CN102456823A - Surface-mount light-emitting device - Google Patents
Surface-mount light-emitting device Download PDFInfo
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- CN102456823A CN102456823A CN2011102763013A CN201110276301A CN102456823A CN 102456823 A CN102456823 A CN 102456823A CN 2011102763013 A CN2011102763013 A CN 2011102763013A CN 201110276301 A CN201110276301 A CN 201110276301A CN 102456823 A CN102456823 A CN 102456823A
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- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
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Abstract
The purpose of the present invention is to provide a surface-mount light-emitting device from which it is extremely easy to remove burrs and that can also be made long-lived. Said surface-mount light-emitting device is characterized by the provision of: a light-emitting element (10); a first resin body (40) that comprises a dry unsaturated polyester resin molded body having a concave part (40c) and is integrated with a first lead (20) on which the light-emitting element (10) is placed and a second lead (30) electrically connected to the light-emitting element (10); a second resin body (50) that covers the light-emitting element (10) placed in the concave part (40c) of the first resin body (40); and a resin insulating part (45) that insulates the first lead (20) and the second lead (30). The surface-mount light-emitting device is also characterized in that the first lead (20) on which the light-emitting element (10) is placed is exposed at the base surface (40a) of the concave part (40c).
Description
Technical field
The present invention relates to the surface-mount type light emitting device in a kind of backlight that is used in ligthing paraphernalia, display, portable phone, animation illumination secondary light source, other the general family expenses light source etc.
Background technology
Adopted the surface-mount type light emitting device of light-emitting component more small-sized, electrical efficiency is preferable, and can send the comparatively bright-coloured light of color.In addition, this light-emitting component is a semiconductor element, so do not have the worry that burns out etc., in addition, it is more excellent also to have the initial stage drive characteristic, the stronger characteristic of ability of anti-vibration, anti-switch repeatedly.Owing to have these more excellent characteristics, so, adopted the light-emitting device of light-emitting diode (LED), laser diode light-emitting components such as (LD) to be used as various light sources and utilized.
People know in surface-mount type light emitting device in the past, to have: light-emitting component; First resinite, it is integrally formed in and is used for carrying first lead-in wire of putting this light-emitting component and second lead-in wire that is electrically connected with above-mentioned light-emitting component; And second resinite of covering luminous element.First resinite also has the function as reflector.
And, in first resinite, adopted and can carry out (with reference to patent documentations 1～3) such as more excellent thermoplastic resin such as injection moulding and production, for example nylon, polyamides.
Yet, in first resinite, adopt nylon, exist the easy variable color of first resinite, also not high, so relatively poor this shortcoming of mechanical strength with the fluid-tight engagement property of lead-in wire.That is, a low main cause of the brightness of light-emitting component is: the reflectivity that variable color caused that is caused by the heat ageing of first resinite that constitutes reflector low, people hope to adopt the variable color less material that is caused by heat ageing.
As the technology in the life-span of improving the surface-mount type light emitting device, in patent documentation 4, proposed in first resinite, to adopt the technology of heat-curing resins such as epoxy resin.Because the epoxy resin molding material discoloration-resistant is stronger, also better with the fluid-tight engagement property of lead-in wire, so compare, can further prolong the life-span of surface-mount type light emitting device with nylon.
In addition, do not disclose with unsaturated polyester resin fully in the patent documentation 4 as first resinite.In heat-curing resin because the fluid-tight engagement property of unsaturated polyester resin moulding material and lead-in wire is lower, so from as the raising mechanical strength of the main purpose of Japanese documentation 4, the point in raising life-span difficulty be used.
Patent documentation 1: japanese kokai publication hei 6-200153 communique
Patent documentation 2: TOHKEMY 2002-374007 communique
Patent documentation 3: TOHKEMY 2010-100682 communique
Patent documentation 4: No. 4608294 communique of japanese
Yet thermoplastic resin nylon the problem of burr can not occur producing when being shaped, and heat-curing resins such as epoxy resin are because Thermocurable can produce burr when being shaped.Be necessary to be used for the operation of appending of deburring thus, in the difficult situation about removing etc., cost will be higher at burr.
And epoxy resin molding material is better with the fluid-tight engagement property of lead-in wire framework, and on the contrary, the burr that when being shaped, is produced is also better with the fluid-tight engagement property of framework, and the removal of this burr also may not be easy.In addition, be necessary at low temperatures epoxy resin molding material to be carried out the keeping of material.
And epoxy resin molding material also has the price comparison height, is not easy to carry out the shortcoming of injection moulding etc.Therefore, epoxy resin molding material is not suitable for the Universal LED reflector.
Summary of the invention
The present invention is a problem in view of the above and making, and the present invention proposes a kind of surface-mount type light emitting device that burr is removed and the life-span is also long that can be very easy to carry out.
In order to address the above problem, surface-mount type light emitting device of the present invention is characterised in that, comprising: light-emitting component; First resinite, in being used for carrying first lead-in wire of putting this light-emitting component and second lead-in wire that is electrically connected with above-mentioned light-emitting component, this first resinite is made up of the dry type unsaturated polyester resin formed body with recess by integrated for it; And second resinite, it covers to carry puts the above-mentioned light-emitting component in the above-mentioned recess of this first resinite; In this surface-mount type light emitting device, on the bottom surface sections of above-mentioned recess, carry first lead-in wire that is equipped with above-mentioned light-emitting component and exposed, and on this bottom surface sections, be provided with the insulation resin portion that is used to make above-mentioned first lead-in wire and above-mentioned second lead wire insulation.
In this surface-mount type light emitting device, preferably on the surface that above-mentioned first lead-in wire and above-mentioned second goes between, at least with part that above-mentioned first resinite contacts on, be provided with the coupling agent treatment portion after coupling agent treatment.
In this surface-mount type light emitting device, preferably on the surface that above-mentioned first lead-in wire and above-mentioned second goes between, at least with part that above-mentioned first resinite contacts on, being provided with surface roughness Ra is the coarse face of 2.5 μ m～4.5 μ m.
In this surface-mount type light emitting device; Preferably on above-mentioned first resinite, be provided with fluid-tight engagement also covers following ranges continuously in following ranges fluid-tight engagement portion, said scope is the scope from the upper surface part to the side end of the outside lead portion of above-mentioned at least first lead-in wire and above-mentioned second lead-in wire.
In this surface-mount type light emitting device, preferred above-mentioned fluid-tight engagement portion fluid-tight engagement outside lead portion that above-mentioned first lead-in wire and above-mentioned second goes between from upper surface part through side end in the scope of lower surface portion, and cover above-mentioned scope.
In this surface-mount type light emitting device, preferably on the side end of the outside lead portion that above-mentioned first lead-in wire and above-mentioned second goes between, be provided with the notch part of depression to the inside, the fluid-tight engagement portion of above-mentioned first resinite and above-mentioned notch part fluid-tight engagement.
In this surface-mount type light emitting device, preferably on the side end of the outside lead portion that above-mentioned first lead-in wire and above-mentioned second goes between, be provided with outstanding laterally jut, the fluid-tight engagement portion of above-mentioned first resinite and above-mentioned jut fluid-tight engagement.
In this surface-mount type light emitting device, the emission wavelength of preferred above-mentioned light-emitting component is 420nm～490nm, and above-mentioned first resinite is the resinite that contains the titanium oxide Chinese white.
According to surface-mount type light emitting device of the present invention, can be very easy to carry out burr removal, life-saving.
