CN102532996B - Flexible ink for white cover film of LED (Light Emitting Diode) soft light strip plate and preparation method of flexible ink - Google Patents
Flexible ink for white cover film of LED (Light Emitting Diode) soft light strip plate and preparation method of flexible ink Download PDFInfo
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- CN102532996B CN102532996B CN201110384027.1A CN201110384027A CN102532996B CN 102532996 B CN102532996 B CN 102532996B CN 201110384027 A CN201110384027 A CN 201110384027A CN 102532996 B CN102532996 B CN 102532996B
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Abstract
The invention relates to the technical field of an LED (Light Emitting Diode) long strip light, in particular to flexible ink for a white cover film of an LED soft light strip plate and a preparation method of the flexible ink. The flexible ink for the white cover film of the LED soft light strip plate is prepared from the following raw materials in percentage by mass: 30-70 percent of thermosetting resin, 2-10 percent of curing agent, 5-30 percent of diluting agent and 10-40 percent of filler. According to the ink and the preparation method thereof, excellent bend resistance performance can be achieved, the wiping resistance performance and the high temperature resistance performance are better, the ink is difficult to crack and yellow under a high temperature condition, and the requirements of a reflow soldering process of the light strip plate are met.
Description
Technical field
The present invention relates to LED long strip shape lamp technical field, relate in particular to flexible ink and preparation method thereof for white covering film of the soft lamp batten of a kind of LED.
Background technology
In recent years, LED long strip shape lamp has been widely applied to the body of wall brightening in various place ，Ru incorporated business building, the brightening in government building, the brightening of historical building body of wall, the decoration of public place of entertainment, night scene engineering etc., and its related scope is also more and more wider.White covering film, as insulation layer and the substrate material of the soft lamp batten of LED, is its important integral part.At present, white covering film generally with epoxy resin or saturated polyester resin preparation, because epoxy resin is more crisp, is difficult to meet the resistance to bending requirement of long strip shape lamp with the matrix resin of flexible ink; Saturated polyester resin is easily cracking, xanthochromia under hot conditions, be difficult to meet the reflow soldering process requirement of lamp batten, therefore, existing thermofixation white ink exists resistance to bending poor to some extent in the market, through Reflow Soldering after yellowing, embrittlement, through problems such as solvent scouring easily come off.
Summary of the invention
The object of the invention is to provide for the deficiencies in the prior art flexible ink and preparation method thereof for white covering film of the soft lamp batten of a kind of LED, can reach good resistance to bending performance, resistance to wiping properties and resistance to elevated temperatures are better, under hot conditions, be difficult for cracking, xanthochromia, meet the reflow soldering process requirement of lamp batten.
For achieving the above object, the present invention adopts following technical scheme.
The white covering film flexible ink of the soft lamp batten of LED, it is made by the raw material of following mass ratio:
Thermosetting resin 30%～70%
Solidifying agent 2%～10%
Thinner 5%～30%
Filler 10%～40%.
Preferably, described thermosetting resin is selected organic-silicon-modified saturated polyester, and its hydroxyl value is at 10～30mgKOH/g, and acid number is at 40～60mgKOH/g.
Preferably, described thermosetting resin is selected the organic-silicon-modified saturated polyester of straight chain type or the organic-silicon-modified saturated polyester of branched chain type.
Preferably, described solidifying agent is the compound that can make the curing reactive group of saturated polyester, can select hexamethylene diisocyanate, hydrogenated diphenyl methane diisocyanate, isoflurane chalcone diisocyanate, imido fundamental mode terpolycyantoamino-formaldehyde resin, methyl-etherified terpolycyantoamino-formaldehyde resin, butylated melamine-formaldehyde resin.
Preferably, described thinner can be selected one or both the mixture in N-BUTYL ACETATE, butanone, pimelinketone, propyl carbinol, isopropylcarbinol, benzene,toluene,xylene, trimethylbenzene, ethyl acetate, butylacetate, ethylene glycol monobutyl ether, ethylene glycol ethyl ether ethyl acetate, ethylene glycol ethyl ether butylacetate, butyl glycol ether, propandiol butyl ether, diethylene glycol ether.
Preferably, described filler can be selected to four kind in titanium dioxide, wilkinite, aerosil, barium sulfate, nano-calcium carbonate.
