CN102466367A - Directionally-placed comprehensive heat exchanger - Google Patents
Directionally-placed comprehensive heat exchanger Download PDFInfo
- Publication number
- CN102466367A CN102466367A CN2010105543928A CN201010554392A CN102466367A CN 102466367 A CN102466367 A CN 102466367A CN 2010105543928 A CN2010105543928 A CN 2010105543928A CN 201010554392 A CN201010554392 A CN 201010554392A CN 102466367 A CN102466367 A CN 102466367A
- Authority
- CN
- China
- Prior art keywords
- condenser
- heat exchanger
- composite condenser
- composite
- horizontal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a directionally placed comprehensive heat exchanger, which comprises an outdoor heat exchanger, a composite condenser and an infusion pump which are connected with one another to form a cyclic flowing path for liquid refrigerants. The directionally-placed comprehensive heat exchanger is characterized in that: the composite condenser consists of a horizontal composite condenser and a vertical composite condenser which are communicated with each other; the horizontal composite condenser comprises one or more than one horizontal single-layer condenser which is communicated with one another; and the vertical composite condenser comprises one or more than one vertical single-layer condenser which is communicated with one another. The directionally-placed comprehensive heat exchanger has the characteristics of simple structure, high stability, high external heat exchange efficiency, and a wide range of the liquid refrigerants.
Description
Technical field: the present invention relates to a kind of comprehensive heat exchanger, particularly a kind of comprehensive heat exchanger of comprehensive placement that is used for a kind of novel efficient on the semiconductor cold-storage and warm-storage.
Background technology: at present; Two kinds of semiconductor refrigeration boxes are arranged on the market. a kind of is the semiconductor refrigeration box that carries out external heat-exchanging with the fan radiation fin; Not only can freeze but also can heat in the case, but refrigerating efficiency is low and obvious noise is arranged, also having a kind of is the semiconductor refrigeration box that carries out external heat-exchanging with the heat pipe-type heat abstractor; Refrigerating efficiency is high slightly, can not heat but freeze only in the case.
Goal of the invention: the purpose of this invention is to provide a kind of so comprehensive heat exchanger of a kind of high efficiency comprehensive placement that is used on the semiconductor cold-storage and warm-storage; The exchange capability of heat of it and surrounding air is much larger than common heat exchanger, thereby improves the refrigerating efficiency of semiconductor refrigerating heat-producing machine and the characteristics of heating efficiency.
The objective of the invention is to realize: become the suitable liquid coolant can be at the external heat exchanger of internal flow with heat conductivility good metal material through following technical scheme; Become composite condenser with heat conductivility good metal material; Select suitable infusion pump for use; External heat exchanger, composite condenser and infusion pump interconnect and constitute the circulation flow passage that liquid coolant flows; It is characterized in that: composite condenser is by the be interconnected combination and constituting of horizontal composite condenser and vertical composite condenser; Horizontal composite condenser is interconnected combination by one or more horizontal individual layer condenser and constitutes, and vertically composite condenser is interconnected combination by one or more vertical individual layer condenser and constitutes.
Operation principle of the present invention is such; Here freeze with the semiconductor cold-storage and warm-storage case and illustrate; Start working after the energising of semiconductor cold-storage and warm-storage case, the semiconductor refrigerating heat-producing machine constantly from indoor draw heat, is passed to outdoor heat exchanger to heat through indoor heat exchanger; Indoor temperature reduces; Reach the purpose of refrigeration, because the work of infusion pump, liquid coolant circulates in the comprehensive heat exchanger of a kind of so comprehensive placement; Take the heat on the outdoor heat exchanger to composite condenser; Be dispersed in the ambient air, owing to composite condenser is made up of the combination that is interconnected of horizontal composite condenser and vertical composite condenser, horizontal composite condenser is by the be interconnected combination and constituting of one or more horizontal individual layer condenser again; Vertically composite condenser is interconnected combination by one or more vertical individual layer condenser and constitutes; Vertically composite condenser is placed on the outer back side of semiconductor cold-storage and warm-storage case usually, and horizontal composite condenser is placed on the outer bottom of semiconductor cold-storage and warm-storage case usually, and the effective heat exchange area of this composite condenser and external environment condition is much larger than the common common composite condenser that has only single placed side and the effective heat exchange area of external environment condition; So very high with the heat exchange efficiency of external environment condition, can increase substantially the operating efficiency of semiconductor cold-storage and warm-storage case.
