CN102508528B - Fully sealed cloud computing server - Google Patents
Fully sealed cloud computing server Download PDFInfo
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- CN102508528B CN102508528B CN201110295291.8A CN201110295291A CN102508528B CN 102508528 B CN102508528 B CN 102508528B CN 201110295291 A CN201110295291 A CN 201110295291A CN 102508528 B CN102508528 B CN 102508528B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The invention discloses a fully sealed cloud computing server and a radiating system. A network card and a display card are integrated on a server mainboard of the server in advance, a CPU (central processing unit), a memory and a solid state disk SSD are mounted on the mainboard in an attached manner, so that a blade server used for realizing a computing function is formed, and the high-density clustered blade server is mounted in a radiating chamber. The fully sealed cloud computing server is characterized in that network cables, USB (universal serial bus) lines and power lines in circuits of the mainboard of the server are arranged in an edge area of the mainboard in a centralized manner, a line concentration slot is simultaneously assorted in the area, a power and data line mixing plug is fittingly inserted in the concentration slot, a mixed line is led out of the server, and the server only provided with the slot and the mixed line can be formed; and the server is sealed by a metal container or sealed by heat conducting insulating materials, the metal container is shorter than 1cm, and the heat conducting insulating materials are high-polymer resin and are solidified on the surface of the server to form an insulating heat conducting wrapping layer. The fully sealed cloud computing server and the radiating system have the advantages that heat of a micro-server cluster can be dissipated in a centralized manner, a large amount of energy can be saved, and the server is miniaturized and standardized and is low in cost.
Description
Technical field
The present invention relates to a kind of hermetically sealed server for cloud computing and cooling system, specifically, that the computational resource of cloud computing is separated with storage resources, its computational resource hardware: the outside of blade server adopts insulating heat-conduction material sealing, and be arranged on thick and fast in heat dissipation chamber, natural water-cooled or air-cooled by heat dissipation chamber to blade server carry out concentrate heat radiation.
Background technology
Mainly there are following two hang-ups in Internet data center IDC (Internet Data Center): energy consumption and heat radiation.This two hang-up constrains the development of cloud computing.At present, the development trend of cloud computing infrastructure is: the maximization of server, virtual.Therefore, the configuration of its server can be more and more higher, and the CPU in cabinet and the thermal value of chipset are also thereupon increasing.The hardware configured by height as Vmware and Hyper-V etc. by virtualization software or hardware combinations are virtualized into the operating unit of multi-user, these operating units are distributed to different users, really can saving resource and the energy.Its shortcoming is: a main frame is out of order, its distribute so virtual machine all can not normally use.And in large-scale server, arrangement concentrated by a large amount of blade, and every block blade mainboard is configured with one or more CPU, and during work, thermal value is quite large, current general most employing powerful fan is ventilated, then by the air-conditioning heat dissipation of machine room.With regard to single server radiating system, green energy conservation not enough, its heat radiation facility need to improve.
The heat dissipation capacity of blade server is very high, the mode of heat radiation in general employing machine, as the ventilation and heat of fan, also has the radiating mode holding conduction oil in machine: be immersed in the conduction oil of insulation by server master board or blade, walk heat by the tape loop of conduction oil.Chinese Patent Application No. CN201020521760.4 discloses and a kind ofly computer motherboard is immersed in the method for carrying out in conduction oil dispelling the heat, and the heat on mainboard, by conduction oil, is delivered to the container holding conduction oil, then by container heat loss through conduction.Its shortcoming is that installation, management, maintenance are all inconvenient, and cost is higher.
Except radiating mode in machine, also have and server sealed or the process of semitight, and the mode adopting machine to dispel the heat outward.Chinese Patent Application No. CN200910105798.5 discloses a kind of main frame scheme sealing fan-free band tank mute water intelligent heat dissipation, mainframe box is adopted hermetic mode, and adopts water-cooling.But its complicated structure, computing machine volume is larger.Chinese Patent Application No. CN200910190442.6 discloses a kind of enclosed waterproof terminal, and have employed " metal shell of water-tight " mode, the chip cooling on its mainboard utilizes heat loss through conduction, and adopts drip-proof fan outward to dispel the heat at housing.But the sealing function of this configuration is only for waterproof, and non-used water dispels the heat.Chinese Patent Application No. CN201010149540.8 discloses a kind of dustproof design method for computer with completely sealed key components, and computer motherboard is carried out dust-proof isolation, and dispels the heat to critical component heat radiator.This mode is only dust-proof isolation, and the program is also not a kind of scheme utilizing natural air or natural water to solve heat dissipation problem.
