CN102438429B - Cooling device of electronic equipment and electronic equipment - Google Patents
Cooling device of electronic equipment and electronic equipment Download PDFInfo
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- CN102438429B CN102438429B CN201110264250.2A CN201110264250A CN102438429B CN 102438429 B CN102438429 B CN 102438429B CN 201110264250 A CN201110264250 A CN 201110264250A CN 102438429 B CN102438429 B CN 102438429B
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- radiator
- passage
- air
- centrifugal fan
- heat abstractor
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Abstract
The invention provides the cooling device of electronic equipment and electronic equipment. The cooling device is high in efficiency. A centrifugal fan (101) is configured in an air chamber (110), and a radiator (107) is arranged in the vicinity of the centrifugal fan. A plurality of radiating fins are combined to heat absorption surfaces (107a and 107b) so as to form a plurality of air flow paths. A slit-shaped passage (107) is extended along the direction vertical to the plurality of radiating fins. The air pressurized through the centrifugal fan is discharged through exhaust ports (16) between the plurality of radiating fins and the passage.
Description
Technical field
The present invention relates to the high efficiency heat abstractor used in the electronic device, in more detail, relate to the heat abstractor of the rising of the housing temperature that can suppress electronic equipment.
Background technology
The portable electric appts such as notebook personal computer (hereinafter referred to as notebook PC), the performance of the electronic device such as processor or video chip improves in recent years, or the packing density of cabinet rises, and causes caloric value constantly to increase.The electronic device held in the inside of cabinet needs to make the temperature in work be no more than permissible value to maintain function.And, because notebook PC is with hand-held or be placed on above-knee operation, therefore need the temperature suppressing cabinet to rise.
For this purpose, carry the heat abstractor be made up of radiator, radiating tube and radiator fan etc. in the inside of notebook PC, by radiator, heat exchange is carried out to the air be taken into from outside and then discharge forcibly, carry out from inside thus dispelling the heat or cooling.Combine the maximum processor of caloric value in the electronic device via radiating tube on a heat sink, therefore temperature rises.In addition, radiator is configured near cabinet, therefore makes the temperature of cabinet increase.
Patent documentation 1 discloses the cooling system being applicable to notebook PC.The cooling system of the document, arranges air entry and metallic plate (plate) near radiator, suppresses the temperature of cabinet to rise with the extraneous air sucked from air entry from metal-plate radiating.Patent documentation 2 discloses a kind of electronic device cooling apparatus, and it keeps the tube-axial fan cooled that air is guided to exhaust outlet by the inner inclination at electronic equipment, prevents the localized heating of the keyboard near CPU.
Patent documentation 3 discloses and makes air flowing smooth and easy, improves the radiator of heat dispersion.The radiating appliance recorded in the document is standby: can be arranged on the heated sheet on thermal source, the radiating part be arranged on heated sheet, the cooling fan that arranges to blow cooling-air to radiating part.Radiating part possesses the heat-conducting plate uprightly arranged with predetermined space on heated sheet and the fin configured in vertical direction between each heat-conducting plate, defines the suction and discharge space of cooling-air between the lower end and heated sheet of fin.
In order to improve the heat-sinking capability of heat abstractor, generally making the air quantity of radiator fan (unit: CFM) increase the thermal resistance reducing radiator, or the area of dissipation of radiator is increased.The air quantity of radiator fan can increase by making the diameter of blade or make rotary speed increase and increase, but, when this method is applied to notebook PC, in size, power consumption and noise etc., there is restriction.
The heat-sinking capability of radiator improves by increasing the area of dissipation of the fin contacted with air, but in size, there is restriction when adopting in notebook PC.When designing cooling system, the thermal resistance value of calculate radiator is required (DEG C/W) based on the ascending temperature (DEG C) of the caloric value (W) according to electronic device and radiator, the area of dissipation of calculating radiator.Forcing in the forced heat radiation mode of blow air by radiator fan to radiator, more improve the flow velocity by the air between fin, thermal resistance more reduces, and heat-sinking capability is higher.
Therefore, by improving the flow velocity of air, for identical heat-sinking capability, the area of dissipation of radiator can be reduced further, for identical area of dissipation, the temperature of radiator can be reduced further.In the thinking of cooling system in the past, in the scope can held in cabinet, determine the structure of radiator, in order to make the wind speed of radiator increase, increasing the diameter of the blade of radiator fan or increasing speed.The cooling system carried in current notebook PC, needs the increase can tackling caloric value while requiring lightness, slimming and miniaturization.And, also require to reduce noise and power consumption.Realize the cooling system with so multiple requirement by existing method, reach the limit.
