CN102466979A - Photoresist edge edge-wash data measuring system and measurement monitoring method - Google Patents

Abstract

The invention discloses a photoresist edge edge-wash data measuring system. The system comprises a developing post-measuring machine, a wafer edge position sensor, an edge-wash line position sensor, a logic operation unit and a pre-warning unit. The system can be used for carrying out developing post-measuring on the wafer and simultaneously calculating the edge-wash width of the photoresist edge and the offset of the edge-wash line, thus the photoresist edge edge-wash data can be obtained in time. The invention further discloses a measurement monitoring method of the photoresist edge edge-wash data, comprising the following steps: measuring and calculating the photoresist edge edge-wash data by using the system; automatically collecting the data, and sending the data to an automatic monitoring system of a semiconductor factory; judging whether the edge-wash width exceeds the maximum allowable width and whether the offset of the edge-wash line exceeds the maximum allowable offset, when exceeds, raising an alarm, and sending the edge-wash width and the offset to workers for measurement. According to the method, the real-time monitoring of the photoresist edge edge-wash data can be realized, and the offset of the edge-wash line can be discovered in time.

Description

Photoresist edge side washing data measurin system and measuring and monitoring method

Technical field

The present invention relates to technical field of manufacturing semiconductors, relate in particular to a kind of photoresist edge side washing data measurin system and measuring and monitoring method.

Background technology

Photoetching process is one of of paramount importance processing step during semiconductor is made, the effect of photoetching mainly be with the graph copying on the mask to semiconductor wafer, for next step carries out etching or ion injecting process is ready.And in photoetching process, the gluing process is occupied important status, because the quality of gluing is directly determining the quality of the aligning in the photoetching process.In the process of gluing, photoresist can be coated with completely whole semiconductor wafer usually, and in order to prevent semiconductor board is polluted, and avoids the semiconductor wafer edge photoresist burr to occur, need the photoresist in semiconductor wafer edge region territory be removed usually.The technology of removing the photoresist in semiconductor wafer edge region territory is called side washing technology.

As a rule, side washing technology has two kinds of implementation methods, and a kind of method is called the edge photoresist and removes (EBR, Edge Bead Remove) method, and another kind of method is called Waffer edge exposure (WEE, Wafer Edge Expose) method.Wherein, The EBR method is a chemical treatment method, and its process is: on semiconductor wafer, during the spin coated photoresist, assemble a nozzle; Said nozzle sprays a small amount of trimming solvent to the semiconductor wafer edge region territory, and said trimming solvent is removed the photoresist in semiconductor wafer edge region territory; And the WEE method is an optical processing method; Its process is: the photoresist to the semiconductor wafer fringe region makes public; The photoresist in softening semiconductor wafer edge region territory; Photoresist behind said the softening is removed in the normal development step, perhaps through the trimming removal of solvents of said nozzle toward the ejection of semiconductor wafer edge region territory.

The width of the photoresist in removed semiconductor wafer edge region territory is commonly referred to the side washing width in side washing technology; The edge of remaining photoresist is commonly referred to side washing line (EBR Line), and the side washing width is the distance between edge to the side washing line of semiconductor wafer just.In order to improve performance of products and yield, the size of side washing width is generally 1.0～1.5mm.And under normal situation, the center of semiconductor wafer should overlap with the center of circle of side washing line.Please refer to Fig. 1; Fig. 1 is the vertical view of the semiconductor wafer after the process side washing under the normal condition; As shown in Figure 1, under normal circumstances, the distance between edge 101 to the side washing line 102 of semiconductor wafer; The size that is side washing width d is 1.0～1.5mm, and the center of semiconductor wafer should overlap with the center of circle of side washing line.

Yet the hardware at board produces skew, and for example the hardware of exposure bench produces skew, and the angle and direction when perhaps semiconductor wafer is sent to board produces under the situation of skew; The side washing line also can produce skew; Make the center of circle of side washing line and the off-centring of semiconductor wafer, as shown in Figure 2, Fig. 2 is a side washing line drift condition synoptic diagram; At this moment, skew has taken place with respect to the center of circle 302 of side washing line 301 in the center 202 of semiconductor wafer 201.Generally, if the side-play amount at the center of the center of circle of side washing line and semiconductor wafer surpasses 200um, with the performance of yield that has a strong impact on integrated circuit and semiconductor devices.

Produce skew for fear of the side washing line, the measure of taking at present is exposure bench regularly to be carried out in the process of preventive maintenance (PM, Preventive Maintenance) exposure bench is carried out accuracy detection, makes its exposure accuracy guarantee to be 1mm.But owing to just carry out one time PM at set intervals, therefore between twice PM.The hardware of exposure bench may squint, and the angle and direction of semiconductor wafer when being sent to board also possibly produce skew, thereby possibly cause the side washing line to produce skew; Yet under the most situation, the skew of side washing line all is to analyze through follow-up defect project teacher (YE, Yield Engineer) or quality engineering teacher (QE, Quality Engineer) to draw, and at this moment, semiconductor wafer has passed through a lot of roads processing step.Thereby side washing line skew can not be by timely discovery, thereby the yield of integrated circuit and the performance of semiconductor devices are impacted.

