CN102467196A - Heat dissipation structure - Google Patents

Abstract

A heat dissipation structure is arranged in an electronic device. The heat dissipation structure has a flow guide tube, and an air channel is formed in the flow guide tube and penetrates through a top surface to a bottom surface of the electronic device. The air channel forms an outlet and an inlet on the top and bottom surfaces respectively. The flow guide pipe is provided with at least one through hole which is communicated with the air flow channel and the interior of the electronic device, so that hot air in the interior of the electronic device flows out from the outlet through the air flow channel, and external cold air flows into the air flow channel from the inlet, thereby forming circulating air flow.

Description

Heat dissipation structure

technical field

The invention relates to a heat dissipation structure, in particular to a heat dissipation structure for electronic equipment without a built-in fan.

Background technique

The difference between a thin computer (thin client) and a common personal computer on the market is that a thin computer does not have built-in applications and omits redundant functions. Thin PC can also be said to be a general term for terminals that can be operated by reading data or executing applications after connecting to a server in a network environment. The thin computer does not have a hard disk and output devices including CDs and floppy drives inside. And the thin computer and the operating system are embedded in the read-only memory, so that the client only has a window terminal that can be input and has simple functions. Therefore, the thin computer itself cannot handle any calculation operations, and all programs and data are stored on the server (Server), and the functions of calculation and data storage are achieved through the server. As network security is increasingly threatened and enterprises want to reduce maintenance costs, thin computers are definitely one of the indispensable basic equipment for the sustainable operation of domestic enterprises in the future.

Because the configuration of the thin computer is simple, and there are no movable components inside it, such as heat dissipation and ventilation. Therefore, the heat dissipation device in the compact computer generally uses heat dissipation fins on the heat source, and the opposite sides of the compact computer casing are provided with ventilation holes, and the heat source is removed through the principles of heat conduction and natural heat convection to avoid internal chips. Crash due to overheating. However, due to the advancement of technology and the user's requirements for product performance improvement, the internal equipment of the thin-type computer must also be continuously improved to achieve the goal of high efficiency and high function during its operation. However, as the internal equipment of the compact computer continues to improve, the heat energy generated by its internal electronic units also continues to increase. Because the ventilation holes of the existing simplified computer are arranged on opposite sides of the casing, the ventilation holes are far away from the central area of the casing, and the internal structure of the simplified computer is easy to block the development of natural heat convection, making the inside of the simplified computer The heat convection effect in the central area is quite insignificant. As a result, the existing heat dissipation structure cannot meet the heat dissipation requirements of today's compact computers.

Contents of the invention

In view of the above problems, the technical problem to be solved by the present invention is to provide a heat dissipation structure, so as to solve the problem that the heat dissipation structure in the prior art cannot meet the heat dissipation requirements of the compact computer.

The heat dissipation structure of an embodiment disclosed in the present invention is suitable for an electronic device. The electronic device has an opposite top surface and a bottom surface, and the electronic device also has an accommodating space for accommodating a motherboard. An electronic component is arranged on the main board, and the heat dissipation structure is used for eliminating heat energy generated by the electronic component. The heat dissipation structure is characterized in that the heat dissipation structure has a guide tube, and the guide tube is arranged in the accommodating space and runs through the main board. There is an air channel in the guide tube, which passes through the electronic device from the top surface to the bottom surface, and the air channel forms an outlet and an inlet on the top surface and the bottom surface respectively. The guide tube has at least one through hole, which connects the air channel and the accommodation space, so that the hot air generated by the electronic components flows into the air channel through the through hole, and flows out from the outlet, and the external cold air flows into the air channel from the inlet, thereby forming A circular airflow.

The heat dissipation structure disclosed in an embodiment of the present invention includes a flow guide tube with an air channel, the guide tube runs through the electronic device, and communicates the air channel with the internal accommodation space of the electronic device through the through hole. Based on the principle that hot air is lighter than cold air, the draft tube generates a circulating airflow in the airflow channel, which accelerates the removal of heat sources in the electronic equipment, thereby achieving a good heat dissipation effect and making up for the lack of heat dissipation effect of the existing heat dissipation structure.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

FIG. 1 is a schematic diagram of a heat dissipation structure used in a compact computer according to an embodiment of the present invention;

FIG. 2 is a structural cross-sectional view of a heat dissipation structure according to an embodiment of the present invention;

FIG. 3 is an enlarged view of a local structure of the heat dissipation structure according to FIG. 3;

FIG. 4 is an enlarged view of a partial structure of a heat dissipation structure according to another embodiment of the present invention;

FIG. 5 is an enlarged view of a partial structure of a heat dissipation structure according to another embodiment of the present invention;

FIG. 6 is a structural cross-sectional view of a heat dissipation structure according to another embodiment of the present invention.

