JP5544739B2 - Thermosetting resin composition for light reflection, optical semiconductor element mounting substrate using the same, manufacturing method thereof, and optical semiconductor device - Google Patents

Description

  The present invention relates to a light-reflective thermosetting resin composition used in an optical semiconductor device in which an optical semiconductor element and wavelength conversion means such as a phosphor are combined, an optical semiconductor element mounting substrate using the same, and a method for manufacturing the same And an optical semiconductor device.

  In recent years, an optical semiconductor device in which an optical semiconductor element such as an LED (Light Emitting Diode) and a phosphor are combined has advantages of high energy efficiency, long life, and the like. It is applied to various uses such as uses, and its demand is expanding.

  Along with this, the brightness of LED devices has been increasing, and the rise in junction temperature due to an increase in the amount of heat generated by the element, or the deterioration of element materials due to a direct increase in light energy, has been regarded as a problem. Development of a device material having resistance to the problem has been an issue.

  Under such circumstances, as a technique for preventing the problem of luminance reduction caused by heat and light, the following Patent Document 1 discloses an optical semiconductor element mounting in which a reflector having a high light reflectance is provided at a site where the optical semiconductor element is mounted. A substrate has been proposed. Patent Document 1 discloses that a reflector or the like is formed by transfer molding. The material includes an epoxy resin, a curing agent, a curing catalyst, a white pigment, and the like. Things have been proposed. In addition, Patent Document 2 below proposes a diallyl phthalate resin composition containing a diallyl phthalate polymer, a polymerization initiator, titanium oxide, and a light stabilizer as a material for an optical semiconductor element storage package.

JP 2006-140207 A JP 2008-255338 A

  However, even if the conventional resin composition is used to form a reflector surrounding the optical semiconductor element or fill a gap between the electrodes to which the optical semiconductor element is connected to the opposite side of the substrate, the optical semiconductor In some cases, light leakage that partially transmits light emitted from the element may occur. If this light leakage is large, the light to be emitted to the upper surface of the optical semiconductor device is lost, so that it is difficult to sufficiently increase the light extraction efficiency as the optical semiconductor device. In applications such as liquid crystal displays, small LED devices are used. In this case, however, the wall portion of the reflector and the thickness of the substrate become smaller, so that the problem of light leakage becomes particularly apparent.

  The present invention has been made in view of the above circumstances, and is a thermosetting resin composition for light reflection capable of forming a cured product having excellent light shielding properties, a substrate for mounting an optical semiconductor element using the same, and a method for producing the same. An object of the present invention is to provide an optical semiconductor device.

［式（１）中、ｎは充填剤成分の成分数を示し、φ_ｉはｎ個の充填剤成分を１番からｎ番まで任意に順番をつけたときにｉ番目の充填剤成分の光反射用熱硬化性樹脂全体における体積割合を示し、ｎ_ｉはｉ番目の充填剤成分の屈折率を示し、ｎ_{ｒｅｊｉｎ}は熱硬化性樹脂成分全体の屈折率を示す。］ To achieve the above object, the present invention is a thermosetting resin composition for obtaining the thus cured product transfer molding, a thermosetting resin component, containing a filler component, the following equation (1 The thermosetting resin composition for light reflection of an LED device is provided, wherein X represented by) is 0.30 to 0.70.

[In formula (1), n represents the number of filler components, and φ _i represents the light of the i-th filler component when n filler components are arbitrarily ordered from 1 to n. It indicates the volume percentage in the entire reflecting thermosetting resin, n _i is the refractive index of the i-th filler _component, n rejin is the refractive index of the entire thermosetting resin component. ]

  According to the thermosetting resin composition for light reflection of the present invention, a cured product having excellent light shielding properties is formed by containing a thermosetting resin component and a filler component so that the parameter X falls within the above range. can do.

  Moreover, according to the thermosetting resin composition for light reflection of the present invention, when a cured product is formed on the base surface of a resin substrate, a metallic substrate, etc., the effect of shielding the base color or the resin by light The effect which suppresses degradation etc. can be show | played.

  When the thermosetting resin composition for light reflection of the present invention forms a cured product having a thickness of 0.1 mm, the light reflectance at a wavelength of 460 nm of the cured product is preferably 90% or more.

  In the light reflecting thermosetting resin composition of the present invention, the filler component has a refractive index of 1.6 to 3.0, titanium oxide, zinc oxide, aluminum oxide, magnesium oxide, zirconium oxide, antimony oxide, water. It is preferable to include at least one inorganic oxide selected from the group consisting of aluminum oxide and magnesium hydroxide.

  Moreover, it is preferable that the center particle diameter of the said inorganic oxide exists in the range of 0.1-20 micrometers from a viewpoint of making a thermosetting resin component highly filled when mixing the thermosetting resin composition for light reflections. .

  Moreover, it is preferable that content of the said inorganic oxide is 70-400 mass parts with respect to 100 mass parts of said thermosetting resin components.

  In the conventional thermosetting resin composition for light reflection, if the amount of white pigment such as titanium oxide is excessively increased in order to suppress light leakage, molding processability when producing a molded body such as a reflector, In some cases, the coating property or the like at the time of forming the light reflecting film is impaired by coating or the like, and it may be difficult to manufacture an optical semiconductor element mounting substrate or an LED device having desired optical characteristics. On the other hand, according to the present invention, even when the content of the inorganic oxide is within the above range, the content and specific gravity of the thermosetting resin composition component and the refractive index and specific gravity of the filler component. From the above formula (1), it is possible to easily obtain a cured product that is sufficiently excellent in light reflectance and light shielding property. That is, when the inorganic oxide is blended with the above content and the parameter X is set to 0.30 to 0.70, thermosetting for light reflection satisfying the light reflectance, light shielding property and molding processability at a higher level. The functional resin composition can be realized.

  When a cured product is formed on the base surface of a resin substrate, a metallic substrate, etc., leaving it in a high temperature environment may cause problems such as interface peeling, deformation, and destruction. In order to prevent such a problem from occurring, it is desirable that the difference in thermal expansion coefficient with the substrate is matched. From such a viewpoint, the content of the inorganic oxide is preferably 130 to 400 parts by mass with respect to 100 parts by mass of the thermosetting resin component.

  Moreover, in the thermosetting resin composition for light reflection of the present invention, the filler component is selected from the group consisting of sodium silicate glass, aluminum silicate glass, sodium borosilicate glass, a crosslinked styrene resin, and a crosslinked acrylic resin. It is preferable to include hollow particles having an outer shell including at least one material and a void portion having a refractive index of 1.0 to 1.1.

  From the viewpoint of light reflectivity, it is preferable that the center particle diameter of the hollow particles is in the range of 0.1 to 50 μm.

  Moreover, it is preferable that content of the said hollow particle is 20-85 mass parts with respect to 100 mass parts of said thermosetting resin components.

  By setting the content of the hollow particles in the above range, it is possible to realize a light-reflective thermosetting resin composition that satisfies the light reflectance, light-shielding property, and molding processability at a higher level.

