CN102447017B - LED (Light Emitting Diode) waterproof jig and LED cutting method - Google Patents
LED (Light Emitting Diode) waterproof jig and LED cutting method Download PDFInfo
- Publication number
- CN102447017B CN102447017B CN201010505638.2A CN201010505638A CN102447017B CN 102447017 B CN102447017 B CN 102447017B CN 201010505638 A CN201010505638 A CN 201010505638A CN 102447017 B CN102447017 B CN 102447017B
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- substrate
- reflector
- waterproof
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The invention relates to an LED (Light Emitting Diode) waterproof jig which is used for carrying out waterproof protection on a plurality of LEDs on a substrate of an LED module when the LED module is cut. The LED waterproof jig comprises a surface on which a plurality of first grooves are arranged, wherein the plurality of first grooves extend inwards the LED waterproof jig so as to respectively contain the plurality of LEDs in a waterproof way. The invention further relates to an LED cutting method.
Description
Technical field
The present invention relates to a kind of light-emitting diode, relate in particular to the cutting method of a kind of light-emitting diode waterproof tool and a kind of light-emitting diode.
Background technology
At present, light-emitting diode (Light Emitting Diode, LED) is low in energy consumption because having, the life-span is long, volume is little and brightness is high etc., and characteristic has been widely applied to a lot of fields.
Usually, light-emitting diode forms by encapsulating complete light emitting diode module cutting, and generally adopts machine cuts method.But in machine cuts process, between incisory blade and sheet material, generation rubs and heats up.Therefore, in cutting process, generally need to use liquid, as water, to help the cooling such as blade and sheet material, in order to avoid light emitting diode module is destroyed by high temperature in cutting process.But in cutting process, the liquid of cooling use easily infiltrates in packaging body, thereby affect the performance parameter of light-emitting diode.
Summary of the invention
In view of this, be necessary to provide a kind of waterproof light-emitting diode waterproof tool and a kind of cutting method of light-emitting diode.
A kind of light-emitting diode waterproof tool, it,, in the time cutting light emitting diode module, carries out waterproofing protection to the multiple light-emitting diodes on the substrate of light emitting diode module.This waterproof tool has a surface, and on this surface, has and multiplely accommodate the first groove of described multiple light-emitting diodes to what extend in this waterproof tool with waterproof respectively.
A kind of cutting method of light-emitting diode, it comprises: a light emitting diode module is provided, it comprises a substrate, and be encapsulated in the multiple light-emitting diodes on this substrate, each light-emitting diode includes the light-emitting diode chip for backlight unit being arranged on this substrate, around the reflector of this light-emitting diode chip for backlight unit, and be arranged on the packaging body of this light-emitting diode chip for backlight unit exiting surface, each reflector has a lateral wall; A waterproof tool is provided, and this waterproof tool has a first surface, and on this first surface, has multiple the first grooves to extending in this waterproof tool, and this first groove has an inner surface; This waterproof tool is set in this light emitting diode module, so that the lateral wall close contact of the inner surface of this waterproof tool and this reflector; Cut this substrate to form multiple package structure for LED.
The cutting method of described light-emitting diode waterproof tool and a kind of light-emitting diode has all adopted waterproof tool, the first groove that this waterproof tool comprises and this light emitting diode module comprise the lateral wall close contact of reflector, therefore, in cutting process, can effective anti-sealing etc. the liquid reflector and the packaging body that see through this light emitting diode module enter this light-emitting diode chip for backlight unit.
Brief description of the drawings
Fig. 1 is the light-emitting diode waterproof tool of the embodiment of the present invention and the section decomposing schematic representation of light emitting diode module.
Fig. 2 is the generalized section that the light-emitting diode waterproof tool of Fig. 1 matches with light emitting diode module.
Fig. 3 is the flow chart of the cutting method of a kind of light-emitting diode of the present invention.
Main element symbol description
Waterproof tool 100
Body 10
Upper surface 101
Lower surface 102
Madial wall 13
Bottom surface 14
Support portion 15
The second groove 16
Light emitting diode module 200
Substrate 20
Light-emitting diode 21
First surface 215
Second surface 216
Reflector 22
Lateral wall 225
Light-emitting diode chip for backlight unit 23
Packaging body 24
Light-emitting face 245
Embodiment
Below in conjunction with accompanying drawing, the embodiment of the present invention is described in further detail.
