CN102495310B - Testing method of COG (chip on glass) product of PMOLED (passive matrix organic light emitting diode) based on tape carrier package - Google Patents
Testing method of COG (chip on glass) product of PMOLED (passive matrix organic light emitting diode) based on tape carrier package Download PDFInfo
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- CN102495310B CN102495310B CN201110386868.6A CN201110386868A CN102495310B CN 102495310 B CN102495310 B CN 102495310B CN 201110386868 A CN201110386868 A CN 201110386868A CN 102495310 B CN102495310 B CN 102495310B
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Abstract
The invention relates to a testing technology of a PMOLED (passive matrix organic light emitting diode), discloses a testing method of a COG (chip on glass) product of a PMOLED based on taper carrier package, and aims at solving the problems of low utilization rate of a substrate caused by a testing mode of a COF (chip on flex) product in the traditional technology, as well as high test cost, low processing precision and cut alignment precision caused by the testing method of the COG product. The method is characterized in that: a diode is arranged at each IC (integrated circuit) pin, and is used for dividing metal Cr on a screen of the IC pin into three sections, wherein the first section of metal Cr is used for connecting an anode end of the diode, the second section of metal Cr is provided with a through hole, and the third section of metal Cr is connected with the IC pin; a cathode of the diode is made of evaporated AL, and is isolated from cathodes of other devices on the screen by utilizing an isolation column; a test point is led out from the first section of metal Cr; and a probe is supported against the test point and a test voltage is applied in testing. The method is suitable for testing the COG product of the PMOLED based on taper carrier package.
Description
Technical field
The present invention relates to the measuring technology of PMOLED, particularly the COG product test method of PMOLED of based thin film encapsulation a kind of.
Background technology
At present, PMOLED (passive type organic electric exciting light-emitting diode) product is divided into COF (chip on film) and two kinds of forms of COG (chip on glass) by power supply mode.In conventional art, the test of COF formal product is generally carried out at the additional test PAD of cell (single screen) (for the derby of testing), and because it will cut test PAD, substrate utilization factor reduces, and need to use FPC (flexible PCB), cost increases; Therefore, OLED producer is more prone to produce the PMOLED product of COG form, yet COG formal product test, need external coordination producer to prepare unit clamp, its expense is also higher, and fixture can not be public between different model product, also there is the problem of machining precision and cutting aligning accuracy, test is also inconvenient.
On the other hand, it is ripe that current thin film encapsulation technology has been tending towards, and tests, and can not produce high cost on the COG product of the PMOLED how to encapsulate at based thin film, becomes the current focus of discussing in the industry.
Summary of the invention
Technical matters to be solved by this invention is: propose the COG product test method of PMOLED of based thin film encapsulation a kind of, the test mode that solves COF product in conventional art causes substrate utilization factor test mode low and COG product to cause the problem that testing cost is high, have machining precision and cutting aligning accuracy.
The present invention solves the problems of the technologies described above adopted technical scheme: the COG product test method of the PMOLED of based thin film encapsulation, comprise: at each IC pin place, a diode is set, and will be divided into three sections for connecting Metal Cr on the screen of IC pin, first paragraph Metal Cr is for connecting the anode tap of diode, in second segment Metal Cr, make via hole, the 3rd section of Metal Cr connects IC pin; The negative electrode of diode adopts the AL of evaporation, utilizes insulated column by the negative electrode of diode and the cathode isolation of shielding upper other devices simultaneously; Test point is drawn from first paragraph Metal Cr; When testing, add test voltage after propping up test point with probe.
The invention has the beneficial effects as follows: by increasing diode at IC pin, and utilize the characteristic of diode, when testing, this diode positively biased, measuring current can enter into each pixel cell in screen by this diode; When screen normal operation, the anti-cut-off partially of this diode, therefore can not affect the normal operation of each pixel cell in screen, does not need to excise test point, can not affect the utilization factor of substrate; And during test, only need to adopt common probe smelting tool to prop up test point, more logical test voltage, convenient test, cost is low.
