CN102514142A - Quantitative glue injection device of high-temperature resin transfer mold - Google Patents
Quantitative glue injection device of high-temperature resin transfer mold Download PDFInfo
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- CN102514142A CN102514142A CN2011104128477A CN201110412847A CN102514142A CN 102514142 A CN102514142 A CN 102514142A CN 2011104128477 A CN2011104128477 A CN 2011104128477A CN 201110412847 A CN201110412847 A CN 201110412847A CN 102514142 A CN102514142 A CN 102514142A
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Abstract
The invention discloses a quantitative glue injection device of a high-temperature resin transfer mold. The quantitative glue injection device of the high-temperature resin transfer mold comprises a high-pressure gas source, a pressure gage, a pressure valve, a vacuum pump, a resin pot, a condenser tube, an oil-bath heating system and a mold. The quantitative glue injection device of the high-temperature resin transfer mold is characterized in that the quantitative glue injection device also comprises a digitized temperature-control system; the resin pot has a small volume; a material outlet interface located at the bottom of the resin pot having a small volume is connected to the mold through a material discharge valve and a joint; a cover of the resin pot having a small volume is provided with a gas source interface, a material feeding interface and a vacuum pump interface; the gas source interface is connected to the high-pressure gas source through the pressure valve and the pressure gage; the material feeding interface is connected to a resin material interface through a feeding valve; the vacuum pump interface is connected to the vacuum pump by a pump switch; the resin pot having a small volume is provided with the digitized temperature-control system; and the digitized temperature-control system is controllably connected to the condenser tube and the oil-bath heating system.
Description
Technical field
The present invention relates to the Composite Preparation technology, be specially a kind of quantitative glue injection device of high-temperature resin transfer modling.
Background technology
Resin transfer moulding technology (RTM) is a kind of forming technique of composite.Characteristics such as this technology has the raw material availability height, and production cost is low, and product can locally strengthen, and fineness is good, and dimensional accuracy is high, and technology is simple are the best composite material process plannings of present overall target.Though RTM technology cost is lower, specification requirement is higher.Tradition RTM shaped device is applicable to middle batch, low temperature (40～60 ℃) injecting glue and makes medium-and-large-sized member.This traditional RTM device is inappropriate for high temperature (being higher than 150 ℃) injecting glue and the application of small members in RTM technology.For example; Bimaleimide resin; Have only when temperature during up to 175 ℃, its viscosity could satisfy the requirement of RTM injecting glue technology, and when using existing RTM device to use this resin injecting glue because temperature does not reach requirement; Resin viscosity can't well soak into prefabricated component too greatly, causes the product porosity to increase; Again for example, for small members,, when using existing RTM device to make,, resin cause the practical efficiency of resin very low owing to need being full of each pipeline like the carbon fibre composite phone housing.
At present both at home and abroad when the higher resin of application viscosity, mainly through two kinds of approach: a kind of approach is to add diluent, the reduction resin viscosity; Another kind of approach is that resin is carried out modification, improves its flowability.But these two kinds of approach have all reduced the original performance of resin, like hot strength, bending strength, shock resistance, toughness and hear resistance etc., reduction are in various degree arranged all." offing normal " RTM technology that proposed in recent years, though performance of products improves, this technological operation is complicated; Can not be widely used, when using existing RTM device manufacturing small-sized member, because the resin utilization rate is low; Cost significantly improves, and also fails to be widely used.
In applicant's range of search, the device for preparing composite about the resin transfer molding (RTM) process with quantitative glue injection and high temperature injecting glue function does not see that still bibliographical information is arranged.
Summary of the invention
To the deficiency of prior art, the technical problem that quasi-solution of the present invention is determined is that a kind of quantitative glue injection device of high-temperature resin transfer modling is provided.Advantages such as this device has the function of quantitative glue injection and high temperature injecting glue, and has simple in structurely, easy to operate, saves the glue amount, and is with low cost.
