CN102467196A - Heat dissipation structure - Google Patents
Heat dissipation structure Download PDFInfo
- Publication number
- CN102467196A CN102467196A CN2010105413587A CN201010541358A CN102467196A CN 102467196 A CN102467196 A CN 102467196A CN 2010105413587 A CN2010105413587 A CN 2010105413587A CN 201010541358 A CN201010541358 A CN 201010541358A CN 102467196 A CN102467196 A CN 102467196A
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- China
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- radiator structure
- mozzle
- flow channel
- electronic component
- motherboard
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Abstract
The invention relates to a heat dissipation structure, which is arranged on an electronic device. The heat dissipation structure is provided with a diversion pipe, wherein an airflow channel is arranged in the diversion pipe, and the airflow channel penetrates through a top surface to a bottom surface of the electronic device; the airflow channel is provided with an outlet and an inlet respectively on the top surface and the bottom surface; and the diversion pipe is provided with at least one through hole, the through hole is communicated with the airflow channel and inside of the electronic device, so that hot air inside the electronic device passes through the airflow channel and flows out from the outlet, and external cold air flows into the airflow channel from the inlet to form a circulating airflow.
Description
Technical field
The present invention relates to a kind of radiator structure, particularly a kind of radiator structure of building the electronic equipment of fan in being used to not have.
Background technology
Thin Client (Thin Client) is compared with general common on the market personal computer, and its difference is to build application program in Thin Client is not, omits unnecessary function.Thin Client also can be described as, under network environment behind the Connection Service device, and readable data or executive utility and the general name of the terminating machine operated.Its inside of Thin Client is not provided with hard disk and comprises output units such as CD, floppy drive.And Thin Client also embeds operating system in the ROM (read-only memory), lets client only have the window machine that can import, possess simple functions.So Thin Client itself can't be handled any computing operation, and all programs and data are all deposited on the server (Server), and reaches the function of computing and storage data through server.Day by day be on the hazard and the enterprise desire reduces under the demand of maintenance cost in internet security, Thin Client definitely is one of sustainable indispensable infrastructure device of following domestic enterprise.
Because the outfit of Thin Client is simple and easy, and its inside do not have a moving element, and the wind that for example dispels the heat looses.Therefore the heat abstractor in the Thin Client generally is to use radiating fin on thermal source; And the relative both sides of Thin Client casing offer air vent; Principle through heat conduction and thermal natural convection is got rid of thermal source, causes deadlock to avoid inner chip overheating.But because progress and the user of science and technology be to the requirement of product enhancing efficiency, the inside of Thin Client is equipped with and also certainly will constantly promotes, high-level efficiency and H.D target when having reached its running.Yet when the inner outfit of Thin Client constantly promoted, the heat energy that also causes its internal electron unit to be produced constantly promoted.Because the air vent of existing Thin Client is arranged at the relative both sides of casing; Air vent is far away apart from middle section in the casing; And the inner structure of Thin Client is prone to stop the development of thermal natural convection, makes that the thermal convection effect in Thin Client central interior zone is very not remarkable.Thus, prior radiating structure also can't satisfy the radiating requirements of Thin Client now.
Summary of the invention
In view of above problem, technical matters to be solved by this invention is to provide a kind of radiator structure, uses the problem that the existing radiator structure of prior art can't satisfy the radiating requirements of Thin Client that solves.
The present invention discloses the radiator structure of an embodiment, is applicable to an electronic installation.Electronic installation has a relative end face and a bottom surface, and electronic installation also has a holding space for holding one motherboard.Motherboard is provided with an electronic component, and radiator structure is in order to get rid of the heat energy that this electronic component produces.Radiator structure is characterised in that radiator structure has a mozzle, and mozzle is arranged in the accommodation space, and runs through motherboard.Having a flow channel in the mozzle, is to connect electronic installation to the bottom surface by end face, and flow channel forms an outlet and an inlet respectively at end face and bottom surface.Mozzle has at least one through hole, and through hole is communicated with flow channel and accommodation space, makes electronic component produce a hot-air via through hole inlet air flow stream road, and is flowed out by outlet, and cool ambient air flows into flow channel by inlet, and then forms a circulating current.