Accompanying drawing explanation
Fig. 1 is the test philosophy schematic diagram in the present invention.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
Test mode for COF product in conventional art causes substrate utilization factor test mode low and COG product to cause the problem that testing cost is high, have machining precision and cutting aligning accuracy, the present invention proposes the COG product test method of the PMOLED of a kind of based thin film encapsulation, and this method of testing comprises two large steps: 1. the making step of test point; 2. testing procedure;
Referring to Fig. 1, the manufacturing process of test point (test PAD) is as follows: at each IC pin place, a diode is set, and will from function, be divided into three sections for connecting Metal Cr on the screen of IC pin (press IC PAD): first paragraph Metal Cr is for connecting the anode tap of diode, in second segment Metal Cr, make via hole (VIA), make the voltage on the negative electrode of diode can be delivered on anode, the 3rd section of Metal Cr connects IC pin, carries out original own job; The negative electrode of diode adopts the AL of evaporation, utilizes insulated column (SEP) that the negative electrode AL of the negative electrode AL of diode and other device is separated simultaneously, and test point is drawn from first paragraph Metal Cr;
The present invention is applicable to adopt thin-film package, because if adopt glass-encapsulated, below test point can be pressed in by glass, probe does not reach; And if employing thin-film package just can utilize MASK when making, test point to be exposed;
After test point completes, when testing, with probe, prop up and add test voltage after test point and can start test;
Like this, when product works, IC powers to product, the anti-cut-off partially of diode in thin-film package, and when product test the diode positively biased in thin-film package, so just can be energized to pixel cell.
During product normal operation, diode is anti-inclined to one side, and current path is: IC-presses each pixel in IC PAD-screen.
Product is diode positively biased when test, and current path is: each pixel in the diode in foreign current-probe-test PAD-thin-film package-VIA-screen.
For the present invention, do not need to increase new technique process, all can on the basis of existing operation, realize, cost is low, and in test, only need to adopt common probe smelting tool just can realize test, not need special test fixture, test simply, further reduce costs.
Claims (1)
1. the COG product test method of the PMOLED that based thin film encapsulates, it is characterized in that, comprise: at each IC pin place, a diode is set, and will be divided into three sections for connecting Metal Cr on the screen of IC pin, first paragraph Metal Cr is for connecting the anode tap of diode, in second segment Metal Cr, make via hole, the 3rd section of Metal Cr is used for connecting IC pin; The negative electrode of diode adopts the AL of evaporation, utilizes insulated column by the negative electrode of diode and the cathode isolation of shielding upper other devices simultaneously; Test point is drawn from first paragraph Metal Cr; When testing, add test voltage after propping up test point with probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110386868.6A CN102495310B (en) | 2011-11-29 | 2011-11-29 | Testing method of COG (chip on glass) product of PMOLED (passive matrix organic light emitting diode) based on tape carrier package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110386868.6A CN102495310B (en) | 2011-11-29 | 2011-11-29 | Testing method of COG (chip on glass) product of PMOLED (passive matrix organic light emitting diode) based on tape carrier package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102495310A CN102495310A (en) | 2012-06-13 |
| CN102495310B true CN102495310B (en) | 2014-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110386868.6A Expired - Fee Related CN102495310B (en) | 2011-11-29 | 2011-11-29 | Testing method of COG (chip on glass) product of PMOLED (passive matrix organic light emitting diode) based on tape carrier package |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109100630B (en) * | 2018-08-23 | 2020-06-19 | 重庆市嘉凌新科技有限公司 | Diode detection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3760411B2 (en) * | 2003-05-21 | 2006-03-29 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Active matrix panel inspection apparatus, inspection method, and active matrix OLED panel manufacturing method |
| TW200823443A (en) * | 2006-11-30 | 2008-06-01 | Chroma Ate Inc | Light sensor inspection device with embedded light source, and the testing machine having the same |
| CN101710473A (en) * | 2009-12-10 | 2010-05-19 | 四川虹视显示技术有限公司 | COG type PM-OLED panel as well as manufacturing process and detection method thereof |
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Granted publication date: 20140212 Termination date: 20201129 |