  The present invention also provides an optical semiconductor element mounting substrate provided with a cured product of the light reflecting thermosetting resin composition of the present invention.

  The present invention also has a recess composed of a bottom surface and a wall surface, the bottom surface of the recess is a mounting portion for an optical semiconductor element, and at least a part of the wall surface of the recess is the thermosetting resin for light reflection of the present invention. An optical semiconductor element mounting substrate comprising a cured product of the composition is provided.

  The present invention also includes a substrate and a first connection terminal and a second connection terminal provided on the substrate, and the light of the present invention is provided between the first connection terminal and the second connection terminal. An optical semiconductor element mounting substrate having a cured product of a reflective thermosetting resin composition is provided.

  The present invention also provides an optical semiconductor device having the optical semiconductor element mounting substrate of the present invention and an optical semiconductor element mounted on the optical semiconductor element mounting substrate.

  The present invention is also a method for producing a substrate for mounting an optical semiconductor element having a recess composed of a bottom surface and a wall surface, wherein at least a part of the wall surface of the recess is formed from the thermosetting resin composition for light reflection of the present invention. Provided is a method for manufacturing an optical semiconductor element mounting substrate comprising a step of forming by transfer molding.

  According to the method for manufacturing a substrate for mounting a semiconductor element of the present invention, by providing the above-described process using the thermosetting resin composition for light reflection of the present invention, the light reflectivity that can function as a reflector is sufficiently high and light-shielding. An excellent recess can be provided. Therefore, according to the semiconductor element mounting substrate obtained by the method of the present invention, it becomes easy to manufacture an optical semiconductor device having desired optical characteristics.

  According to the present invention, there are provided a thermosetting resin composition for light reflection capable of forming a cured product having excellent light shielding properties, a substrate for mounting an optical semiconductor element using the same, a method for manufacturing the same, and an optical semiconductor device. Can do.

It is a perspective view which shows suitable one Embodiment of the board | substrate for optical semiconductor element mounting of this invention. It is the schematic which shows one Embodiment of the process of manufacturing the board | substrate for optical semiconductor element mounting of this invention. It is a perspective view which shows one Embodiment of the state which mounted the optical semiconductor element in the board | substrate for optical semiconductor element mounting of this invention. 1 is a schematic cross-sectional view showing an embodiment of an optical semiconductor device of the present invention. It is a schematic cross section which shows other embodiment of the optical semiconductor device of this invention. It is a schematic cross section which shows other embodiment of the optical semiconductor device of this invention. 1 is a schematic cross-sectional view showing a preferred embodiment of a copper-clad laminate according to the present invention. It is a schematic cross section which shows an example of the optical semiconductor device produced using the copper clad laminated board which concerns on this invention. It is a schematic cross section which shows other embodiment of the optical semiconductor device which concerns on this invention.

［式（１）中、ｎは充填剤成分の成分数を示し、φ_ｉはｎ個の充填剤成分を１番からｎ番まで任意に順番をつけたときにｉ番目の充填剤成分の光反射用熱硬化性樹脂全体における体積割合を示し、ｎ_ｉはｉ番目の充填剤成分の屈折率を示し、ｎ_{ｒｅｊｉｎ}は熱硬化性樹脂成分全体の屈折率を示す。］ (Thermosetting resin composition for light reflection)
The thermosetting resin composition for light reflection of the present invention contains a thermosetting resin component and a filler component, and X represented by the following formula (1) is 0.30 to 0.70. It is characterized by.

[In formula (1), n represents the number of filler components, and φ _i represents the light of the i-th filler component when n filler components are arbitrarily ordered from 1 to n. It indicates the volume percentage in the entire reflecting thermosetting resin, n _i is the refractive index of the i-th filler _component, n rejin is the refractive index of the entire thermosetting resin component. ]

  Here, the total volume V of the thermosetting resin for light reflection can be calculated from the mass and specific gravity of each component. Further, the volume ratio φi of each filler component is obtained by dividing the volume of the i-th filler component by the total volume V of the thermosetting resin composition obtained above.

<Regarding Refractive Index of Thermosetting Resin Component and Filler Component>
In this specification, the refractive index is a value for light of d-line (587.562 nm, He) at a temperature of 25 ° C. The refractive indexes of the thermosetting resin component and the filler component can be measured using various refractometers utilizing the principles such as the critical angle method, the prism coupling method, the Becke method, and the v block method. Examples of the refractometer include a spectrometer, an Abbe refractometer, a Plurich refractometer, and an ellipsometer. The refractometer is appropriately selected according to the properties of the measurement object (solid, liquid such as thin film, bulk, powder). When the object to be measured is a solid, for example, the object to be measured can be thinned by a known method and measured with an Abbe refractometer or an ellipsometer. The refractive index of the filler component such as a white pigment may be a measurement value in the bulk of a compound constituting the filler component or a measurement value in a thin film shape. When measuring powder, the Becke method is preferably used. In the present invention, the refractive index of the thermosetting resin component is determined by the V-block method (manufactured by Kalnew Optical, type KPR), and the refractive index of the filler component such as a white pigment is determined by the Becke method (method compared with the standard solution ). In the case where the filler component is a hollow particle, the inside is filled with air or an inert gas, and therefore a refractive index of 1.0 can be applied.

  If the parameter X is less than 0.30, sufficient light shielding properties cannot be obtained, and it becomes difficult to prevent light leakage. On the other hand, when the parameter X exceeds 0.7, the moldability of the thermoreflective resin composition for light reflection is increased, for example, the moldability is lowered.

  Below, what is suitable as a filler component used by this invention is illustrated.

  Preferable filler components include inorganic oxides having a refractive index of 1.6 to 3.0. Such an inorganic oxide can be suitably blended as a white pigment. Specifically, titanium oxide having a refractive index of 2.5 to 2.7, zinc oxide having a refractive index of 1.9 to 2.0, aluminum oxide having a refractive index of 1.6 to 1.8, and having a refractive index of 1.7. Examples thereof include magnesium oxide, zirconium oxide having a refractive index of 2.4, aluminum hydroxide having a refractive index of 1.6, and magnesium hydroxide having a refractive index of 1.6. The light-reflective thermosetting resin composition of the present invention preferably contains one or more of the above inorganic oxides as a filler component. Furthermore, from the viewpoint of high refractive index, it is preferable to contain titanium oxide having a refractive index of 2.5 to 2.7 among the above inorganic oxides.

In the present invention, it is preferable to blend a surface-treated titanium oxide. Examples of the surface treating agent include metal oxides such as silica, alumina, and zirconia; organic substances such as silane coupling agents, titanium coupling agents, organic acids, polyols, and silicones. As such a titanium oxide, a metal oxide, a silane coupling agent, a titanium coupling based on a fine particle titanium oxide whose content as titanium oxide (TiO ₂ ) is adjusted to 80 to 97% by mass. And titanium oxide surface-treated with an organic substance such as an agent, organic acid, polyol, and silicone. The crystal form of titanium oxide includes three crystal forms: a rutile form having a refractive index of 2.7, an anatase form having a refractive index of 2.5, and a brookite form having a refractive index of 2.6. From the viewpoint of light absorption characteristics, the rutile type is preferable.