Description of drawings
Fig. 1 is a cutaway view of roughly representing the execution mode of surface-mount type light emitting device of the present invention;
Fig. 2 is the vertical view of the surface-mount type light emitting device of Fig. 1;
Fig. 3 is other the cutaway view of execution mode of roughly representing surface-mount type light emitting device of the present invention;
Fig. 4 is other the cutaway view of execution mode of roughly representing surface-mount type light emitting device of the present invention;
Fig. 5 is other the cutaway view of execution mode of roughly representing surface-mount type light emitting device of the present invention;
Fig. 6 is the vertical view of the surface-mount type light emitting device of Fig. 5;
Fig. 7 is other the cutaway view of execution mode of roughly representing surface-mount type light emitting device of the present invention;
Fig. 8 is other the cutaway view of execution mode of roughly representing surface-mount type light emitting device of the present invention;
Fig. 9 is that the reflectivity timeliness of expression first resinite (LED reflector) changes (wavelength: curve chart 460nm).
Embodiment
Below, with reference to accompanying drawing execution mode of the present invention is described.
Unsaturated polyester resin is in the middle of heat-curing resin, and is relatively poor with the fluid-tight engagement property of lead-in wire, so in patent documentation 4, it is not studied as first resinite.Yet, according to discovering of inventor of the present invention, having adopted at first resinite under the situation of unsaturated polyester resin, the burr that can be at an easy rate produced when being shaped is removed.And in the patent documentation 4 of epoxy resin etc. in the disclosed heat-curing resin, the burr that is produced when being shaped is removed very difficulty.
Compare with thermohardening type resins such as epoxy resin; The fluid-tight engagement property of unsaturated polyester resin and lead-in wire is relatively poor, yet compares with nylon, and the fluid-tight engagement property of unsaturated polyester resin and lead-in wire is a same degree; In addition; The heat-resisting discolouration of unsaturated polyester resin is also stronger, so the unsaturated polyester resin life-span can be longer than nylon.Thus, completion of the present invention is conceived to following point, promptly is used as being very beneficial for the advantage of deburring with the lower point of fluid-tight engagement property of the unsaturated polyester resin that do not related in the Japanese documentation 4.
Fig. 1 is a cutaway view of roughly representing the execution mode of surface-mount type light emitting device of the present invention, and Fig. 2 is a vertical view, wherein the A-A cross section of Fig. 1 presentation graphs 2.
This surface-mount type light emitting device has light-emitting component 10, carry first resinite 40 put light-emitting component 10, second resinite 50 of covering luminous element 10.
First resinite 40 is integrally formed in and is used for carrying first lead-in wire 20 of putting light-emitting component and second lead-in wire 30 that is electrically connected with light-emitting component 10.
Light-emitting component 10 has positive and negative a pair of first electrode 11 and second electrode 12 with the one side side.In this manual, the structure that has positive and negative pair of electrodes in same one side side is described, yet also can be employed in the upper surface of light-emitting component 10 and the structure that lower surface has positive and negative pair of electrodes.In this case, the electrode of the lower surface of light-emitting component 10 does not adopt electric wire to be electrically connected with first lead-in wire 20, and adopts solid crystalline substance (die bond) member with electrical conductivity to be electrically connected with first lead-in wire 20.
First lead-in wire 20 has first 20a of inner lead portion and first 20b of outside lead portion.Light-emitting component 10 is carried across solid brilliant member to be put on first 20a of inner lead portion.First 20a of inner lead portion is electrically connected through first electrode 11 that electric wire 60 and light-emitting component 10 are had.First 20b of outside lead portion exposes from first resinite 40.In first lead-in wire 20, except the outside, side at first resinite 40 has the situation of first 20b of outside lead portion, the part that also will expose the rear side of first resinite 40 sometimes is called first 20b of outside lead portion.That is, first 20b of outside lead portion so long as the part that is electrically connected with outer electrode get final product.Because first lead-in wire 20 is connected with outer electrode, so the employing hardware.
Second lead-in wire 30 has second 30a of inner lead portion and second 30b of outside lead portion.Second 30a of inner lead portion is electrically connected through second electrode 12 that electric wire 60 and light-emitting component 10 are had, and second 30b of outside lead portion exposes from first resinite 40.In second lead-in wire 30, be not only to have the situation of second 30b of outside lead portion in the outside, side of second resinite 50, the part that also will expose the rear side of second resinite 50 sometimes is called second 30b of outside lead portion.That is, second 30b of outside lead portion so long as the part that is electrically connected with outer electrode get final product.Because second lead-in wire 30 is connected with outer electrode, so the employing hardware.In order not make 30 short circuits of first lead-in wire, 20 and second lead-in wire, first of the side lead-in wire 20 and second lead-in wire 30 approaching parts are provided with insulating component 90 overleaf.
Be formed with recess 40c on first resinite 40 with bottom surface sections 40a and side surface part 40b.First 20a of inner lead portion of first lead-in wire 20 exposes from the bottom surface sections 40a of the recess 40c of first resinite 40.Expose on the part to carry at this and be equipped with light-emitting component 10 across solid brilliant member.First resinite 40 can utilize injection moulding to wait to be shaped.In first resinite 40, the unsaturated polyester resin of stating after the employing contains the Chinese white 70 of titanium oxide etc.The peristome of preferred recess 40c forms than bottom surface sections 40a wide-mouth more, on side surface part 40b, is provided with inclination.In addition, on the bottom surface sections 40a of recess 40c, also be provided with the insulation resin portion 45 that is used to make 30 insulation of first lead-in wire, 20 and second lead-in wire.
In recess 40c, dispose second resinite 50, with covering luminous element 10.Second resinite 50 adopts heat-curing resin.Second resinite 50 contains fluorescent material 80.Because fluorescent material 80 uses the proportions material bigger than second resinite 50, fluorescent material 80 is arranged so precipitate in the bottom surface sections 40a of recess 40c side.
In this manual, be called the interarea side, its opposite side is called rear side carrying a side that is equipped with light-emitting component 10.
Light-emitting component 10 is employed in semiconductors such as forming GaAlN, ZnS, ZnSe, SiC, GaP, GaAlAs, AlN, InN, AIInGaP, InGaN, GaN, AlInGaN on the substrate and as the structure of luminescent layer.As semi-conductive structure, can enumerate out have MIS knot, the structure of homojunction, heterojunction or the double heterojunction of PIN knot, PN junction.Can from the ultraviolet light to the infrared light, come emission wavelength is carried out various selections according to material, its mixed crystal degree of semiconductor layer.Luminescent layer also can be multiple quantum trap structure or produce the quantum effect, as the single quantum well structure of film.
For such light-emitting component 10, can adopt as one sees fit a plurality of, through its combination, the colour mixture property raising that white is shown.For example, can send green be light light-emitting component 10 can for two, can send each one respectively of the light-emitting component 10 of blue system and red colour system light.In addition, utilize for the panchromatic light-emitting device of using as display unit, the emission wavelength of preferred red colour system is that the emission wavelength of 610nm～700nm, green system is that 495nm～565nm, the blue emission wavelength that is are 430nm～490nm.Under the luminous situation of the mixed light that makes white color system; Consider aging etc. with from the complementary color relation of the emission wavelength of fluorescent material, translucent resin; Thereby the preferred 400nm～530nm of the emission wavelength of light-emitting component 10; More preferably 420nm～490nm is in order further to improve exciting and luminous efficiency of light-emitting component 10 and fluorescent material, more preferably 450nm～475nm respectively.In addition; Also can adopt the light-emitting component 10 that is described below; That is, through light-emitting component 10 is difficult by the component composition of ultraviolet ray ageing with, thus will be than the short wavelength zone of short ultraviolet range of 400nm or visible light main light emission wavelength as light-emitting component 10.
The size of light-emitting component 10 is that the specification of 1mm can be installed, for specification of 600 μ m, 320 μ m etc. also can be installed.
