CN102468307A - Substrate module, display panel and touch panel - Google Patents
Substrate module, display panel and touch panel Download PDFInfo
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- CN102468307A CN102468307A CN2010105500424A CN201010550042A CN102468307A CN 102468307 A CN102468307 A CN 102468307A CN 2010105500424 A CN2010105500424 A CN 2010105500424A CN 201010550042 A CN201010550042 A CN 201010550042A CN 102468307 A CN102468307 A CN 102468307A
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Abstract
The invention provides a substrate module, a display panel and a touch panel. The substrate module comprises a first substrate, a second substrate, a frame glue and atom layer depositing films, wherein the first substrate is provided with a first inner surface, a first outer surface and a first side face; the second substrate is provided with a second inner surface, a second outer surface and a second side face; the first inner surface and the second inner surface are oppositely arranged; the first inner surface of the first substrate and the second inner surface of the second substrate are jointed together through the frame glue; the first substrate, the second substrate and the frame glue form a filling space; and the atom layer depositing films are arranged on the first outer surface and the second outer surface.
Description
Technical field
The present invention relates to a kind of substrate module, display floater and contact panel, relate in particular to a kind of substrate module, display floater and contact panel with ideal machine intensity.
Background technology
Along with progressing greatly of development of semiconductor and information technology, the face equipment that display floater and contact panel are a type has been widely used in the multiple electronic product in the daily life.The user can obtain required information through the image that face equipment shows or directly contact surface plate device is to carry out required function.Thereby the development of face equipment brings very big convenience.
The probability of user's direct contact surface panel assembly significantly promotes, and face equipment is because of not enough possibly also the increasing of damaging of mechanical strength.So whether durable the mechanical strength of face equipment become electronic product key factor.At present, all adopt the substrate of strengthening (glass substrate of for example strengthening) to make face equipment to improve its mechanical strength.Yet, possibly make in the step of making face equipment that the substrate of strengthening produces the concentration zones of stress or produces crack improperly.Therefore, such mode is still limited for the lifting of the mechanical strength of face equipment.
Summary of the invention
The present invention provides a kind of substrate module, has excellent mechanical intensity.
The present invention provides a kind of display floater, has desirable mechanical strength.
The present invention provides a kind of contact panel, has desirable mechanical strength.
The present invention proposes a kind of substrate module, comprises one first substrate, one second substrate, a frame glue and an ald (Atomic Layer Deposition, ALD) film.First substrate has one first inner surface, one first outer surface and one first side.Second substrate has one second inner surface, one second outer surface and one second side.First inner surface and second inner surface are established in opposite directions.First inner surface of first substrate and second inner surface of second substrate lump together through the frame splicing.The ald film is disposed on first outer surface and second outer surface.
The present invention proposes a kind of display floater in addition, comprises an aforesaid substrate module and a display medium, and wherein display medium is filled between first substrate and second substrate.
The present invention proposes a kind of contact panel again, comprises an aforesaid substrate module and an insulating material, and wherein filling insulating material is between first substrate and second substrate.
Based on above-mentioned, the present invention forms an ald film to improve the mechanical strength of substrate module on the outer surface of substrate module after the upright completion of two substrates group.Ald film density is high, and can form protection at substrate module outer surface.Therefore, the phenomenon concentrated of the crack that produced before upright of substrate module group or stress can be releived and the mechanical strength that helps to improve the substrate module more helps to promote the display floater with this substrate module and the reliability of contact panel.
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, hereinafter is special lifts embodiment, and cooperates appended graphic elaborating as follows.
Description of drawings
Fig. 1 is the substrate module sketch map of one embodiment of the invention.
Fig. 2 is the substrate module sketch map of another embodiment of the present invention.
Fig. 3 is the local enlarged diagram of the substrate module of Fig. 1, and wherein only diagram has the ald film and first substrate.
Fig. 4 is the substrate module sketch map of an embodiment more of the present invention.
