CN102480903A - Cooling device and electronic device with cooling device - Google Patents
Cooling device and electronic device with cooling device Download PDFInfo
- Publication number
- CN102480903A CN102480903A CN201010566319.2A CN201010566319A CN102480903A CN 102480903 A CN102480903 A CN 102480903A CN 201010566319 A CN201010566319 A CN 201010566319A CN 102480903 A CN102480903 A CN 102480903A
- Authority
- CN
- China
- Prior art keywords
- fin
- heat
- conducting base
- heat abstractor
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to a cooling device of an electronic device, and the cooling device comprises a heat-conducting base (1) and at least one cooling fin (2) arranged on the heat-conducting base (1). The cooling fin (2) is designed with a corrugated profile, so that the cooling area can be increased while the total size of the cooling device is not increased fundamentally. In addition, the invention also relates to the electronic device with the cooling device.
Description
Technical field
The present invention relates to a kind of heat abstractor that is used for electronic device.The invention still further relates to a kind of electronic device in addition with heat abstractor.
Background technology
Usually use is heat sink in the prior art dispels the heat to electronic device.This heat sink heating part substrate contacted that has usually with electronic device, and pedestal is provided with a plurality of flat fin.According to experiment showed, in identical external condition, for example under the situation of concurrent condition, heat sink radiating effect depends on fin and the contact area of air on heat sink fully, just carries out the area of the radiating surface of heat exchange with air.This area is big more, and heat sink radiating effect is good more.In order to obtain better heat radiating effect, will inevitably expect increasing heat sink size so or on heat sink, install a fan that is used to strengthen convection current.Yet, progressively microminiaturized along with the volume of current electronic device, be installed in heat sink volume on the electronic device also be asked to as much as possible little, thereby can reduce the overall dimension of entire equipment.This has just brought a problem, promptly how not to increase basically under the prerequisite of heat sink overall size, obtains radiating effect as well as possible.
Summary of the invention
Therefore, one object of the present invention is to propose a kind of heat abstractor that is used for electronic device.Can not increase basically under the prerequisite of its overall size according to heat abstractor of the present invention, obtaining the area of dissipation that increases.
This purpose realizes thus that through the present invention promptly heat abstractor has heat conducting base and is installed at least one fin on this heat conducting base, and wherein fin is designed to have corrugated profiles.Compare with the traditional tabular heat abstractor with same size, heat abstractor according to the present invention has the area of dissipation of obvious increase.In practice, the heat dissipation capacity of heat abstractor is calculated by following formula, i.e. Q=ζ A (Δ T1-Δ T2), and wherein Q represents heat dissipation capacity; A represents the gross area of the fin of heat abstractor; Temperature on the fin point of Δ T1 representative when heat abstractor is worked; Δ T2 represents the temperature of fin surrounding air; ζ then represents convection coefficient; Relevant around this convection coefficient and the fin to the physical size of stream mode, fin itself etc.; (constant in order to ensure ζ wherein under the constant situation of ζ wherein; Need to guarantee that fin sheet spacing each other remains unchanged, the height of fin remains unchanged, and geometry is also similar)., the gross area of fin is big more, and then the heat abstractor heat that can distribute is just big more.Because heat abstractor of the present invention has adopted wavy fin; Therefore according to the present invention this fin of design under the area of the projection of the horizontal plane situation identical with the projected area of traditional fin; Have bigger area of dissipation, thereby make heat abstractor according to the present invention have better heat radiating effect more.In addition, fin according to the present invention has mechanical stiffness, and certain if desired stability, and thickness can reduce so, if thickness need keep par, stability can improve so.
According to a preferred design of the present invention, heat conducting base and fin are integrally formed.The manufacturing process that this has simplified heat abstractor has reduced manufacturing cost.
According to another design of the present invention, heat conducting base and fin split form, and wherein, fin is inserted on the heat conducting base.Fin is inserted on the heat conducting base simply in the accommodation section that is provided with in advance through the later stage; Can make heat conducting base and fin flexible combination to a great extent, thereby can require to produce simply heat abstractor according to the heat radiation of different electronic devices with different radiating efficiencys.