In most notebook PC, adopt in radiator fan and be suitable for being contained in the centrifugal fan in slim cabinet.Centrifugal fan, from the direction of principal axis air-breathing of blade, is vented to square with the axis direction.In centrifugal fan, air flow right angle orientation bends sometimes, compared with tube-axial fan, near the discharge side of blade, large eddy current occurs.If this eddy current is rectification, then thinks and flow velocity between the fin that can hinder and should obtain by suppressing eddy current, the thermal resistance of radiator can be reduced.
The method of patent documentation 1 is effective for the temperature rising suppressing cabinet, but the heat dispersion of radiator cannot be made to improve.In addition, air entry is arranged on the precalculated position near radiator by the method for patent documentation 1, therefore, sometimes needs to spend time to adjust overall air balance.In addition, form the stream of air between metallic plate and the bottom surface of cabinet, therefore, cabinet is correspondingly thickening.
Patent documentation 1: Japanese Unexamined Patent Publication 2008-112225 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2000-227822 publication
Patent documentation 3: Japanese Unexamined Patent Publication 2007-42724 publication
Summary of the invention
Therefore, the object of the present invention is to provide the heat abstractor being suitable for lightness, slimming and miniaturization.The present invention also aims to provide the heat abstractor that heat-sinking capability is improved.The present invention also aims to the heat abstractor that the minimizing can seeking noise and power consumption is provided.The present invention also aims to provide the heat abstractor that the temperature of cabinet can be suppressed to rise.The present invention also aims to provide the electronic equipment that have employed this heat abstractor.
At the air chambers contain centrifugal fan of heat abstractor, the radiator in its circumferential arrangement.Radiating appliance is standby for forming multiple fin that many air flow circuits are combined with the first side wall and the second sidewall.The passage of slit-shaped is defined in the mode extended on the direction vertical relative to the face of multiple fin.Air after being pressurizeed by centrifugal fan is discharged with passage via between multiple fin.Passage suppresses the eddy current of the radiator porch caused by centrifugal fan, passes through smooth air, air circulation is improved in air flow circuit.
Passage can be formed by the first side wall and the case forming air chamber.Passage can also be formed as a part for radiator.Can in conjunction with radiating tube on the second sidewall.The height of the interval of fin and passage can be made roughly equal.In addition, the height of passage can be more than 3% of the height of radiator and be less than 13%.
By the invention provides the heat abstractor being suitable for lightness, slimming and miniaturization.And, by the invention provides the heat abstractor making heat-sinking capability improve.And, by the invention provides the heat abstractor of the minimizing can seeking noise and power consumption.And, by the invention provides the heat abstractor that the temperature that can suppress cabinet rises.And, by the invention provides the electronic equipment that have employed this heat abstractor.
Accompanying drawing explanation
Fig. 1 is the stereogram observing the notebook PC of embodiments of the present invention from front and rear.
Fig. 2 is the vertical view of the heat abstractor of present embodiment.
Fig. 3 is the partial perspective view of the heat abstractor of present embodiment.
Fig. 4 be schematically show the heat abstractor of Fig. 2 (A) is overturn after be arranged in system chassis state under the figure in the cross section observed from A-A direction.
Fig. 5 is the figure of the heat-sinking capability that heat abstractor is described.
Fig. 6 is the figure of the delay situation of the air stream illustrated in air chamber.
Fig. 7 is the figure representing the example defining passage in radiator.
Symbol description
10 notebook PC
15 system chassiss
100 heat abstractors
101 radiator fans
105,107,301,351 radiators
109 fan covers
110 air chambers
111 channel covers
125,127,129,313,315,367,369 radiating tubes
151 cases
309,361,363 fin
Embodiment
Fig. 1 (A) and Fig. 1 (B) is the stereogram observing the notebook PC of embodiments of the present invention from front and rear.Notebook PC10 is in the state that will the display case 11 of LCD device (LCD) 12 kept to open from system chassis 15.A large amount of electronic device such as central operation processing unit (CPU), Graphics Processing Unit (GPU), main storage and hard disk drive (HDD) is accommodated in the inside of system chassis 15.These electronic devices in the course of the work temperature rise and become pyrotoxin, make the temperature of system chassis 15 inside increase.
