CN102446778A - 提高引线键合性能的方法 - Google Patents
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Abstract
本发明提供一种提高引线键合能力的方法,包括:在实施引线键合之前对载板依次进行以下步骤:A.对所述载板进行清洗;B.对所述载板的表面进行等离子体蚀刻。通过上述步骤,可以将载板表面的有机物、粉尘、氧化物以及硫化物去除,使载板金属层表面干净清洁,从而提高引线与载板的键合性能。
Description
技术领域
本发明属于半导体集成电路封装领域,涉及利用引线电连接芯片与载板的封装过程,具体涉及提高引线与载板金属层的键合性能的方法。
背景技术
在封装集成电路之前,载板需要依次经过以下各工序:铣板→水洗→棕化表面处理→水洗→E/T开短路测试→外观缺陷检查,之后再将引线3(如高纯度金丝)键合到芯片4的芯片焊盘5和载板金属层2,以使芯片4和载板1电连接。如图1所示,为芯片与载板电连接后的示意图。目前常采用压焊方式进行引线键合,这种引线键合方式虽然操作简单方便,但引线与载板金属层之间的键合性能容易受载板金属层表面的污染物的影响。
载板金属层的污染物主要来自于封装之前生产载板的各道工序,例如:在上述铣板工序时,必然产生的基材粉末、金属粉末以及胶渣等粉尘,虽然铣板后的水洗工序可以将大部分粉尘清洗掉,但是仍会不可避免的残留一部分粉尘,这些粉尘对引线与载板金属层的键合能力影响很大。在进行棕化表面处理工序时,棕氧化药水在棕氧化铜面的同时又会污染镀金层,而镀金层的污染又会降低引线与载板金属层的键合能力。在E/T开短路测试和外观缺陷检查完毕后,进行封装之前,载板要在空气中滞留很长时间,在这个时间段内,载板表面的镀金层在氧气、水汽或含硫的环境中很容易被氧化和/或硫化,生成的氧化物和/或硫化物将降低引线与载板金属层的键合能力。除此之外,外界环境净化程度的不足常使载板表面造成粉尘污染,手指接触又会造成有机物污染,焊盘镀金工序所采用的镀液药水的残留液会导致载板表面污染,退膜后会有残胶存在。
上述这些污染物在生产过程中很难避免,为此技术人员在引线键合之前,利用去离子水对载板进行清洗,以期望将引线键合前的各道工艺产生的污染物去除。然而,经去离子水清洗后,载板金属层仍会残留部分污染物,这使得引线与载板金属层之间的键合性能不能达到理想的效果。
发明内容
本发明所要解决的技术问题是针对现有技术中存在的上述缺陷,提供一种提高引线键合性能的方法,在实施引线键合前对载板表面进行处理,以将载板金属层表面的各种污染物去除,从而提高引线与载板金属层的键合性能。
解决本发明技术问题所采用的技术方案是该提高引线键合性能的方法,包括:在实施引线键合之前对载板依次进行以下步骤:
A.对所述载板进行清洗;
B.对所述载板的表面进行等离子体蚀刻。
优选地,步骤A的所述清洗步骤包括:
(10)利用去离子水消洗所述载板;
(20)利用除油剂清洗所述载板,所述除油剂优选为碱性除油剂。
优选地,步骤(10)中所述去离子水流经所述载板的表面的流速为0.5~1.5m/min;和/或,清洗时间为1.0~5.0min。
优选地,步骤(20)中所述除油剂的温度为25~35℃;和/或所述除油剂的流速为0.5~1.5m/min;和/或除油时间为1.0~2.0min。
优选地,步骤A的所述清洗步骤还包括:(30)采用超声波水洗方式清洗所述载板,优选地采用去离子水。
优选地,在步骤B之前,还包括烘干步骤,所述载板优选在70~90℃温度下烘干2~3分钟。
优选地,所述烘干步骤是在惰性气氛中或真空环境中进行。
优选地,步骤B中所述等离子体蚀刻是在氧气和氩气或者氧气和氮气的气氛中进行。