Among them, reference signs

10 thin computer

100 heat dissipation structure

110 diversion tube

1101 first pipe body

1102 second pipe body

112 air flow channel

114 through holes

116 exit

118 Entrance

210 First shell

212 top surface

220 second housing

222 Bottom

230 storage space

240 electronic components

250 tripod

260 motherboard

270 ventilation holes

300 flat

Detailed ways

Below in conjunction with accompanying drawing, structural principle and working principle of the present invention are specifically described:

Please refer to FIG. 1 , which is a schematic diagram of a heat dissipation structure used in a compact computer according to an embodiment of the present invention. The heat dissipation structure 100 of an embodiment of the present invention is used for heat dissipation of an electronic device. For the convenience of description, the electronic device of this embodiment takes the thin computer 10 as an example, but it is not limited thereto.

Please refer to FIG. 2 and FIG. 3 at the same time. FIG. 2 is a cross-sectional view of a heat dissipation structure according to an embodiment of the present invention, and FIG. 3 is an enlarged view of a partial structure of the heat dissipation structure in FIG. 2 .

The compact computer 10 according to an embodiment of the present invention can be set on a plane 300 , and the plane 300 can be a general desktop or a floor, but not limited thereto. The compact computer 10 of this embodiment includes a first casing 210 , a second casing 220 , a motherboard 260 and an electronic component 240 . Wherein, the second housing 220 faces the plane 300 , and the first housing 210 and the second housing 220 are combined with each other, and the first housing 210 and the second housing 220 jointly form an accommodating space 230 . The motherboard 260 is sandwiched between the first casing 210 and the second casing 220 and located in the accommodating space 230 , and the electronic component 240 is disposed on the motherboard 260 . Wherein, the electronic component 240 may be a central processing unit, but not limited thereto, and the electronic component 240 may generally refer to other electronic components that generate heat. In addition, the compact computer 10 also has a bottom surface 222 and a top surface 212 opposite to each other. The bottom surface 222 is a partial surface of the second housing 220, the top surface 212 is a partial surface of the first housing 210, and the bottom surface 222 faces the plane 300. .

The compact computer 10 of this embodiment also has a plurality of feet 250 , and the feet 250 are disposed on the bottom surface 222 of the second housing 220 and abut against the plane 300 . The compact computer 10 maintains a distance between the bottom surface 222 and the plane 300 through the setting of the stand 250 , that is, the second housing 220 is suspended on the plane 300 .

Please continue to refer to FIG. 1 to FIG. 3 , the heat dissipation structure 100 according to an embodiment of the present invention has a duct 110 . The guide tube 110 is a hollow circular tube, but its shape is not intended to limit the present invention. For example, the shape of the guide tube 110 can also be a hollow square tube or a hollow polygonal tube. In addition, the material of the guide tube 110 may also be plastic, but not limited thereto, and may also be a common metal material. The guide tube 110 further includes a first tube body 1101 and a second tube body 1102 , the shape of the first tube body 1101 can match the shape of the second tube body 1102 , but not limited thereto. The first tube body 1101 is disposed on the first housing 210 and faces the second housing 220 , and the second tube body 1102 is disposed on the second housing 220 and faces the first housing 210 . That is, the first tube body 1101 and the second tube body 1102 are located in the accommodating space 230 .

In this embodiment, the diameter of the end of the first tube body 1101 facing the second tube body 1102 is larger than the tube diameter of the second tube body 1102 , so when the first shell 210 and the second shell 220 are combined with each other, the second shell 210 A tube body 1101 covers one end of the second tube body 1102 so that the first tube body 1101 and the second tube body 1102 can be connected. Therefore, the first pipe body 1101 communicates with the hollow hole in the second pipe body 1102 to form an air channel 112 together. The air channel 112 runs through the thin computer 10 from the top surface 212 to the bottom surface 222 . That is to say, the air duct 112 of the air guide tube 110 runs through the first casing 210 , the motherboard 260 and the second casing 220 . Moreover, in this embodiment, the main board 260 is pierced by the second pipe body 1102, but it is not limited thereto. plate 260. In this embodiment, the air channel 112 is located on the top surface 212 to form an outlet 116 , and the air channel 112 is located on the bottom surface 222 to form an inlet 118 , so that outside air can enter and exit the air channel 112 through the inlet 118 and the outlet 116 .

The air guide tube 110 of this embodiment also has a through hole 114 , the through hole 114 communicates with the air channel 112 and the accommodation space 230 , so that the air in the accommodation space 230 can flow to the air channel 112 . As far as this embodiment is concerned, the through hole 114 is located at the junction of the first tube body 1101 and the second tube body 1102, that is, when the through hole 114 is covered by the first tube body 1101 and the second tube body 1102, the second tube body 1102 A gap is defined between the inner wall of the first tube 1101 and the outer wall of the second tube 1102 . It should be noted that the position and form of the through hole 114 are not used to define the present invention. Please refer to FIG. 4 and FIG. 5 at the same time. FIG. 4 and FIG. 5 are partial structural enlarged views of a heat dissipation structure according to another embodiment of the present invention. In another embodiment of the present invention, the through hole 114 can also be opened directly to the wall surface of the first tube body 1101 , as shown in FIG. 4 . Alternatively, the through hole 114 in another embodiment of the invention can also be opened directly to the wall surface of the second tube body 1102 , as shown in FIG. 5 . As long as the through hole 114 is opened, the air channel 112 can communicate with the accommodating space 230 .