I/O (input/output port) on common server master board is distributed in the surrounding of mainboard, and numerous interface slots has been installed, as: IDE hard disk slot, memory bank, USB slot, com port slot, PCI slot, power supply slot etc., the height of monoblock mainboard is at more than 2cm, installed memory bar and cpu fan, bare machine just reaches the height of 4cm.As server, only just need to use above-mentioned I/O interface when carrying out machine hardware maintenance, software installation, and the time of safeguarding in 1 year only has several hours, high-end server even can accomplish that several years zero dimensions are protected.Can find out, in the normal use of server, nearly all time, the I/O interface of server only needs power lead and netting twine.
At present, the body thinner thickness of industrial computer, the mode that employing machine dispels the heat outward, but industrial computer is higher for the requirement of I/O port, and interface slot can be more; The configuration of UMPC (Ul tra-mobile Personal Computer) and MID (Mobile Internet Devices), also improves the configuration of mainboard, decreases bare machine height; Smart mobile phone, comprises waterproof smart mobile phone, and powerful volume is less, but cell phone mainboard is still configured with a lot of I/O slots, as SIM card, TF card, camera, earphone, USB slot etc.Can find out, these devices must be equipped with numerous I/O interfaces could meet product function demand.
The above, though existing technical scheme relate to heat radiation and the sealing of computing machine, the improvement of computer motherboard and microminiaturization, but all fail to provide the system design and confuration of preferably server master board I/O interface, also fail that provide volume less, that especially body height is thinner server sealing solution.
At present, the radiating mode of data center is: be furnished with heat abstractor in single server, then makes integral heat sink by the air-conditioning of machine room, and this mode energy consumption is very high, and namely PUE (Power Usage Effect iveness) value is very high.Domestic data center PUE value is general about 2, causes huge waste of energy.In server, computational resource and storage resources are normally combined, but the heat dissipation capacity of computational resource is more much higher than the heat dissipation capacity of storage resources.Therefore, the computational resource of cloud computing does heat radiation is separately preferred version.
In addition, in cloud computing, virtualized resource distribution also also exists problem of data safety, one, and hacker can carry out the total equipment of attacking system by renting one of them virtual unit, reads the ephemeral data in server, as the user data in internal memory; Its two, the administrator right of virtual equipment can the resource distribution of leading subscriber, as this authority is illegally used, then likely can cause divulging a secret and losing of user data.This just makes user there is safety worries to publicly-owned cloud system.
In addition, when there is legal dispute, virtual fileinfo, also more difficult confirmation legal ascription, obviously, the data sovereignty of user are difficult to be protected.If but the property rights of monolithic server blade are sole users, then data file entitlement wherein just becomes very clear and definite.
Described in comprehensive, the maximization of cloud computing server, virtual be a technological development direction, but still there is larger heat radiation and energy consumption problem, in prior art, still just there is no good solution; And the another one development trend of cloud computing server is microminiaturized, standardization, and energy consumption, heat radiation and the data question of sovereign right to be solved by a series of technical scheme.
The present invention is the solution made from regard to cloud computing server microminiaturization, standardization aspect, propose a kind of hermetic cloud computing server and cooling system, both the sealing completely to basic computer can have been realized, the configuration of minimum volume is realized with preferably sealing means, simultaneously, to server accepted standard structural allocation, the blade server of a composition fixed configurations, can use natural air cooled and water-cooled to complete heat radiation after its sealing.Therefore a large amount of electric energy can be saved.Blade server is mainly used in making computational resource, so can configure small volume, the reservoir that capacity is less, as SSD solid state hard disc and TF card composition microserver, by these microserver integrated combinations, the computational resource of powerful cloud computing can be formed in less space.Again because microserver is self-existent, can rent or be sold to sole user, data security and the data sovereignty of user can be protected, can satisfying magnanimity user to the demand of " privately owned cloud ".
Summary of the invention
The present invention is the problems such as the server radiating solved in background technology problem, energy-conservation and data security, special propose a kind of hermetic for cloud computing server and cooling system.