In order earlier to find side washing line drift condition, the measure of taking at present is visual inspection, yet finds that through visual inspection there is very big difficulty in the skew of side washing line, also is extremely unscientific simultaneously.

Therefore, how to detect side washing line situation as soon as possible, become the technical matters that present industry is needed solution badly.

Summary of the invention

The object of the present invention is to provide a kind of photoresist edge side washing data measurin system and measuring and monitoring method, to detect the drift condition of side washing line width and side washing line as soon as possible.

For addressing the above problem, the present invention proposes a kind of photoresist edge side washing data measurin system, is used to measure the side-play amount at the skew semiconductor wafer center, the center of circle of photoresist edge side washing width and side washing line on the semiconductor wafer, and this measuring system comprises:

The Waffer edge position transducer is surveyed and each measuring position of definite Waffer edge;

Side washing line position sensor is surveyed the side washing line position corresponding with each measuring position of Waffer edge;

Back detection board develops; Link to each other respectively with said Waffer edge position transducer and side washing line position sensor; According to each measuring position of said Waffer edge and the side washing line position corresponding, obtain the optical imagery of the photoresist edge side washing width of each measuring position with each measuring position of Waffer edge;

Logical calculation device is arranged at said development back and detects in the board, collects the optical imagery of the photoresist edge side washing width of each measuring position automatically, calculates the photoresist edge side washing width of each measuring position; According to the photoresist edge side washing width of all measuring positions, calculate the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; Automatically collect the side-play amount at the skew semiconductor wafer center, the center of circle of corresponding photoresist edge side washing width in each measuring position and side washing line; The side-play amount at the skew semiconductor wafer center, the center of circle of photoresist edge side washing width that each measuring position of the Waffer edge of collecting is corresponding and side washing line sends the automatic monitor system of semiconductor factory to; And judge whether the corresponding photoresist edge side washing width in each measuring position surpasses maximum and allow width; And whether the side-play amount at skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow width or surpass maximum and this side washing width or side-play amount are sent when allowing off-set value when surpassing maximum;

Prior-warning device receives the maximum side washing width of allowing width that surpasses that said logical calculation device sends, and surpasses maximum side-play amount of allowing off-set value, gives the alarm, and this side washing width and side-play amount are sent to the staff detects.

Optional; Each measuring position of said Waffer edge is respectively 0 ° of position, 90 ° of positions, 180 ° of positions and 270 ° of positions; Wherein said 0 ° of position is the wafer notch position, and 90 ° of positions, 180 ° of positions and 270 ° of positions are respectively along said wafer notch position clockwise or the position of half-twist, 180 ° and 270 ° correspondences counterclockwise

Optional, the computing formula of the side-play amount at the skew semiconductor wafer center, the center of circle of said side washing line is:

$S=\sqrt{{S_X}^2+{{\mathrm{<figure-callout\; id="2"\; label="S\; Y"\; filenames="HSA00000344834700011.png"\; state="\{\{state\}\}">S</figure-callout>}}_Y}^2}$

S _X＝(W ₉₀-W ₂₇₀)/2

S _Y＝(W ₀-W ₁₈₀)/2

Wherein, S representes the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; S _XThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of directions X; S _YThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of Y direction; W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Represent photoresist edge side washing width corresponding when the Waffer edge measuring position is 0 °, 90 °, 180 ° and 270 ° of positions respectively; And S _X, S _Y, W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Be vector.

Optional, said logical calculation device is when having the corresponding photoresist edge side washing width in two or more measuring positions to allow width above maximum, with the side washing width transmission of correspondence.

Optional, be provided with in the said logical calculation device:

The graphical computing module of the one SPC is collected the corresponding photoresist edge side washing width in each measuring position of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed width; Judge whether the corresponding photoresist edge side washing width of collecting in each measuring position surpasses maximum and allow width; When the corresponding photoresist edge side washing width in two or more measuring positions surpasses maximum and allows width, the side washing width of correspondence is sent to said prior-warning device; And

The graphical computing module of the 2nd SPC, the side-play amount at semiconductor wafer center squints in the center of circle of collecting the side washing line of each measuring position correspondence of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed off-set value, judges whether the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow off-set value when surpassing maximum, this side-play amount is sent to said prior-warning device.

Optional, said Waffer edge position transducer and said side washing line position sensor are optical sensor.

Optional, it is come card LDS3300M board that board is detected in said development back.

Optional, said maximum allows that off-set value is 200um.