First resinite 40 has recess 40c, and this recess 40c has bottom surface sections 40a and side surface part 40b, and first resinite 40 is integrally formed in from the bottom surface sections 40a of recess 40c and extends on first lead-in wire, 20 and second lead-in wire 30 in the outside.First 20a of inner lead portion of first lead-in wire 20 forms the part of the bottom surface sections 40a of recess 40c.Second 30a of inner lead portion of second lead-in wire 30 forms the part of the bottom surface sections 40a of recess 40c, with first 20a of inner lead portion being spaced apart with regulation.Upload at first 20a of inner lead portion of the bottom surface sections 40a that is equivalent to recess 40c and to be equipped with light-emitting component 10.First 20a of inner lead portion and second 30a of inner lead portion and first 20b of outside lead portion, second 30b of outside lead portion of the bottom surface sections 40a that is equivalent to recess 40c that are equivalent to the bottom surface sections 40a of recess 40c expose from first resinite 40.First lead-in wire, 20 and second lead-in wire 30 of rear side exposes.Thus, can be electrically connected from rear side.
The interarea side of first resinite 40 be shaped as rectangle, also can form ellipse, circle, pentagon, hexagon etc.The interarea side of recess 40c be shaped as ellipse, but also can form circular, rectangle, pentagon, hexagon etc.Under the situation of regulation, have the negative electrode mark.
First resinite 40 is solidfied materials (dry type unsaturated polyester resin formed body) of dry type unsaturated polyester resin compositions.In this dry type unsaturated polyester resin compositions, unsaturated polyester resin is employed in the unsaturated alkyd resin that begins to soften more than 50 ℃.
The so-called here dry type meaning is meant in the temperature range below 30 ℃ it is solid, and can utilize grinding and processing, particle extrusion process they to be processed as granular.
Unsaturated polyester resin is that crosslinking agents such as unsaturated alkyd resin and co-polymerized monomer are mixed and obtain.When the preparing resin composition, co-polymerized monomer is mixed in the resin with other mixture, yet, also can be before the preparing resin composition and mixed with resin.
Unsaturated alkyd resin is to make unsaturated polynary acids, saturated polybasic acid class and glycols generation dehydration condensation and the material that obtains.
As unsaturated polynary acids, can enumerate out for example maleic anhydride, fumaric acid, itaconic acid, citraconic acid etc.
As the saturated polybasic acid class, can enumerate out for example phthalic anhydride, M-phthalic acid, terephthalic acid (TPA), adipic acid, decanedioic acid, tetrabydrophthalic anhydride, methyl tetrahydrophthalic anhydride, inner methylidyne tetrahydric phthalic anhydride, HET acid, tetrabromophthalic anhydride etc.
As glycols, can enumerate out for example ethylene glycol, propane diols, diethylene glycol (DEG), DPG, neopentyl glycol, 1,3-butanediol, 1,6-hexylene glycol, hydrogenated bisphenol A, bisphenol-A epoxy propane compounds, dibromoneopentyl glycol etc.
In unsaturated alkyd resin, can suitably adopt the unsaturated alkyd resin of melt viscosity 1000～2500cP, especially preferred M-phthalic acid is that unsaturated alkyd resin, terephthalic acid (TPA) are unsaturated alkyd resin.
Through adopting this unsaturated alkyd resin, can form the more excellent dry type unsaturated polyester resin compositions of formability and heat-resisting discolouration.
As the crosslinking agent that mixes with unsaturated alkyd resin, for example can adopting, ethene such as styrene, vinyltoluene, divinylbenzene, AMS, methyl methacrylate, vinyl acetate are co-polymerized monomer.
In addition, can adopt diallyl phthalate, triallyl cyanurate, DATBP, benzene oxygen ethyl propylene acid esters, 2-hydroxy ethyl methacrylate, 1, co-polymerized monomers such as 6-hexanediyl ester.Further, can adopt the prepolymer of above-mentioned substance.
Especially preferably adopt diallyl phthalate prepolymer, diallyl phthalate monomer, styrene monomer.In addition, both can use a kind of in the above-mentioned crosslinking agent separately, also can be with two or more common uses.
The unsaturated alkyd resin in unsaturated polyester resin and the ratio of crosslinking agent are to be 99/1～50/50 scope with mass ratio.Wherein, adopt at crosslinking agent under the situation of monomer and since when the mixing quantitative change of monomer for a long time, be not the dry type unsaturated polyester resin compositions of the solid shape of normal temperature, so preferably in unsaturated polyester resin 100 mass parts, the combined amount of monomer is below 10 mass parts.
In addition, the combined amount of unsaturated polyester resin is for all amounts of dry type unsaturated polyester resin compositions, in mass percent is 14%～40% scope.
In the dry type unsaturated polyester resin compositions, can the mixed polymerization initator.As polymerization initiator, can adopt the organic peroxide of the heating and decomposition type that is adopted in the common unsaturated polyester resin compositions.
As above-mentioned substance; Can enumerate out for example tert-butyl hydroperoxide-2-ethylhexyl monocarboxylate, 1; 1-two (peroxidating of uncle's hexyl) cyclohexane, 1; 1-two (tert-butyl hydroperoxide)-3,3,5-trimethyl-cyclohexane, tert-butyl hydroperoxide tricaprylate, benzoyl peroxide, methyl ethyl ketone peroxide, diacetone peroxide, tert butyl peroxy benzoate, cumyl peroxide etc.Both can use a kind of in the above-mentioned substance separately, also can be with two or more common uses.
In above-mentioned substance, preferably adopting the temperature of half-life in the time of 10 hours is the organic peroxide more than 100 ℃, employing cumyl peroxide that particularly can be suitable.
Can be used Chinese white in the dry type unsaturated polyester resin compositions.As Chinese white, can enumerate out for example titanium oxide, barium titanate, aluminium oxide, zinc oxide, magnesia, barium sulfate, magnesium carbonate, brium carbonate, zirconia, strontium titanates etc.Both can use a kind of in the above-mentioned substance separately, also can be with two or more common uses.
In this Chinese white, especially preferably adopt titanium oxide, aluminium oxide, barium titanate.
As titanium oxide, can enumerate out for example anatase-type titanium oxide, Titanium Dioxide Rutile Top grade, shepardite (Brucite) type titanium oxide.Can preferably adopt the Titanium Dioxide Rutile Top grade of excellent heat stability in the above-mentioned substance.
As far as aluminium oxide, barium titanate, have no particular limits, and can adopt known material.
The mean particle diameter of Chinese white is preferably below the 2.0 μ m, and 0.1 μ m～1.0 μ m more preferably further are preferably the scope of 0.3 μ m～0.7 μ m.Wherein, mean particle diameter can wait through the laser diffraction and scattering method and measure.
Relative unsaturated polyester resin 100 mass parts of the combined amount of Chinese white, more than preferred 100 mass parts, the more preferably scope of 100～300 mass parts.
Through the combined amount that makes Chinese white is in this scope, thereby can make heat-resisting discolouration more excellent, becomes first resinite 40 (reflectors of LED etc.) that white is had high reflectance.
Can be used inorganic filler in the dry type unsaturated polyester resin compositions.As inorganic filler, can enumerate out silicon dioxide, aluminium hydroxide, aluminium oxide, magnesia, barium sulfate, magnesium carbonate, brium carbonate etc.Both can use a kind of in the above-mentioned substance separately, also can be with two or more common uses.
In above-mentioned inorganic filler, especially preferred silicon dioxide as above-mentioned substance, can be enumerated out for example fused silica powder, spherical silicon dioxide powder, broken SiO 2 powder, ground silica end.
Below the preferred 250 μ m of the mean particle diameter of inorganic filler, the more preferably scope of 10 μ m～100 μ m.Has the more excellent dry type unsaturated polyester resin compositions of good formability and heat-resisting discolouration and moisture resistance through being the scope of this mean particle diameter, can forming.Wherein, mean particle diameter can wait through the laser diffraction and scattering method and measure.
