CN102476345A - Polishing method of 99.6 percent aluminum oxide ceramic film substrate - Google Patents
Polishing method of 99.6 percent aluminum oxide ceramic film substrate Download PDFInfo
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- CN102476345A CN102476345A CN2010105559606A CN201010555960A CN102476345A CN 102476345 A CN102476345 A CN 102476345A CN 2010105559606 A CN2010105559606 A CN 2010105559606A CN 201010555960 A CN201010555960 A CN 201010555960A CN 102476345 A CN102476345 A CN 102476345A
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Abstract
The invention relates to a polishing method of a 99.6 percent aluminum oxide ceramic film substrate. Raw materials are 99.99 percent aluminum oxide powder materials, 1.8 to 2.5 percent of magnesium oxide and 0.2 percent of silicon dioxide, polishing is carried out after slurry preparation, forming and sintering, novel high-intensity anti-impact bonding agents consisting of 60 weight percent of rosin, 30 percent of lac and 20 percent of beewax are used for gluing the substrate on an aluminum oxide ceramic plate with the thickness being 5mm, then, a grinding machine is used for grinding 0.5 to 4 hours, and the polishing is carried out.
Description
Technical field
The present invention relates to a kind of finishing method of ceramic substrate, especially a kind of finishing method of 99.6% aluminium oxide ceramics film substrate.
Background technology
The PCB circuit, promptly printed circuit board is claimed printed circuit board (PCB) again, is the supplier that electronic devices and components are electrically connected.The history in existing more than 100 year of its development; Its design mainly is a layout design; The major advantage that adopts circuit board is the mistake that significantly reduces wiring and assembling, has improved automatization level and productive labor rate.Yet; Development along with electronic circuit technology; Original PCB circuit board can not satisfy the requirement of industry development; Various countries begin one's study and seek new material and replace macromolecular material to do the base material of circuit board thereupon, and 96% alumina ceramic substrate of lower cost had obtained using widely afterwards, and there are the KYOCERA of Japan, the CoorsTek of the U.S., the Sai Lang Tyke of Germany in 96% bigger ceramic substrate production firm at present.Domestic have wide East 3rd Ring Road group and a Guangdong section of Tsing-Hua University.
And more better 99.6% aluminium oxide ceramics than 96% Alumina Ceramics, there is not manufacturers produce in China always yet.And produce 0.1mm and following ultra-thin substrate technical barrier especially.The technical difficulty of 99.6% alumina ceramic substrate production is that raw-material configuration, moulding, sintering and mill process several aspects.The prescription of 96% alumina ceramic substrate generally all adopts the alumina raw material of 99.9% purity, is equipped with silica, Suzhou soil and calcium carbonate, reduces firing temperature, satisfies the plasticity slurry requirement that casting molding processes requires.Material purity that can 99.6% alumina ceramic substrate is high; Traditional raw material can't meet the demands; Even guaranteed the purity of alumina ceramic substrate, traditional The tape casting and casting can't be realized the moulding and the sintering process of the ceramic substrate of 0.1mm and following thickness.These technical barriers are that a lot of enterprises can't capture for many years.And serious fragmentation has taken place at the substrate that grinds 0.3mm thickness in traditional handicraft, and how could ultra-thin film substrate be polished also is a great problem in the industry.
Summary of the invention
In order to address the above problem, the present invention adopts novel high-strength shock resistance binding agent, carries out ceramic polished (quoting the research situ-gel injection molding of U.S.'s Oak Ridge National Laboratory).Its concrete technical scheme is following:
Raw material is 99.99% alumina powder, the magnesia of 1.8-2.5% and 0.2% silica, and wherein magnesia and silica are as sintering agent.
