CN214384471U - Sealing structure applied to aluminothermic circuit board - Google Patents
Sealing structure applied to aluminothermic circuit board Download PDFInfo
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- CN214384471U CN214384471U CN202023118081.5U CN202023118081U CN214384471U CN 214384471 U CN214384471 U CN 214384471U CN 202023118081 U CN202023118081 U CN 202023118081U CN 214384471 U CN214384471 U CN 214384471U
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Abstract
The utility model discloses a sealing structure applied to an aluminum thermal circuit board, belonging to the technical field of thermal management, comprising a closed cavity with a micro-channel group and a special sealing structure, an upper cover plate clamp and a lower cover plate clamp; the aluminothermic circuit board is provided with a liquid inlet hole and a main sealing area, the upper cover plate clamp is provided with a liquid filling conversion head area and a sealing area, and the lower base plate clamp is provided with a sealing area; the interior of the liquid inlet hole is communicated with the main sealing area through a channel; the main sealing area is a structure with an outer ring provided with a groove with two layers of steps and a boss at the center. The utility model discloses a sealing structure can increase the effective heat radiating area of aluminothermic circuit board, promotes the bonding strength who seals the region, has stronger suitability, higher reliability in the assembly space that integrates, miniaturizes.
Description
Technical Field
The utility model relates to a be applied to sealing structure of aluminothermic way board, especially will contain self-organizing thermal power system (SOTS) channel network's hot road board and weld and seal belongs to heat management technical field.
Background
The SOTS aluminum thermal circuit board is an aluminum alloy cavity which is combined with a novel SOTS heat dissipation technology and is filled with liquid cooling media, and the cavity is sealed through a welding process. However, because the subsequent processes of vacuumizing and filling liquid are required, a liquid filling hole needs to be reserved on the closed cavity, and after the liquid filling operation is finished, the liquid filling hole is closed, so that the whole hot circuit board is sealed.
The traditional method is to connect a copper pipe at the position of the liquid injection hole, finish the operations of vacuumizing and filling liquid by using the copper pipe as a transition section, and then seal the copper pipe. However, since the transition copper tube is exposed outside the cavity, firstly, the overall appearance of the product is not good; secondly, the problems of cracks or leakage and the like are often caused by improper collision; in addition, the protruding copper pipe is easy to interfere with other parts in the process of assembling; it is also important that the joint strength between the liquid injection hole and the transition copper pipe is poor, and the liquid is easy to leak at high pressure.
Therefore, the sealing structure applied to the aluminum-hot circuit board, which can effectively solve the problems of the exposed transition copper pipe and the poor bonding strength of the sealing position, becomes a technical problem to be solved urgently in the technical field.
SUMMERY OF THE UTILITY MODEL
In view of this, one of the objectives of the present invention is to provide a sealing method for an aluminothermic circuit board, which can effectively solve the problems of the transition copper pipe exposing and the poor bonding strength of the sealing position after completing the welding and sealing operation by constructing a special sealing structure on the cavity.
The utility model discloses a following technical means realizes above-mentioned purpose:
the first scheme is as follows:
a sealing method applied to an aluminum-hot circuit board is characterized by comprising the following steps: the method comprises the following steps:
(1) welding and forming the aluminum plate with the microchannel channel group, the upper cover plate and the lower cover plate to form a closed cavity, namely an aluminum thermal circuit board;
(2) processing a special sealing structure on the surface of the aluminothermic circuit board;
(3) preparing a liquid-filling conversion head, an O-shaped ring, a small plugging sheet, a sealing washer and a special sealing clamp, assembling the liquid-filling conversion head, the O-shaped ring, the small plugging sheet, the sealing washer and the aluminothermic circuit board with the special sealing structure together by using the special sealing clamp, and locking by using screws and nuts to form an assembly to be sealed;
(4) pre-cooling the assembly to be sealed at low temperature;
(5) vacuumizing the assembly to be sealed and filling working liquid;
(6) pre-sealing the assembly to be sealed, which is filled with the working liquid, of the finished aluminothermic circuit board;
(7) and placing the pre-sealed assembly to be sealed on resistance spot welding equipment for welding and sealing.