The technical scheme that the present invention solves said device technique problem is: the quantitative glue injection device that designs a kind of high-temperature resin transfer modling; This device comprises high-pressure air source, Pressure gauge, pressure valve, vavuum pump, resin container, condenser pipe, oil bath heating system and mould; It is characterized in that also comprising digital temperature control system; Described resin container is little volume resin container; And the discharging interface in little volume resin container bottom directly is connected with mould with joint through the discharging valve, and the cover of little volume resin container is provided with gas source interface, charging interface and vavuum pump interface, and gas source interface is connected with high-pressure air source through pressure valve, Pressure gauge; The charging interface is connected with resin material mouth through the charging valve, and the vavuum pump interface is connected with vavuum pump through switch pump; Digital temperature control system is housed, temperature control system and condenser pipe and oil bath heating system control connection on the said little volume resin container.
Compared with prior art; High temperature quantitative glue injection device of the present invention has been abandoned the big volume resin container that conventional resins transfer modling injection device uses; Use little volume fat jar (I reaches 0.3 liter) instead, reduced the waste of resin, reduced production cost effectively; Very easy to use, and suitable preparation volume small construction part; Adopt joint to replace traditional conveyance conduit, the temperature control equipment on the use conveyance conduit directly connects resin container and mould, compares with conventional resins transfer modling device to have following technique effect: apparatus structure has been simplified in (1); (2) reduced the waste of resin in the conveyance conduit; (3) reduce resin flow process in the injecting glue process, helped successfully injecting glue; (4) shortened the resin flow time in the injecting glue process, in time injecting glue has avoided high-temperature resin to react the adverse effect of bringing; (5) avoided having reduced resin viscosity, improved quality of item because of resin mobile resin temperature that causes of long distance in conveyance conduit changes.Experimental check shows: apparatus of the present invention are simple in structure, and are easy to operate, cost savings, and product quality greatly improves.
Description of drawings
Fig. 1 is the overall structure sketch map of a kind of embodiment of quantitative glue injection device of high-temperature resin transfer modling of the present invention.
The specific embodiment
Further narrate the present invention below in conjunction with embodiment and accompanying drawing thereof.Specific embodiment does not limit the application's claim.
The present invention designs the quantitative glue injection device of high-temperature resin transfer modling (hereinafter to be referred as device; Referring to Fig. 1); This device comprises high-pressure air source 1, Pressure gauge 2, pressure valve 3, vavuum pump 8, resin container 11, condenser pipe 13, oil bath heating system 14 and mould 19; It is characterized in that also comprising digital temperature control system (abbreviation temperature control system) 12, described resin container is little volume resin container 11, and directly links to each other with mould 19 with joint 17 through discharging valve 16 at the discharging interface 15 of little volume resin container 11 bottoms; The cover of little volume resin container 11 is provided with gas source interface 4, charging interface 7 and vavuum pump interface 10; Gas source interface 4 is connected with high-pressure air source 1 through pressure valve 3, Pressure gauge 2, and charging interface 7 is connected with resin material mouth 5 through charging valve 6, and vavuum pump interface 10 is connected with vavuum pump 8 through switch pump 9; Digital temperature control system (abbreviation temperature control system) 12 is housed, temperature control system 12 and condenser pipe 13 and oil bath heating system 14 control connections on the said little volume resin container 11.
The decision design parameter of apparatus of the present invention is: little volume resin container 11 volumes are 0.3～0.6 liter, and the rated pressure value is 0-5Mpa, and vacuum is-0.1-0Mpa that heating-up temperature is adjustable in 30～300 ℃ of scopes.These parameters design according to the performance of used resin and the technological requirement of product.
Apparatus of the present invention adopt high-temperature resin transfer modling quantitative glue injection technology, have following premium properties:
(1) apparatus of the present invention have good heating function.Only in the heating of resin container bottom, resin temperature is inhomogeneous in the resin container for traditional RTM device.The condenser pipe 13 and the oil bath heating system 14 of apparatus of the present invention are installed on the bottom and tank skin of little volume resin container 11; The bottom and the tank skin of temperature control system 12 controlled system condenser pipes 13 and 14 pairs of little volume resin containers 11 of oil bath heating system heat respectively or simultaneously; Heating surface (area) (HS is big, and guarantees that the resin temperature in the little volume resin container 11 is even.For adapting to different resins, different process demands of different to the injecting glue temperature; The present invention has adopted the bigger temperature control system 12 of serviceability temperature scope; The adjustable temperature scope is 0～300 ℃, and the temperature adjustment accuracy Design is ± 0.5 ℃, makes the range of application of this device obtain large increase.Temperature control system of the present invention is being controlled connected condenser pipe 12 and oil bath heating system 13; The temperature sensor (not drawing among Fig. 1) that is connected with little volume resin container 11 is arranged in it; Temperature in the little volume resin container 11 of temperature control system 12 monitoring in real time; And compare with the temperature of temperature that monitors and setting, according to the use power of organic adjusting condenser pipe 13 of comparing result and oil bath heating system 14, till the temperature of the temperature of real-time monitoring and setting is consistent.