Refer to Fig. 1 and Fig. 2, the embodiment of the present invention provides a kind of light-emitting diode waterproof tool 100, and this waterproof tool 100, in the time cutting light emitting diode module 200, carries out waterproofing protection to light emitting diode module 200.
This light emitting diode module 200 comprises substrate 20, and interval is formed on the multiple light-emitting diodes 21 on this substrate 20.Each light-emitting diode 21 comprises the multiple reflectors 22 that are formed on this substrate 20, is arranged on this substrate 20 and accommodates respectively the light-emitting diode chip for backlight unit 23 in this reflector 22, and being arranged on the packaging body 24 of these light-emitting diode chip for backlight unit 23 exiting surfaces.
This substrate 20 is tabular, and it has a first surface 215 and second surface corresponding thereto 216.On this substrate 20, there are multiple through holes.Each light-emitting diode 21 includes an electrode pair 217.One end of this electrode pair 217 is formed on the first surface 215 of this substrate 20, and its other end passes respectively the plurality of through hole and extends to the second surface 216 of this substrate 20.This light-emitting diode chip for backlight unit 23 is arranged on the electrode that this electrode pair 217 comprises, and is formed and be electrically connected with this electrode pair 217 respectively by routing.
This reflector 22 is formed on the first surface 215 of this substrate 20.These reflector 22 jacketed electrodes 217 are positioned at the end of this first surface 215.In the present embodiment, this reflector 22 has lateral wall 225 and the bottom surface away from first surface 215 of an annular.In the present embodiment, the lateral wall 225 of this reflector 22 is perpendicular to the first surface 215 of substrate 20; In other embodiments, the lateral wall 225 of this reflector 22 can also tilt towards packaging body 24 from first surface 215, embeds for waterproof tool 100.
On the exiting surface of this light-emitting diode chip for backlight unit 23, be arranged on packaging body 24.In the present embodiment, this packaging body 24 is filled whole reflector 22.This packaging body 24 is the potting resin doped with fluorescent material.In the present embodiment, this packaging body 24 has a light-emitting face 245, and this light-emitting face 245 is plane.In the present embodiment, this light-emitting face 245 is concordant with the bottom surface of reflector 22.Certainly, this packaging body 24 can be also other encapsulating materials, and this light-emitting face 245 also can be arranged to other shapes as required, as convex surface, and concave curved surface etc.
In the present embodiment, this waterproof tool 100 is for matching with this light emitting diode module 200.This waterproof tool 100 comprises a body 10, and this body 10 has a upper surface 101 and lower surface corresponding thereto 102.On this upper surface 101, be formed with multiple multiple the first grooves 12 to these body 10 interior extensions.The bottom surface 14 that this first groove 12 includes a madial wall 13 and is connected with this madial wall 13.In the present embodiment, the rectangular setting of this first groove 12, this madial wall 13 is mutually vertical with this bottom surface 14.
Between described the first adjacent groove 12, be formed with the support portion 15 of a projection.On each support portion 15, be formed with the second groove 16 extending to this support portion 15.In an embodiment, the height of this support portion 15 is less than the bottom surface of this reflector 22 to the distance of the first surface 215 of this substrate 20, and the width of support portion 15 is less than or equal to the spacing between adjacent light-emitting diode 21.This second groove 16 is trapezoidal setting, and its openings of sizes reduces to the direction of lower surface 102 gradually along the upper surface 101 of this body 10.
In the time using this waterproof tool 100, first this waterproof tool 100 is matched with this light emitting diode module 200.In the present embodiment, each first groove 12 matches with a light-emitting diode 21, and madial wall 13 and the bottom surface 14 of this first groove 12 closely cooperate with lateral wall 225 and the light-emitting face 245 of this light-emitting diode 21 respectively, so that the support portion 15 of this waterproof tool 100 is between adjacent light-emitting diode 21.Because the height of this support portion 15 is less than the bottom surface of reflector 22 described in this to the distance of the first surface 215 of this substrate 20, after this support portion 15 coordinates with this light emitting diode module 200, the first surface 215 of the bottom of support portion 15 and substrate 20 separately, to avoid cutter when cutting to destroy this waterproof tool 100.