Further, the aluminum plate with the micro-channel group in the step (1) is welded with the upper cover plate and the lower cover plate, and the welding mode is brazing, friction stir welding, laser welding or diffusion welding.
Further, the processing mode of the special sealing structure in the step (2) is numerical control machine processing.
Further, the special sealing structure in the step (2) is a special structure which is composed of a groove with two layers of steps on the outer ring and a boss in the middle.
Further, in the step (3), the liquid-filled conversion head is a small copper part, and a through hole for filling liquid is processed on the liquid-filled conversion head, so that the liquid-filled conversion head is used as a transition section between an external vacuum-pumping liquid-filled system and the aluminum heat circuit board.
Further, the small blocking piece in the step (3) is an aluminum alloy wafer, the thickness of the small blocking piece is 0.5 mm-1.5 mm, and the diameter of the small blocking piece is 8 mm-15 mm.
Further, the special sealing clamp in the step (3) is formed by machining a transparent PC board, 3D printing can also be adopted, and corresponding design can be made according to different aluminothermic circuit boards.
Further, in the step (3), the liquid-filled conversion head, the O-shaped ring, the small plugging sheet, the sealing washer and the aluminothermic circuit board with the special sealing structure are locked together by a special sealing clamp through screws and nuts to form an assembly to be sealed.
Further, the assembly to be sealed in the step (4) needs to be pre-cooled before liquid filling operation, and the assembly is cooled by liquid nitrogen in a mode, so that subsequent vacuumizing operation is easier.
Further, the vacuum pumping and liquid filling operation in the step (5) is completed through a self-made semi-automatic filling device.
Further, the assembly to be sealed in the step (6) is pre-sealed after filling liquid, specifically, a transition copper pipe on the liquid filling conversion head is sealed, and the copper pipe is directly cut off by using a copper pipe sealing clamp.
Further, the resistance spot welding equipment in the step (7) is a medium-frequency inverter spot welding machine.
Scheme II:
a sealing method applied to an aluminum-hot circuit board is characterized by comprising the following steps: the method comprises the following steps:
(1) a special sealing structure is directly processed on the aluminum plate with the micro-channel group;
(2) welding and forming the micro-channel aluminum plate with the special sealing structure with the upper cover plate and the lower cover plate to form a closed cavity, namely an aluminothermic circuit board;
(3) welding a transition copper pipe in a liquid inlet hole of the aluminothermic circuit board, and injecting working liquid into the aluminothermic circuit board through the transition copper pipe;
(4) pre-cooling the aluminothermic circuit board at low temperature;
(5) vacuumizing the aluminothermic circuit board and filling working liquid;
(6) pre-sealing the liquid-filled aluminothermic circuit board;
(7) and placing the pre-sealed aluminothermic circuit board on resistance spot welding equipment for final welding and sealing.
Further, the special sealing structure in the step (1) is processed by a numerical control machine.
Further, the special sealing structure in the step (1) is a special structure which is composed of a groove with two layers of steps on the outer ring and a boss in the middle.
Further, the welding mode in the step (2) is brazing, friction stir welding, laser welding or diffusion welding.
Further, the welding mode of the transition copper pipe in the step (3) is ultrasonic welding.
Further, the low-temperature pre-cooling in the step (4) is to cool the aluminum thermal circuit board by using liquid nitrogen.
Further, the vacuum pumping and liquid filling operation in the step (5) is completed through a self-made semi-automatic filling device.
Further, the pre-sealing in the step (6) specifically means sealing the transition copper pipe by directly cutting off the copper pipe by using a copper pipe sealing clamp.
Further, the resistance spot welding equipment in the step (7) is a medium-frequency inverter spot welding machine.
Another object of the utility model is to provide a be applied to sealing structure of aluminothermic circuit board, through construct special sealing structure on the cavity surface, can effectively solve the transition copper pipe and expose and seal the poor problem of position bonding strength after accomplishing the welding and sealing operation.
The utility model discloses a following technical means realizes above-mentioned purpose:
the utility model provides a be applied to sealing structure of aluminothermic circuit board which characterized in that: comprises a closed cavity (namely an aluminum hot-plate) with a micro-channel group and a special sealing structure, an upper cover plate clamp and a lower base plate clamp; the aluminothermic circuit board is provided with a liquid inlet hole and a main sealing area, the upper cover plate clamp is provided with a liquid filling conversion head area and a sealing area, and the lower base plate clamp is provided with a sealing area; the interior of the liquid inlet hole is communicated with the main sealing area through a channel; the main sealing area is a structure with an outer ring provided with a groove with two layers of steps and a boss at the center.
