CN102520252A - Test mold, manufacturing method thereof, and film resistor substrate unit resistance detection method - Google Patents
Test mold, manufacturing method thereof, and film resistor substrate unit resistance detection method Download PDFInfo
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- CN102520252A CN102520252A CN2011104503330A CN201110450333A CN102520252A CN 102520252 A CN102520252 A CN 102520252A CN 2011104503330 A CN2011104503330 A CN 2011104503330A CN 201110450333 A CN201110450333 A CN 201110450333A CN 102520252 A CN102520252 A CN 102520252A
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- resistance
- testing mould
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Abstract
The invention relates to a test mold, a manufacturing method thereof, and a method for realizing detection of film resistor substrate unit resistance by utilizing the test mold. The detection method of the film resistor substrate unit resistance is realized through the test mold and by using a universal meter to detect a measurement point, obtained unit resistance is more accurate than obtained resistance by using a present formula calculation method, resistance control with high precision can be realized, and actual unit resistance of a film resistor substrate can be rapidly and simply detected.
Description
Technical field
The present invention relates to a kind of testing mould and preparation method thereof, and utilize said testing mould to realize the detection method of sheet resistance substrate unit resistance.
Background technology
Thin film resistor is to be sputtered in the insulating material surface with the metal alloy compositions that type electric plating method will have certain resistivity to process; For example in the manufacturing technology of integrated circuit microelectronic product or hybrid circuit microelectronic product, use thin film resistor at microelectronic product usually as passive electronic circuit component.And the sheet resistance substrate is made up of Copper Foil and the substrate medium of band thin film resistive layer, needs the complicated manufacture processes such as pressing through coated media glue, high-temperature and high-pressure conditions; But existing technology can only draw the resistance before the sheet resistance substrate manufacture, can't detect the effective unit resistance that is made into behind the substrate.
Summary of the invention
The technical matters that the present invention solves provides a kind of testing mould and preparation method thereof, and utilizes said testing mould to realize the detection method of sheet resistance substrate unit resistance.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of testing mould, wherein, testing mould is made up of a plurality of measurement points of arranging in length and breadth.The length L of described measurement point equates with width W.Testing mould is made up of a plurality of measurement points of arranging in length and breadth; Testing mould length is 24 inches, and width is 12 inches; The length L of measurement point equates with width W.
A kind of method for making of testing mould wherein, may further comprise the steps:
Step 1: through software design test resistance figure; The film that uses when the mode of painting through light is then produced figure transfer; Through figure transfer technology resolution chart is transferred on the sheet resistance substrate at last, on the sheet resistance substrate, formed the test resistance figure;
Step 2: cut out needed size, pass through internal layer figure transfer, acid etching, the unnecessary resistance film of etching again from the sheet resistance substrate; Produce half-finished testing mould.
Step 3: half-finished testing mould passes through internal layer figure transfer, alkali etching operation again, on the sheet resistance substrate, produces final testing mould.
At first be through software (printed wiring board popular software; Like cam350, Ucam etc.) design the test resistance figure; The film that uses when the mode of painting through light is then produced figure transfer; Through the figure transfer technology of routine resolution chart is transferred to (in same batch sheet resistance substrate, getting one gets final product) on the sheet resistance substrate at last, on the sheet resistance substrate, formed the test resistance figure this moment.
A kind of detection method of sheet resistance substrate unit resistance of testing mould may further comprise the steps: use multimeter, through the resistance on the probe in detecting measurement point, draw sheet resistance substrate unit resistance.
Since testing mould actual from the sheet resistance substrate aniseed cutting get off, so the unit resistance on the testing mould actual be exactly the unit resistance of sheet resistance substrate.
The sheet resistance substrate is the substrate that contains thin film resistive layer, is used for the printed wiring board of production strip resistance.The mode of production of sheet resistance substrate is that Copper Foil that contains resistance film and substrate are pressed together, and is made into the sheet resistance substrate.
The unit resistance of sheet resistance substrate refers in uniform thin film resistive layer, the resistance of different area, and when its length L is identical with width W ratio, its resistance is equal; When this ratio is 1 (length L=width W), resistance is the unit resistance of the sheet resistance substrate of this kind material.
The theoretical calculation formula of unit resistance: R=ρ * L/d*W
ρ=resistivity; D=resistance material thickness; L=resistance length; W=resistance width; When the material of forming resistance and fixed thickness, resistance is only by L, W decision; When L=W, promptly be the implication of unit resistance.
At first to prepare the sheet resistance substrate, distinguish the copper-clad surface of strip resistance thin layer; The sheet resistance Copper Foil is the metal alloy layer that is electroplated onto the Copper Foil hair side through sputtering technology control.
When on the sheet resistance substrate, pasting dry film, temperature is 105-115 ℃; Pressure is 4.5-5.5Kg/cm
2Speed is 0.9-1.1m/min.Conditions of exposure: control optical density chi is the 6-7 level.Development conditions: Na
2CO
30.9-1.2%; PH value＞10.5; Temperature 28-32 ℃; Pressure 1.3-1.6Kg/cm
2Developing powder 2.5-3.0 m/min.