Description of drawings: description of drawings of the present invention is following:
Fig. 1 is the theory structure sketch map of embodiments of the invention;
Among the figure: 1. outdoor heat exchanger; 2. composite condenser; 3. infusion pump; 4. vertical composite condenser; 5. horizontal composite condenser.
The specific embodiment: the present invention is further specified below in conjunction with accompanying drawing and embodiment:
As shown in Figure 1; Become the suitable liquid coolant can be with heat conductivility good metal material at the external heat exchanger 1 of internal flow; Become composite condenser 2 with heat conductivility good metal material; Select suitable infusion pump 3 for use; External heat exchanger 1, composite condenser 2 and infusion pump 3 interconnect and constitute the circulation flow passage that liquid coolant flows; It is characterized in that: composite condenser 2 is by the be interconnected combination and constituting of horizontal composite condenser 5 and vertical composite condenser 4, and horizontal composite condenser 5 is by the be interconnected combination and constituting of one or more horizontal individual layer condenser, and vertically composite condenser 4 is by the be interconnected combination and constituting of one or more vertical individual layer condenser.
Operation principle of the present invention is such; Here freeze with the semiconductor cold-storage and warm-storage case and illustrate; Start working after the energising of semiconductor cold-storage and warm-storage case, the semiconductor refrigerating heat-producing machine constantly from indoor draw heat, is passed to outdoor heat exchanger 1 to heat through indoor heat exchanger; Indoor temperature reduces; Reach the purpose of refrigeration, because the work of infusion pump 3, liquid coolant circulates in the comprehensive heat exchanger of a kind of so comprehensive placement; Take the heat on the outdoor heat exchanger 1 to composite condenser 2; Be dispersed in the ambient air, owing to composite condenser 2 is made up of the combination that is interconnected of horizontal composite condenser 5 and vertical composite condenser 4, horizontal composite condenser 5 is by the be interconnected combination and constituting of one or more horizontal individual layer condenser again; Vertically composite condenser 4 is interconnected combination by one or more vertical individual layer condenser and constitutes; Vertically composite condenser 4 is placed on the outer back side of semiconductor cold-storage and warm-storage case usually, and horizontal composite condenser 5 is placed on the outer bottom of semiconductor cold-storage and warm-storage case usually, and the effective heat exchange area of this composite condenser 2 and external environment condition is much larger than the common common composite condenser that has only single placed side and the effective heat exchange area of external environment condition; So very high with the heat exchange efficiency of external environment condition, can increase substantially the operating efficiency of semiconductor cold-storage and warm-storage case.
Claims (3)
1. comprehensive heat exchanger of comprehensive placement; Comprise outdoor heat exchanger (1), composite condenser (2) and infusion pump (3); Outdoor heat exchanger (1), composite condenser (2) and infusion pump (3) interconnect the circulation flow passage that constitutes liquid coolant, it is characterized in that: composite condenser (2) is interconnected by horizontal composite condenser (5) and vertical composite condenser (4) and makes up and constitute.
2. the comprehensive heat exchanger of a kind of according to claim 1 comprehensive placement is characterized in that: horizontal composite condenser (5) is communicated with by one or more horizontal individual layer condenser and forms.