Concrete grammar is following:
1) preparation slurry: organic monomer acrylamide and crosslinking agent N-N methylene acrylamide are mixed with deionized water according to 1.8: 100 mass ratio with the optimal proportion of 15: 1 (mass ratio) and the aluminium oxide ceramics powder that configures again; The slurry that is modulated into suitable moulding is (with the 4 glasss of tested viscosity that are coated with of 100ml; The viscosity number that is fit to is 25-45 second), do vacuumizing the de-bubble processing again;
2) gel calendering formation: adopt the thick float glass (length and width 340mmx430mm, this glass is smooth smooth) of 10mm, glass is cleaned oven dry back horizontal positioned, and 4 jiaos go out to place the 10mmx10mm size on glass, organic plate of thickness 0.1mm; Take by weighing a certain amount of slurry that configures then; Drip 0.1% catalyst (persulfate of 10% concentration) (all being mass ratio) stir be poured on glass; Press the same glass of lastblock in the level more on glass that is placed with ceramic size again, just in the middle of 2 sheet glass, formed the gel ceramic substrate of 1 thickness 0.1mm after 10 minutes.This substrate is taken down level gently be placed on the 300 purpose silk screens, just obtained the ultra-thin 99.6% ceramic substrate blank wanted after drying, more than operation is all in 100,000 Clean room completion.
3) monolithic laminates sintering: the ceramic substrate after the moulding carries out the stamping-out various sizes according to client's needs, then sintering in the kiln of 1800 degree.
4) polishing processing: adopt novel high-strength shock resistance binding agent that substrate is bonded on the thick alumina ceramic plate of 5mm, go up grinder again and grind.This novel high-strength shock resistance binding agent is by the rosin of percentage by weight 60%, and 30% shellac and 20% beeswax are formed.
The binding agent of at present single rosin preparation though it can satisfy general ceramic processing request, when environment temperature is hanged down, has shown the fragility of no good cake, not anti-big impact.Even and this binding agent at low temperatures, also can satisfy general ceramic processing request.And general polishing process can't be realized the mill processing of ultrathin substrate; The present invention adopts this special binding agent; Guarantee that ultrathin substrate can be not broken in process of lapping, and serious fragmentation has taken place at the substrate that grinds 0.3mm thickness in traditional handicraft.
The specific embodiment
Embodiment 1
Organic monomer acrylamide and crosslinking agent N-N methylene acrylamide are mixed with deionized water according to 1.8: 100 mass ratio with the optimal proportion of 15: 1 (mass ratio) and the raw material that configures again; The slurry that is modulated into suitable moulding is (with the 4 glasss of tested viscosity that are coated with of 100ml; The viscosity number that is fit to is 25-45 second), do vacuumizing the de-bubble processing again; Adopt the thick float glass of 10mm (length and width 340mmx430mm, this glass is smooth smooth) then, glass is cleaned oven dry back horizontal positioned, and 4 jiaos go out to place the 10mmx10mm size on glass, organic plate of thickness 0.1mm; Take by weighing a certain amount of slurry that configures then; Drip 0.1% catalyst (persulfate of 10% concentration) (all being mass ratio) stir be poured on glass; Press the same glass of lastblock in the level more on glass that is placed with ceramic size again, just in the middle of 2 sheet glass, formed the gel ceramic substrate of 1 thickness 0.1mm after 10 minutes.This substrate is taken down level gently be placed on the 300 purpose silk screens, just obtained the ultra-thin 99.6% ceramic substrate blank wanted after drying, more than operation is all in 100,000 Clean room completion.Then, carry out monolithic and laminate sintering, the ceramic substrate after the moulding is carried out the stamping-out various sizes according to client's needs, then sintering in the kiln of 1800 degree.At last,, adopt novel high-strength shock resistance binding agent that substrate is bonded on the thick alumina ceramic plate of 5mm, go up grinder again and grind the 99.6% aluminium oxide ceramics film substrate that obtains 0.1mm and following thickness through polishing processing.This novel high-strength shock resistance binding agent is by the rosin of percentage by weight 60%, and 30% shellac and 20% beeswax are formed.