During acid etching, Cu
2+Concentration is 140-175g/L; HCL is 1.5-2.5mol/L; NaClO
315-60 mol/L; Temperature is 42-58 ℃.
During the unnecessary resistive film of etching, CuSO
4Concentration is 245-255g/L; H
2SO
43-5 ml/L; Temperature 85-95 ℃.
The stickup dry film of figure transfer for the second time, exposure, development conditions with the first time figure transfer identical.
During alkali etching, Cu
2+Concentration is 120-140g/L; CL
-4.5-5.5mol/L; NaClO
315-60 mol/L; Temperature 42-58 ℃.
The testing mould that uses the multimeter measurement to make: the ohms range that the gear of multimeter is adjusted into measuring resistance; Use two probes of multimeter to click the measurement point figure respectively; Can read resistance from the multimeter reading, this resistance is the unit resistance of sheet resistance substrate.
Compared with prior art, beneficial effect is: a kind of testing mould of the present invention and preparation method thereof, and utilize the detection method of the sheet resistance substrate unit resistance of said testing mould.The existing formula computing method of resulting unit resistance value ratio are more accurate, can realize the control of high-precision resistance, and can be fast, easy detection goes out the effective unit resistance of sheet resistance substrate.
Description of drawings
Fig. 1 is a testing mould synoptic diagram of the present invention;
Fig. 2 is a measurement point synoptic diagram of the present invention.
Embodiment
Like Fig. 1, shown in Figure 2, a kind of testing mould, wherein, testing mould is made up of a plurality of measurement points of arranging in length and breadth 2.The length L of measurement point 2 equates with width W.Testing mould length is 24 inches, and width is 12 inches; The length L of measurement point 2 equates with width W.Detect measurement point 2 realization detections through testing mould with multimeter, the existing formula computing method of resulting unit resistance value ratio are accurate more and quick.
A kind of method for making of testing mould wherein, may further comprise the steps:
Step 1: through software design test resistance figure; The film that uses when the mode of painting through light is then produced figure transfer; Through figure transfer technology resolution chart is transferred on the sheet resistance substrate at last, on the sheet resistance substrate, formed the test resistance figure;
Step 2: cut out needed size, pass through internal layer figure transfer, acid etching, the unnecessary resistance film of etching again from the sheet resistance substrate; Produce half-finished testing mould.
Step 3: half-finished testing mould passes through internal layer figure transfer, alkali etching operation again, on the sheet resistance substrate, produces final testing mould.
A kind of detection method of sheet resistance substrate unit resistance of testing mould wherein, may further comprise the steps: use multimeter, through the resistance on the probe in detecting measurement point 2, draw sheet resistance substrate unit resistance.Since testing mould actual from the sheet resistance substrate aniseed cutting get off, so the unit resistance on the testing mould actual be exactly the unit resistance of sheet resistance substrate.Testing mould is through acid etching and the unnecessary resistive film of etching, expose the test resistance thin layer behind figure transfer and the alkali etching for the second time; Use multimeter; Through the resistance of the measurement point in the probe in detecting testing mould 2, can draw sheet resistance substrate unit resistance.
The sheet resistance substrate is the substrate that contains thin film resistive layer, is used for the printed wiring board of production strip resistance.The mode of production of sheet resistance substrate is that Copper Foil that contains resistance film and substrate are pressed together, and is made into the sheet resistance substrate.The sheet resistance substrate has three-decker usually, is positioned at the substrate of bottom, and cover film resistive layer on the substrate, thin film resistive layer are to electroplate at the hair side of Copper Foil through sputtering technology, and top layer is a copper foil layer.
The unit resistance of sheet resistance substrate refers in uniform thin film resistive layer, the resistance of different area, and when its length L is identical with width W ratio, its resistance is equal; When this ratio is 1 (length L=width W), resistance is the unit resistance of the sheet resistance substrate of this kind material.
The theoretical calculation formula of unit resistance: R=ρ * L/d*W
ρ=resistivity; D=resistance material thickness; L=resistance length; W=resistance width; When the material of forming resistance and fixed thickness, resistance is only by L, W decision; When L=W, promptly be the implication of unit resistance.
Concrete manufacturing process is following:
At first to prepare the sheet resistance substrate, distinguish the copper-clad surface of strip resistance thin layer; The sheet resistance Copper Foil is the metal alloy layer that is electroplated onto the Copper Foil hair side through sputtering technology control.
When on the sheet resistance substrate, pasting dry film, temperature is 105-115 ℃; Pressure is 4.5-5.5Kg/cm
2Speed is 0.9-1.1m/min.Conditions of exposure: control optical density chi is the 6-7 level.Development conditions: Na
2CO
30.9-1.2%; PH value＞10.5; Temperature 28-32 ℃; Pressure 1.3-1.6Kg/cm
2Developing powder 2.5-3.0 m/min.