Alternatively, be provided with perpendicular to the outwardly directed heat conduction support of heat conducting base at heat conducting base, each fin is stacked on the heat conduction support with predetermined spacing in parallel with each other.In this design, each fin is parallel to the heat conducting base setting respectively, and also keeps certain spacing each other, thereby obtains good concurrent condition.
In a preferred design of the present invention, propose, fin stands vertically on heat conducting base with predetermined spacing each other abreast, on heat conducting base, to form the fin row that are arranged in parallel.This structure has good concurrent condition, thereby has obtained to have the heat abstractor of better heat radiating effect.
In another preferred design of the present invention, propose, fin surrounds into circularly each other and stands vertically on heat conducting base.These fin center on the profile of a circle jointly on heat conducting base.Certainly fin also can form other profile on heat conducting base, for example oval or the like, thereby make heat abstractor can mate different installing spaces and electronic device.
Preferably, make heat conducting base and/or fin through liquid forging process.Heat abstractor is processed by the metal with high conductive coefficient usually, and such metal can come processed through liquid forging process with being more prone to, and has simplified manufacturing process to a great extent, has reduced production cost.
Most preferably, said fin has the wave profile of sinusoidal or square wave shape.Interchangeable, the wave profile of said fin also can be the wavy wave profile of sawtooth waveforms or triangle.Proportionate relationship between the crest of these wavy profiles and the thickness of fin also can be done corresponding adjustment according to the requirement of heat radiation; Be preferably 2: 1, wavelength can be done corresponding adjustment according to the requirement of heat radiation with respect to the length of entire heat dissipation sheet or the numerical value of height.In addition, the distance value between the fin is constant with respect to prior art, thereby has guaranteed the constancy of convection coefficient.
Another object of the present invention realizes through a kind of electronic device with heat abstractor of the above-mentioned type.Have such heat abstractor electronic device under the constant basically situation of overall dimension, can obtain better heat radiating effect more.
Should be appreciated that above generality is described and following detailed description is all enumerated and illustrative, purpose is in order to the present invention who requires to protect further explanation to be provided.
Description of drawings
Accompanying drawing constitutes the part of this specification, is used to help further understand the present invention.These accompanying drawing diagrams embodiments of the invention, and be used for explaining principle of the present invention with specification.Identical in the accompanying drawings parts are represented with identical label.Shown in the figure:
Fig. 1 shows first embodiment according to the heat abstractor of prior art;
Fig. 2 shows second embodiment according to the heat abstractor of prior art;
Fig. 3 shows the 3rd embodiment according to the heat abstractor of prior art;
Fig. 4 shows first embodiment according to heat abstractor of the present invention;
Fig. 5 shows second embodiment according to heat abstractor of the present invention;
Fig. 6 shows the 3rd embodiment according to heat abstractor of the present invention.
Embodiment
Fig. 1 to 3 shows three various embodiment according to the heat abstractor of prior art.In first embodiment shown in Fig. 1, on a rectangular heat conducting base 1, be furnished with a plurality of fin 2, these fin 2 stand vertically on heat conducting base 1 with a determining deviation each other abreast.Fin 2 can be integrally formed with heat conducting base 1, and they also can form in split certainly.Visible from Fig. 1, these fin 1 all are smooth heating panels.
In second embodiment shown in Fig. 2; On the heat conducting base 1 of circle, be furnished with a plurality of fin 2; These fin 2 surround into each other and stand vertically circularly on heat conducting base 1, thereby constitute a shape that is similar to lantern, and are visible from Fig. 2; These fin 1 all are smooth heating panels, and these smooth heating panels are inserted into respectively in the preset accommodation section of heat conducting base.
In the 3rd embodiment shown in Fig. 3; Heat conducting base 1 is provided with perpendicular to outwardly directed two the heat conduction supports 3 of heat conducting base; These two heat conduction supports 3 pass each fin 2 respectively; These fin 2 are parallel and spaced apart with predetermined spacing simultaneously, thereby formation is fixed on the heat conduction support 3 and is stacked on the radiator structure on the heat conducting base 1.In this embodiment, fin 2 is smooth heating panel equally.