(2) apparatus of the present invention have good vacuum defoamation function.Tradition RTM device does not have this function.Having now has some stable and very difficult bubbles of getting rid of in the resin that mixes, if these bubbles are failed to access effective elimination and entered in the mould, product just has certain porosity, and performance of products can't arrive assurance.Apparatus of the present invention vacuumize with 8 pairs of little volume resin containers 11 of vavuum pump earlier before resin injects, and make it reach the vacuum of design; Close vavuum pump 8; Open charging valve 6, because suction function, the resin that mixes is sucked into the little volume fat jar 11 of tree; When amount of resin reaches designing requirement in the little volume resin container 11, close charging valve 6; And then the resin of once opening in 8 pairs of little volume resin containers 11 of vavuum pump carries out deaeration.Resin in the little volume resin container 11 is through after the deaeration, and the porosity of product obviously reduces, and the quality of product is guaranteed and improves.
(3) apparatus of the present invention have good quantitative glue injection function.Tradition RTM shaped device is applicable to makes medium-and-large-sized member, and the resin container volume is very big, and the conveyance conduit length between resin container and the mould is longer, and the space is also very big in the conveyance conduit.When making some small members, the utilization rate of resin is very low, has wasted resin greatly.To this phenomenon, apparatus of the present invention have designed little volume resin container 11, and adopt joint 17 directly to be connected with mould 19 with little volume resin container 11, have replaced the conveyance conduit in traditional RTM device.Experiment shows that apparatus of the present invention have improved the resin utilization rate greatly.
(4) apparatus of the present invention have good high temperature injecting glue function.Tradition RTM shaped device does not have the function of high temperature injecting glue.For the higher resin of viscosity, under existing injecting glue temperature, can be applicable to RTM technology in order to make resin viscosity, mainly through two kinds of approach: the one, add diluent, the 2nd, resin is carried out modification.Yet the cost of these two kinds of approach all is to have reduced resinogen performance is arranged.Apparatus of the present invention have been owing to adopted temperature control system 12 efficiently, and adopt joint 17 directly to connect design, have given apparatus of the present invention high temperature and stable injecting glue function, and embodiment is the highest can be heated to 300 ℃; Simultaneously; Designed joint 17 replaces the connected mode of direct and little volume resin container 11 of the conveyance conduit in the conventional apparatus and mould 19; Effectively reduced flowing time and the distance of high-temperature resin in conveyance conduit; Avoided the reaction of resin, particularly sensitive resin in the flow process and the harmful effect that variations in temperature produces, thereby can guarantee that the reality of technological design implements, quality of item is greatly improved.
Apparatus of the present invention are used technical process (referring to Fig. 1) as follows:
At first the fiber reinforcement prefabricated component is packed in the mould 19, the die cavity of this mould 19 is consistent with the preform product net shape; Secondly, closing presure valve 3, charging valve 6 and discharging valve 16 start 8 pairs of little volume resin containers 11 of vavuum pump and vacuumize, and reach till the vacuum of designing requirement, close vavuum pump 8; Open charging valve 6 then, under action of negative pressure, pre-configured resin is in charging aperture 5 is inhaled into little volume resin container 11, and resin is closed charging valve 6 after injecting and finishing; Start 8 pairs of little volume resin containers 11 of vavuum pump once more and vacuumize, make vacuum reach production engineering specifications, get rid of the bubble in the resin in the little volume resin container 11; Close vavuum pump 8 and switch pump 9, start temperature control system 12, set temperature in the little volume resin container 11, make temperature control system 12 in running order according to technological requirement; When temperature reaches setting value; Open pressure valve 3; According to technological requirements such as different fiber volume fractions, preform structure, set needed pressure (generally in 0.1-5Mpa, selecting), open discharging valve 16 simultaneously; Resins in the little volume resin container interior 11 directly are injected under setting pressure in the mould 19, and progressively uniformly penetrating is to the fibre reinforced materials that is placed in advance in the mould 19; When resin 18 when flowing out, has promptly been accomplished the injection of resin from the plastic hole of mould 19; Then, close discharging valve 16 and plastic hole 18, by routine solidify system to mould 19 heat up solidify after, promptly accomplished the quantitative glue injection preparation of composite high-temperature resin transfer modling.
