CN102496552A - Shell for packaging microwave assembly and laser sealing method of shell - Google Patents
Shell for packaging microwave assembly and laser sealing method of shell Download PDFInfo
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- CN102496552A CN102496552A CN2011104051935A CN201110405193A CN102496552A CN 102496552 A CN102496552 A CN 102496552A CN 2011104051935 A CN2011104051935 A CN 2011104051935A CN 201110405193 A CN201110405193 A CN 201110405193A CN 102496552 A CN102496552 A CN 102496552A
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Abstract
The invention relates to a shell for packaging a microwave assembly and a laser sealing method of the shell. The shell for packaging the microwave assembly comprises an aluminum silicon alloy shell and a 4047 aluminum alloy cover plate, wherein the aluminum silicon alloy shell is abutted with the 4047 aluminum alloy cover plate. The laser sealing method comprises the following steps of: cleaning the aluminum silicon alloy shell and the 4047 aluminum alloy cover plate by using acetone, then abutting the aluminum silicon alloy shell with the 4047 aluminum alloy cover plate by using a tool, then fixing the aluminum silicon alloy shell and the 4047 aluminum alloy cover plate by using an Nd:YAG laser, and continuously integrally welding the shell by using the Nd-YAG laser, welding from the bottom of the aluminum silicon alloy shell until reaching the surface of the 4047 aluminum alloy cover plate, wherein the two welding processes are carried out in a nitrogen protective gas. The invention is used for carrying out sealing by using the laser, is easy to realize, has good sealing property and controllable welding depth, can be used for repaired for two times, has little thermal impact to a substrate and a chip because local heating is adopted in the welding process, can realize automatic operation, and has no soldering flux pollution and high reliability.
Description
Technical field
The present invention relates to a kind of microwave components encapsulation with housing and package sealing with laser method thereof.
Background technology
Microwave components is because advantages such as little, the in light weight and long service life of volume enjoy people to pay close attention to.The package casing material kovar alloy that microwave components is traditional is because its thermal conductivity is low, resistivity is high, density is bigger, and its extensive use is restricted.Alusil alloy material not only intensity is high, and good heat conductivity, thermal coefficient of expansion is low, density is low, and is better with the hot matching of ceramic substrate and GaAs chip or silicon.These performances make alusil alloy become one of first-selected sheathing material of ceramic substrate microwave components encapsulation.
Usually use alusil alloy at first alusil alloy to be carried out the plating nickel on surface gold, re-use the low temperature solder and realize sealing, through using a heating platform by hand or in stove, being soldered to a flat deck or step cover plate in the encapsulation as case material.Although use the heating platform capping a little hurry up; But metallic packaging play a part one heat sink; Can raise and encapsulate interior temperature, only if the ambient pressure of package outside can increase along with the pressure that causes in inside because of the encapsulation heating simultaneously, otherwise; Because the difference of encapsulation external and internal pressure can cause that gas passes through weld seam, i.e. the leakage of pore.Simultaneously, because the rising of encapsulation internal temperature also brings risk for the inner components and parts of encapsulation.And traditional solder has oxidized, the shortcomings such as the antifatigue degree is poor, scaling powder pollution, reworkable property difference of being prone to, and makes the use of low temperature solder receive certain restriction.
Summary of the invention
To above-mentioned shortcoming, the technical issues that need to address of the present invention provide a kind of microwave components encapsulation with housing and package sealing with laser method thereof.
For achieving the above object, the technical scheme that the present invention adopts is: housing is used in the microwave components encapsulation, comprises housing and cover plate, and said housing is the alusil alloy housing, and said cover plate is 4047 aluminium alloy cover plates, and said alusil alloy housing docks with 4047 aluminium alloy cover plates.
The thickness of said 4047 aluminium alloy cover plates is 1～2mm.
A kind of microwave components encapsulation is with the package sealing with laser method of housing, and said package sealing with laser method may further comprise the steps:
A, cleaning: use acetone alusil alloy housing and 4047 aluminium alloy cover plates;
B, joint assembling: use frock that the alusil alloy housing is docked with 4047 aluminium alloy cover plates;
C, location welding: use the Nd:YAG laser, adopt the welding of " Contraband " shape, the fixing relative position of alusil alloy housing and 4047 aluminium alloy cover plates, welding process is carried out in nitrogen protection gas;
D, integral solder: use the Nd:YAG laser, the alusil alloy housing is carried out integral solder, welding begins from the alusil alloy housing bottom, and to the lid surface ending, whole welding process is carried out in nitrogen protection gas.
Said docking mode is corner connection, and the assembling slit of joint is less than 0.15mm, and the fitting joint difference in height is less than 0.2 mm.
The weld penetration that welds in said step c and the steps d all is controlled between 0.3～0.4mm.