Optional, said maximum allow width be before the side washing photoresist width on the semiconductor wafer 20%.Simultaneously, for addressing the above problem, the present invention also proposes a kind of method of measuring monitoring photoresist edge side washing data, utilizes above-mentioned photoresist edge side washing data measurin system that side washing data in photoresist edge are measured monitoring, and this method comprises the steps:

Said Waffer edge position transducer detection is also confirmed each measuring position of Waffer edge;

Said side washing line position sensor is surveyed the side washing line position corresponding with each measuring position of Waffer edge;

The optical imagery that board obtains photoresist edge side washing width is detected in the said back of developing;

Said logical calculation device collect automatically the photoresist edge side washing width of each measuring position optical imagery, calculate the photoresist edge side washing width of each measuring position; According to the photoresist edge side washing width of all measuring positions, calculate the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; Automatically collect the side-play amount at the skew semiconductor wafer center, the center of circle of corresponding photoresist edge side washing width in each measuring position and side washing line; The side-play amount at the skew semiconductor wafer center, the center of circle of photoresist edge side washing width that each measuring position of the Waffer edge of collecting is corresponding and side washing line sends the automatic monitor system of semiconductor factory to; And judge whether the corresponding photoresist edge side washing width in each measuring position surpasses maximum and allow width; And whether the side-play amount at skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow width or surpass maximum and this side washing width or side-play amount are sent when allowing off-set value when surpassing maximum;

Said prior-warning device receives the maximum side washing width of allowing width that surpasses that said logical calculation device sends, and surpasses maximum side-play amount of allowing off-set value, gives the alarm, and this side washing width and side-play amount are sent to the staff detects.

Optional; Each measuring position of said Waffer edge is respectively 0 ° of position, 90 ° of positions, 180 ° of positions and 270 ° of positions; Wherein said 0 ° of position is the wafer notch position, and 90 ° of positions, 180 ° of positions and 270 ° of positions are respectively along said wafer notch position clockwise or the position of half-twist, 180 ° and 270 ° correspondences counterclockwise.

Optional, the computing formula of the side-play amount at the skew semiconductor wafer center, the center of circle of said side washing line is:

$S=\sqrt{{S_X}^2+{{\mathrm{<figure-callout\; id="2"\; label="S\; Y"\; filenames="HSA00000344834700011.png"\; state="\{\{state\}\}">S</figure-callout>}}_Y}^2}$

S _X＝(W ₉₀-W ₂₇₀)/2

S _Y＝(W ₀-W ₁₈₀)/2

Wherein, S representes the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; S _XThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of directions X; S _YThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of Y direction; W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Represent photoresist edge side washing width corresponding when the Waffer edge measuring position is 0 °, 90 °, 180 ° and 270 ° of positions respectively; And S _X, S _Y, W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Be vector.

Optional, said logical calculation device is when having the corresponding photoresist edge side washing width in two or more measuring positions to allow width above maximum, with the side washing width transmission of correspondence.

Optional, be provided with in the said logical calculation device:

The graphical computing module of the one SPC is collected the corresponding photoresist edge side washing width in each measuring position of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed width; Judge whether the corresponding photoresist edge side washing width of collecting in each measuring position surpasses maximum and allow width; When the corresponding photoresist edge side washing width in two or more measuring positions surpasses maximum and allows width, the side washing width of correspondence is sent to said prior-warning device; And

The graphical computing module of the 2nd SPC, the side-play amount at semiconductor wafer center squints in the center of circle of collecting the side washing line of each measuring position correspondence of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed off-set value, judges whether the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow off-set value when surpassing maximum, this side-play amount is sent to said prior-warning device.

Optional, said Waffer edge position transducer and said side washing line position sensor are optical sensor.

Optional, it is come card LDS3300M board that board is detected in said development back.

Optional, said maximum allows that off-set value is 200um.

Optional, said maximum allow width be before the side washing photoresist width on the semiconductor wafer 20%.

Compared with prior art; Photoresist provided by the invention edge side washing data measurin system comprises the back detection board that develops; Detect Waffer edge position transducer and the side washing line position sensor that is provided with on the board in the said back of developing; Detect the logical calculation device that is provided with in the board in the said back of developing, and prior-warning device; This measuring system can calculate the photoresist edge side washing width of each measuring position, semiconductor wafer edge when back that semiconductor wafer is developed is detected, and the side-play amount at skew semiconductor wafer center, the center of circle of side washing line; Thereby can after semiconductor wafer is carried out exposure imaging, can obtain photoresist edge side washing data, avoid impacting for follow-up each operation because of the skew of side washing line.