Fig. 5 is the substrate module sketch map of further embodiment of this invention.
Main description of reference numerals:
10,10A, 20,20A:100: first substrate; 102: the first inner surfaces;
The substrate module;
104: the first outer surfaces; 106: the first sides; 110: the first element layers;
200: the second substrates; 202: the second inner surfaces; 204: the second outer surfaces;
206: the second sides; 210: the second element layers; 300: frame glue;
302: the three sides; 400,410:C: crack;
The ald film;
S: packing space; V1, V2: end.
Embodiment
Fig. 1 is the substrate module sketch map of one embodiment of the invention.Please with reference to Fig. 1, substrate module 10 comprises one first substrate 100, one second substrate 200, a frame glue 300 and an ald film 400.First substrate 100 has one first inner surface 102 and one first outer surface 104.Second substrate 200 has one second inner surface 202 and one second outer surface 204.First inner surface 102 and second inner surface 202 are established in opposite directions.First inner surface 102 of first substrate 100 and second inner surface 202 of second substrate 200 are bonded together through frame glue 300.Ald film 400 is disposed on first outer surface 104 and second outer surface 204.
In one embodiment, the material of ald film 400 comprises an inorganic material, an organic material, a polycrystalline material, or a non-crystalline material.Above-mentioned inorganic material comprises aluminium oxide, silica, titanium oxide, zinc oxide, and organic material comprises polyimides.In addition, the material of first substrate 100 and second substrate 200 can be glass, silicon etc., but the material of first substrate 100 and second substrate 200 also can be macromolecule (or plastic cement) material or pliability material.
In the present embodiment, frame glue 300 in fact only contacts first inner surface 102 partly, and contacts second inner surface 202 partly.In addition, frame glue 300 for example can be around the periphery of first substrate 100.So, will constitute a packing space S after first substrate 100, second substrate 200 and 300 groups of upright completion of frame glue.Substrate module 10 can have been inserted display medium (not illustrating) when making display floater among the packing space S.In addition, substrate module 10 is when making contact panel, and configurable among the packing space S have insulating material (not illustrating) or a clearance for insulation thing (not illustrating).In other words, substrate module 10 can be applied in display floater or contact panel or the touch-control display panel.
Can more include other elements when for instance, substrate module 10 is applied to display floater or contact panel or touch-control display panel.Fig. 2 is the substrate module sketch map of another embodiment of the present invention.Please with reference to Fig. 2, substrate module 10A also includes one first element layer 110 and one second element layer 210 except first substrate 100, second substrate 200, frame glue 300 and ald film 400.First element layer 110 is disposed on first inner surface 102 of first substrate 100, and second element layer 210 is disposed on second inner surface 202 of second substrate 200.In one embodiment, first element layer 110 or second element layer 210 comprise a pel array.First element layer 110 or second element layer 210 also can comprise a colour filter array.In another embodiment, at least one comprises a touch control component in first element layer 110 and second element layer 210.Substrate module 10A is the execution mode that disposes element layer in the substrate module 10.Following examples will describe with substrate module 10, yet the those of ordinary skill in the said technical field can be understood substrate module 10A and also can contain the described phenomenon of following content is arranged.
Fig. 3 is the local enlarged diagram of the substrate module of Fig. 1, and wherein only diagram has the ald film and first substrate.Please be simultaneously with reference to Fig. 1 and Fig. 3; First substrate 100 for example can pass through a plurality of procedure of processings before standing with 200 groups of second substrates; For example thin film deposition steps, lithography step etc. are to be made in required element (for example dot structure, colour filter array and touch control component etc.) on first substrate 100.Certainly, second substrate 200 also can pass through many procedure of processings to form required element on it.But, Fig. 3 has only illustrated first substrate 100, so following will describing with first substrate 100.Illustrated phenomenon also can betide in second substrate 200 below those of ordinary skill in the affiliated technical field all can be understood.