The combined amount of inorganic filler is for unsaturated polyester resin 100 mass parts, and preferred mass part is more than 50, more preferably the scope of 50～250 mass parts.
According to being this blend range, can forming dry type unsaturated polyester resin compositions with more excellent formability, be shaped through adopting said composition, can access first resinite 40 (reflectors of LED etc.) with more excellent heat-resisting discolouration and high reflectance.
The summation of the combined amount of Chinese white and inorganic filler is for whole amounts of dry type unsaturated polyester resin compositions, and its mass percent is 44%～74%, and preferred mass percentage is in 50%～72% the scope.
In addition, in the summation of the combined amount of Chinese white and inorganic filler, the shared ratio preferred mass percentage of Chinese white is more than 30%, and more preferably mass percent is in 40%～85% scope.
In addition, for unsaturated polyester resin 100 mass parts, the summation of the combined amount under the situation that Chinese white and inorganic filler mix is preferably below 500 mass parts, more preferably the scope of 100～400 mass parts.Total metering of the combined amount through making Chinese white and inorganic filler is this scope, thereby can be suitable Resin Flow, obtains good formability.
In addition, because as far as Chinese white, inorganic filler, micronize just is easy to generate aggegation, oil suction more more, its filling sometimes is difficulty comparatively, so also can adopt aliphatic acid, coupling agent to wait surface treatment is carried out on its surface.
In addition, in the dry type unsaturated polyester resin compositions, in the scope that the reflectivity not to the flowability of resin combination, as reflector the time counteracts, can suitably mix with other inorganic filler.
As above-mentioned substance, can enumerate out the hollow minute particle of oxide and its hydrate, inorganic foamed particle, silica gel balloon etc. etc.
In the dry type unsaturated polyester resin compositions, can mix supporting material.For supporting material, usually, so long as the unsaturated polyester resin compositions that can in the FRP of BMC, SMC etc., be adopted just can use as supporting material with not limiting.
As above-mentioned substance, can enumerate out for example glass fiber, vinylon fibre, aramid fiber, polyester fiber, wollastonite fibre, potassium titanate crystal whisker etc., preferred glass fibers in the above-mentioned substance.
As glass fiber; Can enumerate out the glass fiber of being processed by the E glass (the electric alkali-free glass of using) that with silicate glass, borosilicate glass is raw material, C glass (chemistry is used alkali-containing glass), A glass (acid-resistant glass), S glass glass such as (high strength glass), above-mentioned glass fiber can be used for making long fibre (rove) and short fiber (chopped strand).
In addition, can adopt above-mentioned glass fiber has been implemented the surface-treated material.
Especially can adopt fibre diameter is that the E glass fiber of 10～15 μ m is restrained through the astringent of vinyl acetate etc., carry out surface treatment through silane coupler after, be cut into the chopped strand that 3～6mm forms.
For unsaturated polyester resin 100 mass parts, the combined amount of supporting material is preferably 10～200 mass parts, and 10～100 mass parts more preferably further are preferably the scope of 20～80 mass parts.
Through under this condition, adopting reinforcement material, can form the dry type unsaturated polyester resin compositions that strength characteristics is more excellent, that can suppress cure shrinkage, have more excellent reflectivity.
The dry type unsaturated polyester resin compositions can mix release agent.As release agent, can adopt the paraffin class of the general fatty acid that adopts, fatty acid metal salt, mineral substance etc. in the heat-curing resin, the especially preferred material that adopts the more excellent fatty acid of heat-resisting variable color, fatty acid metal salts system.
As above-mentioned substance, specifically can enumerate out stearic acid, zinc stearate, aluminum stearate, calcium stearate.Both can use a kind of in the above-mentioned release agent separately, also can be with two or more common uses.
With respect to unsaturated polyester resin 100 mass parts, this release agent can mix with the scope of 4～15 mass parts.If the combined amount of release agent in this scope, then can obtain good release property and more excellent outward appearance simultaneously, when as the reflector of LED etc., can form optimal reflectivity.
In the dry type unsaturated polyester resin compositions; Beyond the blending constituent, can suitably mix following substances at these as required: promptly be used to adjust curing catalysts and polymerization inhibitor, colouring agent, the thickener of the condition of cure of unsaturated polyester resin, other organic type of additive, mineral-type additive etc.
In the dry type unsaturated polyester resin compositions, each composition is mixed, adopt after blender, mixer etc. carry out mixing full and uniformly, can mediate through pressurization kneader, hot roll, extruder etc., pulverizing, granulation and make.
In addition, polymerization initiator preferably adopts the masterbatch that fire, blast is had greater security.
In the dry type unsaturated polyester resin compositions that mixes thus; With the composition epoxy resin that is cured reaction at normal temperatures, volatilize crosslinking agent etc. and to produce the wet type unsaturated polyester resin of thickening from A-stage different at normal temperatures, its storage stability and operability are more excellent.
In addition; Adopted first resinite 40 of this dry type unsaturated polyester resin can utilize the manufacturing process of various habitual hot curing resin compositions to form, can make the variable color that causes by heat ageing less, life-span first resinite 40 of long cheapness reflectors such as () LED.
In addition, as far as the dry type unsaturated polyester resin compositions, because it is a dry type, and thermal stability during melting is more excellent, so manufacturing process preferably adopts the fusion heating forming process of injection molding method, ejection compress moulding method, transfer modling forming process etc.
In said method, the especially suitable injection molding method of selecting to have adopted injection machine utilizes injection molding method can make curring time become shorter, can make first resinite 40 with complicated shape.
In addition; Beyond the condition of dry type, under the situation of unsaturated polyester resin compositions, owing to can not become graininess usually with aqueous or viscosity; So operability is relatively poor; Under the situation of utilizing injection machine to form, be necessary on hopper, to be provided with the equipment of plunger etc., relate to the problem of manufacturing cost.
In contrast, in the dry type unsaturated polyester resin compositions, owing to be the graininess of dry type, so storage stability is more excellent, owing to just can be shaped through a hopper input from injection machine, so operability is more excellent.Can suppress manufacturing cost lower in addition.
In addition, owing to be the resin of Thermocurable, so on the framework of first resinite 40 after the shaping, can produce burr, but because its fluid-tight engagement property is lower, so can remove deburring easily.
The burr that has produced removed for example can utilize known method to carry out, wherein, the preferred employing sprayed (blast) and handled and carry out, and this inject process is the processing that in the burr of unsaturated polyester resin compositions is removed, is widely used.
As inject process, can adopt adopted inject process method in the common burr removal, as this facture, can enumerate out shot-peening, sandblast, injection bead etc.
First lead-in wire 20 has first 20a of inner lead portion and first 20b of outside lead portion.First 20a of inner lead portion exposes from the bottom surface sections 40a of the recess 40c of first resinite 40, is used for carrying putting light-emitting component 10.Have among first 20a of inner lead portion that this quilt exposes and carry the area put light-emitting component 10 and get final product, and from the viewpoint consideration of heat conductivity, electrical conductivity, reflection efficiency etc., preferably than large tracts of land.First 20a of inner lead portion is electrically connected with first electrode 11 of light-emitting component 10 through electric wire 60.First 20b of outside lead portion is except that unloading the part that is equipped with light-emitting component 10, the part that exposes from first resinite 40.First 20b of outside lead portion is electrically connected with outer electrode, also has conductive force simultaneously.
Second lead-in wire 30 has second 30a of inner lead portion and second 30b of outside lead portion.Second 30a of inner lead portion exposes from the bottom surface sections 40a of the recess 40c of first resinite 40.As long as have the area that is electrically connected with second electrode 12 of light-emitting component 10 among second 30a of inner lead portion that this quilt exposes, yet, consider from the viewpoint of reflection efficiency, be preferably than large tracts of land.First 20b of outside lead portion of rear side and second 30b of outside lead portion expose, and form same plane in fact.Can improve surface-mount type light emitting Unit Installation stability thus.In addition, in order to prevent to weld, owing to scolder causes short circuit, also can apply insulating component 90 between the back side of first 20a of inner lead portion and second 30a of inner lead portion than unfertile land with electrical insulating property.Insulating component 90 is with formation such as resins.