The present invention disclose an embodiment radiator structure, be the mozzle that comprises a tool flow channel, mozzle runs through electronic equipment, and through through hole flow channel is connected with the inside accommodation space of electronic equipment.Mozzle makes to produce a circulating current in the flow channel through the hot-air principle light than cold air, and the thermal source in the accelerated electron equipment removes, and then reaches better heat radiating effect, to remedy the deficiency of existing radiator structure radiating effect.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
The synoptic diagram that is used for Thin Client for radiator structure according to an embodiment of the invention shown in Figure 1;
Shown in Figure 2 is the structure cut-open view of radiator structure according to an embodiment of the invention;
Shown in Figure 3 is partial structurtes enlarged drawing according to the radiator structure of Fig. 3;
Shown in Figure 4 is the partial structurtes enlarged drawing of radiator structure according to another embodiment of the present invention;
Shown in Figure 5 is the partial structurtes enlarged drawing of radiator structure according to another embodiment of the present invention;
Shown in Figure 6 is the structure cut-open view of radiator structure according to another embodiment of the present invention.
Wherein, Reference numeral
10 Thin Clients
100 radiator structures
110 mozzles
1,101 first bodys
1,102 second bodys
112 flow channels
114 through holes
116 outlets
118 inlets
210 first housings
212 end faces
220 second housings
222 bottom surfaces
230 accommodation spaces
240 electronic components
250 foot rests
260 motherboards
270 air vents
300 planes
Embodiment
Below in conjunction with accompanying drawing structural principle of the present invention and principle of work are done concrete description:
Please with reference to Fig. 1, shown in Figure 1ly be used for the synoptic diagram of Thin Client for radiator structure according to an embodiment of the invention.The radiator structure 100 of one embodiment of the invention is in order to dispel the heat to an electronic installation.Explanation for ease, the electronic installation of present embodiment is to be example with Thin Client 10, but not as limit.
Please be simultaneously with reference to Fig. 2 and Fig. 3, shown in Figure 2 is the structure cut-open view of radiator structure according to an embodiment of the invention, shown in Figure 3 is partial structurtes enlarged drawing according to the radiator structure of Fig. 2.
The Thin Client 10 of one embodiment of the invention can be arranged on the plane 300, and plane 300 can be general desktop or floor, but not as limit.The Thin Client 10 of present embodiment comprises one first housing 210, one second housing 220, a motherboard 260 and an electronic component 240.Wherein, second housing 220 is towards the plane 300, and first housing 210 and second housing 220 mutually combine, first housing 210 and with second housing, the 220 common accommodation spaces 230 that form.Motherboard 260 is located between first housing 210 and second housing 220, and is positioned at accommodation space 230, and electronic component 240 is arranged on the motherboard 260.Wherein, electronic component 240 can be a central processing unit, but not as limit, electronic component 240 can be made a general reference other electronic component that can produce heat energy.In addition, Thin Client 10 also has a relative bottom surface 222 and an end face 212, and bottom surface 222 is the part surface of second housing 220, and end face 212 is the part surface of first housing 210, and bottom surface 222 is towards the plane 300.
The Thin Client 10 of present embodiment also has a plurality of foot rests 250, and foot rest 250 is arranged on the bottom surface 222 of second housing 220, and against the plane 300.Thin Client 10 makes 300 on bottom surface 222 and plane keep a distance through the setting of foot rest 250, anticipates promptly, and second housing 220 is suspended on the plane 300.
Please continue referring to figs. 1 through Fig. 3, the radiator structure 100 of one embodiment of the invention has a mozzle 110.Mozzle 110 is a hollow circular tube, but its external form is non-in order to limit the present invention, and for example the external form of mozzle 110 also can be the polygon body of hollow square tube or hollow.In addition, the material of mozzle 110 can also be plastics, but not as limit, also can be general metal material.Mozzle 110 also comprises the external form that the external form of one first body 1101 and one second body, 1102, the first bodys 1101 can be mated second body 1102, but not as limit.First body 1101 is arranged on first housing 210, and in the face of second housing, 220, the second bodys 1102 are arranged on second housing 220, and in the face of first housing 210.Anticipate promptly, first body 1101 and second body 1102 are positioned at accommodation space 230.