In the time of this light emitting diode module 200 of cutting, because this light emitting diode module 200 is used in combination with waterproof tool 100, therefore, this light emitting diode module 200 can be placed in liquid, can reduce cutting temperature by this liquid, prevent that high temperature from damaging this light-emitting diode 21.Because lateral wall 225 and the light-emitting face 245 of this light-emitting diode 21 closely cooperate with bottom surface 14 with the madial wall 13 of this first groove 12 respectively; therefore; this waterproof tool 100 can prevent that the reflector 22 that liquid sees through this light emitting diode module 200 from entering this light-emitting diode chip for backlight unit 23 with packaging body 24 effectively, thereby protects this light-emitting diode chip for backlight unit 23.Further, the support portion 15 of this waterproof tool 100 and the second groove 16 disposed thereon, be used in cutting process, for carrying cut substrate 20, and liquid, prevent that the lateral wall 225 that liquid sees through reflector 22 from entering this light-emitting diode chip for backlight unit 23.
Shown in Figure 3, a kind of cutting method of light-emitting diode, it comprises the following steps:
Step 1 a: substrate is provided, and substrate has a first surface.Please also refer to Fig. 1 and Fig. 2, particularly, this substrate 20 comprises a first surface 215 and second surface corresponding thereto 216.
Step 2: form multiple reflectors on the first surface of substrate, each reflector has a lateral wall, and this substrate has the exposure of the bottom that is exposed to each reflector.This reflector 22 is formed on the first surface 215 of this substrate 20.This reflector 22 has lateral wall 225 and the bottom surface away from first surface 215 of an annular.In the present embodiment, the lateral wall 225 of this reflector 22 is perpendicular to the first surface 215 of substrate 20; In other embodiments, the lateral wall 225 of this reflector 22 can also tilt towards packaging body 24 from first surface 215, embeds for waterproof tool 100.Preferably, first on this substrate 20, form multiple electrode pairs 217.One end of each reflector 22 coated electrode pairs 217.The other end of this electrode pair 217 is passed this substrate 20 and is extended to the second surface 216 of this substrate 20.
Step 3: multiple light-emitting diode chip for backlight unit are separately positioned on to the exposure of this substrate, form a packaging body to form light-emitting diode at the exiting surface of each light-emitting diode chip for backlight unit.In the present embodiment, the plurality of light-emitting diode chip for backlight unit 23 is separately positioned in the exposure of this substrate 20, and is positioned on one of them electrode of electrode pair 217, and is electrically connected with this electrode pair 217 by gold thread.On the exiting surface of this light-emitting diode chip for backlight unit 23, be arranged on packaging body 24.In the present embodiment, this packaging body 24 has a light-emitting face 245, and this light-emitting face 245 is plane, and this light-emitting face 245 is concordant with the bottom surface of reflector 22.
Step 4: a waterproof tool is provided, and this waterproof tool has a first surface, and on this first surface, there are multiple the first grooves to extending in this waterproof tool, this first groove has an inner surface.This waterproof tool 100 comprises a body 10, and this body 10 has a upper surface 101 and lower surface corresponding thereto 102.On this upper surface 101, be formed with multiple multiple the first grooves 12 to these body 10 interior extensions.The bottom surface 14 that this first groove 12 includes a madial wall 13 and is connected with this madial wall 13.In the present embodiment, this first groove 12 is rectangle, and this madial wall 13 is orthogonal plane with this bottom surface 14.
Between the first adjacent groove 12, be formed with the support portion 15 of a projection.On each support portion 15, be formed with the second groove 16 extending to this support portion 15.In an embodiment, the height of this support portion 15 is less than the bottom surface of described reflector 22 to the distance of the first surface 215 of this substrate 20, and the width of support portion 15 is less than or equal to the spacing between adjacent light-emitting diode 21.The openings of sizes of this second groove 16 reduces to the direction of lower surface 102 gradually along the upper surface 101 of this body 10.