First lead-in wire, 20 and second lead-in wire 30 can adopt the easy conductive conductor of iron, phosphor bronze, copper alloy etc. and constitute.In addition, in order to improve the reflection of light rate of coming self-emission device 10, also can implement the metal-plated of silver, aluminium, copper, gold etc. to the surface of first lead-in wire, 20 and second lead-in wire 30.In addition, the reflectivity for the surface of improving first lead-in wire 20 the surface and second lead-in wire 30 preferably makes it comparatively level and smooth.In order to improve thermal diffusivity, can make the area of first lead-in wire, 20 and second lead-in wire 30 bigger.Thus, the temperature that can suppress light-emitting component 10 effectively rises, and can on light-emitting component 10, flow through many electric currents.In addition, through making go between 30 thickness thickening of first lead-in wire 20 and second, thereby can improve thermal diffusivity.In the case, the shaping processing that first lead-in wire, 20 and second lead-in wire 30 is bent etc. is comparatively difficult, so be cut into the size of regulation.In addition, through making the thickness thickening of first lead-in wire, 20 and second lead-in wire 30, the amount of deflection of first lead-in wire, 20 and second lead-in wire 30 diminishes, thereby can more easily carry out the installation of light-emitting component 10.And in contrast,, can more easily carry out the forming process of bending machining through first lead-in wire, 20 and second lead-in wire 30 is formed thin tabular, be configured as the shape of regulation.
First lead-in wire, 20 and second lead-in wire 30 is a pair of positive and negative.First lead-in wire, 20 and second lead-in wire 30 needs only each one at least, also can be provided with a plurality of.In addition, upload under the situation of putting a plurality of light-emitting components 10, be necessary to be provided with a plurality of second lead-in wires 30 at first lead-in wire 20.
The material of second resinite 50 is a heat-curing resin.Heat-curing resin for example can be enumerated out: epoxy resin, modified epoxy, organic siliconresin, modified organic silicone resin, acrylic resin, polyurethane resin etc.Can adopt a kind ofly in the above-mentioned resin separately, also can adopt two or more simultaneously.Especially preferred epoxy, modified epoxy, organic siliconresin, modified organic silicone resin.Second resinite 50 is preferred for protecting the hard resin of light-emitting component 10.In addition, second resinite, 50 preferred thermal endurance, ageing resistance, the more excellent resins of light resistance of adopting.In second resinite 50, in order to make its function, can from the one group of material that constitutes by filler, diffusant, pigment, fluorescent material, reflective substance, select at least a being mixed in second resin 50 with regulation.Also can make in second resinite 50 and contain diffusant.Concrete diffusant can suitably adopt for example barium titanate, titanium oxide, aluminium oxide, Si oxide etc.In addition, can be purpose with the wavelength that cuts off outside specifying, make second resinite 50 contain illuminating colour, the coloring pigment of organic or inorganic.In addition, second resinite 50 can absorb the light of self-emission device 10, contains the fluorescent material 80 that is useful on the conversion wavelength.
Above-mentioned fluorophor is through the exciting light of light-emitting component 10; On can being employed in yellow, redness, green, blueness, have the fluorophor of emission spectrum, can also be employed in yellow as the Neutral colour of above-mentioned color, blue-green, have the fluorophor of emission spectrum on orange etc.Through these fluorophor are carried out various combinations and employing, can make surface-mount type light emitting device with various illuminant colours.
In addition, can in the rear side of surface-mount type light emitting device the heat release member be set through the heat release bonding agent.
Have in the surface-mount type light emitting of the above structure device possessing, second 30b of outside lead portion of first 20b of outside lead portion and second lead-in wire 30 that can make first lead-in wire 20 is with the outer electrode ground connection installation that is electrically connected.For example, because first lead-in wire, 20 and second lead-in wire 30 is the thicker flat boards of thickness, so can realize being electrically connected through externally clipping between electrode and the heat release member.In addition, in first 20b of outside lead portion and second electrical connection of the 30b of outside lead portion, can adopt Pb-free solder with outer electrode.In addition, also can upload the mode of putting first 20b of outside lead portion etc. through electrode externally is electrically connected.
This surface-mount type light emitting device can be made through following method.As the manufacturing process of first resinite 40, can suitably adopt the fusion heating forming process of injection molding method, ejection compress moulding method, transfer modling forming process etc.In the middle of these methods, especially be fit to adopt the injection molding method of injection machine, can make first resinite 40 through injection molding method with complicated shape.
At first, first 20a of inner lead portion and second 30a of inner lead portion of bottom surface sections 40a that utilizes mold and bed die to clip first 20b of outside lead portion and second 30b of outside lead portion and be equivalent to the recess 40c of first resinite 40.
Mold is formed with the pit of the recess 40c that is equivalent to first resinite 40.The part of the bottom surface sections 40a of the recess 40c that is equivalent to first resinite 40 of mold forms with first 20a of inner lead portion and contacts with second 30a of inner lead portion.
Then, in by the pit portion that mold and bed die clipped, inject the dry type unsaturated polyester resin compositions.
The unsaturated polyester resin compositions that is injected into is cured through heating, obtains having first resinite 40 of the dry type unsaturated polyester resin formed body of the recess 40c that comprises bottom surface sections 40a and side surface part 40b.In addition, on the bottom surface sections 40a of recess 40c, be used to make the insulation resin portion 45 of first lead-in wire, 20 and second lead-in wire, 30 insulation to be set to dry type unsaturated polyester resin formed body.
Mold and bed die unloaded thereafter.Solidifying under the inadequate situation, carry out the back curing operation, thereby the mechanical strength that improves first resinite 40 makes it reach the degree of the problem that in operation, do not take place.
After this, after carrying out burr removal etc. as required, light-emitting component was put on first 20a of inner lead portion in 10 years.During burr is removed, for example can utilize inject process to carry out.In inject process, can adopt the inject process method that is adopted in the burr removal usually, as this facture, can enumerate out shot-peening, sandblast, injection bead etc.
Next, first electrode 11 and first 20a of inner lead portion that light-emitting component 10 are had are electrically connected.In addition, second electrode 12 and second 30a of inner lead portion that light-emitting component 10 are had are electrically connected.
And then, in carrying the recess 40c that is equipped with light-emitting component 10, dispose heat-curing resin.Dispose in the method for this heat-curing resin, can adopt drip method, injection, extrusion molding etc., preferred drip method.Through adopting drip method, thus can with in the recess 40c remaining air effectively drive out of.In this heat-curing resin, preferably be pre-mixed fluorescent material 80.Thus, can be easier to the tone of surface installing type light-emitting device is adjusted.This heat-curing resin is cured through heating, forms second resinite 50.Can make the surface-mount type light emitting device thus.
Fig. 3 is for roughly representing other the cutaway view of execution mode of surface-mount type light emitting device of the present invention.
In the surface-mount type light emitting device of above-mentioned execution mode, on go between 30 surface of first lead-in wire 20 and second, at least with part that first resinite 40 contacts on, be provided with the coupling agent treatment portion 35 after coupling agent treatment.
Through this coupling agent treatment portion 35 is set, owing to the combination of the chemistry that adopts coupling agent to obtain, thereby first lead-in wire, 20 and second lead-in wire 30 is improved with the fluid-tight engagement power of 40 of first resinites, can provide durability more excellent surface-mount type light emitting device.
