CN102473816B - 基于电流拥挤调节颜色的电致发光装置 - Google Patents

基于电流拥挤调节颜色的电致发光装置 Download PDF

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Publication number
CN102473816B
CN102473816B CN201080029540.2A CN201080029540A CN102473816B CN 102473816 B CN102473816 B CN 102473816B CN 201080029540 A CN201080029540 A CN 201080029540A CN 102473816 B CN102473816 B CN 102473816B
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China
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light
spectrum
emitted
output surface
modifying material
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Expired - Fee Related
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CN201080029540.2A
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English (en)
Chinese (zh)
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CN102473816A (zh
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迈克尔·A·哈斯
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/813Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials

Landscapes

  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
CN201080029540.2A 2009-06-30 2010-06-25 基于电流拥挤调节颜色的电致发光装置 Expired - Fee Related CN102473816B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22166409P 2009-06-30 2009-06-30
US61/221,664 2009-06-30
PCT/US2010/040009 WO2011008474A1 (en) 2009-06-30 2010-06-25 Electroluminescent devices with color adjustment based on current crowding

Publications (2)

Publication Number Publication Date
CN102473816A CN102473816A (zh) 2012-05-23
CN102473816B true CN102473816B (zh) 2015-03-11

Family

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Family Applications (1)

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CN201080029540.2A Expired - Fee Related CN102473816B (zh) 2009-06-30 2010-06-25 基于电流拥挤调节颜色的电致发光装置

Country Status (7)

Country Link
US (1) US8304976B2 (enExample)
EP (1) EP2449608A1 (enExample)
JP (1) JP5728007B2 (enExample)
KR (1) KR20120055540A (enExample)
CN (1) CN102473816B (enExample)
TW (1) TW201110803A (enExample)
WO (1) WO2011008474A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102804422A (zh) 2009-05-05 2012-11-28 3M创新有限公司 用于与led结合使用的重发光半导体载流子器件及其制造方法
US8994071B2 (en) 2009-05-05 2015-03-31 3M Innovative Properties Company Semiconductor devices grown on indium-containing substrates utilizing indium depletion mechanisms
WO2010129412A1 (en) 2009-05-05 2010-11-11 3M Innovative Properties Company Re-emitting semiconductor construction with enhanced extraction efficiency
US8629611B2 (en) 2009-06-30 2014-01-14 3M Innovative Properties Company White light electroluminescent devices with adjustable color temperature
JP2012532454A (ja) 2009-06-30 2012-12-13 スリーエム イノベイティブ プロパティズ カンパニー カドミウム非含有の再発光半導体構成体
US9559272B2 (en) 2012-09-13 2017-01-31 3M Innovative Properties Company Efficient lighting system with wide color range
TWI624821B (zh) * 2017-09-07 2018-05-21 錼創科技股份有限公司 微型發光二極體顯示面板及其驅動方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007034367A1 (en) * 2005-09-19 2007-03-29 Koninklijke Philips Electronics N.V. Variable color light emitting device and method for controlling the same
US20080230795A1 (en) * 2007-03-20 2008-09-25 Eric W B Dias Light emitting diode
WO2009048704A2 (en) * 2007-10-08 2009-04-16 3M Innovative Properties Company Light emitting diode with bonded semiconductor wavelength converter
WO2009055079A1 (en) * 2007-10-26 2009-04-30 Cree Led Lighting Solutions, Inc. Illumination device having one or more lumiphors, and methods of fabricating same