The present invention does not address part and is applicable to prior art.
Provide specific embodiment of the present invention below.These embodiment only are used to further specify the present invention, do not limit the protection domain of application claim of the present invention.
Apparatus of the present invention adopt 170 ℃ of high temperature quantitative glue injection prepared bar shaped composite prefabricated components.
At first, fiber preform is packed in the mould 19, the die cavity of this mould 19 is consistent with bar shaped composite prefabricated component shape; The closing presure valve 3 then, charging valve 6 and discharging valve 16; Start 8 pairs of little volume resin containers 11 of vavuum pump (volume is 0.5 liter), vacuumize, close vavuum pump 8 when reaching vacuum for 0.1Mpa; Open charging valve 6, bimaleimide resin pre-configured under action of negative pressure is in resin material mouth 5 is inhaled into little volume resin container 11, and resin is closed charging valve 6 after injecting and finishing; Play startup vavuum pump 8 once more and vacuumize, the vacuums in the little volume resin container 11 are reached-0.1Mpa, get rid of the bubble in the resins in the resin container 11; Closing vavuum pump 8 and switch pump 9, start temperature control system 12, is 170 ℃ according to the technological requirement design temperature, makes temperature control system 12 in running order; When temperature reaches 170 ℃; Open pressure valve 3; Technological requirement setting pressures such as structure according to fiber volume fraction, prefabricated component are 1.2Mpa; Open discharging valve 16 simultaneously, the resins in the little volume resin container interior 11 directly are injected in the mould 19 under the gas effect that pressure is arranged, uniformly penetrating is to the fibre reinforced materials that is placed in advance in the mould 19; When injecting resin when flow out the plastic hole 18 of mould 19, promptly accomplished the injection of resin; Close discharging valve 16 and plastic hole 18, solidify system to mould 19 curing that heats up by routine again, promptly accomplished the preparation of bar shaped composite prefabricated component.The RTM device traditional with utilization; And compare through adding the composite test specimen that diluent reduces the preparation of resin viscosity method; Apparatus of the present invention are simple to operate, and the composite test specimen hot strength, bending strength, shock resistance, toughness, hear resistance of preparation etc. all have raising in various degree.
Embodiment 2
Apparatus of the present invention adopt TDE-86 epoxy resin and high temperature quantitative glue injection prepared tension test standard specimen.
At first, fiber preform is packed in the mould 19, the die cavity of this mould 19 is consistent with tension test standard specimen shape; The closing presure valve 3 then, charging valve 6 and discharging valve 16; Start 8 pairs of little volume resin containers 11 of vavuum pump (volume is 0.5 liter) and vacuumize, close vavuum pump 8 when reaching vacuum for-0.1Mpa; Open charging valve 6, TDE-86 epoxy resin pre-configured under action of negative pressure is in resin material mouth 5 is inhaled into little volume resin container 11, and resin is closed charging valve 6 after injecting and finishing; Play startup vavuum pump 8 once more and vacuumize, the vacuums in the little volume resin container 11 are reached-0.01Mpa, get rid of the bubble in the resins in the resin container 11; Closing vavuum pump 8 and switch pump 9, start temperature control system 12, is 170 ℃ according to the technological requirement design temperature, makes temperature control system 12 in running order; When temperature reaches 170 ℃; Open pressure valve 3; Technological requirement setting pressures such as structure according to fiber volume fraction, prefabricated component are 0.3Mpa; Open discharging valve 16 simultaneously, the resins in the little volume resin container interior 11 directly are injected under the gas of pressure is arranged in the mould 19, uniformly penetrating is to the fibre reinforced materials that is placed in advance in the mould 19; When injecting resin when flow out the plastic hole 18 of mould 19, promptly accomplished the injection of resin; Close discharging valve 16 and plastic hole 18, solidify system to mould 19 curing that heats up by routine again, promptly accomplished the preparation of bar shaped composite prefabricated component.Compare with the composite test specimen that the traditional RTM device of utilization prepares, embodiment of the invention design operation is simple, and the utilization rate of resin is doubled.