Furthermore, a small plugging sheet is arranged in the main sealing area, and a sealing gasket is placed on the small plugging sheet.
Furthermore, the small plugging sheet is an aluminum alloy wafer, the thickness of the small plugging sheet is 0.5 mm-1.5 mm, and the diameter of the small plugging sheet is 8 mm-15 mm.
Further, the upper cover plate and the lower cover plate are formed by machining transparent PC plates, or 3D printing can be adopted, and corresponding design can be made according to different aluminothermic circuit boards.
The utility model has the advantages that:
the utility model provides a be applied to special sealing structure of aluminothermic road plate is a structure of processing out on aluminothermic road plate body, does not have unnecessary spare part, can maximize and utilize effective heat radiating area to and avoid bumping bad, revealing, fish tail and size interference scheduling problem that produce in subsequent transportation, assembly etc.; the welding sealing method corresponding to the special sealing structure can improve the bonding strength of the sealing position to a greater extent and ensure that the leakage caused by high pressure can not occur in the using process.
The invention is further illustrated by the accompanying drawings and the detailed description, which are not meant to limit the scope of the invention. The conditions and apparatus used in the examples are conventional in the art and commercially available unless otherwise noted.
Drawings
Fig. 1A is a schematic perspective view of a sealing method applied to an aluminothermic circuit board in embodiment 1 of the present invention;
fig. 1B is an exploded perspective view illustrating a sealing method applied to an aluminothermic circuit board according to embodiment 1 of the present invention;
fig. 2A is a schematic perspective view of an aluminothermic circuit board in embodiment 1 of the present invention;
fig. 2B is a sectional view taken along line a-a of a special sealing structure of an aluminothermic circuit board according to embodiment 1 of the present invention;
fig. 3A is a schematic view of an O-ring according to embodiment 1 of the present invention;
fig. 3B is a schematic perspective view of a liquid-filled adapter according to embodiment 1 of the present invention;
fig. 4A is a schematic view of a small blocking piece in embodiment 1 of the present invention;
fig. 4B is a schematic view of a sealing gasket according to embodiment 1 of the present invention;
fig. 5A is a schematic perspective view of an upper cover plate of a special sealing clamp in embodiment 1 of the present invention;
fig. 5B is a schematic perspective view of a lower plate of a special sealing clamp in embodiment 1 of the present invention;
fig. 6 is a schematic view of a special sealing structure inside a cavity of an aluminothermic circuit board in embodiment 2 of the present invention.
Names of main parts:
100 waiting to seal assembly 200 aluminum hot-line board
201 liquid inlet hole 202 main sealing area
303 transition copper pipe
401 small plug piece 402 sealing washer
501 upper cover plate clamp 502 lower plate clamp
503 liquid-filled transition-head region 504 seal area
505 screw 506 nut
601 upper electrode 602 lower electrode
700 second aluminothermic plate 701 second liquid inlet hole
702 second main seal area 703 second transition copper tube
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings:
example 1
As shown in fig. 1A, it is a schematic view of a three-dimensional structure of a sealing method applied to an aluminothermic circuit board in embodiment 1 of the present invention; as shown in fig. 1B, an exploded illustration of a three-dimensional structure of a sealing method applied to an aluminum thermal circuit board in embodiment 1 of the present invention is shown; as shown in fig. 2A, is a schematic perspective view of an aluminothermic circuit board in embodiment 1 of the present invention; as shown in fig. 2B, is a sectional view taken along a line a-a of a special sealing structure of an aluminothermic circuit board in embodiment 1 of the present invention; as shown in fig. 3A, is a schematic view of an O-ring in embodiment 1 of the present invention; as shown in fig. 3B, is a schematic perspective view of a liquid-filled adapter according to embodiment 1 of the present invention; as shown in fig. 4A, it is a schematic view of a small patch in embodiment 1 of the present invention; fig. 4B is a schematic view of a sealing gasket according to embodiment 1 of the present invention; as shown in fig. 5A, is a schematic perspective view of an upper cover plate of a special sealing clamp in embodiment 1 of the present invention; as shown in fig. 5B, is a schematic perspective view of the lower bottom plate of the special sealing clamp in embodiment 1 of the present invention;