  The surface-treated titanium oxide is titanium oxide surface-treated with one or more of silica, alumina, zirconia and organic substances, or titanium oxide surface-treated with one or more of silica, alumina and zirconia. Is preferred.

  From the viewpoint of improving the adhesion with the thermosetting resin component, the surface of the inorganic oxide may be further subjected to organic treatment using a silane coupling agent such as epoxy silane.

  The inorganic oxide having a refractive index of 1.6 to 3.0 has a central particle size of 0.1 to 0.1 from the viewpoint of highly filling the thermosetting resin component when the thermosetting resin composition for light reflection is mixed. It is preferably 20 μm, more preferably 0.1 to 10 μm, still more preferably 0.1 to 5 μm.

  In addition, the titanium oxide used for this invention does not have a restriction | limiting in particular in the acquisition method, Commercially available titanium oxide may be sufficient. Examples of commercially available titanium oxide include D-918, FTR-700 (both trade names) manufactured by Sakai Chemical Industry Co., Ltd., which are rutile-type titanium oxides, and Taipei CR-50, CR manufactured by Ishihara Sangyo Co., Ltd. -50-2, CR-60, CR-60-2, CR-63, CR-80, CR-90, CR-90-2, CR-93, CR-95, CR-97 (all trade names ), JR-403, JR-805, JR-806, JR-701, JR-800, etc. (all trade names) manufactured by Teika Corporation, TR-600, TR-700 manufactured by Fuji Titanium Industry Co., Ltd. , TR-750, TR-840, TR-900 (all are trade names), and the like.

  Here, titanium oxide is obtained by producing a natural product as a raw material by a known sulfuric acid method or hydrochloric acid method. Titanium oxide obtained from each of the sulfuric acid method and hydrochloric acid method has different refractive indices, but the titanium oxide color, that is, the reflection spectrum characteristics, is different depending on the elements mixed from the treatment liquid during production. It is done. Normally, titanium oxide obtained from the hydrochloric acid method has a high light reflectance at a wavelength of 460 to 800 nm, and titanium oxide obtained from the sulfuric acid method has a light reflectance at a wavelength of 460 to 800 nm inferior to the former. In the thermosetting resin composition for light reflection of the present invention, it is preferable to use titanium oxide produced by a hydrochloric acid method having a high light reflectance at a wavelength of 460 to 800 nm.

  The compounding amount of the inorganic oxide having a refractive index of 1.6 to 3.0 is preferably 70 to 400 parts by mass with respect to 100 parts by mass of the thermosetting resin component. If the blending amount is less than 70 parts by mass, it tends to be difficult to obtain a cured product excellent in light-shielding properties. If it exceeds 400 parts by mass, the moldability of the resin composition is lowered and it is difficult to produce a substrate. Tend to be.

  When the thermosetting resin composition for light reflection of the present invention is used for transfer molding, the amount of inorganic oxide having a refractive index of 1.6 to 3.0 is 100 parts by mass of the thermosetting resin component. It is preferable that it is 130-400 mass parts with respect to it. When the light-reflective thermosetting resin composition of the present invention is used for coating a substrate, the compounding amount of the inorganic oxide having a refractive index of 1.6 to 3.0 is 100 parts by mass of the thermosetting resin component. It is preferable that it is 130-400 mass parts with respect to.

  In the present invention, by adding titanium oxide and making the average particle size and content within the above-mentioned range, thermosetting for light reflection capable of forming a molded article having high surface reflectance and excellent light shielding properties. The functional resin composition can be realized more effectively.

  Furthermore, another preferred filler component includes hollow particles. These hollow particles can be suitably blended as a white pigment. When blending hollow particles, if the hollow particles are destroyed by heat treatment or mixing of the resin composition and the hollow portion is lost, the light shielding property is impaired. Therefore, it is preferable that the hollow particles have high heat resistance and pressure strength. Examples of the material constituting the outer shell of the hollow particles include inorganic oxides, metal oxides such as inorganic glass, silica, and alumina, and metal salts such as calcium carbonate, barium carbonate, calcium silicate, and nickel carbonate. Specific examples include sodium silicate glass, aluminum silicate glass, and borosilicate soda glass. In the case of an organic compound, examples thereof include polystyrene resins, poly (meth) acrylate resins, and crosslinked products thereof. Moreover, the outer shell may be comprised from 2 or more types of said material.

  Since light transmitted through the outer shell of the hollow particle is reflected inside the hollow particle, the hollow part is preferably filled with a medium having a low refractive index. From such a viewpoint, it is preferable that the space inside the hollow particle is filled with a mixed gas such as air having a refractive index of 1.0 to 1.1.

  In the present invention, an outer shell comprising at least one material selected from the group consisting of sodium silicate glass, aluminum silicate glass, sodium borosilicate glass, cross-linked styrene resin and cross-linked acrylic resin, and a refractive index of 1 It is preferable to use hollow particles having a void portion of 0.0 to 1.1. The gap may be a vacuum or may be filled with a medium having a refractive index of 1.0 to 1.1. Examples of the medium include air, an inert gas such as nitrogen or argon.

  The hollow particles preferably have a center particle size of 0.1 to 50 μm from the viewpoint of light reflectivity and handleability. If the center particle size is smaller than 0.1 μm, the hollow particles are likely to be dispersed unevenly, and if it is larger than 50 μm, it is difficult to form a reflector having a small thickness, and the reflectance tends to decrease. From the viewpoint of increasing the light reflectance, the center particle diameter of the hollow particles is preferably 0.1 to 30 μm.

  It is preferable that the compounding quantity of a hollow particle is 20-85 mass parts with respect to 100 mass parts of thermosetting resin components. If the blending amount is less than 20 parts by mass, it tends to be difficult to obtain a cured product excellent in light-shielding properties. If it exceeds 85 parts by mass, the moldability of the resin composition is lowered and it is difficult to produce a substrate. Tend to be.

  When the thermosetting resin composition for light reflection of the present invention is used for transfer molding, the amount of hollow particles is preferably 20 to 85 parts by mass with respect to 100 parts by mass of the thermosetting resin component. When the substrate is used for coating, it is preferably 20 to 50 parts by mass with respect to 100 parts by mass of the thermosetting resin component.

  In the present invention, the inorganic oxide having a refractive index of 1.6 to 3.0 and the hollow particles are preferably used in combination, whereby the light-reflective thermosetting property is further improved. A resin composition can be obtained.

  In the light-reflective thermosetting resin composition of the present invention, a filler component other than those described above is preferably contained from the viewpoint of improving moldability. Examples of such filler components include inorganic fillers such as silica, barium sulfate, magnesium carbonate, and barium carbonate. Of these, silica is preferable from the viewpoint of moldability. As the silica, fused spherical silica, crushed silica, and porous silica having fine pores and exhibiting oil absorption can be used.