In detail, in these procedure of processings such as deposition, etching, first substrate 100 may produce crack C.Though crack C is unlikely to cause the damage of substrate module 10, when first substrate 100 received external impacts, stress can concentrate on terminal V1.According to the Griffith fracture theory, first substrate, 100 suffered maximum stresses are during greater than a critical value, and crack C will expand and make 100 breakages of first substrate.That is to say that the stress that terminal V1 accumulated might cause the damage of substrate module 10.In addition, the radius of curvature, affects of terminal V1 the effect that stress is concentrated, wherein sharp-pointed more terminal V1, and its radius of curvature is more little, and then the stress localization effects is remarkable more.So terminal V1 sharply possibly cause significant stress localization effects more and make that the reliability after 10 groups of upright completion of substrate module is not good.
In the present embodiment, first substrate 100 stands into substrate module 10 backs with 200 groups of second substrates and makes ald film 400 through atomic layer deposition method (Atomic Layer Deposition Process).Ald film 400 will form comparatively slick and sly terminal V2 after being filled in crack C.In comparison, the radius of curvature of terminal V2 is greater than the radius of curvature of terminal V1.Therefore, the effect that terminal V2 counter stress is concentrated a little less than, and make disposing of ald film 400 help relax the effect that stress is concentrated.
Under same external impacts, the crack C that deposits ald film 400 is not easy expansion, and does not have the crack C of ald film 400 to be easier to expansion.So present embodiment is formed with the possibility that ald film 400 can reduce by 10 breakages of substrate module on first outer surface 104 of first substrate 100.Likewise, the ald film 400 on second outer surface 204 of second substrate 200 also can reduce the possibility of substrate module 10 breakages.In addition, high via ald film 400 densityes of atomic layer deposition method made, and can further provide substrate module 10 preferable mechanical strength.
Generally speaking, first substrate 100 and second substrate 200 are formed by one first motherboard (not illustrating) and the cutting of one second motherboard (not illustrating) respectively.The production method of substrate module 10 for example is through a plurality of frame glue 300 first motherboard (not illustrating) toward each other to be bonded together with second motherboard (not illustrating), wherein each frame glue 300 all definable go out a substrate module 10 shown in Figure 1.Subsequently, carry out atomic layer deposition method on the outer surface of first motherboard (not illustrating) and second motherboard (not illustrating), to form an ald film 400.Then, first motherboard (not illustrating) that group is upright good and second motherboard (not illustrating) cut into a plurality of like substrate module 10 that Fig. 1 illustrated.So in the substrate module 10 with this production order made, ald film 400 is positioned at first outer surface 104 of first substrate 100 and second outer surface 204 of second substrate 200.
But, in other embodiment, the cutting step of motherboard and the production order of atomic layer deposition method are interchangeable to form substrate module as shown in Figure 4.Fig. 4 is the substrate module sketch map of an embodiment more of the present invention.Please with reference to Fig. 4, substrate module 20 comprises one first substrate 100, one second substrate 200, a frame glue 300 and an ald film 410.In the present embodiment, first substrate 100, second substrate 200 are identical with the configuration relation and the previous embodiment of frame glue 300, and first substrate 100, second substrate 200 similarly cross a packing space S with frame glue 300.But, the production method of substrate module 20 is slightly different with the production method of substrate module 10, and wherein first substrate 100 and second substrate 200 just carry out atomic layer deposition method to form ald film 410 by after cutting down on the motherboard.Therefore, first substrate 100, second substrate 200 and frame glue 300 are by a continuous film (being 410 encirclements of ald film).
Particularly, first substrate 100 of present embodiment has one first inner surface 102, one first outer surface 104 and one first side 106, and wherein ald film 410 directly is disposed on first outer surface 104 and first side 106.And second substrate 200 has one second inner surface 202, one second outer surface 204 and one second side 206, and wherein ald film 410 directly is disposed on second outer surface 204 and second side 206.In addition, ald film 410 more directly is disposed at one three side 302 of frame glue 300 away from packing space S.
