component.
The method for making of 13. 1 kinds of optics integrated mechanisms, is characterized in that, comprises the steps:
A makes optical passive component, and optical passive component is connected with detector, aims at and is fixed on card extender;
B is connected with the metal level of described optical passive component bottom the back electrode of described detector by metal wire, and plastic packaging is encapsulated on substrate;
C is in the punching of described optical passive component bottom surface metal, and the metal level of described optical passive component bottom is connected to outside by metal aperture, fills interconnecting metal, extraction electrode, and form metal routing and pad at encapsulation end face;
D forms optical waveguide fixed sturcture at packaging body, and described optical passive component and outside are connected by optical waveguide, laser instrument is connected with integrated circuit, and plastic packaging is encapsulated on substrate scribing forming unit encapsulating structure;
The waveguide of E alignment light and optical passive component.
14. according to the method for making described in claim 12 or 13, it is characterized in that, the metal level of described optical passive component bottom is made by sputter or electric plating method.
15. according to the method for making described in claim 12 or 13, it is characterized in that, the metal level of described optical passive component bottom and outside intercommunicated any in three kinds of dry etching, wet etching or laser drill crossed.
16. according to the method for making described in claim 12 or 13, it is characterized in that, described metal aperture is annular or cylindricality.
CN201210040365.8A 2011-12-14 2012-02-20 Optical integrated structure and manufacturing method thereof Active CN102540365B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210040365.8A CN102540365B (en) 2011-12-14 2012-02-20 Optical integrated structure and manufacturing method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201110418105.5 2011-12-14
CN201110418105 2011-12-14
CN201210040365.8A CN102540365B (en) 2011-12-14 2012-02-20 Optical integrated structure and manufacturing method thereof

Publications (2)

Publication Number Publication Date
CN102540365A CN102540365A (en) 2012-07-04
CN102540365B true CN102540365B (en) 2014-01-29

Family

ID=46347661

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210040365.8A Active CN102540365B (en) 2011-12-14 2012-02-20 Optical integrated structure and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN102540365B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106158998B (en) * 2016-06-30 2017-08-04 浙江大学 A kind of visible ray and near infrared band silicon substrate fiber waveguide integrated photodetector

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101153939A (en) * 2006-09-28 2008-04-02 中国科学院半导体研究所 Mixed integral single fibre three-way device
CN101180562A (en) * 2004-12-07 2008-05-14 里夫莱克斯光子公司 Optically enabled hybrid semiconductor package
CN101464540A (en) * 2007-12-19 2009-06-24 中国科学院半导体研究所 Mixed integral single fibre three-way device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5977567A (en) * 1998-01-06 1999-11-02 Lightlogic, Inc. Optoelectronic assembly and method of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101180562A (en) * 2004-12-07 2008-05-14 里夫莱克斯光子公司 Optically enabled hybrid semiconductor package
CN101153939A (en) * 2006-09-28 2008-04-02 中国科学院半导体研究所 Mixed integral single fibre three-way device
CN101464540A (en) * 2007-12-19 2009-06-24 中国科学院半导体研究所 Mixed integral single fibre three-way device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
光发射模块中激光器与光纤的无源耦合;杨存永等;《半导体技术》;20050131;第30卷(第1期);第66-68页 *
杨存永等.光发射模块中激光器与光纤的无源耦合.《半导体技术》.2005,第30卷(第1期),第66页.

Also Published As

Publication number Publication date
CN102540365A (en) 2012-07-04

Similar Documents

Publication Publication Date Title
CN111902755B (en) Light transfer board
US11275225B2 (en) Method and system for an optical coupler for silicon photonics devices
US10678005B2 (en) Optically aligned hybrid semiconductor device and method
US20180372968A1 (en) Wafer-level integrated opto-electronic module
DE102004064081B4 (en) Housing for an optical receiver
CN104766903B (en) Integration module and forming method thereof
US8483253B2 (en) 3D optoelectronic packaging
JP2020521186A (en) Optical interconnection device and method of manufacturing optical interconnection device
JP5914647B2 (en) Optical frame mounted with micro-machined alignment features in the die
CN111492281B (en) Passive optical fiber coupler with UV window
KR20070085080A (en) System and method for the fabrication of an electro-optical module
US10393959B1 (en) Photonic integrated circuit bonded with interposer
CN103650140A (en) Wafer scale packaging platform for transceivers
CN110673279A (en) Edge-coupled photoelectric device packaging structure and preparation method thereof
Bernabé et al. On-board silicon photonics-based transceivers with 1-Tb/s capacity
TWI458086B (en) Apparatus, system and method for making optical connector modules
CN102073109A (en) Manufacturing method of QSFP (Quad Small Form-factor Pluggable) module subelement
WO2002014917A1 (en) Optical mounting board, optical module, optical transmitter/receiver, optical transmitting/receiving system, and method for manufacturing optical mounting board
CN102540365B (en) Optical integrated structure and manufacturing method thereof
CN114402243A (en) Microminiature optical transmission module and method for manufacturing the same using semiconductor package
CN116088113A (en) End face coupling packaging method based on flip-chip silicon optical chip
KR101132680B1 (en) Optoelectonic device package
CN107884882B (en) Optical communication assembly, preparation method thereof and communication equipment
Bernabé et al. Packaging and test of photonic integrated circuits (PICs)
JP2019191251A (en) Optical module, optical wiring substrate, and method for manufacturing optical module

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: CHENGDU RHOPTICS OPTOELECTRONIC TECHNOLOGY CO., LT

Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S

Effective date: 20140806

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 100029 CHAOYANG, BEIJING TO: 610041 CHENGDU, SICHUAN PROVINCE

TR01 Transfer of patent right

Effective date of registration: 20140806

Address after: 610041, Sichuan, Chengdu hi tech Development Zone, 188 Rui Rui Road, No. 6, No. 2 building

Patentee after: CHENGDU RUIHUA OPTOELECTRONIC TECHNOLOGY Co.,Ltd.

Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3

Patentee before: Institute of Microelectronics of the Chinese Academy of Sciences

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20210220

Address after: 214028 building D1, China Sensor Network International Innovation Park, No. 200, Linghu Avenue, New District, Wuxi City, Jiangsu Province

Patentee after: National Center for Advanced Packaging Co.,Ltd.

Address before: 2 / F, no.188-6, Zirui Avenue, Chengdu hi tech Development Zone, Sichuan 610041

Patentee before: CHENGDU RUIHUA OPTOELECTRONIC TECHNOLOGY Co.,Ltd.