Fig. 4 to Fig. 6 shows respectively corresponding to three various embodiment according to heat abstractor of the present invention according to the heat abstractor of the prior art of Fig. 1 to Fig. 3.Three embodiment difference with the prior art shown in Fig. 4 to Fig. 6 only are the shape of fin.In three embodiment of the present invention, fin 2 has corrugated profile, thereby compares with the heat abstractor of prior art, under the prerequisite that overall dimension remains unchanged basically, obtains the area of dissipation that increases.
In the first embodiment of the present invention shown in Fig. 4, heat abstractor has rectangular heat conducting base 1 and a plurality of fin 2, and these fin 2 have wavy profile and stand vertically abreast on this heat conducting base 1 with predetermined spacing each other.
In the second embodiment of the present invention shown in Fig. 5, heat abstractor has circular heat conducting base 1 and a plurality of fin 2, and these fin 2 have wavy profile and surround into each other and stand vertically circularly on this heat conducting base 1.
Fig. 6 shows in the third embodiment of the present invention; Heat abstractor has heat conducting base 1, a plurality of fin 2; Wherein, heat conducting base 1 is provided with perpendicular to heat conducting base 1 outwardly directed heat conduction support 3, and each fin 2 is stacked on the heat conduction support 3 with predetermined spacing in parallel with each other.
Should be appreciated that heat conducting base 1 according to heat abstractor of the present invention except above-mentioned shape, can also have other different shape, thereby adapt to different electronic devices and installation environment.In addition, can be integratedly according to the heat conducting base of heat abstractor of the present invention 1 and fin or split ground make through liquid forging die technology.
According to an instantiation heat abstractor of the present invention is described below.Be benchmark with the heat abstractor according to prior art for example, this heat abstractor has flat fin 2, has 169000mm
2Area of dissipation.By comparison, owing to adopted wavy fin 2, under the situation that overall dimension remains unchanged basically, has 210000mm according to heat abstractor of the present invention
2Area of dissipation.Therefore in identical room temperature, for example 25 ℃, identical free convection, and identical power of heat source for example under the situation of 40W, can calculate according to formula Q=ζ A (Δ T1-Δ T2), and heat abstractor according to the present invention has better heat radiating effect more.
More than be merely the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various changes and variation.All any modifications of within spirit of the present invention and principle, being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Reference numeral
1 heat conducting base
2 fin
3 heat conduction supporting column
Claims (10)
1. heat abstractor that is used for electronic device, said heat abstractor has heat conducting base (1) and is installed at least one fin (2) on the said heat conducting base (1), it is characterized in that said fin (2) is designed to have corrugated profiles.
2. heat abstractor according to claim 1 is characterized in that, said heat conducting base (1) is integrally formed with said fin (2).
3. heat abstractor according to claim 1 is characterized in that, said heat conducting base (1) forms with said fin (2) split, and wherein, said fin (2) is inserted on the said heat conducting base (1).
4. heat abstractor according to claim 3; It is characterized in that; Said heat conducting base (1) is provided with perpendicular to the outwardly directed heat conduction support of said heat conducting base (1) (3), and each said fin (2) is stacked on the said heat conduction support (3) with predetermined spacing in parallel with each other.
5. according to each described heat abstractor in the claim 1 to 3, it is characterized in that said fin (2) stands vertically on said heat conducting base (1) with predetermined spacing each other abreast.
6. according to each described heat abstractor in the claim 1 to 3, it is characterized in that said fin (2) surrounds into each other and stands vertically circularly on said heat conducting base (1).
7. according to each described heat abstractor in the claim 1 to 3, it is characterized in that said fin has the corrugated profiles of sinusoidal or square wave shape.
8. according to each described heat abstractor in the claim 1 to 3, it is characterized in that the ratio between the crest of the corrugated profiles of said fin and the thickness of fin is 2: 1.
9. according to each described heat abstractor in the claim 1 to 4, it is characterized in that, make said heat conducting base (1) and/or said fin (2) through liquid forging process.