Compared with prior art, the method for measurement monitoring photoresist edge side washing data provided by the invention utilizes photoresist edge side washing data measurin system that the photoresist edge side washing data of semiconductor wafer are measured and calculated; Simultaneously these data are collected automatically, send to the automatic monitor system of semiconductor factory; And judge whether the corresponding photoresist edge side washing width in each measuring position surpasses maximum and allow width; And whether the side-play amount at skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow width or surpass maximum when allowing off-set value when surpassing maximum; Give the alarm, and this side washing width and side-play amount are sent to staff's detection; Thereby can realize semiconductor wafer photoresist edge side washing data are carried out real time monitoring, and in time find side washing line drift condition, avoid impacting for follow-up each operation because of the skew of side washing line, this method is simple and convenient.

Description of drawings

Fig. 1 is the vertical view of the semiconductor wafer after the process side washing under the normal condition;

Fig. 2 is a side washing line drift condition synoptic diagram;

The measuring principle synoptic diagram of the method for photoresist edge side washing data is monitored in the measurement that Fig. 3 provides for the embodiment of the invention.

Embodiment

Below in conjunction with accompanying drawing and specific embodiment photoresist edge side washing data measurin system and measuring and monitoring method that the present invention proposes are done further explain.According to following explanation and claims, advantage of the present invention and characteristic will be clearer.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only is used for conveniently, the purpose of the aid illustration embodiment of the invention lucidly.

Core concept of the present invention is; A kind of photoresist edge side washing data measurin system is provided; This measuring system comprises the back detection board that develops; Detect Waffer edge position transducer and the side washing line position sensor that is provided with on the board in the said back of developing, detect the logical calculation device that is provided with in the board in the said back of developing, and prior-warning device; This measurement mechanism can be when back that semiconductor wafer is developed be detected; The side-play amount at the skew semiconductor wafer center, the center of circle of measurement and monitoring photoetching glue edge side washing width and side washing line, thus avoided impacting for follow-up each operation because of the skew of side washing line; Simultaneously, a kind of method of measuring monitoring photoresist edge side washing data is provided also, this method utilizes photoresist edge side washing data measurin system that the photoresist edge side washing data of semiconductor wafer are measured and calculated; Simultaneously these data are collected automatically, send to the automatic monitor system of semiconductor factory; And judge whether the corresponding photoresist edge side washing width in each measuring position surpasses maximum and allow width; And whether the side-play amount at skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow width or surpass maximum when allowing off-set value when surpassing maximum; Give the alarm, and this side washing width and side-play amount are sent to staff's detection; Thereby can realize semiconductor wafer photoresist edge side washing data are carried out real time monitoring, and in time find side washing line drift condition, avoid impacting for follow-up each operation because of the skew of side washing line, this method is simple and convenient.

The photoresist edge side washing data measurin system that the embodiment of the invention provides is used to measure the side-play amount at the skew semiconductor wafer center, the center of circle of photoresist edge side washing width and side washing line on the semiconductor wafer, and this measuring system comprises:

The Waffer edge position transducer is surveyed and each measuring position of definite Waffer edge;

Side washing line position sensor is surveyed the side washing line position corresponding with each measuring position of Waffer edge;

Back detection board develops; Link to each other respectively with said Waffer edge position transducer and side washing line position sensor; According to each measuring position of said Waffer edge and the side washing line position corresponding, obtain the optical imagery of the photoresist edge side washing width of each measuring position with each measuring position of Waffer edge;

Logical calculation device is arranged at said development back and detects in the board, collects the optical imagery of the photoresist edge side washing width of each measuring position automatically, calculates the photoresist edge side washing width of each measuring position; According to the photoresist edge side washing width of all measuring positions, calculate the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; Automatically collect the side-play amount at the skew semiconductor wafer center, the center of circle of corresponding photoresist edge side washing width in each measuring position and side washing line; The side-play amount at the skew semiconductor wafer center, the center of circle of photoresist edge side washing width that each measuring position of the Waffer edge of collecting is corresponding and side washing line sends the automatic monitor system of semiconductor factory to; And judge whether the corresponding photoresist edge side washing width in each measuring position surpasses maximum and allow width; And whether the side-play amount at skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; When allowing off-set value, this side washing width or side-play amount are sent above maximum;

Prior-warning device receives the maximum side washing width of allowing width that surpasses that said logical calculation device sends, and surpasses maximum side-play amount of allowing off-set value, gives the alarm, and this side washing width and side-play amount are sent to the staff detects.

Wherein, That the side-play amount at the photoresist edge side washing width that the automatic monitor system of semiconductor factory can be further corresponding with each measuring position of the Waffer edge that receives and the skew semiconductor wafer center, the center of circle of side washing line sends semiconductor factory to is statistical Process Control (SPC; Statistical Process Control) system; Said SPC system controls the process of whole semiconductor factory automatically; The side-play amount at the skew semiconductor wafer center, the center of circle of the side washing line that receives when the SPC system surpasses maximum when allowing off-set value, will send instruction and give follow-up board, stops the associative operation of follow-up board automatically.