the embodiment 1 of the utility model is applied to the sealing method of the aluminum thermal circuit board, which mainly comprises an assembly body 100 to be sealed and an upper electrode 601 and a lower electrode 602 of resistance spot welding equipment; the assembly 100 to be sealed is an integral assembly which comprises an aluminum thermal circuit board 200 with a sealing structure, a liquid-filled conversion head system, a sealing area sealing system and a special sealing clamp and is locked and fixed together by a screw 505 and a nut 506, and is detailed in an exploded illustration shown in fig. 1B;
the embodiment of the utility model provides an area sealing structure's aluminothermic circuit board 200 in 1, include: a liquid inlet hole 201 and a main sealing area 202; the outside of the liquid inlet hole 201 is connected with a liquid filling conversion head system, and the inside of the liquid inlet hole is communicated with the main sealing area 202 through a channel; as shown in fig. 2B, which is a sectional view a-a of the main sealing region 202, the special sealing structure is processed on the surface of the aluminothermic circuit board 200 by a numerical control machine, and the special sealing structure is a structure with a groove with two steps on the outer ring and a boss in the center;
the utility model provides a liquid-filled adapter system in embodiment 1, including O type circle 301, liquid-filled adapter 302 and transition copper pipe 303; the liquid filling conversion head 302 is connected with external semi-automatic filling equipment through a transition copper pipe 303 and can be used for completing the action of filling working liquid into the internal cavity of the aluminothermic circuit board;
the sealing area sealing system in embodiment 1 of the present invention comprises a small plug 401 and a sealing washer 402; installing a small plugging sheet 401 on the main sealing area 202, placing a sealing washer 402 on the small plugging sheet 401, and finally achieving the purpose of compressing the small plugging sheet 401 through a special sealing clamp;
the special sealing clamp in embodiment 1 of the utility model comprises an upper cover plate clamp 501 and a lower base plate clamp 502; two areas, namely a liquid-filling conversion head area 503 and a sealing area 504, exist on the upper cover plate clamp 501, and a liquid-filling conversion head system is arranged on the liquid-filling conversion head area 503; the sealing area 504 corresponds to the main sealing area 202 and the sealing area sealing system on the aluminothermic board 200; then, sequentially stacking a lower base plate clamp 502 (which is also provided with an electrode contact area corresponding to a sealing area 504), the aluminothermic circuit board 200 provided with a sealing area sealing system and an upper cover plate clamp 501 provided with a liquid-filled conversion head system, and locking and fixing the two together through a screw 505 and a nut 506 to finally form an integral assembly 100 to be sealed;
the resistance spot welding equipment in the embodiment 1 of the utility model is an intermediate frequency inversion resistance spot welding machine, which mainly comprises an upper electrode 601 and a lower electrode 602; parameters such as welding current, welding time, pressure and the like can be adjusted in real time on the medium-frequency inverter resistance spot welding equipment; after the parameters are determined, the contact discharge is carried out through the upper electrode 601, the lower electrode 602 and the liquid filled aluminothermic circuit board 200 to be sealed, the heat is concentrated on the small plug piece 401 and the main sealing area 202, then the small plug piece 401 is melted and is combined with the main sealing area 202 under the action of pressure, and the whole welding and sealing operation is completed.