The preparation method of flexible ink for the white covering film of the soft lamp batten of LED, it is thermosetting resin in mass ratio: solidifying agent: thinner: filler is (30%～70%): (2%～10%): (5%～30%): the component of (10%～40%), at room temperature mix, after stirring, on sand mill or three-roller, be ground to fineness and be less than 10um, finally with solvent, be adjusted to working viscosity, be mixed with the white covering film flexible ink of the soft lamp batten of LED; Wherein, described thermosetting resin is selected organic-silicon-modified saturated polyester, and its hydroxyl value is at 10～30mgKOH/g, and acid number is at 40～60mgKOH/g; Described solidifying agent is the compound that can make the curing reactive group of saturated polyester, can select hexamethylene diisocyanate, hydrogenated diphenyl methane diisocyanate, isoflurane chalcone diisocyanate, imido fundamental mode terpolycyantoamino-formaldehyde resin, methyl-etherified terpolycyantoamino-formaldehyde resin, butylated melamine-formaldehyde resin; Described thinner can be selected one or both the mixture in N-BUTYL ACETATE, butanone, pimelinketone, propyl carbinol, isopropylcarbinol, benzene,toluene,xylene, trimethylbenzene, ethyl acetate, butylacetate, ethylene glycol monobutyl ether, ethylene glycol ethyl ether ethyl acetate, ethylene glycol ethyl ether butylacetate, butyl glycol ether, propandiol butyl ether, diethylene glycol ether; Described filler can be selected to four kind in titanium dioxide, wilkinite, aerosil, barium sulfate, nano-calcium carbonate.
Beneficial effect of the present invention is: flexible ink and preparation method thereof for the white covering film of the soft lamp batten of LED of the present invention, adopt organic-silicon-modified saturated polyester resin as matrix resin, the snappiness of vibrin and the high heat resistance energy of silicone resin have been had concurrently, make the present invention can reach good resistance to bending performance, resistance to wiping properties and resistance to elevated temperatures are better, under hot conditions, be difficult for cracking, xanthochromia, meet the reflow soldering process requirement of lamp batten.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.
The white covering film flexible ink of the soft lamp batten of LED of the present invention, it is made by the raw material of following mass ratio:
Thermosetting resin 30%～70%
Solidifying agent 2%～10%
Thinner 5%～30%
Filler 10%～40%.
Preferably, described thermosetting resin is selected organic-silicon-modified saturated polyester, comprises the organic-silicon-modified saturated polyester of straight chain type and the organic-silicon-modified saturated polyester of branched chain type, and its hydroxyl value is at 10～30mgKOH/g, and acid number is at 40～60mgKOH/g.Preferably, described solidifying agent is the compound that can make the curing reactive group of saturated polyester, can select hexamethylene diisocyanate, hydrogenated diphenyl methane diisocyanate, isoflurane chalcone diisocyanate, imido fundamental mode terpolycyantoamino-formaldehyde resin, methyl-etherified terpolycyantoamino-formaldehyde resin, butylated melamine-formaldehyde resin.Preferably, described thinner can be selected one or both the mixture in N-BUTYL ACETATE, butanone, pimelinketone, propyl carbinol, isopropylcarbinol, benzene,toluene,xylene, trimethylbenzene, ethyl acetate, butylacetate, ethylene glycol monobutyl ether, ethylene glycol ethyl ether ethyl acetate, ethylene glycol ethyl ether butylacetate, butyl glycol ether, propandiol butyl ether, diethylene glycol ether.Preferably, described filler can be selected to four kind in titanium dioxide, wilkinite, aerosil, barium sulfate, nano-calcium carbonate.
The white covering film of the soft lamp batten of LED of the present invention is as follows by the preparation method of flexible ink: be thermosetting resin in mass ratio: solidifying agent: thinner: filler is (30%～70%): (2%～10%): (5%～30%): the component of (10%～40%), at room temperature mix, after stirring, on sand mill or three-roller, be ground to fineness and be less than 10um, finally with solvent, be adjusted to working viscosity, be mixed with the white covering film flexible ink of the soft lamp batten of described a kind of LED; Wherein, described thermosetting resin is selected organic-silicon-modified saturated polyester, and its hydroxyl value is at 10～30mgKOH/g, and acid number is at 40～60mgKOH/g, and thermosetting resin also can be selected the organic-silicon-modified saturated polyester of straight chain type and the organic-silicon-modified saturated polyester of branched chain type; Described solidifying agent is the compound that can make the curing reactive group of saturated polyester, can select hexamethylene diisocyanate, hydrogenated diphenyl methane diisocyanate, isoflurane chalcone diisocyanate, imido fundamental mode terpolycyantoamino-formaldehyde resin, methyl-etherified terpolycyantoamino-formaldehyde resin, butylated melamine-formaldehyde resin; Described thinner can be selected one or both the mixture in N-BUTYL ACETATE, butanone, pimelinketone, propyl carbinol, isopropylcarbinol, benzene,toluene,xylene, trimethylbenzene, ethyl acetate, butylacetate, ethylene glycol monobutyl ether, ethylene glycol ethyl ether ethyl acetate, ethylene glycol ethyl ether butylacetate, butyl glycol ether, propandiol butyl ether, diethylene glycol ether; Described filler can be selected to four kind in titanium dioxide, wilkinite, aerosil, barium sulfate, nano-calcium carbonate.