Family Cites Families (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3526801A (en) 1964-08-07 1970-09-01 Honeywell Inc Radiation sensitive semiconductor device
JPH077847B2 (ja) 1984-12-17 1995-01-30 株式会社東芝 半導体発光素子
US5048035A (en) 1989-05-31 1991-09-10 Kabushiki Kaisha Toshiba Semiconductor light emitting device
JP2871477B2 (ja) 1994-09-22 1999-03-17 信越半導体株式会社 半導体発光装置およびその製造方法
EP0759264A1 (en) 1995-03-10 1997-02-26 Koninklijke Philips Electronics N.V. Lighting system for controlling the colour temperature of artificial light under the influence of the daylight level
US6294226B1 (en) 1997-02-19 2001-09-25 Kirin Beer Kabushiki Kaisha Method and apparatus for producing plastic container having carbon film coating
US7014336B1 (en) 1999-11-18 2006-03-21 Color Kinetics Incorporated Systems and methods for generating and modulating illumination conditions
US6016038A (en) 1997-08-26 2000-01-18 Color Kinetics, Inc. Multicolored LED lighting method and apparatus
JP3358556B2 (ja) 1998-09-09 2002-12-24 日本電気株式会社 半導体装置及びその製造方法
AU5463700A (en) 1999-06-04 2000-12-28 Trustees Of Boston University Photon recycling semiconductor multi-wavelength light-emitting diodes
FR2801814B1 (fr) 1999-12-06 2002-04-19 Cebal Procede de depot d'un revetement sur la surface interne des boitiers distributeurs aerosols
US6902987B1 (en) 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
TW497277B (en) 2000-03-10 2002-08-01 Toshiba Corp Semiconductor light emitting device and method for manufacturing the same
US7202613B2 (en) 2001-05-30 2007-04-10 Color Kinetics Incorporated Controlled lighting methods and apparatus
US6636003B2 (en) 2000-09-06 2003-10-21 Spectrum Kinetics Apparatus and method for adjusting the color temperature of white semiconduct or light emitters
IL138471A0 (en) 2000-09-14 2001-10-31 Yissum Res Dev Co Novel semiconductor materials and their uses
JP2004514285A (ja) 2000-11-17 2004-05-13 エムコア・コーポレイション 光抽出を改善するためのテーパーづけ側壁を有するレーザ分離ダイ
US7358679B2 (en) 2002-05-09 2008-04-15 Philips Solid-State Lighting Solutions, Inc. Dimmable LED-based MR16 lighting apparatus and methods
CA2427559A1 (en) 2002-05-15 2003-11-15 Sumitomo Electric Industries, Ltd. White color light emitting device
ATE468147T1 (de) 2003-01-16 2010-06-15 Femmepharma Holding Co Inc Vaginaler oder rektaler applikator und verfahren
NO20041523L (no) 2003-09-19 2005-03-21 Sumitomo Electric Industries Lysemitterende halvlederelement
DE10354936B4 (de) 2003-09-30 2012-02-16 Osram Opto Semiconductors Gmbh Strahlungemittierendes Halbleiterbauelement
US7026653B2 (en) 2004-01-27 2006-04-11 Lumileds Lighting, U.S., Llc Semiconductor light emitting devices including current spreading layers
TWI229465B (en) 2004-03-02 2005-03-11 Genesis Photonics Inc Single chip white light component
TWI243489B (en) 2004-04-14 2005-11-11 Genesis Photonics Inc Single chip light emitting diode with red, blue and green three wavelength light emitting spectra
US7361938B2 (en) 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
US7553683B2 (en) 2004-06-09 2009-06-30 Philips Lumiled Lighting Co., Llc Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices
US7126160B2 (en) 2004-06-18 2006-10-24 3M Innovative Properties Company II-VI/III-V layered construction on InP substrate
US7119377B2 (en) 2004-06-18 2006-10-10 3M Innovative Properties Company II-VI/III-V layered construction on InP substrate
US7534633B2 (en) 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
US7223998B2 (en) 2004-09-10 2007-05-29 The Regents Of The University Of California White, single or multi-color light emitting diodes by recycling guided modes
CA2583504A1 (en) 2004-10-08 2006-07-06 The Regents Of The University Of California High efficiency light-emitting diodes
US7402831B2 (en) * 2004-12-09 2008-07-22 3M Innovative Properties Company Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission
TWI245440B (en) * 2004-12-30 2005-12-11 Ind Tech Res Inst Light emitting diode
US7804100B2 (en) 2005-03-14 2010-09-28 Philips Lumileds Lighting Company, Llc Polarization-reversed III-nitride light emitting device