Further; Each measuring position of said Waffer edge is respectively 0 ° of position, 90 ° of positions, 180 ° of positions and 270 ° of positions; Wherein said 0 ° of position is the wafer notch position, and 90 ° of positions, 180 ° of positions and 270 ° of positions are respectively along said wafer notch position clockwise or the position of half-twist, 180 ° and 270 ° correspondences counterclockwise.

Further, the computing formula of the side-play amount at the center of circle of said side washing line skew semiconductor wafer center is:

$S=\sqrt{{{\mathrm{<figure-callout\; id="2"\; label="S\; X"\; filenames="HSA00000344834700011.png"\; state="\{\{state\}\}">S</figure-callout>}}_X}^2+{{\mathrm{<figure-callout\; id="2"\; label="S\; Y"\; filenames="HSA00000344834700011.png"\; state="\{\{state\}\}">S</figure-callout>}}_Y}^2}$

S _X＝(W ₉₀-W ₂₇₀)/2

S _Y＝(W ₀-W ₁₈₀)/2

Wherein, S representes the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; S _XThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of directions X; S _YThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of Y direction; W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Represent photoresist edge side washing width corresponding when the Waffer edge measuring position is 0 °, 90 °, 180 ° and 270 ° of positions respectively; And S _X, S _Y, W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Be vector.

Further, said logical calculation device is when having the corresponding photoresist edge side washing width in two or more measuring positions to allow width above maximum, with the side washing width transmission of correspondence.

Further, be provided with in the said logical calculation device:

The graphical computing module of the one SPC is collected the corresponding photoresist edge side washing width in each measuring position of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed width; Judge whether the corresponding photoresist edge side washing width of collecting in each measuring position surpasses maximum and allow width; When the corresponding photoresist edge side washing width in two or more measuring positions surpasses maximum and allows width, the side washing width of correspondence is sent to said prior-warning device; And

The graphical computing module of the 2nd SPC, the side-play amount at semiconductor wafer center squints in the center of circle of collecting the side washing line of each measuring position correspondence of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed off-set value, judges whether the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow off-set value when surpassing maximum, this side-play amount is sent to said prior-warning device.

Wherein, Graphical computing module of a said SPC and the graphical computing module of said the 2nd SPC abbreviate SPC Chart usually respectively as; SPC Chart is for having the graphical computational tool of automatic computing function and band exceptions plan (OCAP, Out of Control Action Plan); So-called OCAP is meant when abnormal conditions take place, and can provide the command adapted thereto of subsequent treatment.And in the graphical computing module of a said SPC, the graphical computing module of said the 2nd SPC respectively correspondence be provided with side washing width maximal value (SPEC), side washing line skew maximal value (SPEC).

Further, said Waffer edge position transducer and said side washing line position sensor are optical sensor.

Further, said development back detection board is a come card LDS3300M board.

Further, said maximum allows that off-set value is 200um.

Further, said maximum allow width be before the side washing photoresist width on the semiconductor wafer 20%.

The method of the measurement monitoring photoresist edge side washing data that the embodiment of the invention provides utilizes above-mentioned photoresist edge side washing data measurin system that side washing data in photoresist edge are measured monitoring, and this method comprises the steps:

Said Waffer edge position transducer detection is also confirmed each measuring position of Waffer edge;

Said side washing line position sensor is surveyed the side washing line position corresponding with each measuring position of Waffer edge;

The optical imagery that board obtains photoresist edge side washing width is detected in the said back of developing;

Said logical calculation device is collected the optical imagery of the photoresist edge side washing width of each measuring position automatically, calculates the photoresist edge side washing width of each measuring position; According to the photoresist edge side washing width of all measuring positions, calculate the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; Automatically collect the side-play amount at the skew semiconductor wafer center, the center of circle of corresponding photoresist edge side washing width in each measuring position and side washing line; The side-play amount at the skew semiconductor wafer center, the center of circle of photoresist edge side washing width that each measuring position of the Waffer edge of collecting is corresponding and side washing line sends the automatic monitor system of semiconductor factory to; And judge whether the corresponding photoresist edge side washing width in each measuring position surpasses maximum and allow width; And whether the side-play amount at skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow width or surpass maximum and this side washing width or side-play amount are sent when allowing off-set value when surpassing maximum;

Said prior-warning device receives the maximum side washing width of allowing width that surpasses that said logical calculation device sends, and surpasses maximum side-play amount of allowing off-set value, gives the alarm, and this side washing width and side-play amount are sent to the staff detects.

Further; Each measuring position of said Waffer edge is respectively 0 ° of position, 90 ° of positions, the wherein said 0 ° of position in 180 ° of positions and 270 ° of positions are the wafer notch position, and 90 ° of positions, 180 ° of positions and 270 ° of positions are respectively along said wafer notch position clockwise or the position of half-twist, 180 ° and 270 ° correspondences counterclockwise.