As preferred embodiment, the white covering film flexible ink of the soft lamp batten of a kind of LED of the present invention, it is made by the raw material of following mass ratio:
Thermosetting resin: the organic-silicon-modified saturated polyester 40% of branched chain type
Thinner: N-BUTYL ACETATE 15%
Propyl carbinol 15%
Filler: titanium dioxide 23%
Nano-calcium carbonate 2%
Solidifying agent: hexamethylene diisocyanate 5%.
As another preferred embodiment, the white covering film flexible ink of the soft lamp batten of a kind of LED of the present invention, it is made by the raw material of following mass ratio:
Thermosetting resin: the organic-silicon-modified saturated polyester 38.5% of straight chain type
Thinner: dimethylbenzene 15%
Ethylene glycol monobutyl ether 15%
Filler: titanium dioxide 25%
Solidifying agent: hydrogenated diphenyl methane diisocyanate 6.5%.
As another preferred embodiment, the white covering film flexible ink of the soft lamp batten of a kind of LED of the present invention, it is made by the raw material of following mass ratio:
Thermosetting resin: the organic-silicon-modified saturated polyester 41% of straight chain type
Thinner: dimethylbenzene 15%
Isopropylcarbinol 15%
Filler: titanium dioxide 25%
Solidifying agent: methyl-etherified terpolycyantoamino-formaldehyde resin 4%.
As another preferred embodiment, the white covering film flexible ink of the soft lamp batten of a kind of LED of the present invention, it is made by the raw material of following mass ratio:
Thermosetting resin: the organic-silicon-modified saturated polyester 40.2% of straight chain type
Thinner: dimethylbenzene 15%
Isopropylcarbinol 15%
Filler: titanium dioxide 25%
Solidifying agent: high imines fundamental mode terpolycyantoamino-formaldehyde resin 4.8%.
The white covering film flexible ink of the soft lamp batten of a kind of LED described in various embodiments above, wherein, if described thermosetting resin is selected organic-silicon-modified saturated polyester, its hydroxyl value is at 10～30mgKOH/g, acid number is at 40～60mgKOH/g, and its consumption is 30%～70%, and preferred amounts is 45%～55%, consumption is no less than 30%, otherwise can affect the film-forming properties of ink, resistance to bending, glossiness, sticking power etc.; If higher than 70%, otherwise the hiding lack of white ink, whiteness does not reach requirement.Wherein, thinner can not be lower than 5%, otherwise adhere to, viscosity is too high is unfavorable for construction, also cannot be higher than 30%, otherwise exert an influence for outward appearance and the performance of ink film.Wherein, amount of filler is 10%～40%, can not be too high or too low, and too high meeting makes the unfavorable construction of ink thickness, and ink performance is exerted an influence, and the too low ink became uneven that makes is even.
The white covering film of the soft lamp batten of a kind of LED described in various embodiments is with flexible ink and preparation method thereof above, meeting white covering film with in the resistance to bending performance of flexible ink, aspect resistance to elevated temperatures and resistance to solvent wiping characteristic, realize unified, overcome current material characteristic defective in one aspect, more can meet the terminal applies demand of white covering film.Compare with currently available products, the invention has the advantages that: 1. adopt organic-silicon-modified saturated polyester resin as matrix resin, had the snappiness of vibrin and the high heat resistance energy of silicone resin concurrently; General saturated polyester cured article is the easy embrittlement of wicking, xanthochromia under the condition of 288 ℃, 10 seconds; Organic-silicon-modified saturated polyester resin cured article heat resisting temperature can reach 288 ℃, more than 1 minute.2. organic-silicon-modified saturated polyester is showing more excellently aspect resistance to solvent wiping; The standard method of test of resistance to wiping properties: dip in industrial butanone with bristle toothbrush, then use 1 kilogram force in the curing film coated surface of ink back and forth after wiping 10 times, observation post's wiping position color whether be that wiping position color is inconsistent, or whether observation has peeling paint to see ground, paint slightly changes for color preferably, but loses ground; At present, product is on the market prone to peeling paint phenomenon, and the organic-silicon-modified saturated polyester ink that the present invention prepares can resistance to solvent wiping more than 15 times.In sum, the present invention can reach good resistance to bending performance, resistance to wiping properties and resistance to elevated temperatures are better, under hot conditions, be difficult for cracking, xanthochromia, meet the reflow soldering process requirement of lamp batten, can be widely used at aspect the white covering film of the soft lamp batten of LED or other products film aspect.
The above is only preferred embodiments of the present invention, and the equivalence of doing according to structure, feature and principle described in patent claim of the present invention therefore all changes or modifies, and is included in patent claim of the present invention.