The heat dissipation principle of the heat dissipation structure 100 of this embodiment will be described in detail below, please continue to refer to FIG. 1 and FIG. 2 . When the thin computer 10 is in operation, the electronic components 240 on the motherboard 260 will start to generate heat energy, and then the temperature of the air in the accommodating space 230 will rise to generate hot air. When the hot air flows into the air channel 112 through the through hole 114, since the hot air in the accommodating space 230 is lighter than the cold air outside the compact computer 10, the hot air in the air channel 112 will rise upwards, and The stream flows out of the thin computer 10 through the outlet 116 . When the hot air flows out of the compact computer 10 from the outlet 116 of the air channel 112, an air flow from the inlet 118 to the outlet 116 is generated in the air channel 112, so that the external cold air between the bottom surface 222 and the plane 300 flows from the inlet. 118 flows into the flow channel 112. In this way, a circulating airflow can be formed, and the circulating airflow can accelerate the speed at which the hot air in the accommodating space 230 is taken out of the thin computer 10 . Therefore, such a heat dissipation structure 100 can improve the heat dissipation effect of the electronic components 240 inside the compact computer 10, so as to make up for the heat dissipation effect provided by the existing compact computer 10 only by the heat dissipation fins and the ventilation holes 270 on opposite sides of the casing. insufficient.

Please refer to FIG. 6 at the same time. FIG. 6 is a structural cross-sectional view of a heat dissipation structure according to another embodiment of the present invention. Since the structure of this embodiment is similar to that of the foregoing embodiments, only the differences will be described.

Wherein, the motherboard 260 is sandwiched between the first casing 210 and the second casing 220 and located in the accommodating space 230 , and the electronic component 240 is disposed on the motherboard 260 . The guide tube 110 passes through the motherboard 260 , and the guide tube 110 is in contact with the electronic component 240 . Moreover, the material of the draft tube 110 may also be a metal material with high thermal conductivity, such as copper. At this time, the heat energy generated by the electronic component 240 can not only be discharged from the air channel 112 through the air, but also can be directly transferred to the flow guide tube 110 through the contact between the flow guide tube 110 and the electronic component 240 . Making the circulating air flow take away the heat energy on the guide tube 110 can also improve the heat dissipation effect of the electronic component 240 .

According to the above-mentioned heat dissipation structure disclosed in this embodiment, it includes a flow guide tube with an air channel, the guide tube runs through the electronic device, and communicates the air channel with the internal accommodation space of the electronic device through the through hole. Based on the principle that hot air is lighter than cold air, the draft tube generates a circulating airflow in the airflow channel, which accelerates the removal of heat sources in the electronic equipment, thereby achieving a good heat dissipation effect and making up for the lack of heat dissipation effect of the existing heat dissipation structure.

In addition, when the draft tube is made of a metal material with high thermal conductivity and is in contact with the heat source in the electronic device, the function of heat transfer can be increased, and the heat dissipation effect of the electronic device can also be improved.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (6)

1. A heat dissipation structure, suitable for an electronic device, the electronic device has a relative top surface and a bottom surface, the electronic device also has an accommodating space for a motherboard, the motherboard is provided with at least one electronic Components, the heat dissipation structure is used to eliminate the heat energy generated by the electronic components, and it is characterized in that the heat dissipation structure has a guide tube, which is arranged in the accommodating space and runs through the main board, and the guide tube has an air flow channel , forming an outlet and an inlet through the electronic device, the duct has at least one through hole, communicating the airflow channel and the accommodating space, the hot air generated by the electronic component flows out from the outlet through the airflow channel, External cold air flows into the air channel through the inlet, so that a circulating air flow is formed in the air channel. 2. The heat dissipation structure according to claim 1, wherein the guide tube further comprises a first pipe body and a second pipe body, the first pipe body is connected to the top surface, and the second pipe body Connected with the bottom surface, the first pipe body is connected with the second pipe body to jointly form the air channel. 3. The heat dissipation structure according to claim 2, wherein the second tube penetrates through the motherboard. 4. The heat dissipation structure according to claim 2, wherein the diameter of the end of the first pipe body facing the second pipe body is larger than the pipe diameter of the second pipe body, and the first pipe body covers part of the second pipe body, and is connected with the second pipe body 5 . The heat dissipation structure according to claim 2 , wherein the through hole is jointly formed by a wall surface of the first pipe body and a wall surface of the second pipe body. 6 . The heat dissipation structure according to claim 1 , wherein the electronic component abuts against the flow guide tube, and the electronic component transmits heat energy to the flow guide tube. 7 .

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