  When blending the above-mentioned inorganic filler, a coupling agent can be further added from the viewpoint of improving the adhesion with the thermosetting resin component. Examples of the coupling agent include silane coupling agents and titanate coupling agents. Examples of the silane coupling agent include epoxy silane, amino silane, cationic silane, vinyl silane, acrylic silane, mercapto silane, and composites thereof. It is preferable that the compounding quantity of a coupling agent is 5 mass% or less with respect to the whole thermosetting resin composition from a viewpoint of improving sclerosis | hardenability. Moreover, the inorganic filler previously processed with the said coupling agent can also be mix | blended.

  The center particle diameter of the inorganic filler is within the range of 1 to 100 μm from the viewpoint of improving the packing efficiency with the white pigment such as the inorganic oxide or the hollow particles having the refractive index of 1.6 to 3.0. It is preferable that it exists in. Content of the said inorganic filler in the thermosetting resin composition for light reflections of this invention can be suitably set in the range from which X shown by said Formula (1) will be 0.30-0.70.

  Next, the thermosetting resin component will be described. The thermosetting resin composition for light reflection of the present invention can contain a thermosetting resin, a curing agent, a curing accelerator and the like as a thermosetting resin component.

  As a thermosetting resin, well-known things, such as an epoxy resin, a silicon resin, a polyurethane resin, a diallyl phthalate resin, an unsaturated polyester resin, can be used, for example. When the thermosetting resin composition for light reflection is used for optical materials or optical semiconductors, an epoxy resin or a silicon resin is desirable because there are a wide variety of resins having characteristics that are not easily deteriorated by light or heat. . As for the thermosetting resin, a difference in refractive index that greatly influences the value of the parameter X does not easily occur depending on the type, and therefore a wide range of resins can be selected.

  Hereinafter, an epoxy resin and its curing agent will be exemplified.

  As an epoxy resin, what is generally used with the epoxy resin molding material for electronic component sealing can be used. Specifically, for example, epoxidized phenol and aldehyde novolak resins such as phenol novolak type epoxy resin and orthocresol novolak type epoxy resin, diphenols such as bisphenol A, bisphenol F, bisphenol S, and alkyl-substituted bisphenol. Glycidylamine type epoxy resin obtained by reaction of polyamine such as glycidyl ether, diaminodiphenylmethane and isocyanuric acid with epichlorohydrin, linear aliphatic epoxy resin obtained by oxidizing olefin bond with peracid such as peracetic acid, and alicyclic ring Group epoxy resin. These can be used alone or in combination of two or more.

  Among these, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, diglycidyl isocyanurate, triglycidyl isocyanurate, and 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid or A dicarboxylic acid diglycidyl ester derived from 1,4-cyclohexanedicarboxylic acid is preferable because of relatively little coloring. For the same reason, diglycidyl esters of dicarboxylic acids such as phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methyltetrahydrophthalic acid, nadic acid and methylnadic acid are also suitable. Furthermore, a glycidyl ester such as a nuclear hydrogenated trimellitic acid or a nuclear hydrogenated pyromellitic acid having a cycloaliphatic structure in which an aromatic ring is hydrogenated or a silane compound is heated in the presence of an organic solvent, an organic base and water. As a suitable epoxy resin, polyorganosiloxane having an epoxy group produced by hydrolysis / condensation can be mentioned.

  The method for obtaining the epoxy resin used in the present invention is not particularly limited, and a commercially available epoxy resin may be used. As a commercially available epoxy resin, for example, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate {Celoxide 2021, Celoxide 2021A, Celoxide 2021P (above, manufactured by Daicel Chemical Industries, Ltd., trade name) ), ERL 4221, ERL 4221D, ERL 4221E (above, manufactured by Dow Chemical Japan Co., Ltd., trade name)}, bis (3,4-epoxycyclohexylmethyl) adipate (ERL4299 (made by Dow Chemical Japan Co., Ltd., trade name)), EXA7015 (Dainippon Ink Chemical Co., Ltd., trade name)}, 1-epoxyethyl-3,4-epoxycyclohexane, limonene diepoxide {Epicoat YX8000, Epicoat YX8034, Epicoat YL7170 (above, Japan Epoch Siresin Co., Ltd., trade name), Celoxide 2081, Celoxide 3000, Epolide GT301, Epolide GT401, EHPE3150 (above, Daicel Chemical Industries, Ltd., trade name)}, triglycidyl isocyanurate (TEPIC (Nissan Chemical), Product name).

  As the curing agent when an epoxy resin is blended as the thermosetting resin, a curing agent generally used in an epoxy resin molding material for sealing electronic parts can be used. Such a curing agent is not particularly limited as long as it reacts with an epoxy resin, but is preferably less colored, and more preferably colorless or light yellow.

  Examples of such a curing agent include an acid anhydride curing agent, an isocyanuric acid derivative curing agent, and a phenol curing agent. Examples of the acid anhydride curing agent include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, glutaric anhydride. Examples include acid, dimethyl glutaric anhydride, diethyl glutaric anhydride, succinic anhydride, methyl hexahydrophthalic anhydride, and methyl tetrahydrophthalic anhydride. Isocyanuric acid derivatives include 1,3,5-tris (1-carboxymethyl) isocyanurate, 1,3,5-tris (2-carboxyethyl) isocyanurate, 1,3,5-tris (3-carboxypropyl) ) Isocyanurate, 1,3-bis (2-carboxyethyl) isocyanurate. Among these curing agents, phthalic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, glutaric anhydride, dimethylglutaric anhydride, anhydrous It is preferable to use diethyl glutaric acid or 1,3,5-tris (3-carboxypropyl) isocyanurate. The above curing agents may be used alone or in combination of two or more.

  The above-mentioned curing agent preferably has a molecular weight of 100 to 400 from the viewpoint of moldability and mechanical properties of the cured product. In addition, an anhydride obtained by hydrogenating all unsaturated bonds of an aromatic ring is preferable to an acid anhydride having an aromatic ring such as trimellitic anhydride or pyromellitic anhydride. As the acid anhydride curing agent, an acid anhydride generally used as a raw material for the polyimide resin may be used.

  In the thermosetting resin composition for light reflection of this embodiment, the blending amount of the curing agent is preferably 1 to 150 parts by mass, and 50 to 120 parts by mass with respect to 100 parts by mass of the epoxy resin. Is more preferable.

  The curing agent has 0.5 to 0.9 equivalent of an active group (an acid anhydride group or a hydroxyl group) in the curing agent capable of reacting with the epoxy group with respect to 1 equivalent of the epoxy group in the epoxy resin. It is preferable to mix | blend so that it may become, and it is more preferable to mix | blend so that it may become 0.7-0.8 equivalent. If the said active group is less than 0.5 equivalent, while the cure rate of a thermosetting resin composition will become slow, the glass transition temperature of the hardened | cured material obtained will become low, and there exists a tendency for sufficient elasticity modulus to become difficult to be obtained. On the other hand, when the active group exceeds 0.9 equivalent, the strength after curing tends to decrease.