Claims (2)
- The white covering film flexible ink of the soft lamp batten of 1.LED, is characterized in that: it is made by the raw material of following mass ratio:Thermosetting resin 30%～70%Solidifying agent 2%～10%Thinner 5%～30%Filler 10%～40%;Described thermosetting resin is selected organic-silicon-modified saturated polyester, and its hydroxyl value is at 10～30mgKOH/g, and acid number is at 40～60mgKOH/g;Described thermosetting resin is selected the organic-silicon-modified saturated polyester of straight chain type or the organic-silicon-modified saturated polyester of branched chain type;Described solidifying agent is the compound that can make the curing reactive group of saturated polyester, can select hexamethylene diisocyanate, hydrogenated diphenyl methane diisocyanate, isoflurane chalcone diisocyanate, imido fundamental mode terpolycyantoamino-formaldehyde resin, methyl-etherified terpolycyantoamino-formaldehyde resin, butylated melamine-formaldehyde resin;Described thinner can be selected one or both the mixture in N-BUTYL ACETATE, butanone, pimelinketone, propyl carbinol, isopropylcarbinol, benzene,toluene,xylene, trimethylbenzene, ethyl acetate, butylacetate, ethylene glycol monobutyl ether, ethylene glycol ethyl ether ethyl acetate, ethylene glycol ethyl ether butylacetate, butyl glycol ether, propandiol butyl ether, diethylene glycol ether;Described filler can be selected to four kind in titanium dioxide, wilkinite, aerosil, barium sulfate, nano-calcium carbonate.
- The preparation method of flexible ink for the white covering film of the soft lamp batten of 2.LED, it is characterized in that: be thermosetting resin in mass ratio: solidifying agent: thinner: filler is (30%～70%): (2%～10%): (5%～30%): the component of (10%～40%), at room temperature mix, after stirring, on sand mill or three-roller, be ground to fineness and be less than 10 μ m, finally with solvent, be adjusted to working viscosity, be mixed with the white covering film flexible ink of the soft lamp batten of LED; Wherein, described thermosetting resin is selected organic-silicon-modified saturated polyester, and its hydroxyl value is at 10～30mgKOH/g, and acid number is at 40～60mgKOH/g; Described solidifying agent is the compound that can make the curing reactive group of saturated polyester, can select hexamethylene diisocyanate, hydrogenated diphenyl methane diisocyanate, isoflurane chalcone diisocyanate, imido fundamental mode terpolycyantoamino-formaldehyde resin, methyl-etherified terpolycyantoamino-formaldehyde resin, butylated melamine-formaldehyde resin; Described thinner can be selected one or both the mixture in N-BUTYL ACETATE, butanone, pimelinketone, propyl carbinol, isopropylcarbinol, benzene,toluene,xylene, trimethylbenzene, ethyl acetate, butylacetate, ethylene glycol monobutyl ether, ethylene glycol ethyl ether ethyl acetate, ethylene glycol ethyl ether butylacetate, butyl glycol ether, propandiol butyl ether, diethylene glycol ether; Described filler can be selected to four kind in titanium dioxide, wilkinite, aerosil, barium sulfate, nano-calcium carbonate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110384027.1A CN102532996B (en) | 2011-11-28 | 2011-11-28 | Flexible ink for white cover film of LED (Light Emitting Diode) soft light strip plate and preparation method of flexible ink |
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| CN201110384027.1A CN102532996B (en) | 2011-11-28 | 2011-11-28 | Flexible ink for white cover film of LED (Light Emitting Diode) soft light strip plate and preparation method of flexible ink |
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| CN102532996A CN102532996A (en) | 2012-07-04 |
| CN102532996B true CN102532996B (en) | 2014-02-19 |
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| CN103192572B (en) * | 2013-04-01 | 2015-08-12 | 广州市宝励贸易有限公司 | High temperature resistant cover layer and its Metal Substrate heat sink prepared of use and preparation method thereof |
| CN105713488A (en) * | 2016-03-24 | 2016-06-29 | 湖州新奥克化工有限公司 | Super-abrasion-resistant unsaturated polyester resin coating and preparation method thereof |
| CN107722719A (en) * | 2017-10-09 | 2018-02-23 | 安徽源美广告传媒有限公司 | A kind of advertising and printing ink and preparation method thereof |
| CN107841195A (en) * | 2017-12-18 | 2018-03-27 | 广州聚碳合成材料有限公司 | A kind of ink and PI film white ink |
| CN108641474A (en) * | 2018-04-24 | 2018-10-12 | 湖南省方正达电子科技有限公司 | Rolling coating white ink and preparation method of the one kind for LED light decorations wiring board |
| CN110204955A (en) * | 2019-06-28 | 2019-09-06 | Oppo广东移动通信有限公司 | Fire-retardant ink and preparation method thereof, battery cover board and preparation method thereof and electronic equipment |
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