Further, the computing formula of the side-play amount at the center of circle of said side washing line skew semiconductor wafer center is:

$S=\sqrt{{{\mathrm{<figure-callout\; id="2"\; label="S\; X"\; filenames="HSA00000344834700011.png"\; state="\{\{state\}\}">S</figure-callout>}}_X}^2+{{\mathrm{<figure-callout\; id="2"\; label="S\; Y"\; filenames="HSA00000344834700011.png"\; state="\{\{state\}\}">S</figure-callout>}}_Y}^2}$

S _X＝(W ₉₀-W ₂₇₀)/2

S _Y＝(W ₀-W ₁₈₀)/2

Wherein, S representes the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; S _XThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of directions X; S _YThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of Y direction; W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Represent photoresist edge side washing width corresponding when the Waffer edge measuring position is 0 °, 90 °, 180 ° and 270 ° of positions respectively; And S _X, S _Y, W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Be vector.

Further, said logical calculation device is when having the corresponding photoresist edge side washing width in two or more measuring positions to allow width above maximum, with the side washing width transmission of correspondence.

Further, be provided with in the said logical calculation device:

The graphical computing module of the one SPC is collected the corresponding photoresist edge side washing width in each measuring position of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed width; Judge whether the corresponding photoresist edge side washing width of collecting in each measuring position surpasses maximum and allow width; When the corresponding photoresist edge side washing width in two or more measuring positions surpasses maximum and allows width, the side washing width of correspondence is sent to said prior-warning device; And

The graphical computing module of the 2nd SPC, the side-play amount at semiconductor wafer center squints in the center of circle of collecting the side washing line of each measuring position correspondence of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed off-set value, judges whether the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow off-set value when surpassing maximum, this side-play amount is sent to said prior-warning device.

Further, said Waffer edge position transducer and said side washing line position sensor are optical sensor.

Further, said development back detection board is a come card LDS3300M board.

Further, said maximum allows that off-set value is 200um.

Further, said maximum allow width be before the side washing photoresist width on the semiconductor wafer 20%.

Please refer to Fig. 3; The measuring principle synoptic diagram of the method for photoresist edge side washing data is monitored in the measurement that Fig. 3 provides for the embodiment of the invention; As shown in Figure 3; Choose wafer notch position A as first measuring position, and be 0 ° of position, with become 90 ° position B along clockwise direction with position A as second measuring position with this location definition; With becoming 180 ° position C along clockwise direction with position A, with become 270 ° position D along clockwise direction with position A as the 4th measuring position as the 3rd measuring position;

The center 402 of wafer 401 and the side-play amount S of the center of circle 502 of side washing line 501 along directions X _X=(W ₉₀-W ₂₇₀)/2;

The center 402 of wafer 401 and the side-play amount S of the center of circle 502 of side washing line 501 along the Y direction _Y=(W ₀-W ₁₈₀)/2;

According to Pythagorean theorem, the center 402 of wafer 401 and the total drift amount in the center of circle 502 of side washing line 501

$S=\sqrt{{{\mathrm{<figure-callout\; id="2"\; label="S\; X"\; filenames="HSA00000344834700011.png"\; state="\{\{state\}\}">S</figure-callout>}}_X}^2+{{\mathrm{<figure-callout\; id="2"\; label="S\; Y"\; filenames="HSA00000344834700011.png"\; state="\{\{state\}\}">S</figure-callout>}}_Y}^2};$

Wherein, W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Represent photoresist edge side washing width corresponding when the Waffer edge measuring position is 0 °, 90 °, 180 ° and 270 ° of positions respectively; And S _X, S _Y, W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Be vector.

Need to prove; In a specific embodiment of the present invention, said 0 ° of position is the wafer notch position, and this is the detection of Waffer edge position transducer for ease; Yet the present invention is not as limit, i.e. the present invention can also adopt other position as 0 ° of position.

In sum, the invention provides a kind of photoresist edge side washing data measurin system, this measuring system comprises develop back detection board, Waffer edge position transducer, side washing line position sensor, logical calculation device and prior-warning device; This measuring system can calculate the photoresist edge side washing width of each measuring position, semiconductor wafer edge when back that semiconductor wafer is developed is detected, and the side-play amount at skew semiconductor wafer center, the center of circle of side washing line; Thereby can after semiconductor wafer is carried out exposure imaging, can obtain photoresist edge side washing data, avoid impacting for follow-up each operation because of the skew of side washing line; Simultaneously, the present invention also provides a kind of method of measuring monitoring photoresist edge side washing data, and this method utilizes photoresist edge side washing data measurin system that the photoresist edge side washing data of semiconductor wafer are measured and calculated; Simultaneously these data are collected automatically, send to the automatic monitor system of semiconductor factory; And judge whether the corresponding photoresist edge side washing width in each measuring position surpasses maximum and allow width; And whether the side-play amount at skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow width or surpass maximum when allowing off-set value when surpassing maximum; Give the alarm, and this side washing width or side-play amount are sent to staff's detection; Thereby can realize semiconductor wafer photoresist edge side washing data are carried out real time monitoring, and in time find side washing line drift condition, avoid impacting for follow-up each operation because of the skew of side washing line, this method is simple and convenient.