Example 2
If the surface of the aluminum heat circuit board is not suitable for processing a special sealing structure, the design can be as follows: when the aluminum plate with the micro-channel group is processed, the special sealing structure is processed at the position needing to be sealed, and then the special sealing structure is welded with the upper cover plate and the lower cover plate, so that the special sealing structure exists in the aluminum heat circuit board. In addition, the liquid inlet hole can be placed on the side surface of the aluminothermic circuit board. As shown in fig. 6, it is a schematic view of a special sealing structure inside a cavity of an aluminothermic circuit board in embodiment 2 of the present invention; wherein 700 is a second thermite plate, 701 is a second liquid inlet hole, 702 is a second main sealing area, and 703 is a second transition copper pipe; it can be seen that the direct benefit of this particular sealing structure existing inside the aluminothermic panel is: firstly, the welding and sealing operation can be directly finished on the aluminothermic circuit board body without needing a separate small plug sheet during subsequent sealing; secondly, a special sealing clamp is not needed to be additionally designed. Overall, both efficiency is improved and cost is saved. Therefore, the sealing process of the aluminothermic circuit board designed according to the sealing structure can be simplified as follows: preparing a second aluminothermic circuit board 700 with a special sealing structure in the cavity, wherein the second aluminothermic circuit board 700 comprises a second liquid inlet hole 701 on the side surface and a second main sealing area 702 on the surface; welding a second transition copper pipe 703 on the second liquid inlet hole 701; carrying out low-temperature pre-cooling on the aluminothermic circuit board with the transition copper pipe; the second transition copper pipe 703 is connected with external semi-automatic filling equipment for vacuum pumping and liquid filling; pre-sealing the second transition copper pipe 703; and (4) placing the pre-sealed aluminothermic circuit board on resistance spot welding equipment for final welding and sealing.
The utility model discloses a be applied to sealing structure and sealing method of aluminothermic circuit board, this aluminothermic circuit board is the inside aluminum alloy cavity who is filled with liquid cooling medium that combines the novel heat dissipation technique of SOTS, the cavity through welding process sealing treatment. Through aluminium hot circuit board processes out special seal structure on the surface or in advance on the inside channel aluminum plate of cavity, combines to utilize the utility model provides a welding sealing method can increase the effective heat radiating area of aluminium hot circuit board, promotes the bonding strength who seals the region, has stronger suitability, higher reliability in the assembly space that integrates, miniaturizes.
Although the claimed subject matter has been defined with specific structural features and/or methods, it is to be understood that the claimed subject matter is not limited to the specific features or acts described by the claims. Rather, the specific structural features and methods described in the claims are merely exemplary of the invention.
Claims (5)
1. The utility model provides a be applied to sealing structure of aluminothermic circuit board which characterized in that: comprises a closed cavity with a microchannel group and a sealing structure, an upper cover plate clamp and a lower base plate clamp; the aluminothermic circuit board is provided with a liquid inlet hole and a main sealing area, the upper cover plate clamp is provided with a liquid filling conversion head area and a sealing area, and the lower base plate clamp is provided with a sealing area; the interior of the liquid inlet hole is communicated with the main sealing area through a channel; the main sealing area is a structure with an outer ring provided with a groove with two layers of steps and a boss at the center.
2. The sealing structure applied to the aluminum thermal circuit board as recited in claim 1, wherein: the main sealing area is provided with a small plugging sheet, and the small plugging sheet is provided with a sealing gasket.
3. The sealing structure applied to the aluminum thermal circuit board as recited in claim 2, wherein: the small blocking piece is an aluminum alloy wafer.
4. The sealing structure applied to the aluminum thermal circuit board as recited in claim 3, wherein: the thickness of the aluminum alloy wafer is 0.5 mm-1.5 mm, and the diameter is 8 mm-15 mm.
5. The sealing structure applied to the aluminum thermal circuit board as recited in claim 4, wherein: the upper cover plate clamp and the lower base plate clamp are formed by machining transparent PC plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023118081.5U CN214384471U (en) | 2020-12-23 | 2020-12-23 | Sealing structure applied to aluminothermic circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023118081.5U CN214384471U (en) | 2020-12-23 | 2020-12-23 | Sealing structure applied to aluminothermic circuit board |
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| CN214384471U true CN214384471U (en) | 2021-10-12 |
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| CN202023118081.5U Active CN214384471U (en) | 2020-12-23 | 2020-12-23 | Sealing structure applied to aluminothermic circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112665442A (en) * | 2020-12-23 | 2021-04-16 | 无锡卡兰尼普热管理技术有限公司 | Sealing structure and sealing method applied to aluminothermic circuit board |
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2020
- 2020-12-23 CN CN202023118081.5U patent/CN214384471U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112665442A (en) * | 2020-12-23 | 2021-04-16 | 无锡卡兰尼普热管理技术有限公司 | Sealing structure and sealing method applied to aluminothermic circuit board |
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