US7417260B2 (en) 2005-06-28 2008-08-26 Dong-Sing Wuu Multiple-chromatic light emitting device
JP4971672B2 (ja) * 2005-09-09 2012-07-11 パナソニック株式会社 発光装置
US7285791B2 (en) 2006-03-24 2007-10-23 Goldeneye, Inc. Wavelength conversion chip for use in solid-state lighting and method for making same
KR100875443B1 (ko) 2006-03-31 2008-12-23 서울반도체 주식회사 발광 장치
US20070284565A1 (en) 2006-06-12 2007-12-13 3M Innovative Properties Company Led device with re-emitting semiconductor construction and optical element
US7902542B2 (en) 2006-06-14 2011-03-08 3M Innovative Properties Company Adapted LED device with re-emitting semiconductor construction
US20080121911A1 (en) * 2006-11-28 2008-05-29 Cree, Inc. Optical preforms for solid state light emitting dice, and methods and systems for fabricating and assembling same
JP2008159708A (ja) * 2006-12-21 2008-07-10 Matsushita Electric Works Ltd 発光装置
KR100829925B1 (ko) 2007-03-02 2008-05-16 세메스 주식회사 기판을 처리하는 장치 및 방법
US8941566B2 (en) 2007-03-08 2015-01-27 3M Innovative Properties Company Array of luminescent elements
US7288902B1 (en) 2007-03-12 2007-10-30 Cirrus Logic, Inc. Color variations in a dimmable lighting device with stable color temperature light sources
US7759854B2 (en) 2007-05-30 2010-07-20 Global Oled Technology Llc Lamp with adjustable color
US10505083B2 (en) * 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
WO2009036579A1 (en) 2007-09-21 2009-03-26 Hoffmann Neopac Ag Apparatus for plasma supported coating of the inner surface of tube-like packaging containers made of plastics with the assistance of a non-thermal reactive ambient pressure beam plasma
KR20110019390A (ko) 2008-06-05 2011-02-25 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접합형 반도체 파장 변환기를 갖는 발광 다이오드
JP2011526079A (ja) 2008-06-26 2011-09-29 スリーエム イノベイティブ プロパティズ カンパニー 半導体光変換構成体
CN102124582B (zh) 2008-06-26 2013-11-06 3M创新有限公司 半导体光转换构造
CN102124407A (zh) 2008-08-14 2011-07-13 3M创新有限公司 具有成像光源模块的投影系统
CN102197551A (zh) 2008-09-04 2011-09-21 3M创新有限公司 由gan ld光泵的散热器上式ⅱ-ⅵ族mqw vcsel
WO2010028146A2 (en) 2008-09-08 2010-03-11 3M Innovative Properties Company Electrically pixelated luminescent device
US8619620B2 (en) 2008-09-16 2013-12-31 Qualcomm Incorporated Methods and systems for transmission mode selection in a multi channel communication system
KR20110105842A (ko) 2008-12-24 2011-09-27 쓰리엠 이노베이티브 프로퍼티즈 컴파니 양면 파장 변환기를 갖는 광 발생 소자
US8994071B2 (en) 2009-05-05 2015-03-31 3M Innovative Properties Company Semiconductor devices grown on indium-containing substrates utilizing indium depletion mechanisms
WO2010129412A1 (en) 2009-05-05 2010-11-11 3M Innovative Properties Company Re-emitting semiconductor construction with enhanced extraction efficiency
US8629611B2 (en) 2009-06-30 2014-01-14 3M Innovative Properties Company White light electroluminescent devices with adjustable color temperature
JP2012532454A (ja) 2009-06-30 2012-12-13 スリーエム イノベイティブ プロパティズ カンパニー カドミウム非含有の再発光半導体構成体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007034367A1 (en) * 2005-09-19 2007-03-29 Koninklijke Philips Electronics N.V. Variable color light emitting device and method for controlling the same
US20080230795A1 (en) * 2007-03-20 2008-09-25 Eric W B Dias Light emitting diode
WO2009048704A2 (en) * 2007-10-08 2009-04-16 3M Innovative Properties Company Light emitting diode with bonded semiconductor wavelength converter
WO2009055079A1 (en) * 2007-10-26 2009-04-30 Cree Led Lighting Solutions, Inc. Illumination device having one or more lumiphors, and methods of fabricating same

Also Published As

Publication number Publication date
EP2449608A1 (en) 2012-05-09
KR20120055540A (ko) 2012-05-31
CN102473816A (zh) 2012-05-23
US20120091882A1 (en) 2012-04-19
WO2011008474A1 (en) 2011-01-20
TW201110803A (en) 2011-03-16
JP5728007B2 (ja) 2015-06-03
JP2012532452A (ja) 2012-12-13
US8304976B2 (en) 2012-11-06

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Granted publication date: 20150311

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