On the surface of system chassis 15, be configured with keyboard 20 with surrounding by palmrest 21 and keyboard frame 14.In addition, CD drive (ODD) 13 is installed in the side of system chassis 15, and defines exhaust outlet 16,17 and air entry 18,19.Contain forced air-cooled heat abstractor in the inside of system chassis 15, it is forced to suck extraneous air from air entry 18,19 and is vented from exhaust outlet 16,17, makes inner heat shed thus.
Fig. 2 is the vertical view of the forced air-cooled heat abstractor 100 of present embodiment.Fig. 3 is the partial perspective view of the heat abstractor 100 of present embodiment.Fig. 2 (A) represents the state of having installed fan cover 109 and channel cover 111 on case 151, Fig. 2 (B) represents the state of fan cover 109 and channel cover 111 of the partial demolition above case 151, Fig. 3 (A) is corresponding with Fig. 2 (A), and Fig. 3 (B) has represented from the state decomposition of Fig. 3 (A) situation of channel cover 111.
Fan cover 109 and channel cover 111, when being installed on case 151, becoming a part for case 151 and form air chamber.Centrifugal radiator fan 101 and radiator 105,107 are installed in case 151.When heat abstractor 100 is arranged in system chassis 15, the air outlet slit of radiator 107 and exhaust outlet 16 aligned in position of system chassis 15, the air outlet slit of radiator 105 and exhaust outlet 17 aligned in position.
Radiator fan 101 is aspirated through air entry 18,19 from outside leaked-in air from the fan cover 109 of upper-lower position and the air entry of case 151 being arranged on rotating shaft 103, and the radial direction to blade is discharged.In one example in which, the diameter of the blade of radiator fan 101 is 50mm, and rotary speed is 3300rpm.The air of discharging from radiator fan 101 enters radiator 105,107, is discharged into the outside of system chassis 15 by exhaust outlet 16,17.
Radiating tube 125 and heated parts 123 and radiator 107 thermal coupling, the heat-absorbent surface thermal coupling of radiating tube 127 and heated parts 121 and radiator 107, the heat-absorbent surface thermal coupling of radiating tube 129 and heated parts 121 and radiator 105.Radiating tube 129 also with case 113 thermal coupling.When heat abstractor 100 is arranged in system chassis 15, by heated parts 123 in position 163 and GPU and south bridge thermo-contact, by heated parts 121 in position 161 and CPU thermo-contact.
Case 151, radiator 105,107 are formed by the metal material that the pyroconductivity such as aluminium or copper is high respectively.Radiator 105,107 increases to improve rate of heat exchange to make the contact area of metal material and air, is defined many air flow circuits of slit-shaped in inside by multiple fin.Fin is formed by thin flat plate, and configured in parallel, to form the air flow circuit of preset space length, is combined with the sidewall that short transverse, the i.e. above-below direction at radiator 105,107 is arranged.
In one example, the spacing of fin is 1mm.In addition, about radiator 105,107, the direction of the rotating shaft 103 of radiator fan 101 is called short transverse, the direction of the plane orthogonal with fin is called Width, the direction of being flowed in air flow circuit by air is called depth direction.When radiator fan rotates, the heat that heated parts 123 obtains is released by radiating tube 125 and radiator 107, and the heat that heated parts 121 obtains is released by radiating tube 127,129 and radiator 105,107.In addition, the rear air chamber flowing into heat abstractor 100 is contacted with the electronic device of cabinet inside from air entry 18,19 leaked-in air, therefore, heat abstractor 100 not only can discharge the heat obtained from heated parts 121,123, can also discharge the heat of other electronic device being contained in system chassis 15 inside.
Fig. 4 (A) be schematically show the heat abstractor 100 of Fig. 2 (A) is overturn after be arranged in system chassis 15 state under the figure in the cross section observed from A-A direction.Fig. 4 (B) represents the cross section of same position when being arranged in identical systems cabinet 15 by existing heat abstractor 50.Fig. 4 (A) is only from the difference of Fig. 4 (B): the height of radiator 107 is different; In Fig. 4 (A), be provided with channel cover 111, between a heating surface 107a of radiator 107, define passage 157.