In the present embodiment; First body 1101 is bigger than the caliber of second body 1102 towards the caliber of an end of second body 1102; Therefore when first housing 210 and second housing 220 mutually combine; First body 1101 coats an end of second body 1102, and the body 1101 of winning can be connected with second body 1102.Also therefore, the body 1101 of winning is connected with the interior hollow hole of the pipe of second body 1102, and then forms a flow channel 112 jointly.Flow channel 112 is to run through Thin Client 10 to bottom surface 222 by end face 212.Meaning promptly, the flow channel 112 of mozzle 110 runs through first housing 210, motherboard 260 and second housing 220.And, in present embodiment, be to wear motherboard 260, but not as limit, the position that for example is provided with through change motherboard 260 also can be to wear motherboard 260 by first body 1101 by second body 1102.And the flow channel 112 of present embodiment is positioned at and is formed with an outlet 116 on the end face 212, and flow channel 112 is positioned at 222 of bottom surfaces and is formed with an inlet 118, makes outside air and export 116 turnover flow channels 112 via inlet 118.
The mozzle 110 of present embodiment also has a through hole 114, and through hole 114 is communicated with flow channel 112 and accommodation space 230, makes the air in the accommodation space 230 can flow to flow channel 112.With regard to present embodiment; Through hole 114 is the joining places that are positioned at by first body 1101 and second body 1102; Be that through hole 114 is to be first body 1101 when coating with second body 1102, a folded gap between the outside wall surface of the internal face of first body 1101 and second body 1102.Be noted that the position of through hole 114 is non-in order to decide the present invention at present with formation appearance attitude.Please be simultaneously with reference to Fig. 4 and Fig. 5, Fig. 4 and shown in Figure 5 be the partial structurtes enlarged drawing of radiator structure according to another embodiment of the present invention.The through hole 114 of another embodiment of the present invention also can directly be offered the wall to first body 1101, and is as shown in Figure 4.Or, the through hole 114 of inventing another embodiment also can directly be offered the wall to second body 1102, and is as shown in Figure 5.As long as after through hole 114 is offered flow channel 112 is connected with accommodation space 230.
Below will specify, please continue to consult Fig. 1 and Fig. 2 to the radiating principle of the radiator structure 100 of present embodiment.When Thin Client 10 in when running, electronic component 240 changes that are positioned on its motherboard 260 can begin to produce heat energy, and then air themperatures in the accommodation space 230 are risen and produce hot-air.When hot-air flow in the flow channel 112 via through hole 114; Because the hot-air in the accommodation space 230 is lighter than the cold air outside the Thin Client 10; Therefore the hot-air in flow channel 112 just can pastly rise, and is flowed out outside the Thin Clients 10 by outlet 116.When hot-air flows out outside the Thin Client 10 by the outlet 116 of flow channel 112; Just make and produce air-flows that flowed to outlet 116 by inlet 118 in the flow channel 112, the therefore related cool ambient air that makes 300 on bottom surface 222 and plane is by in the 118 inlet air flow stream roads 112 that enter the mouth.Thus, just can form a circulating current, the Hot air quilt that this circulating current can quicken in the accommodation space 230 is taken the speed outside the Thin Client 10 out of.So such radiator structure 100 can promote the radiating effect of Thin Client 10 internal electronic elements 240, depend merely on the deficiency of air vent 270 radiating effect that provided of radiating fin and the relative both sides of casing to remedy existing 10 of Thin Clients.
Please be simultaneously with reference to Fig. 6, shown in Figure 6 is the structure cut-open view of radiator structure according to another embodiment of the present invention.Because the structure of present embodiment and the structure of the foregoing description are similar, therefore only explain to different part.