  In order to accelerate the curing reaction, the light reflecting thermosetting resin composition of the present embodiment may contain a curing accelerator. Examples of the curing accelerator include amine compounds, imidazole compounds, organic phosphorus compounds, alkali metal compounds, alkaline earth metal compounds, and quaternary ammonium salts. Among these curing accelerators, it is preferable to use an amine compound, an imidazole compound, or an organic phosphorus compound. Examples of the amine compound include 1,8-diaza-bicyclo (5,4,0) undecene-7, triethylenediamine, and tri-2,4,6-dimethylaminomethylphenol. Examples of the imidazole compound include 2-ethyl-4-methylimidazole. Furthermore, examples of the organic phosphorus compound include triphenylphosphine, tetraphenylphosphonium tetraphenylborate, tetra-n-butylphosphonium-o, o-diethylphosphorodithioate, tetra-n-butylphosphonium-tetrafluoroborate, tetra -N-butylphosphonium-tetraphenylborate. These curing accelerators may be used alone or in combination of two or more.

  The blending amount of the curing accelerator is preferably 0.01 to 8 parts by mass and more preferably 0.1 to 3 parts by mass with respect to 100 parts by mass of the epoxy resin. When the blending amount of the curing accelerator is less than 0.01 parts by mass, a sufficient curing acceleration effect may not be obtained, and when it exceeds 8 parts by mass, discoloration may be seen in the obtained cured product.

  If necessary, additives such as an antioxidant, a release agent, and an ion scavenger can be added to the thermosetting resin composition for light reflection of the present invention.

  The light reflecting thermosetting resin composition of the present invention preferably has a light reflectance of 90% or more at a wavelength of 460 to 800 nm after thermosetting. If the light reflectance is less than 90%, there is a tendency that it cannot sufficiently contribute to the improvement of the luminance of the optical semiconductor device. Further, in terms of improving the luminance of the optical semiconductor device, the light reflectivity at a wavelength of 460 nm after curing is preferably 90% or more, and more preferably 95% or more.

  The thermosetting resin composition for light reflection of the present invention comprises a substrate material for mounting an optical semiconductor element, an electrical insulating material, an optical semiconductor sealing material, an adhesive material, a coating material, and a transfer that require high light reflectivity and heat resistance. It is useful in various applications such as an epoxy resin molding material for molding. Hereinafter, a suitable example of a thermosetting resin composition for light reflection when used as an epoxy resin molding material for transfer molding will be described.

  The thermosetting resin composition for light reflection of the present invention has a Shore D hardness within 30 seconds immediately after molding, that is, a hardness during heating, when the molding temperature at the time of transfer molding is 180 ° C. and the conditions are 90 seconds. Is preferably 80 to 95. When the hot hardness is less than 80, curing of the molded product is hindered, and when the molded product is released from the mold, the molded product may be broken or broken. When such a molded body breaks down, the yield for manufacturing the substrate for mounting an optical semiconductor element decreases, and the optical semiconductor device cannot be manufactured.

  The light-reflective thermosetting resin composition of the present invention may have a burr length of 5 mm or less when transfer molded under conditions of a molding temperature of 180 ° C., a molding pressure of 6.9 MPa, and a molding time of 60 to 120 seconds. preferable. If the length of the burr exceeds 5 mm, when manufacturing the optical semiconductor element mounting substrate, resin contamination occurs in the opening (recessed portion) that becomes the optical semiconductor element mounting region, and this is an obstacle to mounting the optical semiconductor element. In addition, there is a possibility that it becomes an obstacle when electrically connecting the optical semiconductor element and the metal wiring. From the viewpoint of workability at the time of manufacturing a semiconductor device, the burr length is more preferably 3 mm or less, and further preferably 1 mm or less.

  The thermosetting resin composition for light reflection of the present invention is selected from the above-mentioned various components, which are selected and blended in such a manner that X represented by the above formula (1) is 0.30 to 0.70. It can be obtained by uniformly dispersing and mixing, and means and conditions thereof are not particularly limited. As a general method for producing a thermosetting resin composition for light reflection, a method of kneading each component with a kneader, a roll, an extruder, a raking machine, a stirring mixer that combines rotation and revolution, etc. Can do. When kneading each component, it is preferable to carry out in a molten state from the viewpoint of improving dispersibility.

  The kneading conditions may be appropriately determined depending on the type and blending amount of each component. For example, kneading is preferably performed at 15 to 100 ° C. for 5 to 40 minutes, and kneading at 20 to 100 ° C. for 10 to 30 minutes is more preferable. preferable. When the kneading temperature is less than 15 ° C., it becomes difficult to knead each component and the dispersibility tends to decrease. When the kneading temperature exceeds 100 ° C., the high molecular weight of the thermosetting resin proceeds, and thermosetting during kneading. The resin may be cured. Further, if the kneading time is less than 5 minutes, a sufficient dispersion effect may not be obtained. If the kneading time exceeds 40 minutes, the thermosetting resin may increase in molecular weight, and the thermosetting resin may be cured.

(Optical semiconductor device mounting substrate)
The substrate for mounting an optical semiconductor element according to the present invention has a recess composed of a bottom surface and a wall surface, and the bottom surface of the recess is an optical semiconductor element mounting portion (optical semiconductor element mounting region). At least a part of the peripheral side surface is made of a cured product of the thermosetting resin composition for light reflection of the present invention. FIG. 1 is a perspective view showing an embodiment of a substrate for mounting an optical semiconductor element of the present invention. The substrate for mounting an optical semiconductor element 110 includes a metal wiring 105 (first connection terminal and second connection terminal) on which Ni / Ag plating 104 is formed, and a metal wiring 105 (first connection terminal and second connection terminal). Insulating resin molded body 103 ′ provided between the terminals) and the reflector 103, and formed of the metal wiring 105 formed with the Ni / Ag plating 104 and the insulating resin molded body 103 ′ and the reflector 103. A recess 200 is provided. The bottom surface of the recess 200 is composed of the metal wiring 105 on which the Ni / Ag plating 104 is formed and the insulating resin molded body 103 ′, and the wall surface of the recess 200 is composed of the reflector 103. And reflector 103 and insulating resin molding 103 'are the moldings which consist of a hardened | cured material of the thermosetting resin composition for light reflections of the said invention.