Advantage of the present invention: utilize laser to seal, be easy to realize, good airproof performance, the depth of weld is controlled; And can reprocess for twice, welding process is a localized heating, and is little to substrate and chip thermal shock; Can realize automation mechanized operation, no scaling powder pollutes, and reliability is high.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is described in further detail.
Fig. 1 encapsulates with the structural representation before the housing package sealing with laser for microwave components of the present invention.
Fig. 2 encapsulates with the structural representation after the housing package sealing with laser for microwave components of the present invention.
Fig. 3 is the welding track sketch map of integral solder of the present invention.
Wherein: 1,4047 aluminium alloy cover plates, 2, the alusil alloy housing.
Embodiment
In order to deepen to understanding of the present invention, will combine embodiment and accompanying drawing that the present invention is made further detailed description below, this embodiment only is used to explain the present invention, does not constitute the qualification to protection range of the present invention.
To shown in Figure 3, housing is used in microwave components encapsulation of the present invention, comprises that alusil alloy housing 2 and thickness are the 4047 aluminium alloy cover plates 1 of 1.5mm like Fig. 1, and alusil alloy housing 2 docks with 4047 aluminium alloy cover plates 1.
Above-mentioned microwave components encapsulation may further comprise the steps with the package sealing with laser method of housing:
A, cleaning: use acetone alusil alloy housing 2 and 4047 aluminium alloy cover plates 1;
B, joint assembling: use frock that alusil alloy housing 2 is docked with 4047 aluminium alloy cover plates 1, the assembling slit of joint is 0.1mm, fitting joint difference in height 0.1 mm;
C, location welding: use the Nd:YAG laser, adopt the welding of " Contraband " shape, weld penetration is 0.3mm, the fixing relative position of alusil alloy housing 2 and 4047 aluminium alloy cover plates 1, and welding process is carried out in nitrogen protection gas;
D, integral solder: use the Nd:YAG laser, alusil alloy housing 2 is carried out integral solder, weld penetration is 0.3mm, and welding begins from alusil alloy housing 2 bottoms, and to the lid surface ending, whole welding process is carried out in nitrogen protection gas.
Utilize laser to seal, be easy to realize, good airproof performance, the depth of weld is controlled, and can reprocess for twice, and welding process is a localized heating, and is little to substrate and chip thermal shock, can realize automation mechanized operation, and no scaling powder pollutes, and reliability is high.
Claims (5)
1. housing is used in the microwave components encapsulation, it is characterized in that comprise housing and cover plate, said housing is the alusil alloy housing, and said cover plate is 4047 aluminium alloy cover plates, and said alusil alloy housing docks with 4047 aluminium alloy cover plates.
2. housing is used in microwave components encapsulation according to claim 1, it is characterized in that the thickness of said 4047 aluminium alloy cover plates is 1～2mm.
3. a microwave components as claimed in claim 1 encapsulates the package sealing with laser method with housing, it is characterized in that said package sealing with laser method may further comprise the steps:
A, cleaning: use acetone alusil alloy housing and 4047 aluminium alloy cover plates;
B, joint assembling: use frock that the alusil alloy housing is docked with 4047 aluminium alloy cover plates;
C, location welding: use the Nd:YAG laser, adopt the welding of " Contraband " shape, the fixing relative position of alusil alloy housing and 4047 aluminium alloy cover plates, welding process is carried out in nitrogen protection gas;
D, integral solder: use the Nd:YAG laser, the alusil alloy housing is carried out integral solder, welding begins from the alusil alloy housing bottom, and to the lid surface ending, whole welding process is carried out in nitrogen protection gas.
4. microwave components encapsulation according to claim 3 is characterized in that with the package sealing with laser method of housing said docking mode is corner connection, and the assembling slit of joint is less than 0.15mm, and the fitting joint difference in height is less than 0.2 mm.