The present invention seeks to: blade server is made advantageous configurations and encapsulation process, make it that natural air cooled or water-cooled can be adopted to solve the problem of heat dissipation, energy conservation.Product to blade server carries out microminiaturization, standardization, low power configuration form an electronic component formula: microserver.Do highly gather and concentrate heat radiation to microserver, form the computational resource group of a powerful cloud computing; Microserver can provide unique user to use, and ensures data security and the data sovereignty of user.
In order to achieve the above object, technical scheme of the present invention is: hermetic cloud computing server and cooling system, it comprises server master board pre-integrated network interface card, video card, CPU, internal memory, solid-state SSD hard disk being close to is arranged on mainboard, form a blade server for computing function, highdensity blade server is arranged in a heat dissipation chamber.Because server normally runs only need power lead and netting twine, therefore the present invention proposes the IDE hard disk slot on mainboard, USB slot, com port slot, PCI slot, power supply slot etc. all to cancel, and by the netting twine in computer motherboard circuit, USB line and power lead concentric wiring to board edges region, configure one in this region simultaneously and coordinate with power data blend plug the line concentration slot inserted, blend is drawn outside server, and composition is only with the blade server of a slot, a blend thus.This configuration greatly reduces the height of server bare machine, and can be arranged in very little container, simultaneously, this server is sealed completely, and described blade server is arranged in heat dissipation chamber to high-density, the computational resource group of composition cloud computing, heat dissipation chamber leads directly to external cooling system, in heat dissipation chamber, cryogen constantly flows on insulating heat-conductive integument, the heat distributed when taking away blade server work, concentrated heat radiation improves radiating efficiency, adopt cryogen can be natural wind or natural water, can energy-conservation a large amount of electric energy, more environmental protection.
Above-mentioned blade server bare machine, even if install CPU and internal memory, it highly also can be controlled within 0.5cm, therefore can adopt canister sealing means, with heat conduction bar, CPU radiating surface and canister inner casing are coupled together, dispelled the heat by metallic container shell.Better a solution is: with heat-conducting insulation material sealing, described heat-conducting insulation material is macromolecule resin, and the surface being solidificated in server forms insulating heat-conductive integument.
Electronic devices and components on described server master board need select the electronic devices and components of non-exhaust, as non-electrolytic capacitor etc.The CPU that it is installed, internal memory, solid-state SSD are fixed configurations, preferably, the mode that these hardware chips adopt plate to carry, direct erecting and welding is on mainboard, instead of the mode of mainboard is connected by slot, the more convenient follow-up resin seal of such installation, makes overall sealing property better.
The system design and confuration of described mainboard wiring, line concentration slot and blend, at least comprises power lead and netting twine, can also add USB line or hard disc data line etc.The exit configuration attaching plug and reticle plug provided of blend.Preferably, blend exit can be merged into a waterproof plug, only need single job, just waterproof plug be inserted the waterproof wiring row in this machine box for server, again by power supply and netting twine separate configuration in waterproof wiring row.
Described Heat Conduction Material is the high-termal conductivity macromolecule resin of insulation, and the height that hardware and circuit board encapsulate is less than 0.5 millimeter, is convenient to lead heat radiation by the contact of cryogen quickly.Described resin is: EL171H high-termal conductivity urethane resin, and its cold curing, insulation, thermal conductivity are higher, this be configured in the suitable temperature 20 degrees Celsius of data center under show preferably insulation and the capacity of heat transmission.Meanwhile, heat conduction can also be added in resin, increase the material of viscosity, improve its thermal conductivity, sealing property.
Described hermetic cloud computing server, is characterized in that: the CPU that heat dissipation capacity is larger and north bridge chips are arranged on the mainboard back side, fixing heat radiation copper coin on chip cooling face, and on copper coin, one side installs radiating fin; Heat radiation copper coin upper surface and periphery all fluted, resin encapsulate time fully contact copper coin surface groove, the bottom of copper coin is sealed completely.It is this that to be configured for water-cooling better.Preferably, chip back covers graphite heat-conducting fin, and the associativity of itself and resin is better, to avoid two kinds of different materials to have different expansivitys under heat effect, causes mainboard to lose sealing, and this to be configured for wind-cooling heat dissipating better.
Cloud computing server also towards microminiaturized, standardization future development to meet the demand of safer energy-conservation and data security, data sovereignty, the present invention proposes a kind of special configuration, it is characterized in that: server adopts mainboard and the CPU configuration of low-power consumption, and is equipped with rechargeable battery; Preferably: mainboard is cell phone mainboard size, CPU is ARM (Britain Advanced RISC Machines) chip, and storage medium is SD card or TF card, and pre-installs server OS, forms microserver.