The ald film 410 of present embodiment is a continuous film, and ald film 410 has high-compactness.So, slowing down except filling up surperficial crack the concentrated phenomenon of stress, fine and close ald film 410 more can be strengthened the engaging force of substrate module 20 so that substrate module 20 has desirable mechanical strength.In addition, ald film 410 just formation after 200 groups of first substrate 100 and second substrates are upright, so the protective effect that ald film 410 provided and the humidification destruction that can not receive steps such as deposition, etching.In other words, when substrate module 20 is applied to display floater or contact panel or touch-control display panel, can keeps excellent mechanical intensity and help to promote the reliability of face equipment.
In addition, Fig. 5 is the substrate module sketch map of further embodiment of this invention.Please with reference to Fig. 5, substrate module 20A is similar in appearance to substrate module 20.Particularly, substrate module 20A also includes one first element layer 110 and one second element layer 210 except first substrate 100, second substrate 200, frame glue 300 and ald film 410.First element layer 110 is disposed on first inner surface 102 of first substrate 100, and second element layer 210 is disposed on second inner surface 202 of second substrate 200.In one embodiment, first element layer 110 or second element layer 210 comprise a pel array.First element layer 110 or second element layer 210 also can comprise a colour filter array.In another embodiment, at least one comprises a touch control component in first element layer 110 and second element layer 210.That is to say that substrate module 20A is the execution mode that disposes element layer in the substrate module 20.
In one embodiment, substrate module 20A can be filled with display medium (not illustrating) when making display floater in the packing space S.Display medium (not illustrating) can be liquid crystal molecule, electrophoresis material or electric wetted material etc.In addition, when display floater is organic electroluminescence display panel, can be filled with inert gas in the packing space S.When making contact panel, configurable in the packing space S have insulating material, a clearance for insulation thing etc. at substrate module 20A.
What deserves to be mentioned is that the described element layer of above embodiment all simply comes out with single stratiform structural diagrams.But, in the practical structure design, these element layers can be stacked by the rete of a plurality of patternings and form, and also can be made up of single rete.Similarly, the described ald film of above embodiment all illustrates out with single rete, and but, in practical structure design, the ald film can be constituted or stacked by multi-layer atomic layer and forms by the individual layer atomic layer.
In addition, the thickness of ald film can determine with substrate material, process conditions (like temperature) and strength demand.In one embodiment, the thickness of ald film can be tens of how rice, but the invention is not restricted to this.The process temperatures of making the ald film can be 100 ℃ to 200 ℃, but the present invention is not limited to this.
In sum, the present invention carries out atomic layer deposition method so that substrate module outer surface forms the ald film after the two substrates group is upright.The ald film has fine and close character and can fill up the crack on the substrate surface.So substrate module of the present invention has preferably that mechanical strength also is not easy to damage because of external force.Substrate module of the present invention helps the reliability of lifting device when being applied to face equipments such as display floater or contact panel.
Though the present invention with the embodiment explanation as above; Right its is not in order to limit the present invention; The those of ordinary skill of technical field under any; Do not breaking away from the spirit and scope of the present invention, when doing partly to change or be equal to replacement, so protection scope of the present invention is as the criterion with the scope that the application's claim is defined.
Claims (12)
1. substrate module is characterized in that: comprising:
One first substrate has one first inner surface, one first outer surface and one first side;
One second substrate has one second inner surface, one second outer surface and one second side, and this first inner surface and this second inner surface are established in opposite directions;
One frame glue, this first inner surface of this first substrate and this second inner surface of this second substrate lump together through this frame splicing; And
One ald film is disposed on this first outer surface and this second outer surface.
2. substrate module according to claim 1 is characterized in that: wherein this first substrate, this second substrate and this frame glue constitute a packing space.
3. substrate module according to claim 2 is characterized in that: wherein this ald film more is disposed on this first side, this second side and this frame glue one the 3rd side away from this packing space.