5. microwave components encapsulation according to claim 3 is characterized in that with the package sealing with laser method of housing the weld penetration that welds in said step c and the steps d all is controlled between 0.3～0.4mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104051935A CN102496552A (en) | 2011-12-08 | 2011-12-08 | Shell for packaging microwave assembly and laser sealing method of shell |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011104051935A CN102496552A (en) | 2011-12-08 | 2011-12-08 | Shell for packaging microwave assembly and laser sealing method of shell |
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| CN102496552A true CN102496552A (en) | 2012-06-13 |
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| CN2011104051935A Pending CN102496552A (en) | 2011-12-08 | 2011-12-08 | Shell for packaging microwave assembly and laser sealing method of shell |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103331520A (en) * | 2013-06-27 | 2013-10-02 | 无锡华测电子系统有限公司 | Sealing method for laser filler welding of hybrid integrated circuit package |
| CN104646957A (en) * | 2014-12-26 | 2015-05-27 | 北京遥测技术研究所 | Laser airtight welding process-based packaged structure of high-frequency microwave product and manufacturing method for package structure |
| CN105081573A (en) * | 2015-09-17 | 2015-11-25 | 中国电子科技集团公司第四十八研究所 | Laser seal welding technique for 3A21 aluminum alloy casing |
| CN105234557A (en) * | 2015-10-28 | 2016-01-13 | 大族激光科技产业集团股份有限公司 | Laser welding method for sealed device |
| CN106181038A (en) * | 2016-08-12 | 2016-12-07 | 中国电子科技集团公司第二十九研究所 | A kind of silumin laser airtight welding method |
| CN106735895A (en) * | 2016-12-15 | 2017-05-31 | 苏州大学 | A kind of method for laser welding of aluminium alloy glass composite |
| CN108305853A (en) * | 2018-01-26 | 2018-07-20 | 中国电子科技集团公司第三十八研究所 | A kind of assembling of microwave module solid and encapsulating structure based on silico-aluminum box body |
| CN109262137A (en) * | 2018-11-29 | 2019-01-25 | 贵州航天电子科技有限公司 | A kind of welding method of intermediate frequency amplifier |
| CN111014955A (en) * | 2019-12-26 | 2020-04-17 | 中国科学院电子学研究所 | Method suitable for air tightness laser sealing welding of silicon-aluminum alloy box body |
| CN114406511A (en) * | 2022-03-01 | 2022-04-29 | 镇江海姆霍兹传热传动系统有限公司 | Welding method of electric heating device cavity assembly |
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| CN101850472A (en) * | 2009-03-31 | 2010-10-06 | 武汉楚天激光（集团）股份有限公司 | Process method for welding aluminum and aluminum alloy material by laser |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103331520B (en) * | 2013-06-27 | 2015-11-11 | 无锡华测电子系统有限公司 | A kind of encapsulating method of laser filler welding of hydrid integrated circuit encapsulation |
| CN103331520A (en) * | 2013-06-27 | 2013-10-02 | 无锡华测电子系统有限公司 | Sealing method for laser filler welding of hybrid integrated circuit package |
| CN104646957B (en) * | 2014-12-26 | 2017-04-19 | 北京遥测技术研究所 | Laser airtight welding process-based packaged method of high-frequency microwave product |
| CN104646957A (en) * | 2014-12-26 | 2015-05-27 | 北京遥测技术研究所 | Laser airtight welding process-based packaged structure of high-frequency microwave product and manufacturing method for package structure |
| CN105081573A (en) * | 2015-09-17 | 2015-11-25 | 中国电子科技集团公司第四十八研究所 | Laser seal welding technique for 3A21 aluminum alloy casing |
| CN105234557B (en) * | 2015-10-28 | 2017-08-22 | 大族激光科技产业集团股份有限公司 | A kind of method for laser welding of air locking |
| CN105234557A (en) * | 2015-10-28 | 2016-01-13 | 大族激光科技产业集团股份有限公司 | Laser welding method for sealed device |
| CN106181038A (en) * | 2016-08-12 | 2016-12-07 | 中国电子科技集团公司第二十九研究所 | A kind of silumin laser airtight welding method |
| CN106181038B (en) * | 2016-08-12 | 2017-12-15 | 中国电子科技集团公司第二十九研究所 | A kind of silumin laser airtight welding method |
| CN106735895A (en) * | 2016-12-15 | 2017-05-31 | 苏州大学 | A kind of method for laser welding of aluminium alloy glass composite |
| CN106735895B (en) * | 2016-12-15 | 2018-09-11 | 苏州大学 | A kind of method for laser welding of aluminium alloy-glass composite material |
| CN108305853A (en) * | 2018-01-26 | 2018-07-20 | 中国电子科技集团公司第三十八研究所 | A kind of assembling of microwave module solid and encapsulating structure based on silico-aluminum box body |
| CN108305853B (en) * | 2018-01-26 | 2019-10-25 | 中国电子科技集团公司第三十八研究所 | A kind of assembling of microwave module solid and encapsulating structure based on silico-aluminum box body |
| CN109262137A (en) * | 2018-11-29 | 2019-01-25 | 贵州航天电子科技有限公司 | A kind of welding method of intermediate frequency amplifier |
| CN111014955A (en) * | 2019-12-26 | 2020-04-17 | 中国科学院电子学研究所 | Method suitable for air tightness laser sealing welding of silicon-aluminum alloy box body |
| CN111014955B (en) * | 2019-12-26 | 2021-08-17 | 中国科学院电子学研究所 | Method suitable for air tightness laser sealing welding of silicon-aluminum alloy box body |
| CN114406511A (en) * | 2022-03-01 | 2022-04-29 | 镇江海姆霍兹传热传动系统有限公司 | Welding method of electric heating device cavity assembly |
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Inventor after: Shi Dongyue Inventor after: Wang Jing Inventor before: Shi Dongyue |
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Free format text: CORRECT: INVENTOR; FROM: SHI DONGYUE TO: SHI DONGYUE WANG JING |
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Application publication date: 20120613 |