Rechargeable battery is equipped with in server, meet the demand of individual server to uninterrupted power source on the one hand, on the other hand, the requirement of microserver group to data center's uninterrupted power source configuring battery formation like this reduces greatly, and the deployment cost of uninterrupted power source also reduces greatly.Battery is enclosed cell, can not Exhaust Gas.
Above-mentioned hermetic cloud computing server and cooling system, fully contact with natural water or air within the longer time, and the thermal conductivity that its tree sealed refers to and insulativity may decline, and will damage server.Therefore, server needs regularly to make care and maintenance, as cleaning, reseal, change/add assembly parts after reseal process.In addition, still need to do security preparedness measure on the server: on server master board, power supply short circuit security system is installed in advance, if sealing is given away secrets, can the pre-service such as the preservation of data be done immediately and report to the police.In order to seal better, server has carried out the water-proofing treatment of several times in advance.
Above-mentioned encapsulant, thermal conductivity opposing metallic, also differs greatly, in order to better conduct the heat of server, metal spraying technique can also be adopted, the insulation film surface spraying metallic particles formed, form certain thickness metal integument on server surface.Difference in order to the expansivity preventing different materials causes loses envelope, and described metal integument blockette, leaves gap between block.Its metal integument can also play electrostatic screening effect, can be applicable to the combination of server high density.
Above-mentioned server is arranged in a heat dissipation chamber to high-density, the heat that each server distributes is by different, the heat dissipation capacity in each region is also different, therefore, a radiation management system is needed to measure and regulate fluid rationally to dispel the heat, therefore the present invention proposes following configuration: server master board is provided with temperature sensor, mainly be distributed in the die sites that heat dissipation capacity on mainboard is large, temperature information is delivered to radiation management system by netting twine passage by server, and cooling system regulates the temperature of fluid and flow velocity to carry out Control Server heat radiation.
In some data center, the configuration of power supply can be more convenient, and the configuration of netting twine is inconvenient, then can do following configuration, comprise the communication module of wifi, 3G or 4G in the server, and can antenna be drawn, be wirelessly connected with the network switch of data center.This configuration can be applicable to setting up the strong server zone of movability.Because the signal of communication of wifi, 3G or 4G is difficult to through-fall, so this configuration is air-cooled than better suited radiating mode.Microserver as previously discussed is also equipped with rechargeable battery, just can accomplish not power-off, not suspension continuous firing, have better movability.
In order to improve the movability of microserver group, can dispel the heat by the mode of water-cooled again, following configuration can be done: computer chip is arranged on the bottom of blade server, the server zone formed is placed in heat dissipation chamber, adopt division board by upper and lower for blade server two parts separately, blade server lower part passes through water-cooling, upper part adopts common ventilation and heat, wifi in server, the antenna of the communication module of 3G or 4G is placed in top, the server zone formed thus and heat dissipation chamber can be arranged in the server of 1U to 4U, every blend of block blade server is connected with network switch module with the power module in server.
Know-why of the present invention is: distribute server blade rationally, be combined into the electronic devices and components of single, standard, microminiaturized a, low-power consumption, and seal with insulating heat-conduction material, after accessing power supply and network, " calculating+communication " electronic devices and components that just composition one is powerful: microserver.Microserver composition cluster, forms the computational resource of a powerful cloud computing, and such microserver group can be undertaken by the mode that Natural Water cold-peace is air-cooled concentrating dispels the heat; Each microserver is also independently, flexibly can be supplied to unique user and use.
Advantage of the present invention and beneficial effect are:
1. pair server realizes low cost sealing, noiselessness during work, and the working temperature, humidity, the cleanliness factor that ensure that server;
2. server microminiaturization, standardization, cost is low, can more renew at any time;
3. achieve and come to dispel the heat to microserver by the mode that Natural Water cold-peace is air-cooled;
4. couple microserver group carries out concentrating heat radiation, saves mass energy;
5. improve the movability of microserver, realize cloud computing deployment rapidly and efficiently;
6. ensure data security and the data sovereignty of user.