优选地,氧气和氩气的体积比为1∶8.5~1∶9.5。
优选地,所述等离子体蚀刻时的真空度为220~260mTorr,和/或蚀刻时间为4~6分钟。
本发明具有以下有益效果:
本发明提供的提高引线键合能力的方法,该方法是在实施引线键合之前,通过清洗步骤将载板表面的有机污染物、粉尘以及胶渣等污染物去除,然后利用等离子体蚀刻将载板表面的氧化物、硫化物以及残留的有机污染物去除,以使载板金属层表面洁净,从而使引线与载板良好地结合,进而提高引线与载板的键合性能。
附图说明
图1为引线与芯片、载板金属层键合后的结构图;
图2为本发明提供的实施引线键合前对载板进行的处理工艺流程图。
图中:1-载板 2-载板金属层 3-引线 4-芯片焊盘 5-球焊接头
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案,下面结合附图对本发明提供的提高引线键合性能的方法进行详细描述。
本发明提供的提高引线键合性能的方法,包括:在实施引线键合之前对载板依次进行以下步骤:
A.对所述载板进行清洗;
B.对所述载板的表面进行等离子体蚀刻。
优选地,步骤A的所述清洗步骤包括:
(10)利用去离子水清洗所述载板;
(20)利用除油剂清洗所述载板,所述除油剂优选为碱性除油剂。
优选地,步骤(10)中所述去离子水流经所述载板的表面的流速为0.5~1.5m/min;和/或,清洗时间为1.0~5.0min。
优选地,步骤(20)中所述除油剂的温度为25~35℃;和/或所述除油剂的流速为0.5~1.5m/min;和/或除油时间为1.0~2.0min。
优选地,步骤A的所述清洗步骤还包括:(30)采用超声波水洗方式清洗所述载板,优选地采用去离子水。
优选地,在步骤B之前,还包括烘干步骤,所述载板优选在70~90℃温度下烘干2~3分钟。
优选地,所述烘干步骤是在惰性气氛中或真空环境中进行。
优选地,步骤B中所述等离子体蚀刻是在氧气和氩气或者氧气和氮气的气氛中进行。
优选地,氧气和氩气的体积比为1∶8.5~1∶9.5。
优选地,所述等离子体蚀刻时的真空度为220~260mTorr,和/或蚀刻时间为4~6分钟。
下面结合图2对实施引线键合前的载板进行的处理工艺进行详细说明。下述实施例中,载板经过棕氧化处理并电镀镍金层,在经过E/T开短路测试以及外观缺陷检查合格后,载板依次经过以下的处理工艺。
实施例1
(11)水洗
用水冲洗载板表面,以去除载板表面的粉尘以及部分胶渣等颗粒状物质。本实施例优选利用去离子水(DI水)冲洗载板表面,冲洗时间为1.0~5.0min,较佳地为1.5~3.5min,最佳地为2.0~3.0min,和/或,冲洗时载板在水槽中的移动速度(或称水流的速度)为0.5~1.5m/min,优选0.8~1.2m/min。
(12)除油
用碱性除油剂(例如MS100 cleaner ALK)清洗载板,以将载板表面的大部分诸如手指印等有机污染物去除。除油清洗时,除油剂的温度为25~35℃,优选20~32℃;和/或,载板的过线速率(即碱性除油剂的流速)为0.5~1.5m/min,优选0.8~1.2m/min;和/或,除油时间为1.0~2.0min,优选1.2~1.8min。
(13)超声波水洗
超声波水洗载板,以将载板表面残留的有机污染物、粉尘以及残留的碱性除油剂清洗掉,同时将棕化表面处理时残留的药水离子元素清洗掉。超声波水洗可以选用普通水清洗,但优选采用去离子水清洗,以避免因水质不洁净而造成新的离子污染。超声波清洗的时间为2.5~3.5min,优选2.8~3.2min。
(14)烘干