Promptly make in the resin molded body at the dry type unsaturated polyester, owing to the fluid-tight engagement property of 20 and second lead-in wire 30 that goes between as first of metal material is lower, so, can the burr on the framework of first resinite 40 after being shaped more easily be removed.On the other hand, because fluid-tight engagement property is lower, diminish for the obstruction power of first lead-in wire, 20 and second lead-in wire 30 with peeling off of 40 of first resinites etc.
Therefore, in this execution mode,, first lead-in wire, 20 and second lead-in wire 30 is improved with the fluid-tight engagement power between first resinite 40, and can remove the burr after the shaping at an easy rate through coupling agent treatment portion 35 is set.
In addition, as far as coupling agent handling part 35, its formation scope is not particularly limited, and goes between 30 surface at least in the part that contacts with first resinite 40 as long as be located at first lead-in wire 20 and second.For example, also can be arranged at the scope that the dotted line of Fig. 3 is represented, i.e. the surface of upper surface part 31a, side end 31b and the lower surface portion 31c of the surface of upper surface part 21a, side end 21b and the lower surface portion 21c of first lead-in wire 20, second lead-in wire 30.
As the coupling agent that is adopted in the coupling agent treatment portion 35, make it with the time when considering as the fluid-tight engagement property raising of first resinite 40 of dry type unsaturated polyester resin formed body, preferably adopt amino silicane coupling agent, acrylic silane coupling agent.
As amino silicane coupling agent; Can enumerate out for example N-(2-amino-ethyl)-3-aminopropyl methyl dimethoxysilane, N-(2-amino-ethyl)-3-TSL 8330, N-(2-amino-ethyl)-3-aminopropyltriethoxywerene werene, 3-aminopropyl dimethylethoxysilane, 3-aminopropyl methyldiethoxysilane, 3-TSL 8330,3-aminopropyltriethoxywerene werene, 3-triethoxysilyl-N-(1,3-dimethyl-butylidene) propylamine, N-phenyl-3-TSL 8330 etc.
As the acrylic silane coupling agent, can enumerate out for example 3-acryloxy propyl trimethoxy silicane, 3-methacryloxypropyl methyl dimethoxysilane, 3-methacryloxypropyl trimethoxy silane, 3-methacryloxypropyl methyldiethoxysilane, 3-methacryloxypropyl triethoxysilane etc.
As coupling agent treatment portion 35, for example can utilize with the same method of disclosed coupling agent treatment in the past to be provided with.
Fig. 4 is for roughly representing other the cutaway view of execution mode of surface-mount type light emitting device of the present invention.
In the surface-mount type light emitting device of this execution mode, first lead-in wire 20 and second go between 30 surface at least with part that first resinite 40 contacts on, being provided with surface roughness Ra is coarse facial 36 of 2.5 μ m～4.5 μ m.
Wherein, can to adopt and utilize the probe point diameter be the measured value of surface roughness meter of 5 μ m to the measured value of surface roughness Ra.
Should be coarse facial 36 through being provided with, utilize coarse facial 36 concavo-convex and the fixed effect that produces, can improve first lead-in wire, the 20 and second lead-in wire 30 fluid-tight engagement power of 40 of first resinites together, can provide durability more excellent surface-mount type light emitting device.
Be in the dry type unsaturated polyester resin formed body, because and lower as 30 the fluid-tight engagement property of first lead-in wire, 20 and second lead-in wire of metal material, so can more easily remove to the burr on the framework of first resinite 40 after being shaped.On the other hand, because fluid-tight engagement property is lower, diminish for the obstruction power of first lead-in wire, 20 and second lead-in wire 30 with peeling off of 40 of first resinites etc.
Therefore, coarse facial 36 through being provided with in this embodiment, first lead-in wire, 20 and second lead-in wire 30 is improved with the fluid-tight engagement power between first resinites 40, and can remove the burr after the shaping at an easy rate.
In addition, as far as coarse facial 36, its formation scope is not particularly limited, and goes between on 30 the surface at least in the part that contacts with first resinite 40 as long as be located at first lead-in wire 20 and second.For example, also can be arranged at the scope that the dotted line of Fig. 3 is represented, promptly on the surface of upper surface part 31a, side end 31b and the lower surface portion 31c of the surface of upper surface part 21a, side end 21b and the lower surface portion 21c of first lead-in wire 20, second lead-in wire 30.
Coarse facial 36 can form on the surface of first lead-in wire, 20 and second lead-in wire 30 through for example by method, injection processing, etching, the grinding methods such as (grind, polish) of YAG laser radiation.
Fig. 5 is for roughly representing other the cutaway view of execution mode of surface-mount type light emitting device of the present invention, and Fig. 6 is a vertical view.Wherein, Fig. 5 is the A-A cutaway view of Fig. 6.
In the surface-mount type light emitting device of this execution mode, on first resinite 40, be provided with fluid-tight engagement portion 41.Fluid-tight engagement portion 41 fluid-tight engagement cover this scope continuously in following ranges, this scope promptly goes between the upper surface part 21a, 31a of 30 first 20b of outside lead portion, second 30b of outside lead portion to side end 21b, 31b from first lead-in wire 20 and second.That is, utilize fluid-tight engagement portion 41, have the structure of holding together to gather first 20b of outside lead portion, second 30b of outside lead portion.
Through fluid-tight engagement portion 41 is set, thereby first lead-in wire, 20 and second lead-in wire 30 is improved with the fluid-tight engagement power of the machinery of 40 of first resinites, can provide durability more excellent surface-mount type light emitting device.
Promptly make in the resin molded body at the dry type unsaturated polyester, owing to the fluid-tight engagement property of 20 and second lead-in wire 30 that goes between as first of metal material is lower, so, can the burr on the framework of first resinite 40 after being shaped more easily be removed.On the other hand, because fluid-tight engagement property is lower, diminish for the obstruction power of first lead-in wire, 20 and second lead-in wire 30 with peeling off of 40 of first resinites etc.
Therefore, in this execution mode,, can increase by first lead-in wire, 20 and second lead-in wire 30 with the fluid-tight engagement area between first resinite 40, thereby fluid-tight engagement power is improved, and can remove the burr after the shaping at an easy rate through fluid-tight engagement portion 41 is set.
In addition, as far as fluid-tight engagement portion 41, as long as fluid-tight engagement is in following ranges and cover this scope continuously: this scope be at least from the upper surface part 21a of first 20b of outside lead portion, second 30b of outside lead portion, 31a to side end 21b, 31b.Therefore, can also the dotted line of fluid-tight engagement in Fig. 5 represent to first 20b of outside lead portion, the lower surface portion 21c of second 30b of outside lead portion, the scope of 31c, and cover this scope.Can improve fluid-tight engagement power further thus.
As far as the fluid-tight engagement portion 41 of first resinite 40, can utilize injection molding method etc. according to aforesaid order, on first 20b of outside lead portion and second 30b of outside lead portion, be shaped integratedly.
Fig. 7 is for roughly representing other the cutaway view of execution mode of surface-mount type light emitting device of the present invention.
In the surface-mount type light emitting device of above-mentioned execution mode, with the execution mode of Fig. 5 likewise, on first resinite 40, be provided with fluid-tight engagement portion 41.And, in first 20b of outside lead portion of first lead-in wire, 20 and second lead-in wire 30, the last fluid-tight engagement portion 41 and notch part 32 fluid-tight engagement of notch part 32, the first resinites 40 of depression to the inside of being provided with of side end 21b, 31b of second 30b of outside lead portion.
Through this notch part 32 is set, thereby first lead-in wire, 20 and second lead-in wire 30 is improved with the fluid-tight engagement power of the machinery of 40 of first resinites, can provide durability more excellent surface-mount type light emitting device.
The shape of notch part 32 does not have special qualification, if in side end 21b, 31b the shape of depression to the inside, for example can form by one or more V-shaped valley etc.