  Although the manufacturing method of the board | substrate for optical semiconductor element mounting of this invention is not specifically limited, For example, it can manufacture by transfer molding using the thermosetting resin composition for light reflections of this invention. FIG. 2 is a schematic view showing an embodiment of a process for producing an optical semiconductor element mounting substrate of the present invention. The optical semiconductor element mounting substrate is formed by, for example, forming a metal wiring 105 from a metal foil by a known method such as punching or etching, and applying Ni / Ag plating 104 by electroplating (FIG. 2A), A step of placing the metal wiring 105 in a mold 151 having a predetermined shape, injecting the thermosetting resin composition for light reflection of the present invention from a resin injection port 150 of the mold 151, and performing transfer molding under predetermined conditions (FIG. 2 (b)) and a step of removing the mold 151 (FIG. 2C). In this manner, the optical semiconductor element mounting region (concave portion) 200 is formed on the optical semiconductor element mounting substrate. The optical semiconductor element mounting region (concave portion) 200 is surrounded by the reflector 103 made of a cured product of the light-reflective thermosetting resin composition. . The bottom surface of the recess is made of a metal wiring 105 serving as a first connection terminal and a metal wiring 105 serving as a second connection terminal, and a cured product of a light-reflective thermosetting resin composition provided therebetween. Insulating resin molded body 103 ′. In addition, as the conditions for the transfer molding, the mold temperature is 170 to 200 ° C., more preferably 170 to 190 ° C., the molding pressure is 0.5 to 20 MPa, more preferably 2 to 8 MPa, and the after cure temperature is 60 to 120 seconds. 1 to 3 hours are preferable at 120 ° C to 180 ° C.

(Optical semiconductor device)
An optical semiconductor device of the present invention includes the optical semiconductor element mounting substrate and an optical semiconductor element mounted on the optical semiconductor element mounting substrate. As a more specific example, the optical semiconductor element mounting substrate, the optical semiconductor element provided in the recess of the optical semiconductor element mounting substrate, and the phosphor-containing envelope that fills the recess and seals the optical semiconductor element An optical semiconductor device provided with a stop resin part is mentioned.

  FIG. 3 is a perspective view showing an embodiment in which the optical semiconductor element 100 is mounted on the optical semiconductor element mounting substrate 110 of the present invention. As shown in FIG. 3, the optical semiconductor element 100 is mounted at a predetermined position in the optical semiconductor element mounting region (concave portion) 200 of the optical semiconductor element mounting substrate 110 and is electrically connected by the metal wiring 105 and the bonding wire 102. The 4 and 5 are schematic cross-sectional views showing an embodiment of the optical semiconductor device of the present invention. As shown in FIGS. 4 and 5, the optical semiconductor device includes an optical semiconductor element mounting substrate 110, an optical semiconductor element 100 provided at a predetermined position in the concave portion 200 of the optical semiconductor element mounting substrate 110, and the concave portion 200. A sealing resin portion made of a transparent sealing resin 101 including a phosphor 106 that fills and seals the optical semiconductor element, and the optical semiconductor element 100 and the metal wiring 105 on which the Ni / Ag plating 104 is formed; Are electrically connected by bonding wires 102 or solder bumps 107.

  FIG. 6 is also a schematic cross-sectional view showing an embodiment of the optical semiconductor device of the present invention. In the optical semiconductor device shown in FIG. 6, the LED element 300 is disposed via a die bonding material 306 at a predetermined position on the lead 304 on which the reflector 303 is formed, and the LED element 300 and the lead 304 are electrically connected by the bonding wire 301. The LED body element 300 is sealed with a transparent sealing resin 302 that is connected and includes a phosphor 305.

  As mentioned above, although preferred embodiment of this invention was described, this invention is not restrict | limited to this. For example, the thermosetting resin composition for light reflection of the present invention can be used as a light reflection coating agent. As this embodiment, a copper-clad laminate, an optical semiconductor element mounting substrate, and an optical semiconductor element will be described.

  The copper clad laminate according to the present invention comprises a light reflecting resin layer formed using the above-described thermosetting resin composition for light reflection of the present invention, and a copper foil laminated on the white resin layer. It is to be prepared.

  FIG. 7 is a schematic cross-sectional view showing a preferred embodiment of a copper clad laminate according to the present invention. As shown in FIG. 7, a copper clad laminate 400 includes a base material 401, a white resin layer 402 laminated on the base material 401, and a copper foil 403 laminated on the white resin layer 402. I have. Here, the white resin layer 402 is formed using the above-described thermosetting resin composition for light reflection of the present invention.

  As the base material 401, a base material used for a copper-clad laminate can be used without particular limitation, and examples thereof include a resin laminate such as an epoxy resin laminate and an optical semiconductor mounting substrate.

  For example, the copper-clad laminate 400 is formed by applying the resin composition of the present invention to the surface of the base material 401, stacking the copper foil 403, and curing by heating and pressing to form the white resin layer 402 made of the resin composition. Can be produced.

  As a method for applying the resin composition of the present invention to the substrate 401, for example, a printing method, a die coating method, a curtain coating method, a spray coating method, a roll coating method, or the like can be used. At this time, the light-reflective thermosetting resin composition of the present invention can contain a solvent so as to facilitate application.

  The heating and pressing conditions are not particularly limited. For example, it is preferable to perform heating and pressing under conditions of 130 to 180 ° C., 0.5 to 4 MPa, and 30 to 600 minutes.

  Using the copper-clad laminate according to the present invention, a printed wiring board for an optical member such as for LED mounting can be produced. Note that the copper clad laminate 400 shown in FIG. 7 is obtained by laminating a white resin layer 402 and a copper foil 403 on one side of a base material 401, but the copper clad laminate according to the present invention is the base material 401. The white resin layer 402 and the copper foil 403 may be laminated on both sides. 7 is obtained by laminating a white resin layer 402 and a copper foil 403 on a base material 401. The copper clad laminate according to the present invention uses the base material 401. Instead, it may be composed of only the white resin layer 402 and the copper foil 403. In this case, the white resin layer 402 plays a role as a base material. In this case, for example, a white resin layer 402 can be obtained by impregnating a glass cloth or the like with the resin composition of the present invention and curing.

  FIG. 8 is a schematic cross-sectional view showing an example of an optical semiconductor device manufactured using the copper-clad laminate according to the present invention. As shown in FIG. 8, the optical semiconductor device 500 is a surface-mount type light emitting diode including an optical semiconductor element 410 and a transparent sealing resin 404 provided so as to seal the optical semiconductor element 410. is there. In the optical semiconductor device 500, the semiconductor element 410 is bonded to the copper foil 403 through the adhesive layer 408, and is electrically connected to the copper foil 403 by a wire 409.

  Furthermore, as another embodiment of the substrate for mounting an optical semiconductor element according to the present invention, using the above-described thermosetting resin composition for light reflection of the present invention, a plurality of conductor members (connection terminals) on the base material are used. An optical semiconductor element mounting substrate including a white resin layer formed on the substrate. In another embodiment of the optical semiconductor device according to the present invention, the optical semiconductor element is mounted on the optical semiconductor element mounting substrate.