Step 5: this waterproof tool is set in this light emitting diode module, so that the lateral wall close contact of the inner surface of this waterproof tool and this reflector.Particularly, each first groove 12 matches with a light-emitting diode 21, and madial wall 13 and the bottom surface 14 of this first groove 12 closely cooperate with lateral wall 225 and the light-emitting face 245 of this light-emitting diode 21 respectively, so that the support portion 15 of this waterproof tool 100 is between adjacent light-emitting diode 21.
Step 6: cut this substrate to form multiple package structure for LED.
In the time of this light emitting diode module 200 of cutting, because this light emitting diode module 200 is used in combination with waterproof tool 100, therefore, this light emitting diode module 200 can be placed in liquid, can reduce cutting temperature by this liquid, prevent that high temperature from damaging this light-emitting diode 21.And; because lateral wall 225 and the light-emitting face 245 of this light-emitting diode 21 closely cooperate with bottom surface 14 with the madial wall 13 of this first groove 12 respectively; therefore; this waterproof tool 100 can prevent that the reflector 22 that liquid sees through this light emitting diode module 200 from entering this light-emitting diode chip for backlight unit 23 with packaging body 24 effectively, thereby protects this light-emitting diode chip for backlight unit 23.
Be understandable that, those skilled in the art also can do other and change in spirit of the present invention, as long as it does not depart from technique effect of the present invention and all can.The variation that these do according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (9)
1. a light-emitting diode waterproof tool; it is in the time cutting light emitting diode module; multiple light-emitting diodes on the substrate of light emitting diode module are carried out to waterproofing protection; it is characterized in that; this waterproof tool has a surface; and on this surface, have and multiplely accommodate the first groove of described multiple light-emitting diodes to what extend in this waterproof tool with waterproof respectively, be formed with the support portion of a projection between the first adjacent groove of this waterproof tool, the end face of this support portion is provided with the second groove.
2. light-emitting diode waterproof tool as claimed in claim 1, is characterized in that, each first groove comprise one with the madial wall of the lateral wall close contact of light-emitting diode and the bottom surface being connected with madial wall.
3. light-emitting diode waterproof tool as claimed in claim 2, is characterized in that, the bottom surface of each the first groove is plane.
4. a cutting method for light-emitting diode, it comprises:
A light emitting diode module is provided, it comprises a substrate, and be encapsulated in the multiple light-emitting diodes on this substrate, each light-emitting diode includes the light-emitting diode chip for backlight unit being arranged on this substrate, around the reflector of this light-emitting diode chip for backlight unit, and being arranged on the packaging body of this light-emitting diode chip for backlight unit exiting surface, each reflector has a lateral wall;
A waterproof tool is provided, and this waterproof tool has a first surface, and on this first surface, has multiple the first grooves to extending in this waterproof tool, and this first groove has an inner surface;
This waterproof tool is set in this light emitting diode module, so that the lateral wall close contact of the inner surface of this waterproof tool and this reflector; And
Cut this substrate to form multiple package structure for LED.
5. the cutting method of light-emitting diode as claimed in claim 4, is characterized in that, the bottom surface that the inner surface of each the first groove comprises a madial wall and is connected with madial wall, the lateral wall close contact of this madial wall and this reflector.
6. the cutting method of light-emitting diode as claimed in claim 5, is characterized in that, the bottom surface of each the first groove and this packaging body close contact.
7. the cutting method of light-emitting diode as claimed in claim 5, it is characterized in that, between the first adjacent groove of this waterproof tool, be formed with the support portion of a projection, this substrate be first surface for carrying the surface of this light-emitting diode chip for backlight unit, this reflector has the bottom surface of a first surface away from this substrate, and the height of this support portion is less than the bottom surface of described reflector to the distance of the first surface of this substrate.
8. the cutting method of light-emitting diode as claimed in claim 7, is characterized in that, the end face of this support portion is provided with the second groove.