Wherein, motherboard 260 is located between first housing 210 and second housing 220, and is positioned at accommodation space 230, and electronic component 240 is arranged on the motherboard 260.Mozzle 110 wears motherboard 260, and mozzle 110 also contacts with electronic component 240.And the material of mozzle 110 can also be the high metal material of coefficient of heat conductivity, for example: copper.At this moment; The heat energy that electronic component 240 is produced not only can be discharged heat energy through air by flow channel 112; Also can contacting through mozzle 110 and electronic component 240; Make the heat energy of electronic component 240 directly be passed to mozzle 110, circulating current is left the heat energy band on the mozzle 110, also can promote the radiating effect of electronic component 240.
According to the radiator structure that above-mentioned present embodiment disclosed, comprise the mozzle of a tool flow channel, mozzle runs through electronic equipment, and through through hole flow channel is connected with the inside accommodation space of electronic equipment.Mozzle makes to produce a circulating current in the flow channel through the hot-air principle light than cold air, and the thermal source in the accelerated electron equipment removes, and then reaches better heat radiating effect, to remedy the deficiency of existing radiator structure radiating effect.
In addition, when mozzle adopts the high metal material of coefficient of heat conductivity, and with electronic equipment in thermal source when contacting, can increase the function that heat is transmitted, also can help the radiating effect of electronic equipment.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (6)
1. a radiator structure is applicable to an electronic installation, and this electronic installation has a relative end face and a bottom surface; This electronic installation also has a holding space for holding one motherboard, and this motherboard is provided with at least one electronic component, and this radiator structure is in order to get rid of the heat energy that this electronic component produces; It is characterized in that this radiator structure has a mozzle, be arranged in this accommodation space and run through this motherboard; Have a flow channel in this mozzle, connect this electronic installation and form one the outlet and an inlet, this mozzle has at least one through hole; Be communicated with this flow channel and this accommodation space; The hot-air that this electronic component produced is flowed out by this outlet via this flow channel, and cool ambient air then flows into this flow channel by this inlet, so that form a circulating current in this flow channel.
2. radiator structure according to claim 1; It is characterized in that this mozzle also comprises one first body and one second body, this first body and this end face link; This second body and this bottom surface link, and this first body also links this second body and forms this flow channel jointly.
3. radiator structure according to claim 2 is characterized in that, this second body runs through this motherboard.
4. radiator structure according to claim 2 is characterized in that, this first body is big than the caliber of this second body towards the caliber of an end of this second body, and this first body coats the part of this second body, and links with this second body
5. radiator structure according to claim 2 is characterized in that, this through hole is formed by the wall of this first body and the wall of this second body jointly.
6. radiator structure according to claim 1 is characterized in that, this electronic component and against this mozzle, this electronic component with thermal energy transfer to this mozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105413587A CN102467196A (en) | 2010-11-10 | 2010-11-10 | Heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105413587A CN102467196A (en) | 2010-11-10 | 2010-11-10 | Heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102467196A true CN102467196A (en) | 2012-05-23 |
Family
ID=46070918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105413587A Pending CN102467196A (en) | 2010-11-10 | 2010-11-10 | Heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102467196A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636409A (en) * | 2015-12-17 | 2016-06-01 | 东莞酷派软件技术有限公司 | Mobile terminal and charger |
| CN108429155A (en) * | 2018-04-03 | 2018-08-21 | 东阳市阳涛电子科技有限公司 | Safety-type outdoor electricity distribution cabinet |
| CN113391669A (en) * | 2020-03-12 | 2021-09-14 | 英业达科技有限公司 | Electronic device and fluid driving device |
-
2010
- 2010-11-10 CN CN2010105413587A patent/CN102467196A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636409A (en) * | 2015-12-17 | 2016-06-01 | 东莞酷派软件技术有限公司 | Mobile terminal and charger |
| CN108429155A (en) * | 2018-04-03 | 2018-08-21 | 东阳市阳涛电子科技有限公司 | Safety-type outdoor electricity distribution cabinet |
| CN108429155B (en) * | 2018-04-03 | 2019-07-23 | 伊发控股集团有限公司 | Safety-type outdoor electricity distribution cabinet |
| CN113391669A (en) * | 2020-03-12 | 2021-09-14 | 英业达科技有限公司 | Electronic device and fluid driving device |
| CN113391669B (en) * | 2020-03-12 | 2023-02-17 | 英业达科技有限公司 | Electronic device and fluid driving device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120523 |