  FIG. 9 is a schematic cross-sectional view showing a preferred embodiment of the optical semiconductor device according to the present invention. As shown in FIG. 9, the optical semiconductor device 600 is formed between a substrate 601, a plurality of conductor members 602 formed on the surface of the substrate 601, and a plurality of conductor members (connection terminals) 602. The optical semiconductor element 610 is mounted on an optical semiconductor element mounting substrate including the white resin layer 603 made of the thermoreflective resin composition for light reflection of the present invention, and the optical semiconductor element 610 is sealed. Thus, a surface-mount type light emitting diode provided with a transparent sealing resin 604 is provided. In the optical semiconductor device 600, the optical semiconductor element 610 is bonded to the conductor member 602 through the adhesive layer 608, and is electrically connected to the conductor member 602 through a wire 609.

  As the substrate 601, a substrate used for an optical semiconductor element mounting substrate can be used without particular limitation, and examples thereof include a resin laminate such as an epoxy resin laminate.

  The conductor member 602 functions as a connection terminal, and can be formed by a known method such as a method of photoetching a copper foil.

  For the substrate for mounting an optical semiconductor element, the thermosetting resin composition for light reflection of the present invention is applied between the plurality of conductor members 602 on the substrate 601 and cured by heating to form the thermosetting resin composition for light reflection. It can be produced by forming a white resin layer 603 made of

  As a method for applying the light-reflective thermosetting resin composition of the present invention to the substrate 601, for example, a coating method such as a printing method, a die coating method, a curtain coating method, a spray coating method, or a roll coating method can be used. . At this time, the light-reflective thermosetting resin composition of the present invention can contain a solvent so as to facilitate application.

  Although it does not specifically limit as heating conditions at the time of heat-hardening the coating film of the thermosetting resin composition for light reflections, For example, it is preferable to heat on 130-180 degreeC and the conditions for 30 to 600 minutes.

  Thereafter, the resin component adhering excessively to the surface of the conductor member 602 is removed by buffing or the like to expose the circuit formed of the conductor member 602, thereby forming an optical semiconductor element mounting substrate.

  In order to ensure the adhesion between the white resin layer 603 and the conductor member 602, it is also preferable to subject the conductor member 602 to a roughening treatment such as oxidation-reduction treatment or CZ treatment (manufactured by MEC Co., Ltd.).

  Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. However, the present invention is not limited to these examples.

<Preparation of thermosetting resin composition for light reflection>
(Examples 3, 6 to 10 and Comparative Examples 1 to 6)
According to the formulation ratio shown in Table 1 (parts by mass) for example 3,6,7, according to the formulation ratio shown in Table 2 (parts by weight) for Comparative Examples 1-6, it was blended each component sufficiently by a mixer After kneading and dispersing, a kneaded product was obtained by melt-kneading with a mixing roll at 40 ° C. for 15 minutes. Next, the obtained kneaded material was cooled and pulverized to prepare a thermosetting resin composition for light reflection.

  About Examples 8-10, according to the mixture ratio (mass part) shown in Table 1, each component is mix | blended and it is for light reflection by mixing for 3 minutes at the rotation speed of 2000 rpm using a rotation revolving type stirring mixer. Each thermosetting resin composition was prepared.

  The details of * 1 to 11 in Tables 1 and 2 are as follows. * Specific gravity and refractive index of 1 to 11 are shown in Tables 1 and 2. In addition, the specific gravity and refractive index about a thermosetting resin component show the specific gravity and refractive index of the mixture of an epoxy resin, a hardening | curing agent, and a curing catalyst.

* 1: Trisglycidyl isocyanurate (epoxy equivalent 100, manufactured by Nissan Chemical Co., Ltd., trade name: TEPIC-S)
* 2: Methylhexahydrophthalic anhydride (manufactured by Hitachi Chemical Co., Ltd.)
* 3: Hexahydrophthalic anhydride (manufactured by Wako Pure Chemical Industries, Ltd.)
* 4: Tetra-n-butylphosphonium-o, o-diethyl phosphorodithioate (manufactured by Nippon Chemical Industry Co., Ltd., trade name: PX-4ET)
* 5: Trimethoxyepoxysilane (manufactured by Toray Dow Corning, trade name: A-187)
* 6: Fused spherical silica (manufactured by Denki Kagaku Kogyo Co., Ltd., trade name: FB-950)
* 7: Fused spherical silica (trade name: FB-301, manufactured by Denki Kagaku Kogyo Co., Ltd.)
* 8: Fused spherical silica (manufactured by Admatechs, trade name: SO-25R)
* 9: Titanium oxide (manufactured by Sakai Chemical Industry Co., Ltd., trade name: FTR-700)
* 10: Aluminum oxide (manufactured by Admatechs, trade name: AO-802)
* 11: Outer shell material Borosilicate glass hollow particles (manufactured by Sumitomo 3M, trade name: S60-HS)

<Evaluation of thermosetting resin composition for light reflection>
The light reflecting thermosetting resin compositions obtained in Examples 3, 6 to 10 and Comparative Examples 1 to 6 were cured on a hot plate at 180 ° C. so that the thickness of the cured product was 0.1 mm ± 0.05 mm. After pressure molding, post-cure was performed at 150 ° C. for 2 hours to prepare test pieces having a thickness of 0.1 mm ± 0.05 mm, respectively.

  About the test piece obtained above, according to the method shown below, the light reflectance and leakage light were measured. Moreover, the processing characteristics of the thermosetting resin composition for light reflection were also evaluated. The results are shown in Tables 1 and 2.

(Measurement of light reflectance)
The optical reflectance (light reflectance) of the test piece at a wavelength of 460 nm was measured using an integrating sphere type spectrophotometer V-750 type (trade name, manufactured by JASCO Corporation).

(Measurement of leakage light)
For the measurement of leakage light, a surface-mount type optical semiconductor device in which a light emitting element having a wavelength peak at a wavelength of 460 nm is mounted as a light source and a reflection frame is provided so as to surround the light emitting element is used. A CCD camera was installed so as to face this surface-mount type optical semiconductor device, and the light distribution from the light emitting elements was photographed so that the highest luminance region could be digitized. At this time, when a current of 100 mA was input to the surface-mount optical semiconductor device, the luminance was 250,000 cd / m ² .

The test piece obtained above was placed so as to block the CCD camera at a distance of 1 mm from the light emitting element of the surface-mount type optical semiconductor device. Next, a current of 100 mA is input to the surface-mount type optical semiconductor device, the light distribution of light passing through the test piece is photographed, the highest luminance region is digitized, and the leakage light luminance (cd / m ² ) Asked. Moreover, the ratio (%) of the leakage light luminance with respect to the luminance when the test piece was not installed was calculated as the leakage light rate (ratio to light source).

(Processing characteristics)
The processing characteristics were evaluated by the following method A: Processing can be performed by the following known transfer molding.
B: It can be processed by the following known printing method.
C: It is difficult to mold any of the methods A and B.