3. the comprehensive heat exchanger of a kind of according to claim 1 comprehensive placement is characterized in that: vertically composite condenser (4) is made up of one or more vertical individual layer condenser connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105543928A CN102466367A (en) | 2010-11-11 | 2010-11-11 | Directionally-placed comprehensive heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105543928A CN102466367A (en) | 2010-11-11 | 2010-11-11 | Directionally-placed comprehensive heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102466367A true CN102466367A (en) | 2012-05-23 |
Family
ID=46070298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105543928A Pending CN102466367A (en) | 2010-11-11 | 2010-11-11 | Directionally-placed comprehensive heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102466367A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1269254A (en) * | 1999-03-04 | 2000-10-11 | 青木有限公司 | Extraction apparatus and method thereof |
| JP2001127223A (en) * | 1999-10-27 | 2001-05-11 | Matsushita Refrig Co Ltd | Heat exchanger |
| CN101794766A (en) * | 2009-01-29 | 2010-08-04 | 雅马哈株式会社 | Heat exchange unit |
| CN101858620A (en) * | 2009-04-07 | 2010-10-13 | 日立空调·家用电器株式会社 | Indoor unit of air conditioner |
| CN201615648U (en) * | 2010-02-24 | 2010-10-27 | 刘万辉 | Novel practical semiconductor refrigeration and heat preservation box |
| CN201852369U (en) * | 2010-11-11 | 2011-06-01 | 刘万辉 | Directionally-placed comprehensive heat exchanger |
-
2010
- 2010-11-11 CN CN2010105543928A patent/CN102466367A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1269254A (en) * | 1999-03-04 | 2000-10-11 | 青木有限公司 | Extraction apparatus and method thereof |
| JP2001127223A (en) * | 1999-10-27 | 2001-05-11 | Matsushita Refrig Co Ltd | Heat exchanger |
| CN101794766A (en) * | 2009-01-29 | 2010-08-04 | 雅马哈株式会社 | Heat exchange unit |
| CN101858620A (en) * | 2009-04-07 | 2010-10-13 | 日立空调·家用电器株式会社 | Indoor unit of air conditioner |
| CN201615648U (en) * | 2010-02-24 | 2010-10-27 | 刘万辉 | Novel practical semiconductor refrigeration and heat preservation box |
| CN201852369U (en) * | 2010-11-11 | 2011-06-01 | 刘万辉 | Directionally-placed comprehensive heat exchanger |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10356949B2 (en) | Server rack heat sink system with combination of liquid cooling device and auxiliary heat sink device | |
| CN107166564B (en) | Heat pipe exchanger, air conditioner control radiating assembly, air conditioner outdoor unit and air conditioner | |
| RU2009141974A (en) | COOLING SYSTEM | |
| CN101922778B (en) | Semiconductor refrigerating air conditioning device | |
| US20150226489A1 (en) | Outdoor unit and refrigeration cycle device | |
| CN105180504A (en) | Semiconductor refrigeration device for circulating cooling system | |
| CN202231001U (en) | Chip cooling device for control module of variable frequency air conditioner | |
| CN102538527A (en) | Double-pump heat pipe type heat exchange equipment | |
| CN106941772B (en) | Double-stage independent liquid-gas double-channel natural cooling data center heat dissipation system | |
| KR101496684B1 (en) | The Air Conditioner using Themoelectric Modules and PCM | |
| CN201615648U (en) | Novel practical semiconductor refrigeration and heat preservation box | |
| CN201852369U (en) | Directionally-placed comprehensive heat exchanger | |
| CN219889932U (en) | Heat radiating device and refrigerator | |
| CN102767895A (en) | Air conditioner used thin finned tube heat exchanger | |
| CN201852351U (en) | Omnibearing placed cold-heat complementary comprehensive heat exchanger | |
| CN101949567A (en) | Separate microchannel thermotube air-conditioning system | |
| US11473848B2 (en) | Thermosiphon heat exchanger | |
| CN201973955U (en) | Novel structure semiconductor refrigerating and heating box | |
| CN204285678U (en) | A kind of micro-channel type separate heat pipe base station air conditioner system | |
| CN102466367A (en) | Directionally-placed comprehensive heat exchanger | |
| CN201204786Y (en) | Liquid cooling radiating device | |
| CN202171364U (en) | High-efficient practical semi-conductor refrigerating and heating storage box | |
| KR102128587B1 (en) | An air conditioner | |
| CN202182587U (en) | High-efficiency novel-structure semiconductor refrigeration and warm-storage box | |
| CN202303723U (en) | Evaporation type air cooling heat pump air conditioning system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120523 |