Obviously, those skilled in the art can carry out various changes and modification to invention and not break away from the spirit and scope of the present invention.Like this, belong within the scope of claim of the present invention and equivalent technologies thereof if of the present invention these are revised with modification, then the present invention also is intended to comprise these changes and modification interior.

Claims (18)

1. photoresist edge side washing data measurin system is used to measure the side-play amount at the skew semiconductor wafer center, the center of circle of photoresist edge side washing width and side washing line on the semiconductor wafer, it is characterized in that, comprising:

The Waffer edge position transducer is surveyed and each measuring position of definite Waffer edge;

Side washing line position sensor is surveyed the side washing line position corresponding with each measuring position of Waffer edge;

Back detection board develops; Link to each other respectively with said Waffer edge position transducer and side washing line position sensor; According to each measuring position of said Waffer edge and the side washing line position corresponding, obtain the optical imagery of the photoresist edge side washing width of each measuring position with each measuring position of Waffer edge;

Logical calculation device is arranged at said development back and detects in the board, collects the optical imagery of the photoresist edge side washing width of each measuring position automatically, calculates the photoresist edge side washing width of each measuring position; According to the photoresist edge side washing width of all measuring positions, calculate the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; Automatically collect the side-play amount at the skew semiconductor wafer center, the center of circle of corresponding photoresist edge side washing width in each measuring position and side washing line; The side-play amount at the skew semiconductor wafer center, the center of circle of photoresist edge side washing width that each measuring position of the Waffer edge of collecting is corresponding and side washing line sends the automatic monitor system of semiconductor factory to; And judge whether the corresponding photoresist edge side washing width in each measuring position surpasses maximum and allow width; And whether the side-play amount at skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow width or surpass maximum and this side washing width or side-play amount are sent when allowing off-set value when surpassing maximum:

Prior-warning device receives the maximum side washing width of allowing width that surpasses that said logical calculation device sends, and surpasses maximum side-play amount of allowing off-set value, gives the alarm, and this side washing width and side-play amount are sent to the staff detects.

2. photoresist as claimed in claim 1 edge side washing data measurin system; It is characterized in that; Each measuring position of said Waffer edge is respectively 0 ° of position, 90 ° of positions, 180 ° of positions and 270 ° of positions; Wherein said 0 ° of position is the wafer notch position, and 90 ° of positions, 180 ° of positions and 270 ° of positions are respectively along said wafer notch position clockwise or the position of half-twist, 180 ° and 270 ° correspondences counterclockwise.

3. photoresist as claimed in claim 2 edge side washing data measurin system is characterized in that, the computing formula of the side-play amount at the skew semiconductor wafer center, the center of circle of said side washing line is:

$S=\sqrt{{S_X}^2+{S_Y}^2}$

S _X＝(W ₉₀-W ₂₇₀)/2

S _Y＝(W ₀-W ₁₈₀)/2

Wherein, S representes the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; S _XThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of directions X; S _YThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of Y direction; W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Represent photoresist edge side washing width corresponding when the Waffer edge measuring position is 0 °, 90 °, 180 ° and 270 ° of positions respectively; And S _X, S _Y, W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Be vector.

4. photoresist as claimed in claim 1 edge side washing data measurin system; It is characterized in that; Said logical calculation device is when having the corresponding photoresist edge side washing width in two or more measuring positions to allow width above maximum, with the side washing width transmission of correspondence.

5. photoresist as claimed in claim 4 edge side washing data measurin system is characterized in that, is provided with in the said logical calculation device:

The graphical computing module of the one SPC is collected the corresponding photoresist edge side washing width in each measuring position of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed width; Judge whether the corresponding photoresist edge side washing width of collecting in each measuring position surpasses maximum and allow width; When the corresponding photoresist edge side washing width in two or more measuring positions surpasses maximum and allows width, the side washing width of correspondence is sent to said prior-warning device; And

The graphical computing module of the 2nd SPC, the side-play amount at semiconductor wafer center squints in the center of circle of collecting the side washing line of each measuring position correspondence of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed off-set value, judges whether the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow off-set value when surpassing maximum, this side-play amount is sent to said prior-warning device.

6. photoresist as claimed in claim 1 edge side washing data measurin system is characterized in that, said Waffer edge position transducer and said side washing line position sensor are optical sensor.

7. photoresist as claimed in claim 1 edge side washing data measurin system is characterized in that, it is come card LDS3300M board that board is detected in said development back.

8. photoresist as claimed in claim 1 edge side washing data measurin system is characterized in that, said maximum allows that off-set value is 200um.