In Fig. 4 (A), (B), between keyboard frame 14 and the bottom surface 22 of system chassis 15, be configured with heat abstractor 100.Case 151 is formed air entry 153, fan cover 109 is formed air entry 155.In Fig. 4 (A), at the internal configurations radiator fan 101 of the air chamber 110 formed by case 151, fan cover 109 and channel cover 111, in Fig. 4 (B), at the internal configurations radiator fan 101 of the air chamber 110 formed by case 151 and fan cover 109.In exhaust outlet 16 side of air chamber 110, configuration radiator 107 in Fig. 4 (A), configuration radiator 51 in Fig. 4 (B).
In conjunction with radiating tube 125,127 on another heating surface 107b of radiator 107.The sidewall with the radiator 107 of heating surface 107a, 107b is combined with fin.Existing radiator 51 is highly L1, and the radiator 107 in present embodiment is highly L2 (L2 < L1).Channel cover 111 is configured in the scope corresponding with heating surface 107a.Radiator 107 and radiator 51 are identical structure except height.
When the height of passage 157 is set to L3, there is the relation of L1=L2+L3.That is, heat abstractor 100 is identical with the height of the case of heat abstractor 50.Cross over the entirety in the Width of radiator 107 or the direction with the plane orthogonal of fin, define the passage 157 of slit-shaped with phase co-altitude.In addition, in order to enhance mechanical strength, can from heating surface 107a support passage lid 111 partly.The height L1 of existing radiator 51 is 17mm in one example.The height L2 of the radiator 107 of present embodiment is 16mm in one example, and now, the height of passage 157 becomes 1mm.In addition, the example being only provided with passage 157 for radiator 107 is illustrated in the drawings, but, also with channel cover, similarly passage can be set for radiator 105.
In heat abstractor 100, when radiator fan 101 rotates, flow into the air of air chamber 110 from air entry 153,155 by being discharged to outside system chassis 15 after radiator 107 and exhaust outlet 16.In heat abstractor 100, portion of air is discharged by passage 157, but in heat abstractor 50, is discharged by means of only radiator 51.
The heat-sinking capability of heat abstractor 100 and heat abstractor 50 are compared the figure illustrated by Fig. 5 by experiment.In an experiment, about heat abstractor 100,50, the rotary speed of radiator fan 101 is fixed as 3300rpm, provides identical heat load, the height L2 changing radiator 107 measures the flow velocity of radiator 107,51 and the temperature at each position.The transverse axis of Fig. 5 represents changes into this level Four of 2.0mm, 1.5mm, 1.0mm, 0.5mm by the height L3 of passage 157.And, about radiator 51, represent the height L3 of passage 157 with 0mm.
Line 201 represents the temperature of heating surface 107b, 51b.Line 203 represents the temperature of the position B of bottom surface 22, and line 205 represents the temperature of the position C of keyboard frame 14.In addition, line 207,209 represents the wind speed of the outlet of radiator 107,51.Line 207 represents the wind speed of the short transverse of radiator 107,51 and the center of Width, and line 209 represents the wind speed for the position of the vicinity of passage 157 in position centered by Width, short transverse.
As shown in Figure 5, the temperature of heating surface 107b is lower than heating surface 51b (line 201), and the temperature of the position B of bottom surface 22 bends down (line 203) than the situation of having carried heat abstractor 50 when having carried heat abstractor 100.The temperature of the position C of keyboard frame 14 is lower than the situation end having carried heat abstractor 100 when having carried heat abstractor 50 (line 205).But the temperature of this degree rises and can not become substantive issue, in addition, can solve by heat abstractor 100 entirety is moved configuration downwards.About wind speed, at the middle position of the short transverse of radiator 107,51, both do not have difference (line 207), and the position near passage 157 shows significant difference (line 209).In heat abstractor 100, the temperature of heating surface 107b reduces compared with heat abstractor 50, therefore, can reduce the temperature of CPU compared with heat abstractor 50, and can reduce the temperature of bottom surface 22.
As shown in Figure 5, when the height L3 of passage 157 is 1.0mm, heat-sinking capability is the highest.This height 1.0mm is equivalent to the spacing of fin.In addition we know, in the gamut from 0.5m to 2.0mm, heat abstractor 100 is higher than the heat-sinking capability of heat abstractor 50.When the height L3 of passage 157 is 0.5mm, the height L2 of radiator 107 becomes 16.5mm, and the height of passage 157 is 3% relative to the ratio of the height of radiator 107.In addition, when the height L3 of passage 157 is 2.0mm, the height L2 of radiator becomes 15mm, and the height of passage 157 is 13% relative to the ratio of the height of radiator 107.