Fig. 8 is for roughly representing other the cutaway view of execution mode of surface-mount type light emitting device of the present invention.
In the surface-mount type light emitting device of above-mentioned execution mode, with the execution mode of Fig. 5 likewise, on first resinite 40, be provided with fluid-tight engagement portion 41.And, in first 20b of outside lead portion of first lead-in wire, 20 and second lead-in wire 30, the last fluid-tight engagement portion 41 and jut 33 fluid-tight engagement that is provided with outstanding laterally jut 33, the first resinites 40 of side end 21b, 31b of second 30b of outside lead portion.
Through this jut 33 is set, thereby first lead-in wire, 20 and second lead-in wire 30 is improved with the fluid-tight engagement power of the machinery of 40 of first resinites, can provide durability more excellent surface-mount type light emitting device.
The shape of jut 33 does not have special qualification, as long as the shape of in side end 21b, 31b, giving prominence to laterally for example can be formed by the projection parallel with the length direction of side end 21b, 31b.
Embodiment
Below, through embodiment the present invention is described in further detail, yet the present invention is not limited to these embodiment.
< manufacturing of the resin combination that first resinite is used >
With the resin combination of the embodiment shown in the table 1 1～9 and the resin combination of the comparative example shown in the table 2 1～3; Mix according to each blending constituent, combined amount; After composition mixed through Sigma's blender equably, mediate through the hot roll that is heated to be 100 ℃, thereby make the kneaded material of sheet; To its cool off, pulverizing, granulation, make granular first resinite with (LED reflector with) resin combination.
Blending constituent adopts following material.
(1) resin
Unsaturated alkyd resin: terephthalic acid (TPA) is unsaturated alkyd resin Japan U-PiCA Company Ltd. system U-PiCA8552
Epoxy resin: the system TEPCIC-S of triglycidyl group isocyanuric acid ester (epoxide equivalent 100) Nissan Chemical Ind Ltd
Nylon resin: nylon 46 resin (STANYL)
(2) crosslinking agent
Crosslinking agent 1: diallyl phthalate prepolymer DAISO Ltd. system DAP polymer
Crosslinking agent 2: diallyl phthalate monomer DAISO Ltd. system DAP monomer
Crosslinking agent 3: styrene monomer
(3) polymerization initiator
The system Percumyl D of cumyl peroxide (40% masterbatch) Japan Oil Co 40
(4) epoxy curing agent
The system RIKACID HH of hexahydrophthalic anhydride New Japan Chem Co., Ltd
(5) Chinese white
Chinese white 1: titanium oxide (Titanium Dioxide Rutile Top grade average grain diameter 0.4 μ m) Tioxide Japan Ltd. system Tioxide R-TC30
Chinese white 2: aluminium oxide (average grain diameter 0.5 μ m)
Chinese white 3: barium titanate (average grain diameter 0.4 μ m)
(6) inorganic filler
Inorganic filler 1: the system FB820 of silicon dioxide (fused silica average grain diameter 25 μ m) Deuki Kagaku Kogyo Co., Ltd
Inorganic filler 2: aluminium hydroxide (average grain diameter 29 μ m)
(7) release agent
Release agent: the system SZ-P of zinc stearate Sakai Chemical Industry Co., Ltd.
(8) strengthen material
Strengthen material: glass fiber (length 3mm) Owens Corning Japan Ltd. makes CS03IE830A
< evaluation method >
(1) injecting formability
Utilize injection machine (matsuda is made made, 150 tons of Thermocurable injection machines); 160 ℃ of mold temperatures; Under the condition of 60 seconds curing times; With the resin combination of the embodiment shown in the table 1 1～9 with the mixed proportion of the comparative example 1～3 shown in the table 2, be made as according to the shaping shrinkage rate measurement of the JIS K of Japanese Industrial Standards 6911 (down together) and use test specimen, carry out actual shaping evaluation through visual observations.
If qualified product are zero, defective item is *.Its result is shown in table 1, table 2.
(2) transfer modling formability
Utilize transfer modling forming machine (50 tons of plunger type transfer modling forming machines); With the resin combination of the embodiment shown in the table 1 1～9 with the mixed proportion of the comparative example 1～3 shown in the table 2; Be made as according to the shaping shrinkage rate of JIS K 6911 measure and use test specimen, carry out actual shaping evaluation through visual observations.
If qualified product are zero, defective item is *.Its result is shown in table 1, table 2.
(3) the reflectivity timeliness changes
Utilize forming machine (matsuda is made made, 150 tons of Thermocurable injection machines); With the resin combination of the embodiment shown in the table 1 1～9 with the mixed proportion of the comparative example 1～3 shown in the table 2; In addition; Utilize forming machine (50 tons of plunger type transfer modling forming machines), with the resin combination of the mixed proportion of comparative example 1～3, be made as according to the reflectivity timeliness of JIS K 6911 change and use test specimen.
It is the LED of 460nm that wavelength is installed on this test block, utilizes albedo measurement device (Japanese electric look Industrial Co., Ltd system beam split color meter) that the reflectivity timeliness of each the LED reflector under 150 ℃ of conditions is changed and measures.
Fig. 9 representes the curve chart that the reflectivity timeliness of the LED reflector of embodiment 4, comparative example 1,2 changes.
In the curve chart of Fig. 9,
(unsaturated polyester resin system LED reflector) represented with (●) among the embodiment 4
(epoxy resin system LED reflector) represented with (■) in the comparative example 1
(polyamide system resin LED reflector) represented with (◆) in the comparative example 2.
In addition, the initial stage reflectivity of embodiment 1～9 and comparative example 1～3 and through the reflectivity after 1000 hours like table 1, shown in 2.
(4) heat-resisting discolouration
In the timeliness of above-mentioned reflectivity changes, utilize albedo measurement device (Japanese electric look Industrial Co., Ltd system beam split color meter) that the surperficial reflectivity of test specimen after handling in 150 ℃, 1000 hours is measured.
The albedo measurement wavelength carries out under the condition of 460nm, suppose that reflectivity is that situation more than 70% is zero, the situation of less than 70% for *, situation about can't measure for-.Its result is like table 1, shown in 2.
(5) spray the burr property handled
Utilize the resin combination of forming machine (matsuda make made, 150 tons of Thermocurable injection machines) with the mixed proportion of embodiment shown in the table 1 1～9 and comparative example 1～3, be made as according to the injection burr of JIS K 6911 handle property and use test specimen.
Each test specimen is carried out inject process (dry-type jetting method, microballon type: nylon condition: with the air quantity of 0.1MPa～0.2MPa, 1m
3/ min), estimate spraying the burr property handled through visual observations.
If qualified product are zero, defective item is *.Its result is shown in table 1, table 2.
(6) storage stability
Whether the embodiment 1～9 under 20 ℃ condition shown in the his-and-hers watches 1 observes with the outward appearance of the resin combination of the mixed proportion of the comparative example 1～3 shown in the table 2, exist to change from the state at initial stage through resin combination and judge storage stability.
Supposing not change is zero, change into *.
Table 1
Table 2
By table 1 and table 2, in embodiment 1～9, among the result of injecting formability, transfer modling formability and the sandblast burr property handled, preservation stability, all obtain good result.In addition, can confirm that especially the mixing as the silicon dioxide of inorganic filler is effectively to injecting formability, heat-resisting discolouration is also had good influence.
In the reflectivity timeliness changes; Though in the polyamide system resin LED reflector of the epoxy resin system of comparative example 1 and comparative example 2,, shown higher reflectivity than the unsaturated polyester resin system LED reflector of embodiment as far as the initial stage reflectivity; But As time goes on; Their reflectivity is low, during through 1000 hours, becomes the lower value of reflectivity than the unsaturated polyester resin system reflector of embodiment 4.