9. photoresist as claimed in claim 1 edge side washing data measurin system is characterized in that, said maximum allow width be before the side washing photoresist width on the semiconductor wafer 20%.

10. a method of measuring monitoring photoresist edge side washing data utilizes the described photoresist of claim 1 edge side washing data measurin system to measure monitoring, it is characterized in that, comprises the steps:

Said Waffer edge position transducer detection is also confirmed each measuring position of Waffer edge;

Said side washing line position sensor is surveyed the side washing line position corresponding with each measuring position of Waffer edge;

The optical imagery that board obtains photoresist edge side washing width is detected in the said back of developing;

Said logical calculation device is collected the optical imagery of the photoresist edge side washing width of each measuring position automatically, calculates the photoresist edge side washing width of each measuring position; According to the photoresist edge side washing width of all measuring positions, calculate the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; Automatically collect the side-play amount at the skew semiconductor wafer center, the center of circle of corresponding photoresist edge side washing width in each measuring position and side washing line; The side-play amount at the skew semiconductor wafer center, the center of circle of photoresist edge side washing width that each measuring position of the Waffer edge of collecting is corresponding and side washing line sends the automatic monitor system of semiconductor factory to; And judge whether the corresponding photoresist edge side washing width in each measuring position surpasses maximum and allow width; And whether the side-play amount at skew semiconductor wafer center, the center of circle of side washing line allows off-set value above maximum; Allow width or surpass maximum and this side washing width or side-play amount are sent when allowing off-set value when surpassing maximum;

Said prior-warning device receives the maximum side washing width of allowing width that surpasses that said logical calculation device sends, and surpasses maximum side-play amount of allowing off-set value, gives the alarm, and this side washing width and side-play amount are sent to the staff detects.

11. the method for measurement monitoring photoresist edge side washing data as claimed in claim 10; It is characterized in that; Each measuring position of said Waffer edge is respectively 0 ° of position, 90 ° of positions, 180 ° of positions and 270 ° of positions; Wherein said 0 ° of position is the wafer notch position, and 90 ° of positions, 180 ° of positions and 270 ° of positions are respectively along said wafer notch position clockwise or the position of half-twist, 180 ° and 270 ° correspondences counterclockwise.

12. the method for measurement monitoring photoresist edge side washing data as claimed in claim 11 is characterized in that, the computing formula of the side-play amount at the skew semiconductor wafer center, the center of circle of said side washing line is:

$S=\sqrt{{S_X}^2+{S_Y}^2}$

S _X＝(W ₉₀-W ₂₇₀)/2

S _Y＝(W ₀-W ₁₈₀)/2

Wherein, S representes the side-play amount at the skew semiconductor wafer center, the center of circle of side washing line; S _XThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of directions X; S _YThe center of circle of expression side washing line and semiconductor wafer center are along the side-play amount of Y direction; W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Represent photoresist edge side washing width corresponding when the Waffer edge measuring position is 0 °, 90 °, 180 ° and 270 ° of positions respectively; And S _X, S _Y, W ₀, W ₉₀, W ₁₈₀And W ₂₇₀Be vector.

13. the method for measurement monitoring photoresist edge side washing data as claimed in claim 10; It is characterized in that; Said logical calculation device is when having the corresponding photoresist edge side washing width in two or more measuring positions to allow width above maximum, with the side washing width transmission of correspondence.

14. the method for measurement monitoring photoresist edge side washing data as claimed in claim 13 is characterized in that, is provided with in the said logical calculation device:

The graphical computing module of the one SPC is collected the corresponding photoresist edge side washing width in each measuring position of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed width; Judge whether the corresponding photoresist edge side washing width of collecting in each measuring position surpasses maximum and allow width; When the corresponding photoresist edge side washing width in two or more measuring positions surpasses maximum and allows width, the side washing width of correspondence is sent to said prior-warning device; And

The graphical computing module of the 2nd SPC, the side-play amount at semiconductor wafer center squints in the center of circle of collecting the side washing line of each measuring position correspondence of Waffer edge that calculates automatically; And the maximum according to being provided with is allowed off-set value, judges whether the center of circle skew semiconductor die of side washing line and the side-play amount at center allow off-set value above maximum; Allow off-set value when surpassing maximum, this side-play amount is sent to said prior-warning device.

15. the method for measurement as claimed in claim 10 monitoring photoresist edge side washing data is characterized in that, said Waffer edge position transducer and said side washing line position sensor be optical sensor.

16. the method for measurement as claimed in claim 10 monitoring photoresist edge side washing data is characterized in that, detection board in said developments back is come card LDS3300M board.

17. the method for measurement monitoring photoresist edge side washing data as claimed in claim 10 is characterized in that said maximum allows that off-set value is 200um.

18. the method for measurement as claimed in claim 10 monitoring photoresist edge side washing data is characterized in that, said maximum allow width be before the side washing photoresist width on the semiconductor wafer 20%.

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