That is, heat abstractor 100 passes through the passage of the height of the scope of 3% to 13% of the height forming radiator, and heat-sinking capability can be made to improve than mutually level heat abstractor 50.In addition, when heat abstractor 100 is set to identical heat-sinking capability with heat abstractor 50, the rotary speed of radiator fan 101 can be reduced, therefore can seek the minimizing of noise and power consumption.And, when being set to identical heat-sinking capability, the height of heat abstractor 100 can be reduced further to seek miniaturization.
Although heat abstractor 100 is relative to the height reduction of heat abstractor 50 radiator, the reason that heat-sinking capability improves is as follows.Known when dynamic pressure in air chamber 110 when rotating making radiator fan 101 carries out sunykatuib analysis, in heat abstractor 50, produce larger dynamic pressure at the position D of Fig. 6, but also produce than other position large dynamic pressure less of position D at position E.And known, in the air flow circuit corresponding with position D, E of radiator 107,105, flow velocity does not add near the degree corresponding with high dynamic pressure.
Its reason is, in centrifugal radiator fan, in the discharge side of blade, larger eddy current occurs, at the entrance of the air flow circuit that fin is formed, air forms eddy current and hinders smooth air to pass through.On the other hand, eddy current is eliminated when arranging passage 157, air can enter the air flow circuit formed between fins swimmingly, therefore as shown in line 209, the flow velocity of the position of each air flow circuit near the passage 157 represented with scope 140 in Fig. 4 (A) rises, and can reduce the thermal resistance of fin.And heating surface 107a itself is also dispelled the heat by the air of passage 157, therefore contributes to the raising of heat-sinking capability.
So far, illustrate the example being formed passage 157 by the heating surface 107a of radiator 107 and channel cover 111, but passage also can be formed as a part for radiator by the present invention.Fig. 7 illustrates the figure possessing the radiator of passage.In the radiator 301 of Fig. 7 (A), between the inwall 307 of one end combining multiple fin 309 and the outer wall 305 of radiator 301, define passage 303.The other end of multiple fin 309 is combined with the outer wall possessing heating surface 311.
The direction vertical with the face of fin 309 defines passage 303 to slit-shaped.In addition, passage 303 also can be formed as the opening of complete slit-shaped, or for the object strengthened, also outer wall 305 and inwall 303 partly can be combined.In conjunction with radiating tube 313,315 on the heating surface 311 of downside being positioned at radiator 301.The heat that radiating tube 313,315 obtains is conducted to air by multiple fin 309.In radiator 301, the circulation of the air in each air flow circuit represented by the scope 310 near passage 303 becomes smooth and easy, and heat-sinking capability improves.
In the radiator 351 of Fig. 7 (B), possessing in conjunction with multiple fin 361 between the outer wall of heating surface 359 and inwall 355, possessing between the outer wall of heating surface 365 and inwall 357 in conjunction with multiple fin 363.Between inwall 35 and inwall 357, the direction vertical with the face of fin 361,363 defines passage 353 to slit-shaped.In conjunction with radiating tube 367 on heating surface 359, in conjunction with radiating tube 369 on heating surface 365.
Further, the heat that heating surface 359 obtains from radiating tube 367 conducts to air by fin 361, and the heat that radiating tube 369 obtains is conducted to air by fin 363.Can by the mode making the height of the fin be combined with heating surface at higher temperature increase, the position of the passage 353 on Decision Height direction.In radiator 351, the circulation of the air in each air flow circuit of scope 360 expression of the vicinity of passage 353 becomes smooth and easy, and heat-sinking capability improves.
So far, the particular implementation with reference to the accompanying drawings describes the present invention, but, the invention is not restricted to execution mode shown in the drawings, as long as play effect of the present invention, certainly can adopt arbitrary structures known before this.
Claims (9)
1. a heat abstractor, is characterized in that,
Have: be contained in the centrifugal fan in air chamber;
Be configured in the periphery of described centrifugal fan, there is the radiator for forming multiple fin that many air flow circuits are combined with the first side wall and the second sidewall; And
The passage that slit-shaped extends on the direction vertical relative to the face of described multiple fin,
Be discharged via described many air flow circuits and described passage by the air after described centrifugal fan pressurization;
Wherein, described passage is defined by described the first side wall and the case forming described air chamber.
2. heat abstractor according to claim 1, is characterized in that,
Described passage is formed as a part for described radiator.
3. heat abstractor according to any one of claim 1 to 2, is characterized in that,
In conjunction with radiating tube on described second sidewall.