Claims (4)
1. the finishing method of an aluminium oxide ceramics film substrate, its raw material is 99.99% alumina powder, the magnesia of 1.8-2.5% and 0.2% silica; Earlier with the feedstock production form slurry; Moulding obtains 99.6% ultra-thin ceramic substrate blank then, carries out sintering, polishes behind the sintering; Promptly adopt novel high-strength shock resistance binding agent that substrate is bonded on the thick alumina ceramic plate of 5mm; Go up the grinder grinding again and polished in 0.5-4 hour, said novel high-strength shock resistance binding agent is by the rosin of percentage by weight 60%, and 30% shellac and 20% beeswax are formed.
2. finishing method as claimed in claim 1; The step that is prepared into slurry is for mix according to 1.8: 100 mass ratio organic monomer acrylamide and crosslinking agent N-N methylene acrylamide with 15: 1 optimal proportion of mass ratio and the raw material that configures again with deionized water; Be modulated into the slurry that is fit to moulding; This slurry with 100ml is coated with 4 glasss of tested viscosity, and the viscosity number that is fit to the slurry of moulding is 25-45 second, does to vacuumize the de-bubble processing again.
3. finishing method as claimed in claim 1; Wherein the step of gel calendering formation is: adopting length and width is the thick float glass of 10mm of 340mmx430mm; Glass is cleaned oven dry back horizontal positioned, and 4 jiaos go out to place the 10mmx10mm size on glass, organic plate of thickness 0.1mm; Take by weighing a certain amount of slurry that configures then; The catalyst of persulfate that drips the 10wt% concentration of 0.1wt% stir be poured on glass; Press the same glass of lastblock in the level more on glass that is placed with ceramic size again, just in the middle of 2 sheet glass, formed the gel ceramic substrate of 1 thickness 0.1mm after 10 minutes; This substrate level is placed on the 300 purpose silk screens, obtains the ultra-thin 99.6% ceramic substrate blank of 0.1mm and following thickness after drying.
4. finishing method as claimed in claim 1; Wherein sintering adopts the method sintering that monolithic laminates; Ceramic substrate blank after the moulding is carried out the stamping-out various sizes according to client's needs, adopt mode that monolithic places then in the kiln of 1800 degree sintering 24-48 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105559606A CN102476345A (en) | 2010-11-22 | 2010-11-22 | Polishing method of 99.6 percent aluminum oxide ceramic film substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010105559606A CN102476345A (en) | 2010-11-22 | 2010-11-22 | Polishing method of 99.6 percent aluminum oxide ceramic film substrate |
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| CN102476345A true CN102476345A (en) | 2012-05-30 |
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| CN2010105559606A Pending CN102476345A (en) | 2010-11-22 | 2010-11-22 | Polishing method of 99.6 percent aluminum oxide ceramic film substrate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106986665A (en) * | 2017-05-03 | 2017-07-28 | 中国振华集团云科电子有限公司 | 99.6% Al of thin film integrated circuit2O3The preparation method of ceramic substrate |
| CN108747597A (en) * | 2018-04-25 | 2018-11-06 | 苏州智能制造研究院有限公司 | A kind of alumina ceramic substrate method of surface finish |
| CN115403363A (en) * | 2021-05-26 | 2022-11-29 | 宜兴鑫程锋新材料有限公司 | Preparation process of aluminum oxide ceramic wafer for radiator |
-
2010
- 2010-11-22 CN CN2010105559606A patent/CN102476345A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106986665A (en) * | 2017-05-03 | 2017-07-28 | 中国振华集团云科电子有限公司 | 99.6% Al of thin film integrated circuit2O3The preparation method of ceramic substrate |
| CN106986665B (en) * | 2017-05-03 | 2020-04-28 | 中国振华集团云科电子有限公司 | Preparation method of 99.6% Al2O3 ceramic substrate for thin film integrated circuit |
| CN108747597A (en) * | 2018-04-25 | 2018-11-06 | 苏州智能制造研究院有限公司 | A kind of alumina ceramic substrate method of surface finish |
| CN115403363A (en) * | 2021-05-26 | 2022-11-29 | 宜兴鑫程锋新材料有限公司 | Preparation process of aluminum oxide ceramic wafer for radiator |
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Application publication date: 20120530 |