Claims (3)
1. the quantitative glue injection device of a high-temperature resin transfer modling; This device comprises high-pressure air source, Pressure gauge, pressure valve, vavuum pump, resin container, condenser pipe, oil bath heating system and mould; It is characterized in that also comprising digital temperature control system; Described resin container is little volume resin container; And the discharging interface in little volume resin container bottom directly is connected with mould with joint through the discharging valve, and the cover of little volume resin container is provided with gas source interface, charging interface and vavuum pump interface, and gas source interface is connected with high-pressure air source through pressure valve, Pressure gauge; The charging interface is connected with resin material mouth through the charging valve, and the vavuum pump interface is connected with vavuum pump through switch pump; Digital temperature control system is housed, temperature control system and condenser pipe and oil bath heating system control connection on the said little volume resin container.
2. according to the quantitative glue injection device of the said high-temperature resin transfer modling of claim 1; It is characterized in that this Design of device parameter is: little volume resin container volume is 0.3～0.6 liter; The rated pressure value is 0-5Mpa; Vacuum is-0.1-0Mpa, and heating-up temperature is adjustable in 30～300 ℃ of scopes, and the temperature adjustment precision is ± 0.5 ℃.
3. according to the quantitative glue injection device of the said high-temperature resin transfer modling of claim 1; It is characterized in that described condenser pipe and oil bath heating system are installed on the bottom and tank skin of little volume resin container, controlled system condenser pipe of temperature control system and oil bath heating system heat respectively or simultaneously the bottom and the tank skin of little volume resin container.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011104128477A CN102514142A (en) | 2011-12-12 | 2011-12-12 | Quantitative glue injection device of high-temperature resin transfer mold |
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| CN2011104128477A CN102514142A (en) | 2011-12-12 | 2011-12-12 | Quantitative glue injection device of high-temperature resin transfer mold |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103483774A (en) * | 2013-09-24 | 2014-01-01 | 滕州市华海新型保温材料有限公司 | High-performance solid buoyancy material and preparation method thereof |
| CN104441689A (en) * | 2014-12-05 | 2015-03-25 | 广州市凯思勒新材料科技有限公司 | RTM molding process suitable for fiber composite material |
| CN104526954A (en) * | 2014-12-15 | 2015-04-22 | 湖北三江航天红阳机电有限公司 | Resin transfer molding glue-injecting device |
| CN106527543A (en) * | 2016-11-26 | 2017-03-22 | 共享铸钢有限公司 | Automatic casting resin temperature control system |
| CN106739012A (en) * | 2016-12-13 | 2017-05-31 | 北京鸿鹄雄狮技术开发有限公司 | A kind of composite shaped platform |
| CN109130065A (en) * | 2018-08-28 | 2019-01-04 | 宁夏龙江化工科技有限公司 | A kind of quantitative glue injection device of high-temperature resin transfer modling |
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| CN101232985A (en) * | 2005-07-27 | 2008-07-30 | 三菱重工业株式会社 | RTM process |
| CN101269548A (en) * | 2008-05-09 | 2008-09-24 | 天津工业大学 | Device and method for preparing composite material with resin transfer molding technique |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103483774A (en) * | 2013-09-24 | 2014-01-01 | 滕州市华海新型保温材料有限公司 | High-performance solid buoyancy material and preparation method thereof |
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| CN104526954A (en) * | 2014-12-15 | 2015-04-22 | 湖北三江航天红阳机电有限公司 | Resin transfer molding glue-injecting device |
| CN104526954B (en) * | 2014-12-15 | 2016-08-31 | 湖北三江航天红阳机电有限公司 | A kind of resin transfer moulding glue filling device |
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| CN106739012A (en) * | 2016-12-13 | 2017-05-31 | 北京鸿鹄雄狮技术开发有限公司 | A kind of composite shaped platform |
| CN109130065A (en) * | 2018-08-28 | 2019-01-04 | 宁夏龙江化工科技有限公司 | A kind of quantitative glue injection device of high-temperature resin transfer modling |
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Application publication date: 20120627 |