4. heat abstractor according to claim 1, is characterized in that,
The interval of described fin and the height of described passage roughly equal.
5. heat abstractor according to claim 1, is characterized in that,
The height of described passage is more than 3% of the height of described radiator and is less than 13%.
6. an electronic equipment, is characterized in that, has:
System chassis;
At the electronic device of the inner heat of described system chassis;
The centrifugal fan configured in the air chamber carried in described system chassis;
Be configured in the periphery of described centrifugal fan, possess the radiator of multiple fin; And
Pass through and the passage of slit-shaped extension on the direction vertical relative to the face of described fin for making a part for the air after by described centrifugal fan pressurization;
Wherein, described passage is defined by the first side wall and the case forming described air chamber.
7. electronic equipment according to claim 6, is characterized in that,
Described electronic device comprises processor,
There is the radiating tube be combined with described processor and described radiator.
8. an electronic equipment, is characterized in that, has:
System chassis;
At the electronic device of the inner heat of described system chassis;
Centrifugal fan; And
Radiator, it possess multiple fin of forming many air flow circuits that the air after by the pressurization of described centrifugal fan is passed through with for the air after making described pressurization passes through and slit-shaped extends on the direction vertical relative to the face of described fin passage;
Wherein, described passage is defined by the first side wall and the case forming air chamber.
9. the radiator combinationally used with centrifugal fan, is characterized in that,
Have: the first side wall;
Second sidewall;
For forming multiple fin that many air flow circuits are combined with described the first side wall and described second sidewall; And
The passage that slit-shaped extends on the direction vertical relative to the face of described fin,
Described air flow circuit and described passage can be passed through by the air after described centrifugal fan pressurization;
Wherein, described passage is defined by described the first side wall and the case forming air chamber.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-210470 | 2010-09-21 | ||
| JP2010210470A JP5127902B2 (en) | 2010-09-21 | 2010-09-21 | Electronic device heat dissipation device and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102438429A CN102438429A (en) | 2012-05-02 |
| CN102438429B true CN102438429B (en) | 2015-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110264250.2A Active CN102438429B (en) | 2010-09-21 | 2011-09-07 | Cooling device of electronic equipment and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5127902B2 (en) |
| CN (1) | CN102438429B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10732681B2 (en) * | 2018-07-26 | 2020-08-04 | Microsoft Technology Licensing, Llc | Adaptive airflow guides in an electronic device |
| JP7113504B2 (en) * | 2018-09-05 | 2022-08-05 | 株式会社ロータス・サーマル・ソリューション | heatsink with fan |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1396508A (en) * | 2001-07-05 | 2003-02-12 | 株式会社东芝 | Cooling device containing fan and ventilation duct and electronic equipment containg cooling device |
| CN1735330A (en) * | 2004-08-09 | 2006-02-15 | 欧姆龙株式会社 | Heat radiating structure for electronic equipment |
| CN101031195A (en) * | 2006-03-02 | 2007-09-05 | 古河电气工业株式会社 | A heat sink with a centrifugal fan |
| CN101174172A (en) * | 2006-10-30 | 2008-05-07 | 联想（新加坡）私人有限公司 | Housing temperature suppressing structure in electronic device and portable computer |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002049106A1 (en) * | 2000-12-11 | 2002-06-20 | Fujitsu Limited | Electronic device unit |
| JP4612609B2 (en) * | 2006-11-08 | 2011-01-12 | 富士通株式会社 | Electronic equipment unit |
-
2010
- 2010-09-21 JP JP2010210470A patent/JP5127902B2/en active Active
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- 2011-09-07 CN CN201110264250.2A patent/CN102438429B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1396508A (en) * | 2001-07-05 | 2003-02-12 | 株式会社东芝 | Cooling device containing fan and ventilation duct and electronic equipment containg cooling device |
| CN1735330A (en) * | 2004-08-09 | 2006-02-15 | 欧姆龙株式会社 | Heat radiating structure for electronic equipment |
| CN101031195A (en) * | 2006-03-02 | 2007-09-05 | 古河电气工业株式会社 | A heat sink with a centrifugal fan |
| CN101174172A (en) * | 2006-10-30 | 2008-05-07 | 联想（新加坡）私人有限公司 | Housing temperature suppressing structure in electronic device and portable computer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012069551A (en) | 2012-04-05 |
| CN102438429A (en) | 2012-05-02 |
| JP5127902B2 (en) | 2013-01-23 |
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