  The transfer molding of A uses a transfer molding machine (product name “ATOM-FX” manufactured by Mtex Matsumura Co., Ltd.), with a mold temperature of 180 ° C., a curing time of 90 seconds, a molding pressure of 6.9 MPa, and a mold clamping pressure of 20 t. The method of molding with was applied. As the mold, a batch molding mold was used, which was arranged in a matrix of 4 vertical x 4 horizontal and the number of cavities was set to 16. The cavity size was 3 mm square per piece and the thickness was 1 mm. As the substrate, a copper lead frame having a silver plating thickness of 0.25 mm was used.

  In the printing method of B, the compounded material (thermosetting resin composition for light reflection) is cast on a substrate in which an electrode part for mounting an optical semiconductor element is protected with a heat-resistant masking tape, and a glass squeegee is used. After forming a film by operating a squeegee at a speed of 5 mm / s so as to obtain a uniform thickness of 0.1 mm, a thermosetting property for light reflection under conditions of a curing temperature of 150 ° C. and a curing time of 4 hours. A method of removing the masking tape for protecting the electrode applied in advance by curing the resin composition was applied.

  Said C means the case where it could not be processed by any of the above methods A and B.

As shown in Tables 1 and 2, the thermosetting resin compositions for light reflection in Examples 3 and 6 to 10 in which the parameter X is in the range of 0.3 to 0.7 are as thin as 0.1 mm. Even when the cured product was formed, it was confirmed that the light reflectance was high and the leakage light was small. On the other hand, the light-reflective thermosetting resin compositions obtained in Comparative Examples 1 to 6 generated significant leakage light. In particular, it can be seen that the effect of suppressing light leakage cannot be obtained in Comparative Example 6 using only hollow particles . Light reflecting thermosetting resin composition of Example 3 in combination with a medium air particles titanium oxide, it is understood that more excellent cured light shielding property is formed. On the other hand, when the white pigment is added so that the parameter X exceeds 0.7, it is difficult to perform the processing by either transfer molding or printing.

  According to the thermosetting resin composition for light reflection of the present invention, it is possible to improve the light extraction efficiency in an optical semiconductor element mounting substrate or an optical semiconductor device.

  DESCRIPTION OF SYMBOLS 100 ... Optical semiconductor element, 101 ... Transparent sealing resin, 102 ... Bonding wire, 103 ... Hardened | cured material (reflector) of the thermosetting resin composition for light reflection, 103 '... Curing of the thermosetting resin composition for light reflection Article (insulating resin molding) 104 ... Ni / Ag plating, 105 ... metal wiring, 106 ... phosphor, 107 ... solder bump, 110 ... substrate for mounting optical semiconductor element, 150 ... resin injection port, 151 ... mold, DESCRIPTION OF SYMBOLS 200 ... Optical semiconductor element mounting area, 300 ... LED element, 301 ... Wire bond, 302 ... Transparent sealing resin, 303 ... Reflector, 304 ... Lead, 305 ... Phosphor, 306 ... Die bond material, 400 ... Copper-clad laminate, 401 ... base material, 402 ... white resin layer, 403 ... copper foil, 404 ... sealing resin, 408 ... adhesive layer, 409 ... wire, 410 ... optical semiconductor element, 500, 6 0 ... optical semiconductor device, 601 ... substrate, 602 ... conductor member, 603 ... white resin layer, 604 ... sealing resin, 608 ... adhesive layer, 609 ... wire, 610 ... optical semiconductor element.

Claims (15)

A transfer molding Therefore a thermosetting resin composition to obtain a cured product,
Containing a thermosetting resin component and a filler component;
A thermosetting resin composition for light reflection of an LED device, wherein X represented by the following formula (1) is 0.30 to 0.70.

[In formula (1), n represents the number of filler components, and φ _i represents the light of the i-th filler component when n filler components are arbitrarily ordered from 1 to n. It indicates the volume percentage in the entire reflecting thermosetting resin, n _i is the refractive index of the i-th filler _component, n rejin is the refractive index of the entire thermosetting resin component. ]   The thermosetting resin composition for light reflection according to claim 1, wherein when a cured product having a thickness of 0.1 mm is formed, the light reflectance at a wavelength of 460 nm of the cured product is 90% or more.   The filler component is at least selected from the group consisting of titanium oxide, zinc oxide, aluminum oxide, magnesium oxide, zirconium oxide, antimony oxide, aluminum hydroxide and magnesium hydroxide having a refractive index of 1.6 to 3.0. The thermosetting resin composition for light reflection according to claim 1 or 2, comprising one kind of inorganic oxide.   The thermosetting resin composition for light reflection according to claim 3, wherein the center particle diameter of the inorganic oxide is in the range of 0.1 to 20 µm.   The thermosetting resin composition for light reflection according to claim 3 or 4, wherein the content of the inorganic oxide is 70 to 400 parts by mass with respect to 100 parts by mass of the thermosetting resin component.   The light-reflective thermosetting resin composition according to any one of claims 3 to 5, wherein the content of the inorganic oxide is 130 to 400 parts by mass with respect to 100 parts by mass of the thermosetting resin component. object.   An outer shell in which the filler component comprises at least one material selected from the group consisting of sodium silicate glass, aluminum silicate glass, sodium borosilicate glass, cross-linked styrene resin, and cross-linked acrylic resin; and a refractive index The thermosetting resin composition for light reflection as described in any one of Claims 1-6 containing the hollow particle which has the space | gap part which is 1.0-1.1.   The thermosetting resin composition for light reflection according to claim 7, wherein the hollow particles have a center particle diameter in the range of 0.1 to 50 μm.   The light-reflective thermosetting resin composition according to claim 7 or 8, wherein the content of the hollow particles is 20 to 85 parts by mass with respect to 100 parts by mass of the thermosetting resin component.   An LED element mounting substrate comprising a cured product obtained by transfer molding the light-reflective thermosetting resin composition according to any one of claims 1 to 9. It has a recess composed of a bottom surface and a wall surface, and the bottom surface of the recess is a mounting portion of the LED element,
The substrate for LED element mounting which at least one part of the said wall surface of the said recessed part becomes from the hardened | cured material obtained by transfer molding the thermosetting resin composition for light reflections as described in any one of Claims 1-9. . A board, and a first connection terminal and a second connection terminal provided on the board,
A cured product obtained by transfer molding the thermosetting resin composition for light reflection according to any one of claims 1 to 9, between the first connection terminal and the second connection terminal. A substrate for mounting an LED element.   An optical semiconductor device comprising: the LED element mounting substrate according to claim 10; and an LED element mounted on the LED element mounting substrate. A method for manufacturing an LED element mounting substrate having a recess composed of a bottom surface and a wall surface,
Forming at least a part of the wall surface of the recess by transfer molding the thermosetting resin composition for light reflection according to any one of claims 1 to 9,
The manufacturing method of the board | substrate for LED element mounting provided with. A method for suppressing light leakage of a substrate for LED element mounting comprising a molded body made of a cured product obtained by transfer molding a thermosetting resin composition for light reflection,
The light leakage suppression method using the thermosetting resin composition for light reflections as described in any one of Claims 1-9 as said thermosetting resin composition for light reflections.

Images