9. the cutting method of light-emitting diode as claimed in claim 5, is characterized in that, the formation method of this light emitting diode module comprises: a substrate is provided, and substrate has a first surface; On the first surface of substrate, form multiple reflectors, each reflector has a lateral wall, and this substrate has the exposure of the bottom that is exposed to each reflector; Multiple light-emitting diode chip for backlight unit are separately positioned on to the exposure of this substrate, form a packaging body to form light-emitting diode at the exiting surface of each light-emitting diode chip for backlight unit, each packaging body has a light-emitting face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010505638.2A CN102447017B (en) | 2010-10-13 | 2010-10-13 | LED (Light Emitting Diode) waterproof jig and LED cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010505638.2A CN102447017B (en) | 2010-10-13 | 2010-10-13 | LED (Light Emitting Diode) waterproof jig and LED cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102447017A CN102447017A (en) | 2012-05-09 |
| CN102447017B true CN102447017B (en) | 2014-10-15 |
Family
ID=46009324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010505638.2A Expired - Fee Related CN102447017B (en) | 2010-10-13 | 2010-10-13 | LED (Light Emitting Diode) waterproof jig and LED cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102447017B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6798279B2 (en) * | 2016-11-28 | 2020-12-09 | 豊田合成株式会社 | Manufacturing method of light emitting device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5445559A (en) * | 1993-06-24 | 1995-08-29 | Texas Instruments Incorporated | Wafer-like processing after sawing DMDs |
| US5824177A (en) * | 1995-07-13 | 1998-10-20 | Nippondenso Co., Ltd. | Method for manufacturing a semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6688300B2 (en) * | 1999-04-08 | 2004-02-10 | Intercon Technologies, Inc. | Techniques for dicing substrates during integrated circuit fabrication |
-
2010
- 2010-10-13 CN CN201010505638.2A patent/CN102447017B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5445559A (en) * | 1993-06-24 | 1995-08-29 | Texas Instruments Incorporated | Wafer-like processing after sawing DMDs |
| US5824177A (en) * | 1995-07-13 | 1998-10-20 | Nippondenso Co., Ltd. | Method for manufacturing a semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102447017A (en) | 2012-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2617880C2 (en) | Moulded lens forming led-module of integrated circuit scale and manufacturing method thereof | |
| KR100616684B1 (en) | High power led package and fabrication method thereof | |
| EP2246913B1 (en) | Light emitting diode package and lighting system including the same | |
| JP5274479B2 (en) | Multi-stage heat transfer slug and light emitting diode package employing the same | |
| CN105990507B (en) | side-illuminated light emitting diode structure and manufacturing method thereof | |
| US20140231858A1 (en) | LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount | |
| TW201316391A (en) | Method of cutting light emitting element packages employing ceramic substrate, and method of cutting multilayered object | |
| EP3271952A1 (en) | Light emitting diode chip and a method for the manufacture of a light emitting diode chip | |
| JP2007059781A (en) | Submount-attached light emitting element and light emitting device | |
| CN102856464A (en) | Packaging structure and packaging method of light emitting diode | |
| CN102447017B (en) | LED (Light Emitting Diode) waterproof jig and LED cutting method | |
| KR101467959B1 (en) | Led metal substrate | |
| JP2008124195A (en) | Light-emitting device, and its manufacturing method | |
| US20210184087A1 (en) | Packaged ultraviolet light-emitting device and production method thereof | |
| TW201530837A (en) | Flexible light emitting semiconductor device with large area conduit | |
| CN102456802A (en) | Manufacturing method of packaging structures of light emitting diodes | |
| CN102104012B (en) | Manufacturing method of light-emitting diode | |
| JP2010103149A (en) | Light emitting member, light emitting device, electronic device, mechanical device, method of manufacturing the light emitting member, and method of manufacturing the light emitting device | |
| JP5509304B2 (en) | Light emitting diode package and manufacturing method thereof | |
| KR102111142B1 (en) | Light emitting device and method of making the same | |
| KR101041438B1 (en) | Light emitting diode package including double-cavity and its manufacturing method | |
| TWI546993B (en) | Light emitting diode lead frame structure | |
| KR20150076122A (en) | Light emitting diode strip lamp | |
| TWI425660B (en) | Led waterproof fixture and led cutting method | |
| JP5643700B2 (en) | Wiring board processing method and manufacturing method thereof, light emitting device and manufacturing method thereof, and electrical apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141015 Termination date: 20151013 |
|
| EXPY | Termination of patent right or utility model |