Accompanying drawing explanation
Fig. 1 is single blade server structure figure;
Fig. 2 is the cluster configuration figure of blade server;
Number in the figure illustrates:
Server master board (101), CPU (102), memory chip group (103), southern north bridge chipset (104), wifi/3G/4G communication module (105), rechargeable battery (106);
Line concentration slot (201), blend (202), netting twine (203), power lead (204), built-in aerial (205), external antenna (206);
Machine box for server (301), blade server (302), power-supply system and line bank (303), internet exchange system and line bank (304), power bus (305), optical fiber (306);
Heat radiation copper coin (401), radiating fin (402), macromolecule resin sealing (403).
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described:
One piece 3.5 cun (14.6cmx10.2cm) server master boards (101), CPU (102), memory chip group (103) and rechargeable battery (106) have been installed above it, the chipsets such as CPU (102) are provided with heat radiation copper coin (401), its upper surface is provided with radiating fin (402).Mainboard (101) edge is provided with line concentration slot (201), draws blend (202), comprises netting twine (203) and power lead (204).By this server, with macromolecule resin sealing (403).
The area size of blade server (302) is a bit larger tham 14.6cm*10.2cm, vertically be inserted in the server (301) of 3U size, blade height 1cm, spacing is configured to 1cm, make the array of 22*4, the quantity of insertable server (302) is: 88.The internet exchange system doing waterproof sealing process in netting twine (203) access cabinet and line bank (304), power lead (204) access power-supply system and line bank (303), and power-supply system and the network switching equipment of drawing that power bus (305) and optical fiber (306) access to data center.
In order in certain space, hold more blade server, improve the computing power of cloud computing, the present invention proposes the configuration of microserver (hereinafter referred to as " in incognito ") especially: the 4 core server CPU " CPUARMADA XP " based on ARM framework adopting U.S. Marvel (step prestige science and technology) company, the TF storage card of the most high primary frequency of 1.6G hertz, 2G internal memory, 32G or more.Linux server operating system is installed.The area control of blade is at 8*4cm, and thickness 0.5cm, in incognito spacing 0.5cm, make the array of 40*8, is vertically inserted in the server of 1U size, and the quantity can inserted in incognito is: 320.
As the machine box for server of heat dissipation chamber, its structure can be done to change according to water-cooled or air-cooled radiating mode.
In the machine box for server of different size, configure the blade server of different performance, select to facilitate user: as order high-performance server in 3 3U cabinets and 20 be positioned at the low-power consumption of 1U cabinet in incognito, complete the cloud computing work needed for it.
Just install/solidify server OS and relative program in advance before sealing in incognito, after sealing, make configurations in incognito, as the gateway etc. of data center by the netting twine communication of this locality for this.Also can draw USB data line come and communicate in incognito.
User's Telnet this in incognito, mounting software, calls outside storage data and carries out work.The used time can not close this power supply in incognito yet; Because of only responsible calculating in incognito, user data all leaves in special storage server, even if close wherein, one or more in incognito, also can not interrupt overall cloud computing service.Therefore from overall cloud computing resources, this is more energy-conservation than large-scale virtualized server, because after wherein single virtualized server closing, large server still needs to power up work always.
It can be natural water body in heat dissipation chamber, as the seawater crossed through purified treatment, server also needs to do waterproof configuration further, wherein, the blend that server is drawn is merged into a waterproof plug, insert the waterproof wiring row in this machine box for server, stacking cabinet is immersed in seawater, and the slow fluxion strap of seawater of low temperature walks heat.Heat dissipation chamber also can be high building ventilating layer, and the direction of machine box for server can regulate according to wind direction, is beneficial to blade server and dispels the heat quickly.
Single or multiplely be placed on family or working environment in incognito: by being placed in incognito in the container or refrigerator that are filled with water, accessing local router with netting twine, just can read/write the data in the NAS memory device be connected on this router; Also can be placed on the place of ventilating cool in incognito, be connected to router by WIFI, the above-mentioned information processing maincenter that namely can be used as family's Internet of Things in incognito.