经过上述的水洗、除油以及超声波水洗步骤后,需要将载板及时烘干,以避免载板表面氧化。载板在温度为70~90℃下烘干,较佳地为75~85℃,更佳地为78~83℃;和/或,载板优选在氮气或氩气等惰性气氛中或在真空环境中烘干,以避免在烘干过程中载板表面可能发生氧化或硫化现象;和/或,载板的烘干时间为2~3min,优选2.3~2.8min。
(15)等离子体蚀刻
将烘干后的载板放入等离子体蚀刻机蚀刻载板的表面。在蚀刻过程中,等离子体中的粒子撞击载板表面残留的胶渣、油污以及氧化物和/或硫化物,使它们成为细小颗粒,然后通过抽真空系统排出等离子体蚀刻机。与此同时,真空室内的氩气与胶渣和油污等有机污染物发生化学反应并气化,之后再由抽真空系统排出等离子体蚀刻机。通过上述物理碰撞以及化学反应,可以将载板表面的氧化物和/或硫化物以及残留的胶渣、油污去除。
等离子体蚀刻采用的工艺参数为:真空度220~260mTorr(毫托),优选230~250mTorr;和/或温度60~70℃;和/或通入的氧气和氩气的体积(流量)比O2∶Ar=1∶8.5~1∶9.5,优选O2∶Ar-1∶8.8~1∶9.2;功率3.5~4KW;和/或蚀刻时间4~6min,优选4.5~5.5min。
在生产过程中,经过步骤(11)至步骤(15),可以将载板表面的有机污染物、粉尘、胶渣以及氧化物和/或硫化物尽可能地去除,从而使载板表面以及载板金属层表面干净清洁。在洁净的载板金属层上实施引线键合,可以提高引线与载板金属层之间的结合力,从而提高引线与载板金属层之间的键合性能。
本领域技术人员应理解,在图2中所示的步骤(11)至步骤(15)中,可执行其中的所有步骤;不过根据需要,也可仅执行其中的所需步骤,即不必执行所有步骤。而且,上述步骤可根据需要执行多次。
可以理解的是,以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式,然而本发明并不局限于此。对于本领域内的普通技术人员而言,在不脱离本发明的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也视为本发明的保护范围。
Claims (10)
1.一种提高引线键合性能的方法,包括:在实施引线键合之前对载板依次进行以下步骤:
A.对所述载板进行清洗;
B.对所述载板的表面进行等离子体蚀刻。
2.根据权利要求1所述的方法,其特征在于,步骤A中的所述清洗步骤包括:
(10)利用去离子水清洗所述载板;
(20)利用除油剂清洗所述载板,所述除油剂优选为碱性除油剂。
3.根据权利要求2所述的方法,其特征在于,步骤(10)中所述去离子水流经所述载板的表面的流速为0.5~1.5m/min;和/或,清洗时间为1.0~5.0min。
4.根据权利要求2所述的方法,其特征在于,步骤(20)中所述除油剂的温度为25~35℃;和/或所述除油剂的流速为0.5~1.5m/min;和/或除油时间为1.0~2.0min。
5.根据前述权利要求中任一项所述的方法,其特征在于,步骤A的所述清洗步骤包括:
(30)采用超声波水洗方式清洗所述载板,优选地采用去离子水。
6.根据前述权利要求中任一项所述的方法,其特征在于在步骤B之前,还包括烘干步骤,所述载板优选在70~90℃温度下烘干2~3分钟。
7.根据权利要求6所述的方法,其特征在于所述烘干步骤是在惰性气氛中或真空环境中进行。
8.根据前述权利要求中任一项所述的方法,其特征在于,步骤B中所述等离子体蚀刻是在氧气和氩气或者氧气和氮气的气氛中进行。
9.根据权利要求8所述的方法,其特征在于,氧气和氩气的体积比为1∶8.5~1∶9.5。
10.根据前述权利要求中任一项所述的方法,其特征在于,所述等离子体蚀刻时的真空度为220~260mTorr,和/或蚀刻时间为4~6分钟。
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