Can confirm thus: the unsaturated polyester resin system LED reflector of embodiment 4, to compare with the epoxy resin system of comparative example 1 and the polyamide system resin LED reflector of comparative example 2, the timeliness of reflectivity changes less.
Can confirm in the unsaturated polyester resin system LED of each embodiment reflector; As table 1 also can be clear and definite; Adopting wavelength is that the reflectivity at its initial stage is approximately more than 90% under the situation of LED of 460nm, 150 ℃, it has the reflectivity more than 70% during through 1000 hours.
In addition; About storage stability, as being cured the comparative example 1 of the composition epoxy resin of reaction with normal temperature, and cause as the styrene monomer of crosslinking agent under the normal temperature in the comparative example 3 of wet type unsaturated polyester resin compositions of volatilization; Cause thickening from A-stage, for defective.
Claims (8)
1. a surface-mount type light emitting device is characterized in that, comprising:
Light-emitting component;
First resinite, its be used for carrying first lead-in wire put this light-emitting component and is electrically connected with above-mentioned light-emitting component second go between integratedly, this first resinite is made up of the dry type unsaturated polyester resin formed body with recess;
And second resinite, it is used to cover carry puts the above-mentioned light-emitting component in the above-mentioned recess of this first resinite;
On the bottom surface sections of above-mentioned recess, carry first lead-in wire that is equipped with above-mentioned light-emitting component and exposed, and on this bottom surface sections, be provided with the insulation resin portion that is used to make above-mentioned first lead-in wire and above-mentioned second lead wire insulation.
2. surface-mount type light emitting device according to claim 1 is characterized in that,
On the surface that above-mentioned first lead-in wire and above-mentioned second goes between, at least with part that above-mentioned first resinite contacts on, be provided with the coupling agent treatment portion after coupling agent treatment.
3. surface-mount type light emitting device according to claim 1 is characterized in that,
On the surface that above-mentioned first lead-in wire and above-mentioned second goes between, at least with part that above-mentioned first resinite contacts on, being provided with surface roughness Ra is the coarse face of 2.5 μ m～4.5 μ m.
4. according to each described surface-mount type light emitting device of claim 1 to 3, it is characterized in that,
On above-mentioned first resinite, be provided with fluid-tight engagement also covers following ranges continuously in following ranges fluid-tight engagement portion, said scope is the scope from the upper surface part to the side end of the outside lead portion of above-mentioned at least first lead-in wire and above-mentioned second lead-in wire.
5. surface-mount type light emitting device according to claim 4 is characterized in that,
Above-mentioned fluid-tight engagement portion fluid-tight engagement outside lead portion that above-mentioned first lead-in wire and above-mentioned second goes between from upper surface part through side end in the scope of lower surface portion, and cover above-mentioned scope.
6. surface-mount type light emitting device according to claim 4 is characterized in that,
Side end in the outside lead portion that above-mentioned first lead-in wire and above-mentioned second goes between is provided with the notch part of depression to the inside, the fluid-tight engagement portion of above-mentioned first resinite and above-mentioned notch part fluid-tight engagement.
7. surface-mount type light emitting device according to claim 4 is characterized in that,
Side end in the outside lead portion that above-mentioned first lead-in wire and above-mentioned second goes between is provided with outstanding laterally jut, the fluid-tight engagement portion of above-mentioned first resinite and above-mentioned jut fluid-tight engagement.
8. surface-mount type light emitting device according to claim 1 is characterized in that,
The emission wavelength of above-mentioned light-emitting component is 420nm～490nm, and above-mentioned first resinite is the resinite that contains the titanium oxide Chinese white.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010238026 | 2010-10-22 | ||
| JP2010-238026 | 2010-10-22 | ||
| JP2011-087910 | 2011-04-12 | ||
| JP2011087910 | 2011-04-12 | ||
| JP2011-090460 | 2011-04-14 | ||
| JP2011090460 | 2011-04-14 |
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| CN102456823A true CN102456823A (en) | 2012-05-16 |
| CN102456823B CN102456823B (en) | 2013-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011102763013A Active CN102456823B (en) | 2010-10-22 | 2011-09-15 | Surface-mount light-emitting device |
| CN2011203503771U Expired - Lifetime CN202231064U (en) | 2010-10-22 | 2011-09-15 | Surface mount type luminous device |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011203503771U Expired - Lifetime CN202231064U (en) | 2010-10-22 | 2011-09-15 | Surface mount type luminous device |
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|---|---|
| CN (2) | CN102456823B (en) |
| TW (1) | TWM423359U (en) |
| WO (1) | WO2012053260A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110233199A (en) * | 2018-08-31 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | LED support and preparation method thereof, LED light emitting device, light emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI484668B (en) * | 2012-03-08 | 2015-05-11 | Kenly Prec Ind Co Ltd | Manufacturing method of light emitting diodes |
| JP2014077071A (en) * | 2012-10-11 | 2014-05-01 | Japan U-Pica Co Ltd | Radically polymerizable resin composition for led reflector, granular material composed of the composition, molding method using the granular material and led reflector |
| JP5758355B2 (en) * | 2012-07-13 | 2015-08-05 | 日本ユピカ株式会社 | Unsaturated polyester resin composition for LED reflector, granule comprising the composition, and LED reflector obtained by molding the granule |
| JP5153952B1 (en) * | 2012-06-04 | 2013-02-27 | 日本ユピカ株式会社 | Crystalline unsaturated polyester resin composition for LED reflector, granule comprising the composition, and LED reflector obtained by molding the granule |
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| CN101654548A (en) * | 2008-08-21 | 2010-02-24 | 昭和高分子株式会社 | Unsaturated polyester resin composition for lamp reflector and its molding product, and a lamp reflector |
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| JP2005191192A (en) * | 2003-12-25 | 2005-07-14 | Kyocera Corp | Substrate for mounting light emitting element and light emitting device |
| JP4783647B2 (en) * | 2006-02-27 | 2011-09-28 | パナソニック株式会社 | Semiconductor device using package parts for semiconductor device |
| CN101842891A (en) * | 2007-08-29 | 2010-09-22 | 松下电器产业株式会社 | Wiring member, metal component with resin and resin sealed semiconductor device, and processes for producing them |
| JP5304314B2 (en) * | 2008-11-07 | 2013-10-02 | 凸版印刷株式会社 | Lead frame for LED light emitting element, manufacturing method thereof, and LED light emitting element using the same |
| JP5544739B2 (en) * | 2009-03-31 | 2014-07-09 | 日立化成株式会社 | Thermosetting resin composition for light reflection, optical semiconductor element mounting substrate using the same, manufacturing method thereof, and optical semiconductor device |
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2011
- 2011-07-04 WO PCT/JP2011/065300 patent/WO2012053260A1/en active Application Filing
- 2011-07-05 TW TW100212288U patent/TWM423359U/en not_active IP Right Cessation
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| JPH01182316A (en) * | 1988-01-14 | 1989-07-20 | Matsushita Electric Works Ltd | Unsaturated polyester resin molding material |
| CN101137720A (en) * | 2005-03-08 | 2008-03-05 | 昭和高分子株式会社 | Unsaturated polyester resin composition for lamp reflectors and moldings thereof |
| JP2008255338A (en) * | 2007-03-14 | 2008-10-23 | Nippon Gosei Kako Kk | Diallyl phthalate resin composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110233199A (en) * | 2018-08-31 | 2019-09-13 | 深圳市聚飞光电股份有限公司 | LED support and preparation method thereof, LED light emitting device, light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102456823B (en) | 2013-03-20 |
| WO2012053260A1 (en) | 2012-04-26 |
| TWM423359U (en) | 2012-02-21 |
| CN202231064U (en) | 2012-05-23 |
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