10. an electronic device is characterized in that, said electronic device has each described heat abstractor in the claim 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010566319.2A CN102480903A (en) | 2010-11-29 | 2010-11-29 | Cooling device and electronic device with cooling device |
| PCT/EP2011/069724 WO2012072388A1 (en) | 2010-11-29 | 2011-11-09 | Heat radiation device and electronic device comprising the heat radiation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010566319.2A CN102480903A (en) | 2010-11-29 | 2010-11-29 | Cooling device and electronic device with cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102480903A true CN102480903A (en) | 2012-05-30 |
Family
ID=45370456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010566319.2A Pending CN102480903A (en) | 2010-11-29 | 2010-11-29 | Cooling device and electronic device with cooling device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102480903A (en) |
| WO (1) | WO2012072388A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107317557A (en) * | 2017-06-22 | 2017-11-03 | 成都希塔科技有限公司 | The system cooling system of high power power amplifier |
| CN108757243A (en) * | 2018-08-10 | 2018-11-06 | 扬州法世德汽车部件有限公司 | A kind of efficient inlet plenum of heat dissipation |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW376171U (en) * | 1998-11-24 | 1999-12-01 | Foxconn Prec Components Co Ltd | Radiating device |
| KR20020015261A (en) * | 2001-03-26 | 2002-02-27 | 이종만 | Method of fin insert injection molding for Heat sink |
| TWI267337B (en) * | 2003-05-14 | 2006-11-21 | Inventor Prec Co Ltd | Heat sink |
| CN2842733Y (en) * | 2005-06-10 | 2006-11-29 | 富准精密工业(深圳)有限公司 | Radiating apparatus |
| CN100518468C (en) * | 2005-10-14 | 2009-07-22 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| US8196643B2 (en) * | 2009-01-20 | 2012-06-12 | Shyh Ming Chen | Ring heat dissipating device formed by punching and riveting through a shaping mold |
-
2010
- 2010-11-29 CN CN201010566319.2A patent/CN102480903A/en active Pending
-
2011
- 2011-11-09 WO PCT/EP2011/069724 patent/WO2012072388A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107317557A (en) * | 2017-06-22 | 2017-11-03 | 成都希塔科技有限公司 | The system cooling system of high power power amplifier |
| CN108757243A (en) * | 2018-08-10 | 2018-11-06 | 扬州法世德汽车部件有限公司 | A kind of efficient inlet plenum of heat dissipation |
| CN108757243B (en) * | 2018-08-10 | 2023-10-27 | 扬州法世德汽车部件有限公司 | Efficient air inlet chamber dispels heat |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012072388A1 (en) | 2012-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016528736A (en) | Multilayer heat spreader assembly with separate convection fins | |
| CN103096678B (en) | Heat abstractor | |
| CN203912432U (en) | Radiator and programmable logic controller | |
| CN102480903A (en) | Cooling device and electronic device with cooling device | |
| US20120118550A1 (en) | Heat dissipating device and method of manufacture thereof | |
| CN205693973U (en) | A kind of pcb board assembly | |
| CN210610161U (en) | Inverter device and heat dissipation device thereof | |
| US20150060036A1 (en) | Assembled aluminum extrusion heat dissipator | |
| CN207865339U (en) | A kind of UVLED curing systems radiator | |
| CN205454364U (en) | Heat dissipation post and radiator | |
| CN110785063B (en) | Telescopic additional-installed radiating fin | |
| CN108050496A (en) | A kind of UVLED curing systems radiator | |
| CN103429052A (en) | Cooling member | |
| CN203686956U (en) | Radiator | |
| CN207395549U (en) | A kind of high efficiency and heat radiation cold forging radiator | |
| JP2013149766A (en) | Collector box for photovoltaic power generation system | |
| CN108684194A (en) | A kind of high-performance aluminum Section Bar Heat Sinks | |
| CN106912180A (en) | Heat radiation module | |
| CN218335953U (en) | Radiator and photovoltaic inverter system with same | |
| CN219019341U (en) | Heat pipe assembly radiator | |
| CN214901827U (en) | Air-cooled radiator | |
| CN202818840U (en) | Radiator profile | |
| CN204130519U (en) | Based on the fixing of plug-in type MOSFET pipe and radiator structure | |
| KR20150025762A (en) | Heat sink for electronic comonent | |
| CN216218368U (en) | Quick radiating radiator section bar |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Munich Germany Applicant after: Osram Co., Ltd. Address before: Munich, Germany Applicant before: Osram GMBH |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: OSRAM GMBH TO: OSRAM AG |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120530 |