Claims (7)
1. hermetic cloud computing server, its server master board pre-integrated network interface card, video card, by CPU, internal memory, solid-state SSD hard disk is close to and is arranged on mainboard, form a blade server for computing function, the blade server of high density cluster is arranged in a heat dissipation chamber, it is characterized in that: cancel the hard disk I DE slot on server master board, USB slot, com port slot, PCI slot, power supply slot, and by the netting twine in server master board circuit, USB line and power lead concentric wiring are to board edges region, configure one in this region simultaneously and coordinate with power data blend plug the line concentration slot inserted, blend is drawn outside server, can form and only be with a slot, the server of a blend, described server canister sealing or heat-conducting insulation material sealing, the height of canister is less than 1cm, heat-conducting insulation material is macromolecule resin, insulating heat-conductive integument is formed, described server combination to be become single miniaturized electronic components and parts by being solidificated in server surface,
Computer chip is arranged on the bottom of blade server, the server zone formed is placed in heat dissipation chamber, adopt division board by upper and lower for blade server two parts separately, blade server lower part passes through water-cooling, upper part adopts common ventilation and heat, the communication module of wifi, 3G or 4G is comprised in server, and draw antenna, the antenna of communication module is placed in top, the server zone formed thus and heat dissipation chamber can be arranged in the server of 1U to 4U, and every blend of block blade server is connected with network switch module with the power module in server.
2. hermetic cloud computing server according to claim 1, it is characterized in that: the thickness that described macromolecule resin encapsulates on hardware and circuit board is less than 0.5 millimeter, resin is: EL171H high-termal conductivity urethane resin.
3. hermetic cloud computing server according to claim 1, is characterized in that: the CPU that heat dissipation capacity is larger and north bridge chips are arranged on the mainboard back side, chip cooling face are fixed with heat radiation copper coin, and on copper coin, one side is provided with radiating fin; Heat radiation copper coin upper surface and periphery all fluted, resin encapsulate time fully contact copper coin groove, the bottom of copper coin has been hermetic, and the chip cooling back side is coated with graphite heat-conducting fin.
4. hermetic cloud computing server according to claim 1, is characterized in that: server adopts mainboard and the CPU configuration of low-power consumption, and is equipped with rechargeable battery; Mainboard is cell phone mainboard size, and CPU is ARM chip, and storage medium is SD card or TF card, and is preinstalled with server OS.
5. hermetic cloud computing server according to claim 1, is characterized in that: installed power supply short circuit security system in blade server, and has carried out the water-proofing treatment of several times in advance to server.
6. hermetic cloud computing server according to claim 1, it is characterized in that: described server adopts silica gel solution to carry out water-proofing treatment, adopt metal spraying technique again, the insulation film surface spraying metallic particles formed, certain thickness metal integument is formed on server surface, metal integument blockette, leaves gap between block.
7. the hermetic cloud computing server described in any one of claim 1-6, it is characterized in that: the mainboard of described hermetic cloud computing server is provided with temperature sensor, temperature information is delivered to radiation management system by netting twine passage by server, and cooling system regulates the temperature of fluid and flow velocity to carry out the heat radiation of Control Server.
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| CN103576743A (en) * | 2012-07-25 | 2014-02-12 | 成都亿友科技有限公司 | Centralized control device of integrated cloud computing server |
| CN103500947B (en) * | 2013-07-10 | 2016-01-06 | 浙江首航实业有限公司 | Multifunctional intelligent photoelectric box |
| KR101951531B1 (en) | 2014-03-26 | 2019-02-22 | 애플 인크. | Temperature management for inductive charging systems |
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| CN105183101A (en) * | 2015-07-27 | 2015-12-23 | 耿四化 | Highly integrated notebook computer mainboard structure |
| CN105676985A (en) * | 2015-12-31 | 2016-06-15 | 中国科学院深圳先进技术研究院 | Miniature server cluster equipment based on solar power supply |
| CN110390036B (en) * | 2019-06-03 | 2020-04-10 | 惠安源和机械有限公司 | Double-index data query platform |
| CN110427076A (en) * | 2019-07-24 | 2019-11-08 | 广东思泉新材料股份有限公司 | A kind of cloud computing board and its cooling means |
| CN111799540B (en) * | 2020-06-30 | 2021-09-10 | 江苏胜帆电子科技有限公司 | Quick heat dissipation formula controlling means based on 5G antenna |
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| CN2487009Y (en) * | 2001-05-31 | 2002-04-17 | 朱大为 | Shell structure of electronic device |
| CN201278531Y (en) * | 2008-07-15 | 2009-07-22 | 徐正夫 | Cabinet type server intelligent interface |
| CN101840250A (en) * | 2009-03-19 | 2010-09-22 | 喻小兵 | Scheme for sealed fanless computer mainframe with water tank to realize mute intelligent heat dissipation |
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| CN102508528A (en) | 2012-06-20 |
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