During acid etching, Cu
2+Concentration is 140-175g/L; HCL is 1.5-2.5mol/L; NaClO
315-60 mol/L; Temperature is 42-58 ℃.
During the etching resistive film, CuSO
4Concentration is 245-255g/L; H
2SO
43-5 ml/L; Temperature 85-95 ℃.
The stickup dry film of figure transfer for the second time, exposure, development conditions with the first time figure transfer identical.
During alkali etching, Cu
2+Concentration is 120-140g/L; CL
-4.5-5.5mol/L; NaClO
315-60 mol/L; Temperature 42-58 ℃.
The testing mould that uses the multimeter measurement to make: the ohms range that the gear of multimeter is adjusted into measuring resistance; Use two probes of multimeter to click measurement point 2 figures respectively; Can read resistance from the multimeter reading, this resistance is the unit resistance of sheet resistance substrate.
The above only is a preferred implementation of the present invention, should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention, can do the improvement of some suitable actual conditions to the technical scheme of invention.Therefore, protection scope of the present invention is not limited thereto, and those of skill in the art are any to be included within protection domain of the present invention based on non-material change on the technical scheme of the present invention.
Claims (4)
1. testing mould is characterized in that: testing mould is made up of a plurality of measurement points of arranging in length and breadth (2).
2. a kind of testing mould according to claim 1 is characterized in that: the length L of described measurement point (2) equates with width W.
3. the method for making of a testing mould comprises claim 1 or 2 described measurement points (2), it is characterized in that, may further comprise the steps:
Step 1: through software design test resistance figure; The film that uses when the mode of painting through light is then produced figure transfer; Through figure transfer technology resolution chart is transferred on the sheet resistance substrate at last, on the sheet resistance substrate, formed the test resistance figure;
Step 2: cut out needed size, pass through internal layer figure transfer, acid etching, the unnecessary resistance film of etching again from the sheet resistance substrate; Produce half-finished testing mould;
Step 3: half-finished testing mould passes through internal layer figure transfer, alkali etching operation again, on the sheet resistance substrate, produces final testing mould.
4. detection method of utilizing the sheet resistance substrate unit resistance of the said testing mould of claim 1; It is characterized in that may further comprise the steps: use multimeter; Through the resistance on the probe in detecting measurement point (2), draw sheet resistance substrate unit resistance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104503330A CN102520252A (en) | 2011-12-29 | 2011-12-29 | Test mold, manufacturing method thereof, and film resistor substrate unit resistance detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104503330A CN102520252A (en) | 2011-12-29 | 2011-12-29 | Test mold, manufacturing method thereof, and film resistor substrate unit resistance detection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102520252A true CN102520252A (en) | 2012-06-27 |
Family
ID=46291240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104503330A Pending CN102520252A (en) | 2011-12-29 | 2011-12-29 | Test mold, manufacturing method thereof, and film resistor substrate unit resistance detection method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107449969A (en) * | 2017-09-14 | 2017-12-08 | 无锡格菲电子薄膜科技有限公司 | The measurement apparatus and measuring method of the resistance of Electric radiant Heating Film |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0282169A (en) * | 1988-09-20 | 1990-03-22 | Tanaka Kikinzoku Kogyo Kk | Substrate for measuring temperature coefficient of resistance of thin film |
| CN1764844A (en) * | 2003-03-26 | 2006-04-26 | Jsr株式会社 | Connector for measurement of electric resistance, connector device for measurement of electric resistance and production process thereof, and measuring apparatus and measuring method of electric resis |
| TW200928381A (en) * | 2007-12-28 | 2009-07-01 | Mei-Huei Wu | Universal test device capable of testing precision resistance |
| CN101483975A (en) * | 2008-12-26 | 2009-07-15 | 广州杰赛科技股份有限公司 | Manufacturing method for planar resistor printed board with thick metal plated on circuit surface |
-
2011
- 2011-12-29 CN CN2011104503330A patent/CN102520252A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0282169A (en) * | 1988-09-20 | 1990-03-22 | Tanaka Kikinzoku Kogyo Kk | Substrate for measuring temperature coefficient of resistance of thin film |
| CN1764844A (en) * | 2003-03-26 | 2006-04-26 | Jsr株式会社 | Connector for measurement of electric resistance, connector device for measurement of electric resistance and production process thereof, and measuring apparatus and measuring method of electric resis |
| TW200928381A (en) * | 2007-12-28 | 2009-07-01 | Mei-Huei Wu | Universal test device capable of testing precision resistance |
| CN101483975A (en) * | 2008-12-26 | 2009-07-15 | 广州杰赛科技股份有限公司 | Manufacturing method for planar resistor printed board with thick metal plated on circuit surface |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107449969A (en) * | 2017-09-14 | 2017-12-08 | 无锡格菲电子薄膜科技有限公司 | The measurement apparatus and measuring method of the resistance of Electric radiant Heating Film |
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Application publication date: 20120627 |