4. substrate module according to claim 1 is characterized in that: wherein this ald film is a continuous film, surrounds this first substrate, this second substrate and this frame glue.
5. substrate module according to claim 1; It is characterized in that: more comprise one first element layer and one second element layer; This first element layer is disposed on this first inner surface of this first substrate, and this second element layer is disposed on this second inner surface of this second substrate.
6. substrate module according to claim 5 is characterized in that: wherein this first element layer or this second element layer comprise a pel array.
7. substrate module according to claim 5 is characterized in that: wherein this first element layer or this second element layer comprise a colour filter array.
8. substrate module according to claim 5 is characterized in that: wherein at least one comprises a touch control component in this first element layer and this second element layer.
9. substrate module according to claim 1 is characterized in that: wherein the material of this ald film comprises an inorganic material, an organic material, a polycrystalline material or a non-crystalline material.
10. substrate module according to claim 9 is characterized in that: wherein this inorganic material comprises aluminium oxide, silica, titanium oxide, zinc oxide, and this organic material comprises polyimides.
11. a display floater is characterized in that: comprising:
Like the arbitrary described substrate module of claim 1 to 10; And
One display medium is filled between this first substrate and this second substrate.
12. a contact panel is characterized in that: comprising:
Like the arbitrary described substrate module of claim 1 to 10; And
One insulating material is disposed between this first substrate and this second substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105500424A CN102468307A (en) | 2010-11-15 | 2010-11-15 | Substrate module, display panel and touch panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105500424A CN102468307A (en) | 2010-11-15 | 2010-11-15 | Substrate module, display panel and touch panel |
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| Publication Number | Publication Date |
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| CN102468307A true CN102468307A (en) | 2012-05-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010105500424A Pending CN102468307A (en) | 2010-11-15 | 2010-11-15 | Substrate module, display panel and touch panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109003951A (en) * | 2018-08-10 | 2018-12-14 | 云谷（固安）科技有限公司 | Encapsulating structure, display device and encapsulating structure preparation method |
| CN109509402A (en) * | 2017-09-14 | 2019-03-22 | 昆山国显光电有限公司 | A kind of flexible display apparatus |
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| WO2004105149A1 (en) * | 2003-05-16 | 2004-12-02 | E.I. Dupont De Nemours And Company | Barrier films for plastic substrates fabricated by atomic layer deposition |
| US20060284556A1 (en) * | 2003-11-12 | 2006-12-21 | Tremel James D | Electronic devices and a method for encapsulating electronic devices |
| WO2009071741A1 (en) * | 2007-12-03 | 2009-06-11 | Beneq Oy | Method for increasing the durability of glass and a glass product |
| CN102770801A (en) * | 2010-02-02 | 2012-11-07 | 贝尼科公司 | Strengthened structural module and method of fabrication |
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2010
- 2010-11-15 CN CN2010105500424A patent/CN102468307A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004105149A1 (en) * | 2003-05-16 | 2004-12-02 | E.I. Dupont De Nemours And Company | Barrier films for plastic substrates fabricated by atomic layer deposition |
| US20060284556A1 (en) * | 2003-11-12 | 2006-12-21 | Tremel James D | Electronic devices and a method for encapsulating electronic devices |
| WO2009071741A1 (en) * | 2007-12-03 | 2009-06-11 | Beneq Oy | Method for increasing the durability of glass and a glass product |
| CN102770801A (en) * | 2010-02-02 | 2012-11-07 | 贝尼科公司 | Strengthened structural module and method of fabrication |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109509402A (en) * | 2017-09-14 | 2019-03-22 | 昆山国显光电有限公司 | A kind of flexible display apparatus |
| CN109509402B (en) * | 2017-09-14 | 2022-03-18 | 广州国显科技有限公司 | Flexible display device |
| CN109003951A (en) * | 2018-08-10 | 2018-12-14 | 云谷（固安）科技有限公司 | Encapsulating structure, display device and encapsulating structure preparation method |
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Application publication date: 20120523 |